WO2013131376A1 - 一种led灯具 - Google Patents

一种led灯具 Download PDF

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Publication number
WO2013131376A1
WO2013131376A1 PCT/CN2012/083834 CN2012083834W WO2013131376A1 WO 2013131376 A1 WO2013131376 A1 WO 2013131376A1 CN 2012083834 W CN2012083834 W CN 2012083834W WO 2013131376 A1 WO2013131376 A1 WO 2013131376A1
Authority
WO
WIPO (PCT)
Prior art keywords
lamp
heat dissipation
cavity
led
lamp cup
Prior art date
Application number
PCT/CN2012/083834
Other languages
English (en)
French (fr)
Inventor
张文龙
Original Assignee
厦门天力源光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN2012100592787A external-priority patent/CN102644866A/zh
Priority claimed from CN2012100986562A external-priority patent/CN102679212A/zh
Application filed by 厦门天力源光电科技有限公司 filed Critical 厦门天力源光电科技有限公司
Publication of WO2013131376A1 publication Critical patent/WO2013131376A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb

Definitions

  • the invention relates to a lighting device, in particular to an LED lamp with LED as a light source with good heat dissipation effect.
  • LED is a light-emitting diode, which is made of electroluminescent semiconductor material. LED has low voltage, high efficiency, good monochromaticity, strong applicability, good stability, short response time, long life and no pollution. Excellent characteristics such as environment; LED is generally powered by low-voltage power supply, the power supply voltage is generally between 2-24V, which is more safe; LED consumes 80% less energy than incandescent lamps with the same efficacy; each unit LED is small. Lighting fixtures of various shapes can be prepared and adapted to different environments.
  • LEDs have the above excellent characteristics that LEDs are widely used in the fields of illumination, decoration, and the like, including integrated lamps made of LED chips as light sources.
  • LEDs due to the junction temperature and heat dissipation problem of such LED lamps, the promotion and use of LED lamps has been affected.
  • the object of the present invention is to overcome the deficiencies of the prior art and provide an LED lamp, which can better solve the junction temperature and heat dissipation problem of the chip of the LED lamp, not only maintains the excellent characteristics of the integrated LED lamp, but also achieves good heat dissipation. This has effectively promoted the promotion and use of integrated LED lamps.
  • an LED lamp comprising a lamp cover component, a flow guiding cavity, a light source component mounted with the LED chip, and a heat dissipation structure;
  • the heat dissipation structure body is provided with a plurality of heat dissipation in the circumferential direction a first through hole penetrating through the heat dissipation structure;
  • the lamp cover member is disposed on a front side of the light source component on which the LED chip is mounted;
  • a second through hole is disposed on the lamp cover member; and one end of the flow guiding cavity Connected to the second through hole of the lamp cover member, the other end of the flow guiding cavity is connected to the first through hole of the heat dissipation structure, so that the inner space of the heat dissipation structure and the outer space of the lamp cover member realize air convection through the flow guiding cavity.
  • the light source component of the LED chip is a light source panel, one surface of the heat dissipation structure is a mounting surface, and a light source panel mounted with an LED chip is fixed on a mounting surface of the heat dissipation structure, and the first through hole penetrates through the heat dissipation structure Between the mounting surface and the back surface; the light cover component can be a light panel or a light cover.
  • an air deflector or a flow guide cover is further disposed on the back surface of the heat dissipation structure.
  • the guiding cavity is a separate component, one end of the guiding cavity is connected with the lamp panel or the lamp cover, and the other end of the guiding cavity is connected with the heat dissipation structure.
  • the guiding cavity is integrated with the lamp panel or the lamp cover, and one end of the guiding cavity is integrally connected with the lamp panel or the lamp cover, and the other end of the guiding cavity is connected with the heat dissipation structure.
  • the guiding cavity is one or more.
  • the back surface of the heat dissipation structure is further provided with a hollow structure, and the hollow structure is disposed on the back surface of the heat dissipation structure provided with the first through hole.
  • the plurality of fins on the back surface of the heat dissipation structure are respectively disposed at the periphery of the first through hole, and are arranged in a ray-type divergence from the first through hole to the periphery.
  • the heat dissipation structure is a single modular structure.
  • the heat dissipation structure is a combination of a plurality of modular structures, and a manifold is arranged between the modular structures.
  • the heat dissipation structure can be designed as a modular design, and a large number of lamps can be formed by any combination, or can be a single lamp.
  • the busbar may be designed on the heat dissipation structure or the busbar may not be designed.
  • the light source panel is fixed on the mounting surface of the heat dissipation structure by a thermal adhesive.
  • the light source panel is fixed to the mounting surface of the heat dissipation structure by screws.
  • the light source panel is fixed on the mounting surface of the heat dissipation structure by a spring piece or a spring pressing structure.
  • the integrated LED lamp of the invention can be an integrated LED downlight, an integrated LED ceiling lamp, or an integrated LED panel light.
  • the integrated LED panel light or the integrated LED ceiling lamp can be a modular design, and a large number of lamps can be formed by any combination, or can be a single lamp.
  • the busbar may be designed on the heat dissipation structure or the busbar may not be designed.
  • the light source component mounted with the LED chip comprises: an LED chip, a driving PCB box, and a driving PCB board;
  • the lampshade component comprises: a lampshade, a lamp head plastic part, a lamp cap, a lamp cup; a lampshade, a lamp cup, a lamp head plastic part and a lamp cap
  • the lamp cups are connected in sequence;
  • the driving PCB box is mounted between the cavity of the lamp cup and the inner cavity of the lamp cap plastic part, and drives the outer wall of the PCB box and the cavity of the lamp cup
  • a preset gap is disposed between the inner walls, and the driving PCB board is installed between the inner cavity of the driving PCB box and the inner cavity of the lamp head plastic part;
  • the lamp cup includes an upper portion and a lower portion, and a lower portion of the lamp cup forms a heat dissipation structure
  • the sidewall of the cavity is provided with a plurality of heat dissipation strips along the vertical direction, and a heat dissipation s
  • the LED chip is mounted on the mounting surface of the upper end of the upper portion of the lamp cup; at the top end of the lamp cover, a flow guiding cavity is provided for opening into the inner cavity of the lamp cover, and a second through hole is provided thereon, and the bottom end of the guiding cavity is connected to The upper end of the cavity of the lamp cup is such that air outside the LED bulb can flow between the flow guiding cavity, the cavity of the lamp cup and the heat sink of the lamp cup.
  • the PCB board for mounting an LED chip is further included; the LED chip is mounted on the mounting surface of the upper end of the upper portion of the lamp cup by a PCB board, and the LED chip is fixed on the PCB board for mounting the LED chip.
  • a sidewall of the cavity of the lower portion of the lamp cup is a circumferentially closed annular structure
  • the heat dissipation strip is disposed outside a sidewall of the cavity of the lower portion of the lamp cup, and in the sidewall, corresponding to the phase
  • the top end of the heat dissipating slit formed between the adjacent heat dissipating strips is provided with a heat dissipating hole capable of communicating with the cavity of the lamp cup, and the air outside the LED bulb passes through the diversion hole, the guiding cavity, the heat dissipating hole of the lamp cup and the heat dissipating slit of the lamp cup Flow between.
  • the mounting surface of the upper end of the upper portion of the lamp cup is a flat surface or a curved surface.
  • the mounting surface of the upper end of the upper portion of the lamp cup is a plurality of slopes or a plurality of curved surfaces.
  • a plate structure is formed between the mounting surface of the upper end of the upper portion of the lamp cup and the inner wall of the cavity of the lamp cup.
  • the inner wall surface of the cavity of the lamp cup is further provided with a plurality of fins disposed along the vertical direction.
  • the heat sink and the lamp cup are of a unitary structure.
  • the heat sink is of a unitary structure, and the heat sink is fixed to the inner wall surface of the cavity of the lamp cup.
  • the top end of the guiding cavity is provided with a shielding plate, and the shielding plate is provided with one or more ventilation holes.
  • the guiding cavity and the lamp cover are of a unitary structure.
