CN102518955A - Packaging body for luminous source - Google Patents
Packaging body for luminous source Download PDFInfo
- Publication number
- CN102518955A CN102518955A CN2011103099693A CN201110309969A CN102518955A CN 102518955 A CN102518955 A CN 102518955A CN 2011103099693 A CN2011103099693 A CN 2011103099693A CN 201110309969 A CN201110309969 A CN 201110309969A CN 102518955 A CN102518955 A CN 102518955A
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- China
- Prior art keywords
- led wafer
- luminous source
- electrode
- heat pipe
- encapsulation body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004806 packaging method and process Methods 0.000 title abstract 3
- 238000005538 encapsulation Methods 0.000 claims description 30
- 238000009434 installation Methods 0.000 claims description 27
- 239000000758 substrate Substances 0.000 claims description 13
- 239000000843 powder Substances 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 239000013078 crystal Substances 0.000 abstract 3
- 238000005266 casting Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical class C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 230000005855 radiation Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 4
- 239000012530 fluid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910021386 carbon form Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003657 tungsten Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
Images
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a packaging body for a luminous source. The packaging body comprises a metal base, a transparent casing and a light emitting unit, wherein the base is suitably connected with a proper electrical socket; the transparent casing is arranged on the base, so that the transparent casting and the base can form an accommodation space; the light emitting unit is arranged in the accommodation space and comprises a light emitting diode crystal element; and the light emitting diode crystal element can be operably arranged in the accommodation space so that light emitted from six surfaces of the light emitting diode crystal element can be completely led out for use.
Description
The application is that the application number of submitting on May 21st, 2009 is divided an application for " luminous source encapsulation body " for " 200910138968.X ", denomination of invention.
Technical field
The present invention relates to a kind of luminous source encapsulation body.
Background technology
Different with the principle of luminosity of conventional incandescent heating, light emitting diode (LED) but principle of luminosity mainly be to apply electric current on luminescent substance, to reach illumination effect, so LED is called as cold light source.Because LED has advantages such as high-durability, life-span are long, light and handy, power consumption is low, and do not contain harmful substance such as mercury, therefore, make the solid-state illumination of application of LEDs become the important research and development target of following global Lighting Industry and semiconductor industry yet.
Fig. 1 shows a kind of known osram lamp B.This bulb B comprises one and is suitable for metal base B1 that E27 type socket (not shown) connects, combines with this metal base B1 to make and can place in this accommodation space B20 with the transparent shell B2 of an accommodation space B20 of the common formation of this metal base B1, one and be fixed on conductive connecting pin group B3 on this pedestal B1, reach a tungsten filament coil B4 who is connected electrically to this conductive connecting pin group B3.When this B1 was connected with the socket of energized, this tungsten filament coil B4 can switch on shinny and reach illumination purposes.Yet, so conventional illuminator very power consumption and life-span short, do not meet economic principle and do not meet the carbon reduction trend in the present whole world.
Summary of the invention
The luminous source encapsulation body that the purpose of this invention is to provide a kind of not only economy but also environmental protection.
According to characteristic of the present invention, a kind of luminous source encapsulation body is provided, and this luminous source encapsulation body comprises: a metal base, this pedestal are suitable for being connected with suitable electrical outlets; One places the feasible transparent shell that can form an accommodation space with this pedestal on this pedestal; And light emission unit that places in this accommodation space; This light emission unit comprises a LED wafer, and this LED wafer places in this accommodation space so that the light that comes out from six surface emitting of this LED wafer is able to all derived utilization operationally.
According to another characteristic of the invention, a kind of luminous source encapsulation body is provided, and this luminous source encapsulation body comprises: an installation base plate, this installation base plate are transparent high heat-radiating substrates and have an installation surface that is laid with predetermined circuit trace; LED wafer, this LED wafer are installed on the installation surface of this installation base plate and have first electrode and second electrode, and this first electrode is connected to the corresponding electrical circuits track of this substrate via lead; Heat pipe with through hole, this substrate attach to this heat pipe so that the LED wafer on this substrate is positioned at the through hole of this heat pipe, and second electrode of this LED wafer is connected to this heat pipe via lead; And interior phosphor powder layer that can cover this LED wafer that makes of through hole that is formed on this heat pipe.
According to a characteristic more of the present invention, a kind of luminous source encapsulation body is provided, and this luminous source encapsulation body comprises: a microscler heat pipe; And the LED wafer on a plurality of end portion that are installed on this heat pipe with the upside-down mounting mode.
