CN102576569A - 原位内存退火 - Google Patents

原位内存退火 Download PDF

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Publication number
CN102576569A
CN102576569A CN2010800429958A CN201080042995A CN102576569A CN 102576569 A CN102576569 A CN 102576569A CN 2010800429958 A CN2010800429958 A CN 2010800429958A CN 201080042995 A CN201080042995 A CN 201080042995A CN 102576569 A CN102576569 A CN 102576569A
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CN
China
Prior art keywords
memory
data
memory device
storage system
annealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800429958A
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English (en)
Chinese (zh)
Inventor
I·夏菲尔
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Rambus Inc
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Rambus Inc
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Filing date
Publication date
Application filed by Rambus Inc filed Critical Rambus Inc
Publication of CN102576569A publication Critical patent/CN102576569A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/34—Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
    • G11C16/349—Arrangements for evaluating degradation, retention or wearout, e.g. by counting erase cycles
    • G11C16/3495—Circuits or methods to detect or delay wearout of nonvolatile EPROM or EEPROM memory devices, e.g. by counting numbers of erase or reprogram cycles, by using multiple memory areas serially or cyclically
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00—Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02—Addressing or allocation; Relocation
    • G06F12/08—Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
    • G06F12/10—Address translation
    • G06F12/1009—Address translation using page tables, e.g. page table structures
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C16/00—Erasable programmable read-only memories
    • G11C16/02—Erasable programmable read-only memories electrically programmable
    • G11C16/06—Auxiliary circuits, e.g. for writing into memory
    • G11C16/10—Programming or data input circuits
    • G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
    • G11C16/16—Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/04—Arrangements for writing information into, or reading information out from, a digital store with means for avoiding disturbances due to temperature effects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2212/00—Indexing scheme relating to accessing, addressing or allocation within memory systems or architectures
    • G06F2212/10—Providing a specific technical effect
    • G06F2212/1016—Performance improvement
    • G06F2212/1024—Latency reduction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)
  • Hardware Redundancy (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
CN2010800429958A 2009-08-21 2010-06-29 原位内存退火 Pending CN102576569A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US23596409P 2009-08-21 2009-08-21
US61/235,964 2009-08-21
US24347909P 2009-09-17 2009-09-17
US61/243,479 2009-09-17
PCT/US2010/040322 WO2011022123A1 (en) 2009-08-21 2010-06-29 In-situ memory annealing

Publications (1)

Publication Number Publication Date
CN102576569A true CN102576569A (zh) 2012-07-11

Family

ID=43607275

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800429958A Pending CN102576569A (zh) 2009-08-21 2010-06-29 原位内存退火

Country Status (5)

Country Link
EP (1) EP2467855A4 (https=)
JP (1) JP2013502647A (https=)
KR (1) KR20120059569A (https=)
CN (1) CN102576569A (https=)
WO (1) WO2011022123A1 (https=)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105373342A (zh) * 2014-08-19 2016-03-02 三星电子株式会社 异构统一存储器
CN106205671A (zh) * 2015-05-26 2016-12-07 华邦电子股份有限公司 存储器系统及其管理方法
CN108701026A (zh) * 2016-04-01 2018-10-23 英特尔公司 用于在存储器约束下管理进程的方法和装置
CN110659226A (zh) * 2018-06-28 2020-01-07 晨星半导体股份有限公司 用以存取数据的方法以及相关电路
CN111258500A (zh) * 2014-09-30 2020-06-09 株式会社日立制作所 分布式存储系统以及数据控制方法
CN112041825A (zh) * 2018-05-02 2020-12-04 株式会社半导体能源研究所 半导体装置
CN114944354A (zh) * 2022-07-21 2022-08-26 江苏邑文微电子科技有限公司 晶圆退火设备的异常校验方法和装置
US20230037270A1 (en) 2020-09-02 2023-02-02 Samsung Electronics Co., Ltd. Multi-non-volatile memory solid state drive block-level failure prediction with separate log per non-volatile memory
TWI857152B (zh) * 2019-10-25 2024-10-01 南韓商三星電子股份有限公司 固態式硬碟及用於固態式硬碟的方法及製品