  • the guiding current is a single-type structure, and a large through hole is arranged at a top end of the lamp cover, and a peripheral edge of the guiding cavity is fitted in a large through hole of the lamp cover, and a bottom end of the guiding cavity and a cavity of the lamp cup The upper end is fixed.
  • a plurality of slopes or a plurality of curved surfaces of the upper end of the upper portion of the lamp cup are set to at least two.
  • a cover plate is further included, and the cover plate is mounted on the PCB board for mounting the LED chip, and the cover plate is provided with a lens capable of correspondingly matching with the LED chip on the PCB board on which the LED chip is mounted.
  • the upper and lower portions of the lamp cup are of a unitary structure; the upper and lower portions of the lamp cup may also be of a split structure.
  • the invention has the beneficial effects that an LED lamp is formed by using a lamp cover component, a guiding cavity, a light source component mounted with the LED chip, and a heat dissipation structure, and a plurality of heat dissipation fins are disposed on the heat dissipation structure body.
  • the heat dissipation structure is provided with a first through hole penetrating through the heat dissipation structure body, and a second through hole is disposed on the lamp cover member; one end of the flow guiding cavity is connected to the second through hole, and the other end is connected to the first through hole,
  • the air convection is achieved by the inner space of the heat dissipation structure and the outer space of the lamp cover component through the flow guiding cavity.
  • the hot air heated by the LED will rise upward with the guiding cavity on the panel or the lampshade, enter the heat dissipating structure and diffuse into the outside through the heat sink, and the panel of the lamp is due to the “wind extraction” effect of the air “chimney effect”.
  • the hot air in the diversion chamber of the lampshade is automatically replenished by the cold air outside the lamp, thereby enhancing the air convection and forming a good conduction path of heat conduction and heat dissipation, thereby effectively solving the LED lamp.
  • the heat dissipation problem extends the service life of LED lamps. Since the hollow structure is further provided on the back surface of the heat dissipation structure, and the hollow structure is provided on the back surface of the heat dissipation structure provided with the first through hole, it contributes to convection of air.
  • Embodiment 1 is a schematic structural view of Embodiment 1 of the present invention.
  • FIG. 2 is a schematic exploded perspective view of a first embodiment of the present invention
  • FIG. 3 is a perspective view showing a three-dimensional structure of a heat dissipation structure according to Embodiment 1 of the present invention.
  • FIG. 4 is a schematic perspective structural view of a lamp panel according to Embodiment 1 of the present invention.
  • Figure 5 is a schematic view showing the air guiding state of Embodiment 1 of the present invention.
  • Figure 6 is a schematic structural view of Embodiment 2 of the present invention.
  • Figure 7 is a schematic exploded perspective view of a second embodiment of the present invention.
  • Figure 8 is a schematic view showing the air guiding state of Embodiment 2 of the present invention.
  • Figure 9 is a schematic structural view of Embodiment 3 of the present invention.
  • Figure 10 is a schematic exploded perspective view of a third embodiment of the present invention.
  • Figure 11 is a schematic view showing the air guiding state of Embodiment 3 of the present invention.
  • Figure 12 is a schematic structural view of Embodiment 4 of the present invention.
  • Figure 13 is a schematic exploded perspective view of a fourth embodiment of the present invention.
  • Figure 14 is a schematic view showing the air guiding state of Embodiment 4 of the present invention.
  • Figure 15 is a schematic view showing the external structure of Embodiment 5 of the present invention.
  • Figure 16 is a schematic structural view of Embodiment 5 of the present invention.
  • Figure 17 is a schematic exploded perspective view of a fifth embodiment of the present invention.
  • Figure 18 is a perspective view showing the configuration of a lamp cup according to Embodiment 5 of the present invention.
  • Figure 19 is a cross-sectional view showing a lamp cup according to Embodiment 5 of the present invention.
  • FIG. 20 is a perspective view showing a three-dimensional structure of a guide body according to Embodiment 5 of the present invention.
  • Figure 21 is a cross-sectional view showing a guide body of a fifth embodiment of the present invention.
  • Figure 22 is a schematic view showing the flow of air in the configuration of Embodiment 5 of the present invention.
  • Figure 23 is a schematic external view of Embodiment 6 of the present invention.
  • Figure 24 is a schematic structural view of Embodiment 6 of the present invention.
  • Figure 25 is a schematic exploded perspective view of a sixth embodiment of the present invention.
  • Figure 26 is a schematic view showing the flow of air in the configuration of Embodiment 6 of the present invention.
  • Figure 27 is a perspective view showing the three-dimensional structure of the lamp cup of Embodiment 7 of the present invention.
  • Fig. 28 is an exploded perspective view showing the three-dimensional structure of the lamp cup of the eighth embodiment of the present invention.
  • an LED lamp of the present invention is an integrated LED downlight, comprising a lamp panel 1011, a guiding cavity 1012, a light source panel 1013 mounted with an LED chip, and a heat dissipation structure 1014 is provided with a plurality of LED chips 10131 on the light source panel 1013; one surface of the heat dissipation structure 1014 is a mounting surface 10141, and a light source panel 1013 on which an LED chip is mounted is fixed on a mounting surface 10141 of the heat dissipation structure.
  • a hollow structure 10142 and a plurality of fins 10143 are disposed on the back surface of the heat dissipation structure with respect to the mounting surface, and the hollow structure 10142 is disposed in the middle of the back surface of the heat dissipation structure, and is provided at a middle position of the heat dissipation structure.
  • the mounting surface of the heat dissipation structure and the first through hole 10144 of the back surface are actually, the hollow structure is disposed on the back surface of the heat dissipation structure provided with the first through hole; the lamp panel 1011 is mounted on the light source panel 1013 through the ring 1015.
  • the front side is formed in a state of covering the front side of the light source panel 1013 on which the LED chip is mounted, and the lamp panel 1011 is also connected to the heat dissipation structure 1014 on the rear side of the light source panel via the ring 1015.
  • the ring 1015 and the heat dissipation structure 1014 are fixed by a thread structure; a second through hole 10111 is disposed at an intermediate position of the lamp panel 1011, and the second through hole 10111 is composed of a plurality of small holes; one end of the flow guiding cavity 1012 is connected at At the second through hole 10111 of the luminaire panel, the other end of the flow guiding cavity 1012 is connected to the first through hole 10144 of the heat dissipation structure, so that the space of the hollow structure 10142 on the back surface of the heat dissipation structure and the external space of the luminaire panel 1011 pass through the guide.
  • the flow chamber 1012 achieves air convection.
  • This embodiment has a hollow structure, and of course, a hollow structure may not be provided.
  • the guiding cavity is one.
  • the guiding cavity may also be multiple.
  • each guiding cavity is connected to the second through hole of the lamp panel.
  • the second through holes and the first through holes may be plural or one.
  • the second through hole 10111 is disposed in the middle of the lamp panel 1011, and the first through hole 10144 is disposed in the middle of the heat dissipation structure; of course, the second through hole 10111 may also be disposed at other positions of the lamp panel 1011. Similarly, the first through hole 10144 may be disposed at other positions of the heat dissipation structure 1014.
  • an air deflector 1016 and a rear cover 1017 are further disposed on the back surface of the heat dissipation structure, and the air deflector 1016 and the rear cover 1017 can be fixed together on the back surface of the heat dissipation structure 1014 by screws; of course, air guiding The device 1016 and the back cover 1017 may also be omitted.
  • the guiding cavity 1012 and the luminaire panel 1011 are of an integrated structure, one end of the guiding cavity 1012 is integrally connected with the luminaire panel 1011, and the other end of the guiding cavity 1012 is connected with the heat dissipation structure 1014; of course, the guiding cavity It can also be designed as a separate part, with one end of the flow guiding cavity being connected to the lamp panel and the other end of the flow guiding cavity being connected to the heat dissipation structure.
  • a lens 1018 is also integrally provided on the luminaire panel 1011.
  • the lens may also be a separate component and then attached to the luminaire panel 1011.
  • the hollow structure 10142 on the back surface of the heat dissipation structure is disposed in the middle of the back surface of the heat dissipation structure 1014.
