CN102639660A - 组合物、胶带及其使用 - Google Patents

组合物、胶带及其使用 Download PDF

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CN102639660A
CN102639660A CN2010800548834A CN201080054883A CN102639660A CN 102639660 A CN102639660 A CN 102639660A CN 2010800548834 A CN2010800548834 A CN 2010800548834A CN 201080054883 A CN201080054883 A CN 201080054883A CN 102639660 A CN102639660 A CN 102639660A
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melting point
low melting
adhesive tape
epoxy resin
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汀完崔
郑�勋
金载星
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3M Innovative Properties Co
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Abstract

本发明公开了一种组合物，其包含热固性粘结剂，传导性加固稀松布和低熔点金属颗粒。所述低熔点金属颗粒在350℃或低于350℃下熔化。所述组合物可制成胶带。本发明还公开了将所述组合物粘结至基底。

Description

组合物、胶带及其使用
技术领域
本发明广义地涉及导电粘合剂、胶带及其使用。
背景技术
热固性传导性双面粘合胶带，例如得自Tatsuta的CBF 300传导性胶带，通常用于将增强板粘结至挠性印刷电路板。用于增强板粘结应用的典型双面传导性压敏粘合(PSA)胶带宣称实现了在电接触和粘附性方面的长期可靠性。然而，仍然需要具有更好的电性和粘附性可靠性的热固性传导性膜。
发明内容
在一个方面，本发明提供了一种组合物，其包含：热固性粘结剂，传导性加固稀松布以及包含低熔点金属颗粒的传导性填料，其中所述低熔点金属颗粒在350℃或低于350℃下熔化。在一些实施例中，该组合物为压敏的。在一些实施例中，热固性粘结剂包含可加热固化的环氧树脂，该可加热固化的环氧树脂的固化剂以及丙烯酸类聚合物。在那些实施例的一些中，丙烯酸类聚合物通过在存在环氧树脂的情况下使丙烯酸类单体聚合而形成。在一些实施例中，传导性加固稀松布包括金属涂覆的聚合物纤维和金属涂覆的碳纤维中的至少一种。在一些实施例中，低熔点金属颗粒包括低熔点锡合金。
在另一方面，本发明提供了包含根据本发明的组合物的胶带、膜和片材。在一些实施例中，该组合物置于两个隔离衬垫之间。
还在另一方面，本发明提供了一种方法，包括将根据本发明的组合物粘附至至少一个具有导电迹线的基底。在一些实施例中，基底是挠性的。在一些实施例中，所述方法还包括将组合物粘附至金属增强板。
如本文所用：
除非另外指明，术语“传导性”是指“导电”；并且
术语“导电”是指具有小于109欧姆/厘米的体电阻。
在一些实施例中，根据本发明的导电组合物和/或制品具有小于104欧姆/厘米的体电阻。
结合具体实施方式以及所附权利要求书将更好地理解本发明的特征和优点。以下结合本发明的各种示例性实施例描述了本发明的这些和其他特征以及优点。以上概述并非旨在描述本发明的每一个公开实施例或每种实施方式。随后的附图和详细说明将更具体地举例说明示例性实施例。
附图说明
图1是根据本发明的示例性热固性导电胶带的侧视图；和
图2是通过根据本发明的加热固化的组合物粘附至金属增强板上的挠性电路的横截面侧视图。
虽然上述确定的附图示出了本发明的若干实施例，但还可以想到其他实施例，如讨论中所述。在所有情况下，本发明以示例性而非限制性的方式呈现本发明。应当理解，本领域的技术人员可以设计许多其他修改形式和实施例，其仍落在本发明的原理的范围和精神内。附图未按比例绘制。附图中的类似参考标号用于代表类似部分。
具体实施方式
通常，热固性粘结剂由热固性粘结剂前体形成，所述热固性粘结剂前体通常包含至少足够的固化剂以引起热固化（即有效量），从而形成热固性粘结剂，但一些热固性粘结剂前体可能不需要添加热固化剂。
可用的热固性粘结剂前体包括（例如）环氧树脂、丙烯酸酯树脂、酚醛树脂、氨基甲酸酯树脂、氰酸酯树脂、以及它们的组合。在这些当中，与丙烯酸类聚合物共混的可加热固化的环氧树脂是理想的。在这些体系中，可加热固化的环氧树脂和该环氧树脂的固化剂与多官能(甲基)丙烯酸单体密切混合，然后(甲基)丙烯酸单体聚合形成与可固化环氧树脂混合的丙烯酸类聚合物，其可为可加热固化的胶带形式。如本文所用，前缀“（甲基）丙烯((meth)acryl)”包含丙烯基及/或甲基丙烯酸。关于热固性粘结剂的进一步细节可见于美国专利No.5,086,088（Kitano等人）中，其在需要压敏粘合剂特性的情况下尤其有用。类似的热固性粘结剂可通过将热塑性聚合物与环氧树脂和该环氧树脂的热固化剂共混，并至少部分地固化环氧树脂来制备；例如，如美国专利申请公开No.US20020182955（Weglewski等人）和美国专利No.6406782（Johnson等人）中所述。