Families Citing this family (18)

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US8724393B2 (en) 2011-05-02 2014-05-13 Macronix International Co., Ltd. Thermally assisted flash memory with diode strapping
US9001590B2 (en) 2011-05-02 2015-04-07 Macronix International Co., Ltd. Method for operating a semiconductor structure
US8824212B2 (en) 2011-05-02 2014-09-02 Macronix International Co., Ltd. Thermally assisted flash memory with segmented word lines
US8488387B2 (en) * 2011-05-02 2013-07-16 Macronix International Co., Ltd. Thermally assisted dielectric charge trapping flash
TWI508075B (zh) * 2011-06-09 2015-11-11 Macronix Int Co Ltd 熱協助介電電荷捕捉快閃記憶體
CN102831923B (zh) * 2011-06-14 2015-09-30 旺宏电子股份有限公司 热协助介电电荷捕捉闪存
TWI514387B (zh) * 2012-02-09 2015-12-21 Macronix Int Co Ltd 具有分段字線之熱輔助快閃記憶體
CN102662799B (zh) * 2012-04-13 2015-01-21 华为技术有限公司 数据备份的方法、服务器及热备份系统
US9348748B2 (en) 2013-12-24 2016-05-24 Macronix International Co., Ltd. Heal leveling
US9559113B2 (en) 2014-05-01 2017-01-31 Macronix International Co., Ltd. SSL/GSL gate oxide in 3D vertical channel NAND
KR102142590B1 (ko) 2014-06-16 2020-08-07 삼성전자 주식회사 저항성 메모리 장치 및 저항성 메모리 장치의 동작방법
US9043638B1 (en) * 2014-11-14 2015-05-26 Quanta Computer Inc. Method for enhancing memory fault tolerance
US9836349B2 (en) 2015-05-29 2017-12-05 Winbond Electronics Corp. Methods and systems for detecting and correcting errors in nonvolatile memory
KR102873068B1 (ko) * 2016-11-24 2025-10-16 삼성전자주식회사 메모리를 관리하는 방법 및 장치
KR102731057B1 (ko) * 2018-09-21 2024-11-15 삼성전자주식회사 메모리 장치와 통신하는 데이터 처리 장치 및 방법
KR20220150552A (ko) * 2021-05-04 2022-11-11 에스케이하이닉스 주식회사 반도체 메모리 장치 및 이의 동작 방법
US12327594B2 (en) * 2021-10-29 2025-06-10 Macronix International Co., Ltd. 3D flash memory module chip and method of fabricating the same
JP7749492B2 (ja) * 2022-03-01 2025-10-06 キオクシア株式会社 メモリシステム及びメモリシステムの処理方法

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CN1938782A (zh) * 2004-02-04 2007-03-28 爱特梅尔股份有限公司 具有同时写入和擦除功能的非易失性存储器阵列
CN101147133A (zh) * 2005-02-16 2008-03-19 桑迪士克股份有限公司 闪速存储器中的直接文件数据编程及删除
CN101252168A (zh) * 2007-02-21 2008-08-27 旺宏电子股份有限公司 具有加热器的相变化储存单元及其制造方法
CN101354915A (zh) * 2007-04-30 2009-01-28 三星电子株式会社 相变存储器件、使用其的存储系统和读取存储器件的方法
US20090125671A1 (en) * 2006-12-06 2009-05-14 David Flynn Apparatus, system, and method for storage space recovery after reaching a read count limit

