CN102595781A - 电路板设计 - Google Patents

电路板设计 Download PDF

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CN102595781A
CN102595781A CN2012100773956A CN201210077395A CN102595781A CN 102595781 A CN102595781 A CN 102595781A CN 2012100773956 A CN2012100773956 A CN 2012100773956A CN 201210077395 A CN201210077395 A CN 201210077395A CN 102595781 A CN102595781 A CN 102595781A
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circuit board
signal line
signal
line traces
glass
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詹姆斯·麦考尔
戴维·夏伊金德
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Intel Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0248—Skew reduction or using delay lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
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    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1554—Rotating or turning the PCB in a continuous manner
    • H—ELECTRICITY
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
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Abstract

描述了一种电路板，其中玻纤纤维图案已被改进，所述图案与在常规FR4电路板中发现的图案不同。在一个实施方案中，多组玻纤纤维以锯齿形或鱼脊形的方式被设置。在一种使用中，当一对导体被设置到板上或设置在板中时，围绕第一导体的材料倾向于与围绕第二导体的材料相类似。这样做可以降低在所述导体间的差模-共模转换。

Description

电路板设计
本申请是PCT国际申请号为PCT/US2004/026401、国际申请日为2004年8月13日、中国国家申请号为200480023188.6、发明名称为“电路板设计”的申请的分案申请。
发明背景
本发明涉及电路板设计。更特殊地，本发明涉及改进电路板，以提高其电气性能。
电路板，包括印刷电路板或PCB，在本行业中常用于在单个单元中来连接元件。最常见类型的印刷电路板是由在本领域被称为FR4的材料制成的。这类电路板的加工相对比较便宜。它是用玻纤(fiberglass)纤维(fiber)的矩形格栅(grid)或织物(cloth)来构成的，所述玻纤纤维通常是采用环氧树脂来结合到铜基底的。另外，玻纤织物可以用环氧树脂来浸渍。阻燃剂(FR)被加到板中，从而使所述板可以经受高热的环境(例如，当将元件焊到板上时)。电导体(例如，用铜制成)被沉积到板中或板的任一侧上，并且在板上的元件(例如，集成电路芯片)、用于插入其他电路板(例如，插入到母板中的子板)的插座等之间传输信号。在本领域中，用于FR4电路板的材料在降低信号线之间的串扰(crosstalk)方面已经是有效的。