  • the plurality of fins 10143 on the back surface of the heat dissipation structure are radiated in a radial manner from the middle of the back surface of the heat dissipation structure to the periphery.
  • the heat sink is not limited to being arranged in a ray-type divergence from the middle to the periphery of the back surface of the heat dissipation structure, and may be arranged in other forms.
  • the light source panel 1013 is fixed on the mounting surface 10141 of the heat dissipation structure by a thermal conductive adhesive; of course, the light source panel can also be fixed on the mounting surface of the heat dissipation structure by screws.
  • the light source panel 1013 can also be fixed on the mounting surface of the heat dissipation structure by a spring piece or a spring pressing structure.
  • day of light ring 1019 which is used to mount the fixture to the ceiling of the consumer's roof, and is also a part of the current downlight. But this is not a necessary part, or you can not.
  • an LED lamp of the present invention is an integrated LED ceiling lamp, comprising a lamp cover 1021, a flow guiding cavity 1022, a light source panel 1023 and an LED chip mounted thereon.
  • the heat dissipation structure 1024 is provided with a plurality of LED chips on the light source panel 1023; one surface of the heat dissipation structure 1024 is a mounting surface, and the light source panel 1023 on which the LED chip is mounted is fixed on the mounting surface of the heat dissipation structure, and the heat dissipation structure is a hollow structure and a plurality of fins are disposed on the back surface of the mounting surface, and a first through hole penetrating through the mounting surface and the back surface of the heat dissipation structure body is disposed at an intermediate position of the heat dissipation structure; the lamp cover 1021 is disposed on the light source panel The front side of the 1023 is formed in a state of covering the front side of the light source panel 1023 on which the LED chip is mounted, and the lamp cover 1021 is connected to the heat dissipation structure 1024 on the rear side of the light source panel, for example, by screwing or snapping; The second position of the 1021 is provided with a second
  • a rear cover 1027 is further mounted on the back surface of the heat dissipation structure, and the light source panel 1023, the heat dissipation structure 1024 and the rear cover 1027 can be fixed to the ceiling together by screws; the back cover 1027 can also be omitted.
  • the guiding cavity 1022 is a separate component. One end of the guiding cavity 1022 is connected to the lamp cover 1021, and the other end of the guiding cavity 1022 is connected to the heat dissipation structure 1024.
  • the hollow structure of the back surface of the heat dissipation structure is provided in the middle of the back surface of the heat dissipation structure 1024.
  • the plurality of fins on the back surface of the heat dissipation structure are radiated by the radiation from the middle to the periphery of the back surface of the heat dissipation structure.
  • the heat sink is not limited to being arranged in a ray-type divergence from the middle to the periphery of the back surface of the heat dissipation structure, and may be arranged in other forms.
  • the light source panel 1023 is fixed to the mounting surface of the heat dissipation structure by screws; of course, the light source panel 1023 can also be fixed on the mounting surface of the heat dissipation structure by a thermal adhesive.
  • the light source panel 1023 can also be fixed on the mounting surface of the heat dissipation structure by a spring piece or a spring pressing structure.
  • the back cover 1027 is an optional component, which may or may not be assembled.
  • the optional component has the following functions: one is decorative; the other is to increase heat conduction and heat dissipation; and the third is to prevent dust caused by air circulation from contaminating the ceiling.
  • Fig. 8 is a view showing a state in which cold air flows into the hot air.
  • an LED lamp of the present invention is an integrated LED panel lamp, comprising a lamp cover 1031, a guiding cavity 1032, a light source panel 1033 and an LED chip mounted thereon.
  • the heat dissipation structure 1034 is provided with a plurality of LED chips on the light source panel 1033; one surface of the heat dissipation structure 1034 is a mounting surface, and the light source panel 1033 on which the LED chip is mounted is fixed on the mounting surface of the heat dissipation structure, and the heat dissipation structure is a hollow structure and a plurality of fins are disposed on the back surface of the mounting surface, and a first through hole penetrating through the mounting surface and the back surface of the heat dissipation structure body is disposed at an intermediate position of the heat dissipation structure; the lamp cover 1031 is disposed on the light source panel The front side of the 1033 is formed in a state of covering the front side of the light source panel
  • a rear cover 1037 is further disposed on the back surface of the heat dissipation structure, and the heat dissipation structure 1034 and the back cover 1037 can be fixed by screws; the back cover 1037 can also be omitted.
  • the guiding cavity 1032 and the lampshade 1031 are of an integral structure, and the other end of the guiding cavity 1032 is connected with the heat dissipation structure 1034; of course, the guiding cavity can also be designed as a separate component, so that one end of the guiding cavity is The lampshade is connected, and the other end of the flow guiding cavity is connected to the heat dissipation structure.
  • the hollow structure of the back surface of the heat dissipation structure is provided in the middle of the back surface of the heat dissipation structure 1034.
  • the plurality of fins on the back surface of the heat dissipation structure are radiated by the radiation from the middle to the periphery of the back surface of the heat dissipation structure.
  • the heat sink is not limited to being arranged in a ray-type divergence from the middle to the periphery of the back surface of the heat dissipation structure, and may be arranged in other forms.
  • the light source panel 1033 is fixed on the mounting surface of the heat dissipation structure by a thermal adhesive.
  • the light source panel 1033 can also be fixed on the mounting surface of the heat dissipation structure by screws; the light source panel 1033 can also be fixed on the mounting surface of the heat dissipation structure by the elastic piece or the spring pressing structure.
  • the back cover 1037 is an optional component, which may or may not be assembled.
  • the optional components have the following functions: one is decorative; the other is to increase heat dissipation and heat dissipation; and the third is to prevent dust caused by air circulation from contaminating the ceiling.
  • Fig. 11 is a view showing a state in which cold air flows into the hot air.
  • an LED lamp of the present invention is also an integrated LED panel lamp, which is different from Embodiment 3 in that the heat dissipation structure of Embodiment 3 is a single modular structure.
  • the heat dissipation structure 1044 of the present embodiment is a combination of a plurality of modular structures 10441, and a junction groove 1040 is provided between the modular structures 10441.
  • the light source panel 1043 on which the LED chip is mounted has a plurality of pieces, and the lamp cover 1041 and the rear cover 1047 are also combined, and the single one of the lamp cover 1041 and the rear cover 1047 respectively correspond to the respective modular structures 10441 of the heat dissipation structure.
  • Fig. 14 is a view showing a state in which cold air flows into the hot air.
  • an LED lamp of the present invention is an LED bulb with good heat dissipation, including a lampshade 1, a lamp cup 2, an LED chip 3, and a PCB board for mounting an LED chip.
  • the cavity 21 is mounted between the cavity 21 of the lamp cup and the inner cavity 71 of the cap plastic part 7, and is provided with a preset between the outer wall of the driving PCB case 5 and the inner wall of the cavity 21 of the lamp cup.
  • the driving PCB board 6 is mounted between the inner cavity of the driving PCB case 5 and the inner cavity of the base plastic part 7;
  • the lamp cup 2 includes an upper portion 27 and a lower portion 28, and a cavity of the lower portion 28 of the lamp cup 2
  • the side wall is provided with a plurality of heat dissipation strips 26 along the vertical direction, and the heat dissipation slits 22 are formed between the adjacent heat dissipation strips 26 to form a first through hole, and the heat dissipation slit 22 directly communicates with the cavity 21 of the lamp cup.
