CN102581750B - 一种双镶嵌层无蜡研磨抛光模板 - Google Patents
一种双镶嵌层无蜡研磨抛光模板 Download PDFInfo
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- CN102581750B CN102581750B CN201210094461.0A CN201210094461A CN102581750B CN 102581750 B CN102581750 B CN 102581750B CN 201210094461 A CN201210094461 A CN 201210094461A CN 102581750 B CN102581750 B CN 102581750B
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CN201210094461.0A CN102581750B (zh) | 2012-03-31 | 2012-03-31 | 一种双镶嵌层无蜡研磨抛光模板 |
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CN201210094461.0A CN102581750B (zh) | 2012-03-31 | 2012-03-31 | 一种双镶嵌层无蜡研磨抛光模板 |
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CN102581750A CN102581750A (zh) | 2012-07-18 |
CN102581750B true CN102581750B (zh) | 2015-04-29 |
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Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105619237B (zh) * | 2014-11-28 | 2018-07-27 | 浙江华正新材料股份有限公司 | 一种无腊抛光吸附垫及其制造方法 |
CN104759984A (zh) * | 2015-03-27 | 2015-07-08 | 苏州赫瑞特电子专用设备科技有限公司 | 一种单面抛光机粘片装置 |
CN105127881A (zh) * | 2015-07-30 | 2015-12-09 | 洛阳金诺机械工程有限公司 | 一种用于晶片双面磨抛机的承载盘及其磨抛机和磨抛方法 |
CN106737128A (zh) * | 2016-11-23 | 2017-05-31 | 东莞市中镓半导体科技有限公司 | 一种用于双面研磨抛光设备上的单面抛光系统 |
JP6917058B2 (ja) * | 2017-06-06 | 2021-08-11 | 丸石産業株式会社 | 吸着層を備える研磨パッドを使用する研磨方法 |
CN108608316A (zh) * | 2018-05-18 | 2018-10-02 | 成都成量工具集团有限公司 | 量块的加工工装及加工方法 |
CN109483398A (zh) * | 2018-12-07 | 2019-03-19 | 宁波日晟新材料有限公司 | 一种晶体抛光模板及其制备方法与应用 |
CN112873074B (zh) * | 2021-03-10 | 2022-11-01 | 安徽禾臣新材料有限公司 | 一种抛光用无蜡垫的生产方法 |
CN115008342B (zh) * | 2022-06-15 | 2023-08-25 | 安徽禾臣新材料有限公司 | 一种晶片抛光用防崩角的无蜡垫及其生产工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87202507U (zh) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | 硅片无蜡抛光垫 |
US6045435A (en) * | 1997-08-04 | 2000-04-04 | Motorola, Inc. | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects |
JP4384136B2 (ja) * | 2006-05-31 | 2009-12-16 | ニッタ・ハース株式会社 | 研磨パッド |
WO2011129254A1 (ja) * | 2010-04-15 | 2011-10-20 | 東洋ゴム工業株式会社 | 研磨パッド |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6025649A (ja) * | 1983-07-18 | 1985-02-08 | Toshiba Mach Co Ltd | 両面ポリシング装置による片面ポリシング装置 |
JP2004283929A (ja) * | 2003-03-20 | 2004-10-14 | Shin Etsu Handotai Co Ltd | ウエーハ保持用キャリア並びにそれを用いた両面研磨装置及びウエーハの両面研磨方法 |
EP1696011B1 (en) * | 2005-02-23 | 2009-01-07 | JSR Corporation | Chemical mechanical polishing method |
WO2008035586A1 (fr) * | 2006-09-19 | 2008-03-27 | Hoya Corporation | Procédé de production d'un substrat de verre pour un disque magnétique et procédé de fabrication d'un disque magnétique |
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- 2012-03-31 CN CN201210094461.0A patent/CN102581750B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN87202507U (zh) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | 硅片无蜡抛光垫 |
US6045435A (en) * | 1997-08-04 | 2000-04-04 | Motorola, Inc. | Low selectivity chemical mechanical polishing (CMP) process for use on integrated circuit metal interconnects |
JP4384136B2 (ja) * | 2006-05-31 | 2009-12-16 | ニッタ・ハース株式会社 | 研磨パッド |
WO2011129254A1 (ja) * | 2010-04-15 | 2011-10-20 | 東洋ゴム工業株式会社 | 研磨パッド |
JP2011228358A (ja) * | 2010-04-15 | 2011-11-10 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
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Effective date of registration: 20150922 Address after: 300384 6 Haitai development road, Huayuan Industrial Park, Tianjin (room 401-04-24, block g, Haitai green industrial base) Patentee after: TIANJIN XIMEI SEMICONDUCTOR MATERIAL CO., LTD. Address before: 300000 Tianjin City Hedong District Gu Jie Zeng 1-2. Patentee before: Tianjin Ximei Technology Co.,Ltd. |
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Effective date of registration: 20190103 Address after: 300384 Tianjin Binhai New Area Tianjin Huayuan Industrial Zone Haitai Development Six Road No. 6 Haitai Green Industrial Base G Block 401 Room-04-24 Co-patentee after: TANGSHAN GUOXIN JINGYUAN ELECTRONICS CO., LTD. Patentee after: TIANJIN XIMEI SEMICONDUCTOR MATERIAL CO., LTD. Address before: Room 401-04-24, G Block, Haitai Green Industrial Base, No. 6 Liudao, Haitai Development Zone, Tianjin Huayuan Industrial Park, 300384 Patentee before: TIANJIN XIMEI SEMICONDUCTOR MATERIAL CO., LTD. |
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