FR4电路板也用来在差分点对点(point to point)接口中传输信号。在这样的接口中，提供两条信号线迹线(trace)来传输一个数据信号。第一条迹线传输所述数据信号的一部分，这部分的信号与在第二条迹线上传输的所述数据信号的其他部分180°异相(out-of-phase)。在两条信号线迹线的接收端，两个异相的信号被差分(differentiated)，从而再现在信号中传输的原始数据。信号迹线对常常用于总线体系结构中。
在目前的操作频率下，FR4已经成功地被用于差分信号的传输。随着元件(包括处理器)操作频率的提高，在将FR4用作电路板材料时可能出现问题。例如，当总线频率超过1GHz(千兆赫，或者每秒10亿个周期)，差模-共模转换(differential to common modeconversion)对信号迹线对来讲可能成为问题。在这种转换中，在第一和第二迹线之间的相位差从上述最佳的180°偏离。如果相位差下降到某个阈值以下，接受设备将无法差分(differentiate)所述的两个信号以取回(retrieve)原始的数据信号。尽管这样的转换出现在FR4电路板中，然而在较低的频率，转换的水平还不是一个考虑因素。在较高的频率，这种转换会变得严重，使公知的FR4电路板的使用无法进行。
对这种问题的一种解决方案是用一种不同的(或许是均匀的(homogeneous))材料来替换FR4板。这样的板在本领域是公知的，但是通常比普通的FR4材料更昂贵。
由于上述原因，存在对改进的电路板材料的需求。
附图说明
图1为具有矩形栅格(lattice)结构和一对信号迹线的FR4电路板的使用示意图。
图2为具有锯齿形或鱼脊形栅格结构和一对信号迹线的FR4电路板的使用示意图。
图3为根据本发明的实施方案，改进的FR4电路板和一对信号迹线的使用示意图。
图4a-c为本发明的实施方案的示意图，所述实施方案采用FR4电路板的部分来加工电路板。
具体实施方式
参见图1，图中表示的是具有一对信号迹线的FR4板的部分。电路板10分别包括垂直和水平玻纤纤维11a，11b。虽然只示出了一个矩形栅格结构，但是可以在电路板10中提供多个这样的栅格结构。电路板10还包括树脂12(例如环氧树脂)，所述树脂被设置成遍及玻纤纤维11a，11b的矩形栅格结构11a-b。在图1的板中，提供了一对信号迹线13a，13b。在该实施例中，信号线一般平行于水平玻纤纤维11b。这些信号迹线可以埋置在电路板的树脂中，设置在电路板的树脂的顶上，等等。如图1所示，第一信号线13a被一般地设置在相邻的水平纤维11b之间。在该实施例中，每条信号线迹线具有约5密耳(mil)(即，5毫英寸或0.005英寸)的宽度。然而，第二信号线13b被一般地设置在水平纤维11b中的一根的上面。在该实施例中，迹线间的间距为5密耳(mil)。
当将所述的第一和第二信号线迹线用于差分信号传输时，期望使这些迹线在特性阻抗和传播常数方面是等同的。采用低频率时，FR4电路板材料的非均匀性对信号迹线的这些特征的影响是可以忽略的。然而，当信号频率增加时，在所述信号迹线附近的材料组成中的差异对这些特征具有显著影响。在高信号频率，这些特征将对由所述迹线传输的信号的大小和相位有影响。如果电路板材料对这些迹线中的特性阻抗和传播常数的影响是不同的，那么，确定在这些迹线中的信号间的差异变得更加困难，并且会导致期望被传输的数据丢失。
在图1的实施例中，在第二迹线13b附近的板材料具有相对较高的玻纤对树脂的比率，而在第一迹线13a附近的板材料是以玻纤对树脂的比率要低得多的材料组成的。在604MHz(即604兆赫兹或每秒604兆个周期)，5密耳(mil)宽的FR4电路板迹线具有在3.32和3.50之间变化的介电常数Er。采用两条5密耳宽并且间隔5密耳的信号线迹线，对30英寸的迹线长度而言，由于所述迹线对之间的累积相移而产生的完全差模-共模转换(即全部信号损失)估计出现在3.5GHz。