  • the sidewall of the cavity forms a hollow at the heat dissipation slit, so that the air outside the LED bulb passes through the heat dissipation slit 22 directly to the cavity 21 of the lamp cup 2;
  • the upper end of the upper portion 27 of the lamp cup 2 there are a plurality of oblique The surface 23 (ie, the mounting surface), the plurality of PCB chip mounting boards 4 are respectively fixed on the corresponding inclined surfaces 23 of the upper end of the upper portion 27 of the lamp cup, and each of the LED chips for mounting LED chips 4 is fixed to at least one LED chip 3,
  • at the top end of the lampshade 1 is provided a flow guiding cavity 9 leading into the inner cavity of the lampshade, the bottom end of the guiding cavity 9 being connected to the upper end 24 of the cavity of the lamp cup,
  • the second through hole is disposed on the guiding cavity 9 so that air outside the LED bulb can flow between the guiding cavity 9, the cavity 21 of the lamp cup and the heat dis
  • the inner wall surface of the cavity 21 of the lamp cup is further provided with a plurality of fins 25 disposed along the vertical direction; the heat dissipation area is increased;
  • the heat sink 25 and the lamp cup 2 are of an integral structure; the heat sink 25 is formed on the lamp cup 2, of course, the heat sink and the lamp cup may also be a separate structure, that is, the heat sink is a single structure (independent And the heat sink is fixed to the inner wall surface of the cavity of the lamp cup;
  • the top end of the guiding cavity 9 is provided with a shielding plate 91, and the shielding plate 91 is provided with one or more gas permeable holes 92 (forming a second through hole);
  • the flow guiding cavity 9 is of a unitary structure, and a large through hole 11 (second through hole) is disposed at a top end of the lamp cover 1.
  • the periphery of the top end of the guiding cavity 9 is fitted in the large through hole 11 of the lamp cover.
  • the bottom end of the flow guiding cavity is fixed to the upper end 24 of the cavity of the lamp cup;
  • the plurality of inclined faces 23 of the upper end of the upper portion 27 of the lamp cup 2 are set to six, and the plurality of PCB chips 4 for mounting LED chips are six, and each of the LED chips for mounting LED chips 4 is respectively fixed to the corresponding lamp.
  • the PCB chip 4 for mounting the LED chip is fixed on the inclined surface 23 of the upper end of the upper portion 27 of the lamp cup by means of a glue fixing manner or a snap fixing manner or a screw fixing manner;
  • a cover plate 31 is further included, and each cover plate 31 is respectively covered on a corresponding PCB board 4 for mounting LED chips, and the cover plate 31 is provided with LED chips 3 on the PCB board 4 for mounting LED chips.
  • the corresponding lens 32 that is, the PCB chip 4 for mounting the LED chip is fixed with six LED chips 3, and the cover plate 31 is also provided with six lenses 32. The position of the lens 32 on the cover plate 31 and the PCB for mounting the LED chip are provided.
  • the LED chip 3 on the board 4 corresponds; the cover plate 31 and the lens 32 are provided to further adjust the illumination angle of the lamp, in this case for expanding the light angle, that is, it can be expanded to 270° or higher, closer to or Similar to the light angle of an ordinary incandescent bulb; of course, it is also possible not to install the cover 31 and the lens 32;
  • a matching thread is arranged between the lamp head plastic part 7 and the lamp cap 8, and is screwed and fixed by screwing;
  • the bottom end of the driving PCB case 5 and the base plastic part 7 are fixed by a buckle, and a hole is arranged at the top end of the driving PCB case 5, so that the connecting wire between the PCB board 4 and the driving PCB board 6 for mounting the LED chip can be passed through. ;
  • the driving PCB board 6 is mounted between the inner cavity of the driving PCB box 5 and the inner cavity of the lamp head plastic member 7;
  • the bottom end of the lamp cup 2 is connected to the lamp head plastic member 7, and the lamp cup 2 is fixed on the driving PCB case 5 by screws;
  • the cover plate 31 is carded on the lamp cup 2;
  • the bottom end of the lampshade 1 is fixed to the lamp cup 2 by a snapping manner
  • the periphery of the top end of the guiding cavity 9 is fitted to the hole edge of the large through hole 11 of the lampshade 1, and the bottom end of the guiding cavity 9 is provided with a buckle, which is snapped into the cavity of the lamp cup by the snapping manner.
  • This embodiment includes a PCB board for mounting an LED chip.
  • a PCB board for mounting an LED chip it is also possible not to install a PCB board for an LED chip, but to directly fix the LED chip on the inclined surface 23 of the upper end of the lamp cup; of course, the mounting surface may also be a flat surface. Either a surface or a number of surfaces.
  • An LED light bulb with good heat dissipation is to fix a PCB chip 4 for mounting an LED chip on a slope 23 of an upper end of an upper portion 27 of the lamp cup, and a slope 23 of the upper end of the lamp cup and a cavity 21 of the lamp cup
  • the plate structure formed between the inner walls functions as a heat conducting base, and the inner portion of the lamp cup 2 is designed as a cavity structure and a plurality of longitudinal heat radiating strips 26 are disposed on the side wall of the lower portion of the lamp cup, adjacent
  • a heat dissipating slit 22 is formed between the heat dissipating strips 26, and the back of the heat conducting base is designed as a hollow fin 25, that is, a plurality of fins disposed along the vertical direction are disposed on the inner wall surface of the cavity of the lamp cup.
  • the cavity 21 of the lamp cup that is, the back of the heat-conducting base can communicate with the outside air through the flow guiding cavity 9 and the heat-dissipating slit 22 of the lamp cup, so that the heat generated by the light source of the LED chip 3 is used for mounting the LED chip.
  • the PCB board 4 - the heat-conducting base that is, the plate-like structure formed between the inclined surface of the upper end of the lamp cup and the inner wall of the cavity of the lamp cup - the heat sink 25 on the inner wall surface of the cavity of the lamp cup is emitted, and
  • the back of the thermal base is the cavity of the lamp cup and is connected to the outside air.
  • the exchange of hot and cold air is accelerated, and a good conduction path of heat conduction and heat dissipation is formed, which plays a good and effective convection heat dissipation, and is transmitted to the heat sink of the lamp cup and the heat radiated into the cavity of the lamp cup.
  • the air flowing through the cavity of the lamp cup is heated, and the heated hot air is accelerated to flow to a high place, and the air is further accelerated and increased, and the flow rate and flow rate of the air flowing into and out of the lamp cup cavity are accelerated.
  • the exchange and circulation of air further enhances and increases the convection heat dissipation effect, thereby more effectively solving the heat dissipation problem of the LED lamps, so that the LED lamps of the same specification extend the service life of the LED lamps; or the LEDs of the same power
  • the lamp is designed to be more compact, or to make the same size LED lamp more powerful.
  • the LED bulb with good heat dissipation of the present invention wherein the upper, lower, top, etc. have a description of the orientation, is not a limitation of the present invention, and only represents the relative position between the components of the LED bulb, and the LED bulb can be as
  • the lamp cap shown in the figure is used in the lower style, or the lamp cap can be used in the upper style, and the structure at this time is turned upside down by 180 degrees.
  • Embodiment 6 as shown in FIG. 13 to FIG. 26, this embodiment is an LED light bulb, which is different from Embodiment 5 in that:
  • the shape of the lampshade 1 is different
  • the inclined angle of the inclined surface 23 of the upper end of the upper portion 27 of the lamp cup 2 is small; and the inclined surface 23 is three;
  • the guiding cavity 9 and the lampshade 1 are of a unitary structure, that is, the guiding cavity 9 is integrally formed on the lampshade 1;
  • Embodiment 7 referring to FIG. 27, this embodiment is an LED light bulb, which is different from Embodiment 5 in that:
  • the upper portion 27 and the lower portion 28 of the lamp cup are of a split configuration, i.e., the upper portion 27 and the lower portion 28 are separate components; the upper portion 27 of the lamp cup and the lower portion 28 of the lamp cup are secured by a threaded connection.
  • the upper portion 27 of the lamp cup and the lower portion 28 of the lamp cup may not be fixed by a threaded connection, but the glue bonding phase is fixed or the snap fit is fixed.
  • Embodiment 8 as shown in FIG. 28, this embodiment is an LED light bulb, which is different from Embodiment 7 in that:
  • the side wall of the cavity of the lower portion 28 of the lamp cup is a circumferentially closed annular structure, the heat strip 26 being disposed outside the side wall of the cavity of the lower portion of the lamp cup, in the side wall corresponding to the phase
  • the top end of the heat dissipation slit 22 formed between the adjacent heat dissipation strips 26 is provided with a heat dissipation hole 29 that can communicate with the cavity of the lamp cup.
  • the air outside the LED bulb passes through the flow guiding cavity 9, the cavity 21 of the lamp cup, and the heat dissipation of the lamp cup.