According to a characteristic more again of the present invention, a kind of luminous source encapsulation body is provided, and this luminous source encapsulation body comprises: a cup type shell, this shell have a sealed bottom and an open top relative with this bottom; Heat dissipating layer on inner surface that is formed on this shell; A heat-conducting layer that is formed on this heat dissipating layer; A reflecting layer that is formed on this heat-conducting layer; A light emission unit, this light emission unit comprise the power control circuit device that is used to provide this LED wafer running electric current that an installation base plate, on the reflecting layer that places on the inner surface that is formed on this shell is installed on the LED wafer on this substrate with the upside-down mounting mode and places the outer surface of this shell.
Description of drawings
Fig. 1 is a schematic side plane that shows known incandescent lamp bulb;
Fig. 2 is the signal part stereogram of the light emission unit of a luminous source encapsulation body that shows first preferred embodiment of the present invention;
Fig. 3 is a signal phantom that shows the luminous source encapsulation body of first preferred embodiment of the present invention;
Fig. 4 is the signal part side plan view of the variation example of a luminous source encapsulation body that shows first preferred embodiment of the present invention;
Fig. 5 is the schematic side plane of the another variation example of a luminous source encapsulation body that shows first preferred embodiment of the present invention;
Fig. 6 is a schematic side plane that shows the luminous source encapsulation body of second preferred embodiment of the present invention;
Fig. 7 is a signal part stereogram that shows the luminous source encapsulation body of the 3rd preferred embodiment of the present invention;
Fig. 8 is a diagrammatic side view that shows the luminous source encapsulation body of the 4th preferred embodiment of the present invention;
Fig. 9 is the schematic side plane of the variation example of a luminous source encapsulation body that shows the 4th preferred embodiment of the present invention; And
Figure 10 is the demonstration block schematic diagram of employed circuit in the present invention.
The specific embodiment
In the detailed description of the preferred embodiments of the present invention at the back, identical or similar elements is indicated by identical label, and their detailed description will be omitted.In addition, for clear announcement characteristic of the present invention, the element in the accompanying drawing is not to describe by actual ratio.
Fig. 2 and Fig. 3 are the sketch mapes that shows the luminous source encapsulation body U1 of first preferred embodiment of the present invention, and Fig. 2 is a schematic isometric that is presented at employed light emission unit 4 among the luminous source encapsulation body U1 shown in Fig. 3.
See also Fig. 2 and shown in Figure 3, the luminous source encapsulation body U1 of first preferred embodiment of the present invention comprise a metal base that is used for connecting 1, light emission unit 4 with the socket (not shown), and one be located at and make the transparent shell 5 that can form the accommodation space of ccontaining this light emission unit 4 on this pedestal 1 with this base 1.
This base 1 according to need be designed to be suitable for, for example, the base 1 that the socket as E27, PAR 30, PAR 38, MR16 or the like connects and have a positive electrode contact and a ground contact.In the present embodiment, this base 1 is an example with E27, and its positive electrode contact is located at the bottom and the negative electrode contact is located at sidewall.
This transparent shell 5 can be processed by any suitable material, and is connected to this pedestal 1 and makes and can form this accommodation space jointly with this pedestal 1.
This light emission unit 4 comprises pair of conductive electrode 21,22, reflector 3, reaches LED wafer 40.
This is fixed on this pedestal 1 by rights to conductive electrode 21,22 and is respectively to have the first conduction link 210,220 and the second conduction link 211,221.The first conduction link 210 of this conductive electrode 21 is connected to the positive electrode contact of this base 1, and the first conduction link 220 of this conductive electrode 22 is connected to the negative electrode contact of this base 1.
This reflector 3 insulation ground are set in this to conducting electricity link 211,221 on the conductive electrode 21,22 and near second of said a plurality of conductive electrodes 21,22.
This LED wafer 40 has a first surface and the second surface that second electrode 42 is installed that first electrode 41 is installed.This first electrode 41 is electrically connected so that this LED wafer 40 is supported fixing by this to conductive electrode 21,22 with this second conduction link 211,221 to conductive electrode 21,22 respectively with this second electrode 42.On the first surface of this LED wafer 40 and second surface, be formed with heat radiation film 43.In the present embodiment, this heat radiation film 43 is that 800 to 1200W/mk material forms by coefficient of heat transfer.On four side surfaces of each heat radiation film 43 and this LED wafer 40, be formed with phosphor powder layer 44.