在包含环氧树脂的热固性粘结剂前体的情形中，诸如双氰胺或咪唑固化剂之类的热固化剂的含量基于热固性粘结剂的总重量计为最多约20重量%。
加固稀松布可为沿着稀松布纤维具有导电性的机织物或非织造稀松布。其例子包括金属涂覆的机织材料和金属涂覆的非织造材料，例如镀镍-铜-镍的聚对苯二甲酸乙二醇酯(PET)聚酯非织造材料、镀锡的机织材料以及镀银的碳纤维非织造材料。
可任选地包含在根据本发明的组合物中的可用添加剂包括（但不限于）填料、颜料、纤维、机织物和非织造织物、发泡剂、抗氧化剂、稳定剂、阻燃剂、链转移剂以及粘度调节剂。
根据本发明的组合物可成形为各种形状，例如膜、片材和带材，任选地与一个或两个可以可脱开的方式粘附的衬片（如硅化的纸张或聚酯，或聚烯烃）、或金属箔或金属增强板接触。如此形成的带材和片材的厚度通常与传导性加固稀松布大致相同；例如，在约20微米至100微米的范围内，通常在40微米至70微米的范围内，但可以使用更高和更低的厚度。
现在参见图1，胶带100包含根据本发明的组合物110，其夹置在任选的以可脱开的方式粘附的衬片108之间。组合物110包含热固性粘结剂106、传导性加固稀松布104和低熔点金属颗粒102。一旦加热固化，该胶带便为导电的。通常，组合物在固化之前也为导电的，然而这并非必需的，只要其在固化之后为导电的即可。
现在参见图2，在一个示例性使用中，胶带100夹置在挠性电路200和金属增强板210之间，借此当胶带100加热固化时其将挠性电路200固定至金属增强板210，同时在挠性电路200上的至少一个电路元件240和金属增强板210之间提供导电性。
传导性加固稀松布通常设置在热固性胶带内，使得其沿着至少其长度和宽度与胶带共延。通常，传导性加固稀松布的存在量对胶带而言为约8克/平方米(gsm)至100gsm，厚度在约20微米至100微米的范围内。
低熔点金属颗粒可为任何金属颗粒，其在350℃或低于350℃下，通常在小于约275℃，并且更通常在小于约225℃下熔化。例子包括焊料合金，例如42Sn/58/Bi（熔点(m.p.)=138℃）、43/Sn/43Pb/14Bi(m.p.=163℃)、62Sn/36Pb/2Ag(m.p.=179℃)、63Sn/37Pb(m.p.=183℃)、60Sn40Pb(m.p.=191℃)、95.55Sn/4Ag/0.5Cu(m.p.=217℃)、99.3Sn/0,7Cu(m.p.=227℃)、95Sn/5Ag(m.p.=245℃)、10Sn/88Pb/2Ag(m.p.=290℃)、5SN/95/Pb(m.p.=312℃)。低熔点金属在热固性导电组合物中的含量基于热固性导电组合物的总重量计通常为约10重量%至80重量%，通常地为40重量%至60重量%，但还可以使用更高和更低的量。
通过以下非限制性实例进一步说明本公开的目的和优点，但这些实例中所述的具体材料及其用量，以及其他条件和细节不应视为对本公开进行不当限定。
实例
除非另外指明，在实例和说明书的其余部分中的所有份数、百分比、比率等都是以重量计。
实例1
粘合剂浆料以表1中记录的组成来制备（如下）。
表1
相应的胶带试样即胶带1和胶带2这样来制备：通过涂布辊将购自Ajin Electron(Kangso-Gu,Korea)的50微米厚的传导性镀镍聚酯非织造稀松布和镀铜非织造稀松布以及粘合剂浆料传送至透明有机硅隔离衬垫之间。涂布辊上的间隙设置为45-48um，其比稀松布厚度略薄。
通过暴露于紫外辐射下520秒将涂覆的粘合剂浆料固化以形成胶带，顶面辐射强度为约3.0mW/cm2，底面辐射强度为3.0mW/cm2。
将每个待评估的胶带层合至Au/Cu箔，移除隔离衬垫，然后在室温和15psi(0.1MPa)下将胶带横跨导电迹线（以2毫米间距间隔开）粘附至印刷电路板并保持5秒。然后，在300psi(2.1MPa)和210℃下将层合物压力粘合2分钟，然后在180℃下固化30分钟。测量了层合至胶带并在印刷电路板上以2毫米间距间隔开的两条相邻导电迹线之间的XYZ-轴的电阻。表2（如下）记录了层合后、压力/粘合后以及固化后的平均XYZ-轴电阻，记录在表2（如下）中的值为五个重复的平均值。
表2
Figure BDA00001721936600061
表3（如下）记录了胶带试样在180℃下固化30分钟之后根据ASTM D3330测得的180°剥离粘合力。
表2
本文提及的所有专利和出版物均以引用方式全文并入本文中。除非另外指明，否则本文给出的所有实例均应视为非限制性的。在不脱离本公开的范围和精神实质的条件下，本领域技术人员可对本公开进行各种修改和变更，并且应当理解，本公开不应当不当地受限于本文中所述的示例性实施例。