  • the hole 29 flows between the heat dissipation slit 22 of the lamp cup.
  • the sidewall of the cavity is not hollowed out at the heat dissipation slit, and the heat dissipation slit 22 is not in direct communication with the cavity 21 of the lamp cup. Therefore, a heat dissipation hole 29 is provided at the sidewall of the top end of the heat dissipation slit 22, The air outside the LED bulb is led to the cavity 21 of the lamp cup 2 through the heat dissipation slit 22 and the heat dissipation hole 29.
  • the LED lamp of the invention fully utilizes the "wind extraction” effect of the air “chimney effect”, and forms a good conduction path of heat conduction and heat dissipation in the lamp, thereby effectively solving the heat dissipation problem of the LED lamp and prolonging
  • the service life of LED lamps has good industrial applicability.

Abstract

一种LED灯具，包括灯罩部件（1011）、导流腔（1012）、安装有LED芯片的光源部件（1013）和散热结构体（1014），在散热结构体（1014）上设有多条散热片（10143），散热结构体（1014）设有贯穿于散热结构体（1014）内的第一透孔（10144），在灯罩部件（1011）上设有第二透孔（10111）；导流腔（1012）的一端连接在第二透孔（10111）处，导流腔（1012）的另一端连接至散热结构体（1014）的第一透孔（10144），以使得散热结构体（1014）的背面空间与灯罩部件（1011）的外部空间通过导流腔（1012）实现空气对流。这种结构充分利用了空气烟囱效应，在LED灯具中形成了良好的导热和散热途径，有效解决了LED灯具的散热问题，并且延长了LED灯具的使用寿命。

Description

一种LED灯具 技术领域
本发明涉及一种照明装置，特别是涉及一种具有良好散热作用的以LED为光源的一种LED灯具。
背景技术
LED即发光二极管，是一种采用电致发光的半导体材料制作而成的，LED具有电压低、效能高、单色性好、适用性强、稳定性好、响应时间短、寿命长、不污染环境等优良特性；LED一般情况下采用低压电源供电，供电电压一般在2-24V之间，更具安全性；LED消耗能量较同光效的白炽灯减少80%；每个单元LED很小，可以制备成各种形状的照明器具，并且适合于不同的环境。
正是由于LED具有如上的优良特性，因此LED被广泛地应用于照明、装饰等领域中，包括采用以LED芯片为光源制成的一体化灯具。但是，由于这种LED灯具存在着结温散热问题，因此影响了LED灯具的推广使用。
发明内容
本发明的目的在于克服现有技术之不足，提供一种LED灯具，能够较好地解决LED灯具的芯片的结温散热问题，既保持一体化LED灯具的优良特性，又能够很好地实现散热，从而有力地促进了一体化LED灯具的推广使用。
本发明解决其技术问题所采用的技术方案是：一种LED灯具，包括灯罩部件、一导流腔、一安装有LED芯片的光源部件和一散热结构体；该散热结构体周向设有多条散热片，该散热结构体设有贯穿于散热结构体的第一透孔；灯罩部件设置在安装有LED芯片的光源部件的前侧；在灯罩部件上设有第二透孔；导流腔的一端连接在灯罩部件的第二透孔处，导流腔的另一端连接至散热结构体的第一透孔，以使得散热结构体的内部空间与灯罩部件的外部空间通过导流腔实现空气对流。
所述的LED芯片的光源部件为光源面板，所述散热结构体的一面设为安装面，安装有LED芯片的光源面板固定在散热结构体的安装面上，第一透孔贯穿于散热结构体的安装面与背面之间；所述灯罩部件可以是灯具面板或灯罩。
进一步的，在散热结构体的背面还装有空气导流器或导流盖板。当然，也可以没有装空气导流器或导流盖板。
所述的导流腔为单独的零件，导流腔的一端与灯具面板或灯罩相连接，导流腔的另一端与散热结构体相连接。
所述的导流腔与灯具面板或灯罩为一体式结构，导流腔的一端与灯具面板或灯罩一体相连接，导流腔的另一端与散热结构体相连接。
所述的导流腔为一个或者多个。
所述的散热结构体的背面还设有镂空结构，该镂空结构设在设有第一透孔的散热结构体的背面。
所述的散热结构体的背面的多条散热片分别设在第一透孔的周边，且由第一透孔向周边呈射线型发散布置。
所述的散热结构体为单个模块式结构。
所述的散热结构体为多个模块式结构的组合体，在模块式结构之间设有汇流槽。散热结构体可设计为模块式设计，经任意组合可以形成较大的灯具，也可以单独为一个灯具。对于组合形成较大的灯具时，可以在散热结构体上设计汇流槽，也可以不设计汇流槽。
所述的光源面板通过导热胶固定在散热结构体的安装面上。
所述的光源面板通过螺丝固定在散热结构体的安装面上。
所述的光源面板通过弹片或弹簧压紧结构固定在散热结构体的安装面上。
本发明的一种一体化LED灯具，可以是一体化LED筒灯，也可以是一体化LED吸顶灯，还可以是一体化LED平板灯。当作为一体化LED平板灯或一体化LED吸顶灯时，一体化LED平板灯或一体化LED吸顶灯可以是模块式设计，经任意组合可以形成较大的灯具，也可以单独为一个灯具。对于组合形成较大的灯具时，可以在散热结构体上设计汇流槽，也可以不设计汇流槽。
本发明的又一技术方案为：
所述安装有LED芯片的光源部件包括：LED芯片、驱动PCB盒、驱动PCB板；所述灯罩部件包括：灯罩、灯头塑件、灯头、灯杯；灯罩、灯杯、灯头塑件和灯头之间依序相连接；灯杯设有上下通透的空腔；驱动PCB盒装在灯杯的空腔和灯头塑件的内腔之间，且驱动PCB盒的外壁与灯杯的空腔的内壁之间设有预置的间隙，驱动PCB板则装在驱动PCB盒的内腔和灯头塑件的内腔之间；所述灯杯包括上部和下部，所述灯杯的下部形成散热结构体其空腔的侧壁设有若干条沿着竖向的散热条，相邻的散热条之间形成散热缝为第一透孔，该散热缝直接与灯杯的空腔相连通；在灯杯的上部的上端设有安装面， LED芯片安装在灯杯的上部的上端的安装面上；在灯罩的顶端设有通入灯罩的内腔的导流腔，其上设有第二透孔，该导流腔的底端接至灯杯的空腔的上端，以使得LED灯泡外部的空气能够通过导流腔、灯杯的空腔和灯杯的散热缝之间进行流动。
进一步的，还包括有安装LED芯片用PCB板；该安装LED芯片用PCB板固接在灯杯的上部的上端的安装面上，所述LED芯片固定在安装LED芯片用PCB板上。
所述灯杯的下部的空腔的侧壁为沿周向封闭的环形结构，所述散热条设在灯杯的下部的空腔的侧壁外，在在所述侧壁中，对应于相邻的散热条之间所形成散热缝的顶端设有能够连通灯杯的空腔的散热孔，LED灯泡外部的空气通过导流孔、导流腔、灯杯的散热孔和灯杯的散热缝之间进行流动。
