CN102483216B - 具有光导和集成热导的固态灯 - Google Patents

具有光导和集成热导的固态灯 Download PDF

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CN102483216B
CN102483216B CN201080034843.3A CN201080034843A CN102483216B CN 102483216 B CN102483216 B CN 102483216B CN 201080034843 A CN201080034843 A CN 201080034843A CN 102483216 B CN102483216 B CN 102483216B
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photoconduction
thermal conductance
lamp
solid state
light source
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CN102483216A (zh
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雷蒙德·P·约翰斯顿
迈克尔·A·梅斯
马丁·克里斯托弗森
布莱恩·W·利克
凯蒂·B·汤普森
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3M Innovative Properties Co
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085—Means for removing heat created by the light source from the package
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/87—Arrangements for heating or cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/673—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for intake
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • F21Y2115/15—Organic light-emitting diodes [OLED]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/0045—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it by shaping at least a portion of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081—Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0095—Light guides as housings, housing portions, shelves, doors, tiles, windows, or the like

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Planar Illumination Modules (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

本发明提供一种固态灯，所述固态灯具有固态光源例如LED和光导以及热导。所述光导耦合到所述光源，用于接收和分布来自所述光源的光，所述热导与所述光导集成用于从所述固态光源提供热传导并通过对流作用耗散热量以冷却所述灯。