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JP3561002B2 (ja) * 1994-05-18 2004-09-02 富士通株式会社 ディスク装置
JP2004310930A (ja) * 2003-04-08 2004-11-04 Renesas Technology Corp 不揮発性半導体記憶装置
US7072219B1 (en) * 2004-12-28 2006-07-04 Macronix International Co., Ltd. Method and apparatus for operating a non-volatile memory array
US7495954B2 (en) * 2006-10-13 2009-02-24 Sandisk Corporation Method for partitioned erase and erase verification to compensate for capacitive coupling effects in non-volatile memory
US7876621B2 (en) * 2007-04-23 2011-01-25 Sandisk Il Ltd. Adaptive dynamic reading of flash memories
JP2009037670A (ja) * 2007-07-31 2009-02-19 Toshiba Corp フラッシュメモリ

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1938782A (zh) * 2004-02-04 2007-03-28 爱特梅尔股份有限公司 具有同时写入和擦除功能的非易失性存储器阵列
CN101147133A (zh) * 2005-02-16 2008-03-19 桑迪士克股份有限公司 闪速存储器中的直接文件数据编程及删除
US20090125671A1 (en) * 2006-12-06 2009-05-14 David Flynn Apparatus, system, and method for storage space recovery after reaching a read count limit
CN101252168A (zh) * 2007-02-21 2008-08-27 旺宏电子股份有限公司 具有加热器的相变化储存单元及其制造方法
CN101354915A (zh) * 2007-04-30 2009-01-28 三星电子株式会社 相变存储器件、使用其的存储系统和读取存储器件的方法

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105373342A (zh) * 2014-08-19 2016-03-02 三星电子株式会社 异构统一存储器
CN105373342B (zh) * 2014-08-19 2019-09-24 三星电子株式会社 异构统一存储器
CN111258500A (zh) * 2014-09-30 2020-06-09 株式会社日立制作所 分布式存储系统以及数据控制方法
CN111258500B (zh) * 2014-09-30 2023-05-09 株式会社日立制作所 分布式存储系统以及数据控制方法
CN106205671A (zh) * 2015-05-26 2016-12-07 华邦电子股份有限公司 存储器系统及其管理方法
CN106205671B (zh) * 2015-05-26 2019-02-19 华邦电子股份有限公司 存储器系统及其管理方法
CN108701026B (zh) * 2016-04-01 2024-04-09 英特尔公司 用于在存储器约束下管理进程的方法和装置
CN108701026A (zh) * 2016-04-01 2018-10-23 英特尔公司 用于在存储器约束下管理进程的方法和装置
CN112041825A (zh) * 2018-05-02 2020-12-04 株式会社半导体能源研究所 半导体装置
CN112041825B (zh) * 2018-05-02 2025-06-27 株式会社半导体能源研究所 半导体装置
CN110659226A (zh) * 2018-06-28 2020-01-07 晨星半导体股份有限公司 用以存取数据的方法以及相关电路
TWI857152B (zh) * 2019-10-25 2024-10-01 南韓商三星電子股份有限公司 固態式硬碟及用於固態式硬碟的方法及製品
US12530129B2 (en) 2019-10-25 2026-01-20 Samsung Electronics Co., Ltd. Firmware-based SSD block failure prediction and avoidance scheme
US20230037270A1 (en) 2020-09-02 2023-02-02 Samsung Electronics Co., Ltd. Multi-non-volatile memory solid state drive block-level failure prediction with separate log per non-volatile memory
US12229030B2 (en) 2020-09-02 2025-02-18 Samsung Electronics Co., Ltd. Multi-non-volatile memory solid state drive block-level failure prediction with separate log per non-volatile memory
CN114944354A (zh) * 2022-07-21 2022-08-26 江苏邑文微电子科技有限公司 晶圆退火设备的异常校验方法和装置
CN114944354B (zh) * 2022-07-21 2022-09-27 江苏邑文微电子科技有限公司 晶圆退火设备的异常校验方法和装置

Also Published As

Publication number Publication date
JP2013502647A (ja) 2013-01-24
EP2467855A4 (en) 2013-08-21
EP2467855A1 (en) 2012-06-27
KR20120059569A (ko) 2012-06-08
WO2011022123A1 (en) 2011-02-24

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Application publication date: 20120711