所述灯杯的上部的上端的安装面为平面或曲面。
所述灯杯的上部的上端的安装面为若干个斜面或若干个曲面。
所述灯杯的上部的上端的安装面与灯杯的空腔的内壁之间形成板式结构。
所述灯杯的空腔的内壁面上还设有若干条沿着竖向设置的散热片。
所述的散热片与灯杯为一体式结构。
所述的散热片为单体式结构，散热片与灯杯的空腔的内壁面相固定。
所述导流腔的顶端设有遮板，该遮板上设有一个或多个透气小孔。
所述的导流腔与灯罩为一体式结构。
所述的导流为单体式结构，在灯罩的顶端设有大透孔，导流腔的顶端的周沿配合在灯罩的大透孔中，导流腔的底端与灯杯的空腔的上端相固定。
所述灯杯的上部的上端的若干个斜面或若干个曲面至少设为两个。
进一步的，还包括罩板，罩板罩在安装LED芯片用PCB板上，罩板上装有能够与安装LED芯片用PCB板上的LED芯片对应配合的透镜。
所述的灯杯的上部和下部为一体式结构；所述的灯杯的上部和下部也可以为分体式结构。
本发明的有益效果是，由于采用灯罩部件、一导流腔、一安装有LED芯片的光源部件和一散热结构体来构成一种LED灯具，且在散热结构体上设有多条散热片，该散热结构体设有贯穿于散热结构体的第一透孔，在灯罩部件上设有第二透孔；导流腔的一端连接在第二透孔处，另一端连接至第一透孔，以使得散热结构体的内部空间与灯罩部件的外部空间通过导流腔实现空气对流。当LED光源点亮发热时，加热了周围的空气，由于空气的“烟囱效应”， LED所加热的热空气会随著灯具面板或灯罩上的导流腔向上升，进入散热结构体并经过散热片发散到外界中，而由于空气“烟囱效应”的“拔风”作用，灯具面板或灯罩的导流腔中的热空气散溢后，将自动由灯具外界的冷空气不断补充，从而加强了空气对流，形成一个良好的导热和散热的传导途径，从而有效地解决了LED灯具的散热问题，延长了LED灯具的使用寿命。由于在散热结构体的背面还设有镂空结构，且该镂空结构是设在设有第一透孔的散热结构体的背面，有助于空气的对流。
以下结合附图及实施例对本发明作进一步详细说明；
附图说明
图1是本发明实施例1的构造示意图；
图2是本发明实施例1的立体构造分解示意图；
图3是本发明实施例1的散热结构体的立体构造示意图；
图4是本发明实施例1的灯具面板的立体构造示意图；
图5是本发明实施例1的空气导流状态示意图；
图6是本发明实施例2的构造示意图；
图7是本发明实施例2的立体构造分解示意图；
图8是本发明实施例2的空气导流状态示意图；
图9是本发明实施例3的构造示意图；
图10是本发明实施例3的立体构造分解示意图；
图11是本发明实施例3的空气导流状态示意图；
图12是本发明实施例4的构造示意图；
图13是本发明实施例4的立体构造分解示意图；
图14是本发明实施例4的空气导流状态示意图；
图15是本发明实施例5外部结构示意图；
图16是本发明实施例5的构造示意图；
图17是本发明实施例5的立体构造分解示意图；
图18是本发明实施例5的灯杯的立体构造示意图；
图19是本发明实施例5的灯杯的剖视图；
图20是本发明实施例5的导流腔为单体式结构的立体构造示意图；
图21是本发明实施例5的导流腔为单体式结构的剖视图；
图22是本发明实施例5的构造中的空气流动示意图；
图23是本发明实施例6的外形示意图；
图24是本发明实施例6的构造示意图；
图25是本发明实施例6的立体构造分解示意图；
图26是本发明实施例6的构造中的空气流动示意图；
图27是本发明实施例7的灯杯的立体构造分解示意图；
图28是本发明实施例8的灯杯的立体构造分解示意图。
具体实施方式
实施例1，参见图1至图5所示，本发明的一种LED灯具，为一体化LED筒灯，包括一灯具面板1011、一导流腔1012、一安装有LED芯片的光源面板1013和一散热结构体1014，在光源面板1013上装有多个LED芯片10131；该散热结构体1014的一面设为安装面10141，安装有LED芯片的光源面板1013固定在散热结构体的安装面10141上，在散热结构体的相对于所述安装面的背面设有镂空结构10142以及多条散热片10143，镂空结构10142是设在散热结构体的背面的中间，在散热结构体的中间位置设有贯穿于散热结构体的安装面与背面的第一透孔10144，实际上也就是，镂空结构设在设有第一透孔的散热结构体的背面；灯具面板1011是通过环圈1015安装在光源面板1013的前侧，形成遮盖在安装有LED芯片的光源面板1013的前侧的状态，灯具面板1011也是通过环圈1015与光源面板后侧的散热结构体1014相连接，环圈1015与散热结构体1014是通过螺纹结构相固定的；在灯具面板1011的中间位置设有第二透孔10111，第二透孔10111是由许多小孔构成；导流腔1012的一端连接在灯具面板的第二透孔10111处，导流腔1012的另一端连接至散热结构体的第一透孔10144，以使得散热结构体背面的镂空结构10142的空间与灯具面板1011的外部空间通过导流腔1012实现空气对流。
本实施例具有镂空结构，当然，也可以不设置镂空结构。
本实施例中，导流腔为一个，当然，导流腔也可以为多个，当采用的是多个导流腔时，每个导流腔都是连接在灯具面板的第二透孔与散热结构体的第一透孔之间，当然，第二透孔和第一透孔可以是多个，也可以是一个。
本实施例中，第二透孔10111是设在灯具面板1011的中间，第一透孔10144是设在散热结构体的中间；当然，第二透孔10111也可以设在灯具面板1011的其他位置，同样，第一透孔10144也可以设在散热结构体1014的其他位置。
进一步的，在散热结构体的背面还装有空气导流器1016和后盖1017，可以通过螺丝将空气导流器1016和后盖1017一起固定在散热结构体1014的背面；当然，空气导流器1016和后盖1017也可以不要。
所述的导流腔1012与灯具面板1011为一体式结构，导流腔1012的一端与灯具面板1011一体相连接，导流腔1012的另一端与散热结构体1014相连接；当然，导流腔也可以设计为单独的零件，让导流腔的一端与灯具面板相连接，导流腔的另一端与散热结构体相连接。
灯具面板1011上还一体设有透镜1018，当然，透镜也可以是单独的零件，然后再装到灯具面板1011上。
所述的散热结构体的背面的镂空结构10142设在散热结构体1014的背面的中间。
所述的散热结构体的背面的多条散热片10143由散热结构体的背面的中间向周边呈射线型发散。当然，散热片不局限于由散热结构体的背面的中间向周边呈射线型发散布置，也可以是其他形式布置。
所述的光源面板1013通过导热胶固定在散热结构体的安装面10141上；当然，光源面板也可以通过螺丝固定在散热结构体的安装面上。光源面板1013还可以通过弹片或弹簧压紧结构固定在散热结构体的安装面上。
还包括一天花灯圈1019，天花灯圈1019的作用是用于将灯具安装固定在消费者屋顶的天花板上的，是目前普通筒灯上也配备的零件。但这并不是必备的零件，也可以不要。
如图5所示，当LED光源点亮发热时，加热了周围的空气，由于空气的“烟囱效应”， LED所加热的热空气会随着灯具面板1011上的导流腔1012向上升，进入散热结构体1014在空气导流器1016的导引下经过散热叶片10143发散到外界中，而由于空气“烟囱效应”的“拔风”作用，灯具面板1011的导流腔1012中的热空气散溢后，将自动由灯具外界的冷空气不断补充，从而加强了空气对流，形成一个良好的导热和散热的传导途径；图5为冷空气流入热空气流出的状态示意图。