The setting like this that should be noted that this LED wafer 40 can make the light that is come out by six surface emitting of this LED wafer 40 be able to all derived utilization, and then overall brightness is able to promote.
Embodiment shown in Fig. 3 is applicable to dc source, yet the present invention also is applicable to AC power.See also shown in Figure 4ly, in the present embodiment, between this is to conductive electrode 21,22, connect a capacitor C and can directly use AC power at this conductive electrode 21 current-limiting resistance R of series connection and a diode D.
On the other hand, as shown in fig. 5, in these accommodation spaces that form jointly by pedestal 1 and transparent shell 5, non-conductive heat radiation fluid can be set, for example, as non-conductive heat radiation oily or its similar as.In this non-conductive heat radiation fluid, also can be doped with fluorescent material.Certainly, any suitable fluid (air inclusion) should covered within the scope of the present invention.
Fig. 6 shows the luminous source encapsulation body U2 of second preferred embodiment of the present invention.The luminous source encapsulation body U2 of this second preferred embodiment comprises an installation base plate 6, LED wafer 40, and heat pipe 7.
This installation base plate 6 is transparent high heat-radiating substrates, and has an installation surface 60 that is laid with predetermined circuit trace (not shown).
This LED wafer 40 is installed on the installation surface 60 of this installation base plate 6 and has first electrode 400 and second electrode 401.This first electrode 400 is connected to the corresponding electrical circuits track of this substrate 6 via lead 61.
In the present embodiment, this heat pipe 7 has through hole 70.This substrate 6 attaches to this heat pipe 7 so that the LED wafer 40 on this substrate 6 is positioned at the through hole 70 of this heat pipe 7.Second electrode 401 of this LED wafer 40 is connected to this heat pipe 7 via lead 62.
Through hole 70 interior the making that transparent phosphor powder layer 71 is formed on this heat pipe 7 can cover this LED wafer 40.
Fig. 7 shows the luminous source encapsulation body U3 of the 3rd preferred embodiment of the present invention.This luminous source encapsulation body U3 comprises heat pipe 7 ' and a plurality of LED wafers 40.In the present embodiment, the end portion effect of this heat pipe 7 ' is as having five first installation surface of crystalline substance mounting portion of (only showing three first installation surface of crystalline substance wherein in the accompanying drawings).On each brilliant first installation surface, LED wafer 40 is installed with the upside-down mounting mode.
Fig. 8 shows the luminous source encapsulation body U4 of the 4th preferred embodiment of the present invention.This luminous source encapsulation body U4 comprises light emission unit and a cup type shell 8.
This glass type shell 8 expects to form and have sealed bottom and the open top relative with this bottom by making pottery.Should be noted that this shell 8 can also be formed by the pottery material sintering that is doped with iron (Fe) powder.
On the inner surface of this glass type shell 8, be formed with a heat dissipating layer 80.In the present embodiment, this heat dissipating layer 80 can be formed by the material as diamond film and its coefficient of heat conduction is that 400W/ (mK) is to 700W/ (mK).
On this heat dissipating layer 80, be formed with a heat-conducting layer 81.In the present embodiment, this heat-conducting layer 81 can separate that material as the carbon forms and its coefficient of heat conduction is 800 to 1200W/mk by picture row.
On this heat-conducting layer 81, be formed with a reflecting layer 82.Accomplish through plating or plasma coating means in this reflecting layer 82, and can be formed by metal or nonmetallic material.
Should be noted that potter's clay adds Fe or the like metal or nonmetallic materials behind high temperature sintering, form ceramal or non-ceramal and promote the function of the heat conduction and the heat radiation of reflector.
This light emission unit comprises LED wafer 40, installation base plate 45, reaches power control circuit device 46.
This LED wafer 40 is installed on brilliant first installation surface of this installation base plate 45 with the upside-down mounting mode on.This installation base plate 45 is installed on the inner surface of this glass type shell 8; Be positioned at the at of this shell 8, and the predetermined circuit trace that the corresponding pad (not shown) with this LED wafer 40 is electrically connected arranged (on the not shown brilliant first installation surface that is arranged in this installation base plate 45.
This installation base plate 45 also has a pair of conductive connecting pin 47 that extends through the bottom of this shell 8.This is electrically connected the link of conductive connecting pin 47 and the predetermined circuit trace of this installation base plate 45, and the free end of its bottom that extends through this shell 8 is suitable for being connected with the Connection Block of external power source supply.