根据本发明的实施方案，采用设想用于FR4电路板的同类材料来制造电路板。图2表示的是所述的实施方案。参见图2，在所示的电路板20的部分中，第一和第二玻纤纤维组21a，21b互相重叠。这些组在这个实施方案中形成锯齿形(zig-zag)或鱼脊形(herringbone)的设计。换句话说，每个玻纤组是以顶点连接的直线段(即，如在周期性的三角波形中那样)为特征的。虽然示出了两组玻纤纤维，可以提供一组或更多组这样的组。与在FR4电路板中一样，加入树脂以形成电路板结构。正如在本领域中对FR4电路板所公知的那样，将存在树脂材料对玻纤材料的比率相对高的区域(如在区域25)以及所述比率相对较低的区域(如在区域27)。另外，两条信号线迹线23a，23b被设置在电路板20之中或之上。如从图2中可见，存在于信号线迹线23a，23b附近的电路板材料是在树脂和玻纤材料之间的不同比率的混和物。在这个实施方案中，其作用是：总体上讲，所述第一信号线迹线23a附近的材料的内容与所述第二信号线迹线23b附近的材料相比将是相似的。由于第一和第二信号线迹线23a，23b附近的材料是相似的，因此，总体上讲，当将这些迹线用于差模信号传输(signaling)时，存在较少的差模-共模转换。
在图2的实施方案中，玻纤材料被形成为锯齿形或鱼脊形设计。相邻纤维之间的间距与图1中的玻纤栅格的间距近似，即约5密耳(mil)。随着信号频率的提高和信号迹线宽度的减小，玻纤材料栅格的密度(即，厚度和间距)可以被调整，从而减小在信号线对中的差模-共模转换。
用于在图1的电路板10中使用的玻纤织物的矩形栅格是以常规方式制成的。所述织物是通过获得玻纤纤维并且将它们编织在一起或交织水平纤维和垂直纤维来制成的。通过修改目前加工玻纤织物的系统，可以进行图2中的锯齿形或鱼脊形设计的制造。例如，在构成玻纤的第一组21a中，当纤维被安放到表面上时，可以左右地(side-to-side)移动给出(emitting)玻纤纤维的装置。可替换地，当纤维被安放时，可以左右地移动其上被安放纤维的表面。一旦锯齿形或鱼脊形的玻纤纤维被制成，可以采用环氧树脂将其附着到铜基底上，正如采用标准的FR4制造方法一样。因此，通过以常规的方式从电路板上去除不想要的铜可以形成信号线迹线23a，23b。
图2中所示的本发明实施方案可以以与目前可以获得的常规FR4电路板相近的低成本来制造。图2的板的加工可以采用许多与在常规FR4电路板的加工中使用的设备相同的设备。
图3所示为本发明的另一个实施方案。在图3中，FR4电路板是以常规方式制成的。换句话说，在环氧树脂33中提供了水平和垂直玻纤纤维31a，31b的玻纤织物。在玻纤纤维和树脂成形在一起后，整个装置被旋转，然后切割到应有的尺寸。例如，在图3中，玻纤栅格被旋转45°(即，水平玻纤纤维或垂直纤维与切割线形成45°的非垂直角(non-rightangle))。当将两条导电迹线35a，35b设置在电路板37上时，容易发现两条导体都经过较高玻纤树脂比(fiberglass-to-resin)的材料和较低玻纤树脂比的材料的区域，这样有助于降低在两条导体迹线中的信号之间的差模-共模转换。
通过考虑本发明的说明书和实施，对本领于技术人员而言，本发明的其他实施方案将会明显。另外，为了描述清晰的目的，而非出于限制本发明的目的，使用了某些术语。上面描述的实施方案和优选特征应当认为是示例性的，而本发明是由所附权利要求书来定义的。
例如，一块或多块常规的FR4板可以被旋转(例如，45°)并且切成很多方块。然后，来自所述板(多块)的多块单独的方块可以再旋转到期望的方向并且重新形成在一起。图4a-c所示为这样的实施例。在图4a中，FR4板被旋转30°并且被切成多个部分或方块41。在图4b中，第二块FR4板被旋转45°并且被切成多个部分或方块42。然后，如果需要，多个单独的方块可以被旋转，并且接着被重新形成合在一起，以形成具有导体43a，43b的新的FR4板。
尽管图4a-c所示的实施方案具有直线形状，其他形状也可以使用。另外，如图4a-c所示，在用来构建新的FR4板的各个部分之间，玻纤纤维的密度是不需要相同的。