实施例2，参见图6至图8所示，本发明的一种LED灯具，为一体化LED吸顶灯，包括一灯罩1021、一导流腔1022、一安装有LED芯片的光源面板1023和一散热结构体1024，在光源面板1023上装有多个LED芯片；该散热结构体1024的一面设为安装面，安装有LED芯片的光源面板1023固定在散热结构体的安装面上，在散热结构体的相对于所述安装面的背面设有镂空结构以及多条散热片，在散热结构体的中间位置设有贯穿于散热结构体的安装面与背面的第一透孔；灯罩1021设在光源面板1023的前侧，形成遮盖在安装有LED芯片的光源面板1023的前侧的状态，灯罩1021与光源面板后侧的散热结构体1024相连接，比如可以通过螺纹连接或卡接的方式；在灯罩1021的中间位置设有第二透孔，第二透孔是由许多小孔构成；导流腔1022的一端连接在灯罩的第二透孔处，导流腔1022的另一端连接至散热结构体的第一透孔，以使得散热结构体背面的镂空结构的空间与灯罩1021的前面的空间通过导流腔1022实现空气对流。
进一步的，在散热结构体的背面还装有后盖1027，可以通过螺丝将光源面板1023、散热结构体1024和后盖1027一同固定到天花板上；后盖1027也可以不要。
所述的导流腔1022为单独的零件，导流腔1022的一端与灯罩1021相连接，导流腔1022的另一端与散热结构体1024相连接。
所述的散热结构体的背面的镂空结构设在散热结构体1024的背面的中间。
所述的散热结构体的背面的多条散热片由散热结构体的背面的中间向周边呈射线型发散。当然，散热片不局限于由散热结构体的背面的中间向周边呈射线型发散布置，也可以是其他形式布置。
所述的光源面板1023是通过螺丝固定在散热结构体的安装面上；当然，光源面板1023也可以通过导热胶固定在散热结构体的安装面上。光源面板1023还可以通过弹片或弹簧压紧结构固定在散热结构体的安装面上。
后盖1027是选装件，可以装配也可以不装配，该选装件的作用有：一是装饰性；二是增加导热散热作用；三是防止空气流通带来的灰尘污染天花板。
图8为冷空气流入热空气流出的状态示意图。
实施例3，参见图9至图11所示，本发明的一种LED灯具，为一体化LED平板灯，包括一灯罩1031、一导流腔1032、一安装有LED芯片的光源面板1033和一散热结构体1034，在光源面板1033上装有多个LED芯片；该散热结构体1034的一面设为安装面，安装有LED芯片的光源面板1033固定在散热结构体的安装面上，在散热结构体的相对于所述安装面的背面设有镂空结构以及多条散热片，在散热结构体的中间位置设有贯穿于散热结构体的安装面与背面的第一透孔；灯罩1031设在光源面板1033的前侧，形成遮盖在安装有LED芯片的光源面板1033的前侧的状态，灯罩1031与光源面板后侧的散热结构体1034相连接，比如可以通过螺纹连接或卡接的方式；在灯罩1031的中间位置设有第二透孔，第二透孔是由许多小孔构成；导流腔1032的一端连接在灯罩的第二透孔处，导流腔1032的另一端连接至散热结构体的第一透孔，以使得散热结构体背面的镂空结构的空间与灯罩1031的前面的空间通过导流腔1032实现空气对流。
进一步的，在散热结构体的背面还装有后盖1037，可以通过螺丝将散热结构体1034和后盖1037固定在一起；后盖1037也可以不要。
所述的导流腔1032与灯罩1031为一体式结构，导流腔1032的另一端与散热结构体1034相连接；当然，导流腔也可以设计为单独的零件，让导流腔的一端与灯罩相连接，导流腔的另一端与散热结构体相连接。
所述的散热结构体的背面的镂空结构设在散热结构体1034的背面的中间。
所述的散热结构体的背面的多条散热片由散热结构体的背面的中间向周边呈射线型发散。当然，散热片不局限于由散热结构体的背面的中间向周边呈射线型发散布置，也可以是其他形式布置。
所述的光源面板1033是通过导热胶固定在散热结构体的安装面上。当然，光源面板1033也可以通过螺丝固定在散热结构体的安装面上；光源面板1033还可以通过弹片或弹簧压紧结构固定在散热结构体的安装面上。
后盖1037是选装件，可以装配也可以不装配，该选装件的作用有：一是装饰性；二是增加导热散热作用；三是防止空气流通带来的灰尘污染天花板。
图11为冷空气流入热空气流出的状态示意图。
实施例4，参见图12至图14所示，本发明的一种LED灯具，也是一体化LED平板灯，与实施例3的不同之处在于，实施例3的散热结构体为单个模块式结构，本实施例的散热结构体1044为多个模块式结构10441的组合体，在模块式结构10441之间设有汇流槽1040。此种结构中，安装有LED芯片的光源面板1043有多块，灯罩1041和后盖1047也是组合体，灯罩1041和后盖1047中的单件则分别与散热结构体的各个模块式结构10441对应配合，这样，就可以由多个模块组合形成较大的灯具。当然，也可以不设计汇流槽。
图14为冷空气流入热空气流出的状态示意图。
实施例5，参见图15至图22所示，本发明的一种LED灯具，为一种具有良好散热的LED灯泡，包括灯罩1、灯杯2、LED芯片3、安装LED芯片用PCB板4、驱动PCB盒5、驱动PCB板6、灯头塑件7和灯头8；灯罩1、灯杯2、灯头塑件7和灯头8之间依序相连接；灯杯2设有上下通透的空腔21；驱动PCB盒5装在灯杯的空腔21和灯头塑件7的内腔71之间，且驱动PCB盒5的外壁与灯杯的空腔21的内壁之间设有预置的间隙，驱动PCB板6则装在驱动PCB盒5的内腔和灯头塑件7的内腔之间；所述灯杯2包括上部27和下部28，所述灯杯2的下部28的空腔的侧壁设有若干条沿着竖向的散热条26，相邻的散热条26之间形成散热缝22形成第一透孔，该散热缝22直接与灯杯的空腔21相连通，也就是空腔的侧壁在散热缝处形成镂空，使LED灯泡外部的空气通过散热缝22直接通至灯杯2的空腔21；在灯杯2的上部27的上端设有若干个斜面23（即安装面），若干块安装LED芯片用PCB板4分别固定在灯杯的上部27的上端的对应斜面23上，每块安装LED芯片用PCB板4至少固接一个LED芯片3，以使灯的光角度增加至180°以上；在灯罩1的顶端设有通入灯罩的内腔的导流腔9，该导流腔9的底端接至灯杯的空腔的上端24，导流腔9上设有第二透孔，以使得LED灯泡外部的空气能够通过导流腔9、灯杯的空腔21和灯杯的散热缝22之间进行流动（如图22中的箭头所指）。
其中，
所述灯杯的上部27的上端的斜面23与灯杯的空腔21的内壁之间形成板式结构；
所述灯杯的空腔21的内壁面上还设有若干条沿着竖向设置的散热片25；增加散热面积；
所述的散热片25与灯杯2为一体式结构；散热片25是成型在灯杯2上，当然，散热片与灯杯也可以是分体结构，即散热片为单体式结构（独立的零件），再将散热片与灯杯的空腔的内壁面相固定；
所述导流腔9的顶端设有遮板91，该遮板91上设有一个或多个透气小孔92（形成第二透孔）；
所述的导流腔9为单体式结构，在灯罩1的顶端设有大透孔11（第二透孔），导流腔9的顶端的周沿配合在灯罩的大透孔11中，导流腔的底端与灯杯的空腔的上端24相固定；
所述灯杯2的上部27的上端的若干个斜面23设为六个，所述若干块安装LED芯片用PCB板4为六块，每块安装LED芯片用PCB板4分别固定在对应的灯杯的上端的斜面23中；
所述安装LED芯片用PCB板4以点胶固定方式或卡扣固定方式或螺丝固定方式固定在所述灯杯的上部27的上端的斜面23上；
进一步的，还包括六块罩板31，每块罩板31分别罩在对应的一块安装LED芯片用PCB板4上，罩板31上装有能够与安装LED芯片用PCB板4上的LED芯片3对应配合的透镜32，即安装LED芯片用PCB板4固定有六个LED芯片3，罩板31上也设有六个透镜32，则罩板31上的透镜32的位置与安装LED芯片用PCB板4上的LED芯片3相对应；设置有罩板31和透镜32可以进一步地调节灯的照射光角，本例为用于扩大光角度，即可以扩大至270°或者更高，更接近或类同普通白炽灯泡的光角度；当然也可以不要安装罩板31和透镜32；