Description

具有光导和集成热导的固态灯
背景技术
在工业、消费品和建筑照明应用中，照明的能量效率已成为一个重要的考量因素。随著固态灯技术的发展，发光二极管(LED)已变得比荧光灯更具能量效率。此外，市场对于白炽灯、荧光灯和高强度放电灯具有庞大的已建立的装置基础。由于LED的固有点光源特性，并且需要以相对低的温度操作，故这些类型的应用对于LED提出了重大的技术挑战。现今有许多解决方案来解决这些问题，包括风扇、散热片、热管等等。然而，这些方法因增加复杂性、成本、效率损失、增加故障模式和不可取的形状系数而限制了应用。仍需要寻找能以吸引人的制造成本和设计提供光学和效率优点的解决方案。
发明内容
根据本发明的灯包括光源、光导和热导。光导耦合到光源以接收和分布来自光源的光，而热导则与光导集成用于从光源提供热传导以便冷却灯。
附图说明
附图包含在本说明书中并构成本说明书的部分，并且它们结合具体实施方式阐明本发明的优点和原理。在这些附图中，
图1是示出具有光导和集成热导的固态光源的示意图；
图2是使用光导片和共延伸热导的固态灯的透视图；
图3是图2的灯的侧视图；
图4是使用光导片和双重共延伸热导的固态灯的透视图；
图5是图4的灯的侧视图；
图6是使用光导的固态灯的横截面侧视图，该光导具有用于发射光的外部和用于冷却的内部；
图7是图6的灯的俯视图；
图8是图6的灯的仰视图；
图9是具有主动冷却元件的固态灯的横截面侧视图；
图10是具有热导的固态灯的侧视图，该热导具有空气通道；
图11是图10的灯的俯视图；
图12是具有热导的固态灯的侧视图，该热导具有空气通道；
图13是图12的灯的俯视图；
图14是具有热导的固态灯的侧视图，该热导具有单个孔；
图15是图14的灯的俯视图；
图16是示出具有光提取装置的光导的示意图；
图17是示出具有用于冷却或作为提取装置的孔的光导的示意图；
图18是示出具有反射层的光导的示意图；
图19是散热器在形成耦合到热导翅片的装置前的俯视图；
图20是图19的散热器在形成所述装置后的俯视图；
图21是图19的散热器在形成所述装置后的侧视图；以及
图22是图19的散热器在形成所述装置后的俯视图。
具体实施方式
图1是示出灯10的组件的示意图，该灯具有电力电路12、固态光源14和包括光导16和集成热导18的热光导。电力电路12从电源接收电力，并提供所需的电压和电流以驱动光学耦合到光导16的固态光源14。具体地讲，固态光源14将光注入接收并分布光的光导16。光导16包括光注入、光传播和光提取区域或元件以便分布光。热导18与光导16集成，以便通过传导作用从固态光源14吸热以及通过对流作用耗散热，从而冷却灯10并有效地利用用于冷却的面积和体积。热导18包括热采集、热扩散和热耗散区域或元件以便冷却灯。通过光导和热导的集成，本发明的实施例克服了诸如上文所述的当前固态灯概念的许多限制。
固态光源14可用例如LED、有机发光二极管(OLED)或其他固态光源实施。某些实施例可从固态光源提供均匀分布的光。或者，可用透镜聚焦所发射的光。例如，在某些实施例中，灯可产生光锥或光幕。透镜可具有透气性以用于冷却，并可包括菲涅耳透镜、棱镜结构或小透镜结构。固态光源可发射多种色彩的光，以用于装饰或其他照明效果。固态光源14与电力电路12电连接，而电力电路可包括柔性电路或其他电路以对固态光源供电。为光源供电的电路可包括调光电路和电子器件以控制有助于产生更多所需光的频率偏移或色彩偏移组件，此类电子器件的例子见述于2008年6月12日提交的名称为“AC Illumination Apparatus with AmplitudePartitioning”(具有振幅分割的交流照明设备)的美国专利申请No.12/137667，该专利如同全文阐述般以引用方式并入本文。
光导16可用例如能够从固态光源接收光并发射光的透明或半透明材料实施。例如，光导16优选地由光学上适宜的材料制成，例如聚碳酸酯、聚丙烯酸酯如聚甲基丙烯酸甲酯、聚苯乙烯、玻璃或具有相对高折射率的许多不同的塑性材料。光导可按多种形状构造，如灯泡状、球体、圆柱体、立方体、片状或其他形状。此外，光导可包含可含有光频率偏移发色团的基质材料，以获得更理想的显色指数，基质稳定染料的例子见述于美国专利No.5,387,458，其如同全文阐述般以引用方式并入本文。
热导18可用能够从固态光源传导热并耗散热的材料实施。例如，热导优选地由热导率为约1W/(m-K)至1000W/(m-K)、更优选地为10W/(m-K)至1000W/(m-K)、最优选地为100W/(m-K)至1000W/(m-K)的材料构成。热导通过传导作用从固态光源吸热，并通过对流作用使热耗散到空气中。可任选地，热导的组件可包括热管。热导与光导集成，这表示热导直接或间接地与固态光源充分接触，以便从固态光源传导和耗散热以使灯运行。例如，热导可从固态光源吸热，以将光源维持在足够冷的温度下，从而按预期运行。热导可与固态光源直接物理接触，或诸如通过上面安装固态光源的环或其他组件与固态光源间接接触。热导也可直接地或经其他组件间接地与光导物理接触。或者，热导不必与光导物理接触，前提条件是热导可从固态光源传导足够的热量以使灯运行。因此，热导以接近于光导面积的至少一部分或优选大部分而共延伸地存在，或者就灯泡状、球体或其他具有内部体积的三维形状而言，热导存在于光导体积的至少一部分或优选大部分内。
热导可包括热传导增强结构，例如金属涂层或金属层或传导粒子，以有助于将固态光源产生的热传导至热导中并沿着热导传导。此外，热导可具有对流热增强结构，例如翅片和微结构，以增加对流热传递系数。热导还可具有光学增强结构，以便增强光导的光输出。例如，热导可由反射性材料形成，或由经改性以具有反射性表面诸如白漆、抛光表面或在其表面上具有薄反射性材料的材料制成。
图2和图3分别是使用光导片24和共延伸热导22的固态灯20的透视图和侧视图。灯20包括与光导片24光学耦合的多个固态光源26。例如，固态光源26可位于光导片24边缘中的半球形或其他类型的凹陷内，并可通过使用光学透明的粘合剂而固定。光导片24通过发射表面28而分布来自固态光源26的光，并可被构造成在表面28上提供大体上均匀的光分布。热导22通过充分共延伸并与光导24物理接近而与光导24集成，以从固态光源26吸走热并耗散热，以将灯28维持在足够冷的温度下以便运行。
图4和图5分别是使用光导片34和双重共延伸热导32和36的固态灯30的透视图和侧视图。灯30包括与光导片34光学耦合的多个固态光源38。例如，固态光源38可位于光导片34边缘中的半球形或其他类型的凹陷内，并可通过使用光学透明的粘合剂而固定。光导片34通过发射端40而分布来自固态光源的光，并可被构造成从端40提供大体上均匀的光分布。热导32和36通过充分共延伸并与光导34物理接近而与光导34集成，以从固态光源38吸走热并耗散热，以将灯30维持在足够冷的温度下以便运行。