Claims (18)

1.一种电路板，包括：
树脂；
第一和第二波纤光纤；以及
第一和第二信号线迹线，用于发送电信号，其中：
在所述第一和第二信号线迹线附近的材料在成分上是总体类似的。
2.如权利要求1所述的电路板，其特征在于，所述第一和第二信号线迹线将所述第一和第二玻纤光纤以大约45度角度进行交叉。
3.如权利要求1所述的电路板，其特征在于，所述树脂是环氧树脂。
4.如权利要求1-3中任意一项所述的电路板，其特征在于，
所述第一和第二玻纤光纤形成与所述电路板的切割线成非垂直角度；
所述第一和第二信号线迹线通过较高玻纤树脂比材料区域以及较低玻纤树脂比材料区域，以帮助减少第一和第二信号线迹线的信号之间的差分-共模转换。
第一和第二信号线迹线是一对差分信号线迹线；
第一和第二信号线迹线被用于差分模式信号传输；和/或
第一和第二信号线迹线用于以1Ghz及以上的频率传输电信号。
5.如权利要求4所述的电路板，其特征在于，第一和第二玻纤光纤与所述电路板的切割线成大约45度角度。
6.如权利要求1-3中任意一项所述的电路板，其特征在于，第一信号线迹线附近的玻纤和树脂材料之间的比率是第一信号线迹线的整个部分附近的玻纤和树脂材料之间的总体比率，并且其中第二信号线迹线附近的玻纤和树脂材料之间的比率是第二信号线迹线的整个部分附近的玻纤和树脂材料之间的总体比率。
7.如权利要求1-3中任意一项所述的电路板，其特征在于，第一和第二玻纤光纤在第一和第二信号线迹线附近对角地交叉。
8.如权利要求1-3中任意一项所述的电路板，其特征在于，第一和第二玻纤光纤在第一和第二信号线迹线附近以锯齿形方式交叉。
9.如权利要求1-3中任意一项所述的电路板，其特征在于，在第一信号线迹线附近的玻纤和树脂材料之间的比率与第二信号线迹线附近的玻钎和树脂材料之间的比率相类似。
10.一种用于制造电路板的方法，包括：
添加树脂；
形成第一和第二波纤光纤；以及
形成第一和第二信号线迹线，所述第一和第二信号线迹线用于发送电信号，其中：
在所述第一和第二信号线迹线附近的材料在成分上是总体类似的。
11.如权利要求10所述的用于制造电路板的方法，其特征在于，所述第一和第二信号线迹线将所述第一和第二玻纤光纤以大约45度角度进行交叉。
12.如权利要求10所述的用于制造电路板的方法，其特征在于，所述树脂是环氧树脂。
13.如权利要求10-12中任意一项所述的用于制造电路板的方法，其特征在于，
所述第一和第二玻纤光纤形成与所述电路板的切割线成非垂直角度；
所述第一和第二信号线迹线通过较高玻纤树脂比材料区域以及较低玻纤树脂比材料区域，以帮助减少第一和第二信号线迹线的信号之间的差分-共模转换。
第一和第二信号线迹线是一对差分信号线迹线；
第一和第二信号线迹线被用于差分模式信号传输；和/或
第一和第二信号线迹线用于以1Ghz及以上的频率传输电信号。
14.如权利要求13所述的用于制造电路板的方法，其特征在于，第一和第二玻纤光纤与所述电路板的切割线成大约45度角度。
15.如权利要求10-12中任意一项所述的用于制造电路板的方法，其特征在于，第一信号线迹线附近的玻纤和树脂材料之间的比率是第一信号线迹线的整个部分附近的玻纤和树脂材料之间的总体比率，并且其中第二信号线迹线附近的玻纤和树脂材料之间的比率是第二信号线迹线的整个部分附近的玻纤和树脂材料之间的总体比率。
16.如权利要求10-12中任意一项所述的用于制造电路板的方法，其特征在于，第一和第二玻纤光纤在第一和第二信号线迹线附近对角地交叉。
17.如权利要求10-12中任意一项所述的用于制造电路板的方法，其特征在于，第一和第二玻纤光纤在第一和第二信号线迹线附近以锯齿形方式交叉。
18.如权利要求10-12中任意一项所述的用于制造电路板的方法，其特征在于，在第一信号线迹线附近的玻纤和树脂材料之间的比率与第二信号线迹线附近的玻钎和树脂材料之间的比率相类似。
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EP2480053A3 (en) 2012-12-05
CN102625572A (zh) 2012-08-01
US7676917B2 (en) 2010-03-16
US8415002B2 (en) 2013-04-09
EP2480056A2 (en) 2012-07-25
US7459200B2 (en) 2008-12-02
EP2480055A2 (en) 2012-07-25
US9596766B2 (en) 2017-03-14
EP1654915B1 (en) 2012-03-07
CN101147432B (zh) 2012-05-30
CN101147432A (zh) 2008-03-19
EP2480056A3 (en) 2012-12-05
CN102625573A (zh) 2012-08-01
EP2480055A3 (en) 2012-12-05
US8673391B2 (en) 2014-03-18
WO2005018293A3 (en) 2007-01-11
TWI276373B (en) 2007-03-11
WO2005018293A2 (en) 2005-02-24
CN102595779A (zh) 2012-07-18
US20130227838A1 (en) 2013-09-05
EP2480055B1 (en) 2017-10-25
TW200518644A (en) 2005-06-01
EP2480053A2 (en) 2012-07-25
EP1654915A2 (en) 2006-05-10
CN102625573B (zh) 2015-12-16
US20050034893A1 (en) 2005-02-17
US20140150257A1 (en) 2014-06-05
CN102595780A (zh) 2012-07-18
ATE548890T1 (de) 2012-03-15
EP2480057A3 (en) 2012-12-05
EP2480057A2 (en) 2012-07-25
US20070169341A1 (en) 2007-07-26
US20100170087A1 (en) 2010-07-08
EP2480054A3 (en) 2012-12-05

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Application publication date: 20120718