This power control circuit device 46 places the outer surface of this shell 8, is positioned at the accommodation space 80 of the bottom of this shell 8.This power control circuit device 46 comprises AC/DC change-over circuit 460 and a constant-current circuit 461, as shown in Figure 10.
This AC/DC change-over circuit 460 has and is connected electrically to this input to conductive connecting pin 47.This constant-current circuit 461 has the input of the output that is connected electrically to this AC/DC change-over circuit 460, and is connected electrically to the output of this LED wafer 40.
This power-supply controller of electric also can have PWM function frequency conversion output, can save the energy and reach 20% and reduce the LED heating more than 30%.
This power-supply controller of electric also can have overtemperature protection, overcurrent voltage protection.Owing to overtemperature protection, overcurrent voltage protection are to show to be prone to knowledge to those skilled in the art, its be described in more detail in this and repeat no more for this reason.
Fig. 9 is the variation example for the embodiment of Fig. 8.With different at the embodiment shown in Fig. 8, the outer surface of this reflector is formed with a plurality of at the fin 83 that extends in the radial direction.Said a plurality of fin 83 adds the high-thermal conductive metal sintering by high heat transfer metal or pottery and forms.
On the surface of said a plurality of fins 83, also can be coated with high heat radiation powder to reach heat conduction and heat radiation combines.
Claims (1)
1. luminous source encapsulation body is characterized in that comprising:
An installation base plate, said installation base plate are transparent high heat-radiating substrates and have an installation surface that is laid with predetermined circuit trace;
LED wafer, said LED wafer are installed on the installation surface of said installation base plate and have first electrode and second electrode, and said first electrode is connected to the corresponding electrical circuits track of said substrate via lead;
Heat pipe with through hole; Said substrate attaches to said heat pipe so that the LED wafer on said substrate is positioned at the through hole of said heat pipe, and second electrode of said LED wafer is connected to said heat pipe via lead; And
The interior phosphor powder layer that can cover said LED wafer that makes of through hole that is formed on said heat pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103099693A CN102518955A (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103099693A CN102518955A (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910138968A Division CN101893212B (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102518955A true CN102518955A (en) | 2012-06-27 |
Family
ID=46289977
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103099693A Pending CN102518955A (en) | 2009-05-21 | 2009-05-21 | Packaging body for luminous source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102518955A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054716A (en) * | 1997-01-10 | 2000-04-25 | Rohm Co., Ltd. | Semiconductor light emitting device having a protecting device |
| CN2881341Y (en) * | 2006-03-21 | 2007-03-21 | 广镓光电股份有限公司 | LED module structure |
| CN2886805Y (en) * | 2005-12-16 | 2007-04-04 | 璨圆光电股份有限公司 | Structure in which LED circuit is integrated in radiation baseplate |
| CN201081166Y (en) * | 2007-07-17 | 2008-07-02 | 华刚光电（上海）有限公司 | Multiple-channel heat radiating high power LED device |
| CN101268561A (en) * | 2005-09-20 | 2008-09-17 | 松下电工株式会社 | Led lighting equipment |
| CN101271884A (en) * | 2007-03-22 | 2008-09-24 | 沈育浓 | Luminous source encapsulation body |
-
2009
- 2009-05-21 CN CN2011103099693A patent/CN102518955A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6054716A (en) * | 1997-01-10 | 2000-04-25 | Rohm Co., Ltd. | Semiconductor light emitting device having a protecting device |
| CN101268561A (en) * | 2005-09-20 | 2008-09-17 | 松下电工株式会社 | Led lighting equipment |
| CN2886805Y (en) * | 2005-12-16 | 2007-04-04 | 璨圆光电股份有限公司 | Structure in which LED circuit is integrated in radiation baseplate |
| CN2881341Y (en) * | 2006-03-21 | 2007-03-21 | 广镓光电股份有限公司 | LED module structure |
| CN101271884A (en) * | 2007-03-22 | 2008-09-24 | 沈育浓 | Luminous source encapsulation body |
| CN201081166Y (en) * | 2007-07-17 | 2008-07-02 | 华刚光电（上海）有限公司 | Multiple-channel heat radiating high power LED device |
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| ASS | Succession or assignment of patent right |
Owner name: CHANGCHUNTENG HOLDING CO., LTD. Free format text: FORMER OWNER: SHEN YUNONG Effective date: 20130201 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20130201 Address after: Virgin Islands (British) Applicant after: CHANGCHUNTENG HOLDING Co.,Ltd. Address before: Taipei City, Taiwan, China Applicant before: Shen Yunong |
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Application publication date: 20120627 |