对于灯20和30，光导和共延伸的热导可被构造成平坦状以外的多种形状。例如，其可形成为圆形、螺旋形或非平坦形状以实现装饰或其他照明效果。光导可由例如聚碳酸酯、聚丙烯酸酯如聚甲基丙烯酸甲酯、聚苯乙烯、玻璃或具有相对高折射率的许多不同的塑性材料形成。共延伸的热导可例如作为光导上的金属涂层而形成。
图6是使用具有用于发射光的外部和用于冷却的内部的光导的固态灯42的优选实施例的横截面侧视图。图7和图8分别为灯42的俯视图和仰视图。灯42包括光导52、集成的热导54和任选的散热器环46上的固态光源。散热器环46可通过热传导而操作，或具有与其相关的热管或热虹吸管。散热器环包括有效连接至热导的元件，此类元件的例子包括具有热连接到热导的弯曲翅片元件的环。或者，固态光源可在无散热器环的情况下直接耦合到热导。对于固态光源，灯42可包括例如围绕环46而排列的LED 48、50、66、68、70和72，如图8中所示。固态光源光学耦合到光导52；例如，光源可位于光导52边缘中的半球形或其他类型的凹陷内，并可通过使用光学透明的粘合剂而固定。
基座44被构造成连接到电源，并且其可包括电力电路，用于从电源提供所需的电压和电流以驱动固态光源。基座44可用例如与常规灯泡插座配套使用的白炽灯基座实施，或可用与常规荧光灯装置连接器配套使用的基座实施。在光导52与基座44之间提供空气通道56和58，以通过空气通道60提供整个热导54上的自由对流。
在该示例性实施例中，热导用金属翅片54、62和64实施，如图7中所示。翅片与光导52集成，如图7和图8中所示，以便从固态光源48、50、66、68、70、72吸热，并通过空气通道60中的空气流产生的对流作用而耗散热。热导可任选地包括热管或热虹吸管。光导52可用例如聚碳酸酯、聚丙烯酸酯如聚甲基丙烯酸甲酯、聚苯乙烯、玻璃或具有相对高折射率的许多不同的塑性材料实施。灯42的外部可用于分布和发射来自固态光源的光，而灯42的内部则用于冷却热导和固态光源。光导52可形成为灯泡形状，如图6中所示，或形成为其他形状。采用某些形状，例如图6中所示的灯泡形状，光导52的内部可形成内部体积，而热导可与光导的内部体积集成，用于从固态光源提供热传导。
图9是具有主动冷却元件88的固态灯74的横截面侧视图。灯74可具有与灯42类似的构造。灯74包括基座76、光导84、热导86和固态光源，诸如排列在任选的散热器环78上的LED 80和82。主动冷却元件88(例如风扇)除了自由对流外还通过空气通道87吸取空气以用于冷却。主动冷却元件88可通过基座76连接到电源，并且其可在灯74处于操作状态时连续运行，或可包括温度传感器以用于仅当灯74超过某一温度时才使其启动。
图10至15示出具有光导的固态灯的其他构造，该光导具有用于发射光的外部和用于通过集成的热导而冷却的内部。这些构造可以按类似于上文所述的灯42的方式运行。图10和11分别为具有穿孔空气通道开口的固态灯90的侧视图和俯视图。灯90包括用于连接到电源的基座92、用于分布光的光导98、穿过光导98的空气通道100以及与光导98相关的热导。热导包括翅片102、环94和介于基座92和环94之间的穿孔部96。穿孔部96允许空气流穿过空气通道100。热导的翅片102传导来自环94的热，并通过空气通道100中的对流作用而耗散热。
图12和13分别是具有热导(具有多个孔)的固态灯104的侧视图和俯视图。灯104包括用于连接到电源的基座106、用于分布光的光导114、穿过光导114的空气通道116以及与光导114相关的热导。热导包括翅片118、环108以及在基座106与环108之间的具有多个孔112的区段110。孔112允许空气流穿过空气通道116。热导的翅片118传导来自环108的热，并通过空气通道116中的对流作用而耗散热。
图14和15分别为具有热导(具有单个孔)的固态灯120的侧视图和俯视图。灯120包括用于连接到电源的基座122、用于分布光的光导130、穿过光导130的空气通道132以及与光导130相关的热导。热导包括翅片134、环124以及介于基座122与环124之间的具有孔128的区段126。孔128允许空气流穿过空气通道132。热导的翅片134传导来自环124的热，并通过空气通道132中的对流作用而耗散热。
图16至18示出上文所述固态灯的光导的多种任选装置。图16是示出具有光提取装置142的光导140的示意图。此类光提取装置可用于提供由光导发射的光的更大或更均匀的分布，或者这些提取装置可提供特定的光学效应，例如定制光图案以获得特定的照明图案。提取装置的例子包括印刷或以其他方式附着到光导外表面或内表面上的光提取材料的点图案或其他形状。提取装置还可包括通过喷砂或其他技术将光导的外部粗糙化，其他提取装置包括形成于表面上的微结构化装置，如微结构化棱镜或小透镜。
图17是示出具有用于冷却的孔146的光导144的示意图。若固态灯大体上水平地安装，则孔146可通过对流作用提供穿过光导且跨热导的用于冷却的空气流，而非提供大体上沿着光导内表面(如穿过空气通道60)的空气流。孔146还可作为提取装置运行。
图18是示出具有反射层150的光导148的示意图。光导148可在其内表面上包括反射层150，使得通过光导148分布的一部分光由反射层150反射，并从外表面152发射，而非从光导的内表面发射。反射层的例子为可得自3M公司的增强型镜面反射(ESR)薄膜产品。
图19至22示出具有用于安装热导翅片的装置的散热器160。图19是散热器160在形成耦合到热导翅片的装置前的俯视图。图20、21和22分别是形成所述装置后的散热器160的俯视图、侧视图和透视图。散热器160可按类似于上文所述散热器环46的方式操作，但其具有用于安装冷却翅片以便与热导连接的额外装置。
如图19中所示，散热器160具有环部162和三角形区段164、166、168和170。在制造工艺中，散热器160可由金属或其他材料片形成。例如，可使用冲压工艺从金属片上切割散热器160并使区段164、166、168和170弯曲为与环部162成大体直角，如图20至图22中所示，从而形成朝上的突出部。
固态光源可按类似于LED安装于散热器环46上的方式而安装于环部162上。热导的冷却翅片(例如上文所述的翅片)可例如通过焊接、传导性环氧树脂、夹具或以其他方式热连接到区段164、166、168和170。如此，具有安装装置的散热器160有效地变为热导的一部分，并可容易地由材料片制成。四个三角形区段164、166、168和170仅为了进行示意性的说明而示出。可使用更多或更少的装置，并且这些装置根据例如待连接的冷却翅片的构造而可具有多种形状。