Claims (11)

1.一种组合物，其包含：热固性粘结剂，传导性加固稀松布和低熔点金属颗粒，其中所述低熔点金属颗粒在350℃或低于350℃下熔化。
2.根据权利要求1所述的组合物，其中所述组合物为压敏的。
3.根据权利要求1所述的组合物，其中所述热固性粘结剂包含可热固化的环氧树脂，所述可热固化的环氧树脂的固化剂以及丙烯酸类聚合物。
4.根据权利要求1所述的组合物，其中所述丙烯酸类聚合物通过在存在所述环氧树脂的情况下使丙烯酸类单体聚合而形成。
5.根据权利要求1所述的组合物，其中所述传导性加固稀松布包括金属涂覆的聚合物纤维和金属涂覆的碳纤维中的至少一种。
6.根据权利要求1所述的组合物，其中所述低熔点金属颗粒包括低熔点锡合金。
7.一种包含根据权利要求1所述的组合物的胶带。
8.根据权利要求8所述的胶带，其夹置于两个隔离衬垫之间。
9.一种方法，该方法包括将根据权利要求1所述的组合物粘附至至少一个具有导电迹线的基底。
10.根据权利要求9所述的方法，其中所述基底为挠性的。
11.根据权利要求10所述的方法，该方法还包括将所述组合物粘附至金属增强板。
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