Claims (10)

1.一种具有集成光导和热导的灯，包括：
光源；
光导，所述光导耦合到所述光源，用于接收和分布来自所述光源的光；以及
热导，所述热导与所述光导集成，用于从所述光源提供热传导以冷却所述灯，
其中，所述光导包括穿过所述光导的多个孔。
2.根据权利要求1所述的灯，其中所述光源包括一个或多个发光二极管。
3.根据权利要求1所述的灯，其中所述光源包括一个或多个有机发光二极管。
4.根据权利要求1所述的灯，还包括耦合到所述光源的散热器。
5.根据权利要求1所述的灯，其中所述光导包括光提取装置。
6.根据权利要求1所述的灯，还包括位于所述光导一侧上的反射层。
7.根据权利要求1所述的灯，其中所述热导包括反射表面。
8.根据权利要求1所述的灯，其中所述光导包括材料片，所述热导包括与所述光导共延伸的导热材料。
9.根据权利要求1所述的灯，还包括为所述光源提供电力的电路。
10.一种具有集成光导和热导的灯，包括：
光源；
光导，所述光导包含具有外表面和内表面的材料，其中所述光导具有光注入元件、光传播元件和光提取元件以便分布来自所述光源的光；以及
热导，所述热导与所述光导的所述内表面集成，用于从所述光源提供热传导，其中所述热导具有热采集元件、热扩散元件和热耗散元件以冷却所述灯，
其中，所述光导包括穿过所述光导的多个孔。
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