灯头塑件7和灯头8之间设有相配合的螺纹，通过螺纹连接后再铆压固定；
驱动PCB盒5的底端与灯头塑件7采用卡扣相固定，驱动PCB盒5的顶端设有一个孔，可以让安装LED芯片用PCB板4与驱动PCB板6之间的连接导线穿过；
驱动PCB板6是卡装在驱动PCB盒5的内腔和灯头塑件7的内腔之间；
灯杯2的底端与灯头塑件7相接，灯杯2是通过螺钉固定在驱动PCB盒5上；
罩板31是卡装在灯杯2上；
灯罩1的底端通过卡扣方式固定在灯杯2上；
导流腔9的顶端的周沿贴合在灯罩1的大透孔11的孔沿处，导流腔9的底端则设有卡扣，通过卡扣方式卡接在灯杯的空腔的上端24；
本实施例含有安装LED芯片用PCB板，当然，也可以不要安装LED芯片用PCB板，而是将LED芯片直接固定在灯杯的上端的斜面23上；当然，安装面也可以是一个平面，或者是一个曲面，或者是若干个曲面。
本发明的一种具有良好散热的LED灯泡，是将安装LED芯片用PCB板4固定在灯杯的上部27的上端的斜面23上，灯杯的上端的斜面23与灯杯的空腔21的内壁之间所形成的板式结构起着导热基座的作用，灯杯2的内部设计为空腔结构并在灯杯的下部的侧壁设有若干条沿着竖向的散热条26，相邻的散热条26之间形成散热缝22，同时将导热基座的背部设计成镂空式的散热片25，也就是在灯杯的空腔的内壁面上设置若干条沿着竖向设置的散热片25，这种结构，灯杯的空腔21即导热基座的背部可以通过导流腔9和灯杯的散热缝22与外界空气连通，从而使LED芯片3光源发出的热量通过安装LED芯片用PCB板4——导热基座即灯杯的上端的斜面与灯杯的空腔的内壁之间所形成的板式结构——灯杯的空腔的内壁面上的散热片25散发出去，并且由于导热基座的背部即灯杯的空腔与外界空气是连通的，从而加快了冷热空气的交换流通，形成一个良好的导热和散热的传导途径，起到良好、有效的对流散热作用，同时传导至灯杯散热片和散发至灯杯空腔内的热量对流经灯杯腔体的空气进行加热，而被加热后的热空气会加速向高处流动，周而复始，进一步地加速和加大流入和流出灯杯腔体的空气流速和流量即加快了冷热空气的交换流通，也就更进一步地提高和加大对流散热作用，从而更有效地解决了LED灯具的散热问题，使得同规格的LED灯延长了LED灯的使用寿命；或者使得同功率的LED灯设计到更小型化，或者使得同尺寸的LED灯设计到更大功率。
本发明的一种具有良好散热的LED灯泡，其中的上、下、顶等具有方位的描述，并不是对本发明的限制，仅表示LED灯泡的部件之间的相对位置而已，该LED灯泡可以如图所示灯头在下方样式使用，也可以是灯头在上方样式使用，此时的结构呈上下翻转180度。
实施例6，参见图13至图26所示，本实施例为一种LED灯泡，与实施例5的不同之处在于：
灯罩1的外形不同；
灯杯2的上部27的上端的斜面23的倾斜角度较小；且斜面23为三个；
导流腔9与灯罩1为一体式结构，即，导流腔9是一体制作在灯罩1上；
安装LED芯片用PCB板4上没有加装罩板及其透镜。
实施例7，参见图27所示，本实施例为一种LED灯泡，与实施例5的不同之处在于：
灯杯的上部27和下部28为分体式结构，即上部27和下部28为各自独立的零件；灯杯的上部27和灯杯的下部28之间通过螺纹连接相固定。当然，灯杯的上部27和灯杯的下部28之间也可以不是螺纹连接相固定，而是胶水粘接相固定或卡扣配合相固定。
实施例8，参见图28所示，本实施例为一种LED灯泡，与实施例7的不同之处在于：
灯杯的下部28的空腔的侧壁为沿周向封闭的环形结构，所述散热条26设在灯杯的下部的空腔的侧壁外，在在所述侧壁中，对应于相邻的散热条26之间所形成散热缝22的顶端设有能够连通灯杯的空腔的散热孔29，LED灯泡外部的空气通过导流腔9、灯杯的空腔21、灯杯的散热孔29和灯杯的散热缝22之间进行流动。这种结构，是空腔的侧壁在散热缝处没有形成镂空，散热缝22与灯杯的空腔21没有直接连通，因此，要在散热缝22的顶端的侧壁处设置散热孔29，使LED灯泡外部的空气通过散热缝22、散热孔29通至灯杯2的空腔21。
工业实用性
本发明一种LED灯具，其结构充分利用了空气“烟囱效应”的“拔风”作用，在灯具中形成一个良好的导热和散热的传导途径，从而有效地解决了LED灯具的散热问题，延长了LED灯具的使用寿命，具有良好的工业实用性。

Claims (25)

  1. 一种LED灯具，其特征在于：包括一灯罩部件、一导流腔、一安装有LED芯片的光源部件和一散热结构体；该散热结构体周向设有多条散热片，该散热结构体设有贯穿于散热结构体的第一透孔；灯罩部件设置在安装有LED芯片的光源部件的前侧；在灯罩部件上设有第二透孔；导流腔的一端连接在灯罩部件的第二透孔处，导流腔的另一端连接至散热结构体的第一透孔，以使得散热结构体的内部空间与灯罩部件的外部空间通过导流腔实现空气对流。
  2. 根据权利要求1所述的一种LED灯具，其特征在于：所述的LED芯片的光源部件为光源面板，所述散热结构体的一面设为安装面，安装有LED芯片的光源面板固定在散热结构体的安装面上，第一透孔贯穿于散热结构体的安装面与背面之间；所述灯罩部件可以是灯具面板或灯罩。
  3. 根据权利要求2所述的一种LED灯具，其特征在于：进一步的，在散热结构体的背面还装有空气导流器或导流盖板。
  4. 根据权利要求2或3所述的一种LED灯具，其特征在于：所述的导流腔为单独的零件，导流腔的一端与灯具面板或灯罩相连接，导流腔的另一端与散热结构体相连接。
  5. 根据权利要求2或3所述的一种LED灯具，其特征在于：所述的导流腔与灯具面板或灯罩为一体式结构，导流腔的一端与灯具面板或灯罩一体相连接，导流腔的另一端与散热结构体相连接。
  6. 根据权利要求4所述的一种LED灯具，其特征在于：所述的导流腔为一个或者多个。
  7. 根据权利要求5所述的一种LED灯具，其特征在于：所述的导流为腔一个或者多个。
  8. 根据权利要求6或7所述的一种LED灯具，其特征在于：所述的散热结构体的背面还设有镂空结构，该镂空结构设在设有第一透孔的散热结构体的背面。
  9. 根据权利要求8所述的一种LED灯具，其特征在于：所述的散热结构体的背面的多条散热片分别设在第一透孔的周边，且由第一透孔向周边呈射线型发散布置。
  10. 根据权利要求2或3所述的一种LED灯具，其特征在于：所述的散热结构体为单个模块式结构；或所述的散热结构体为多个模块式结构的组合体，在模块式结构之间设有汇流槽。
  11. 根据权利要求1所述的一种LED灯具，其特征在于：所述安装有LED芯片的光源部件包括：LED芯片、驱动PCB盒、驱动PCB板；所述灯罩部件包括：灯罩、灯头塑件、灯头、灯杯；灯罩、灯杯、灯头塑件和灯头之间依序相连接；灯杯设有上下通透的空腔；驱动PCB盒装在灯杯的空腔和灯头塑件的内腔之间，且驱动PCB盒的外壁与灯杯的空腔的内壁之间设有预置的间隙，驱动PCB板则装在驱动PCB盒的内腔和灯头塑件的内腔之间；所述灯杯包括上部和下部，所述灯杯的下部形成散热结构体其空腔的侧壁设有若干条沿着竖向的散热条，相邻的散热条之间形成散热缝为第一透孔，该散热缝直接与灯杯的空腔相连通；在灯杯的上部的上端设有安装面， LED芯片安装在灯杯的上部的上端的安装面上；在灯罩的顶端设有通入灯罩的内腔的导流腔，其上设有第二透孔，该导流腔的底端接至灯杯的空腔的上端，以使得LED灯泡外部的空气能够通过导流腔、灯杯的空腔和灯杯的散热缝之间进行流动。
  12. 根据权利要求11所述的一种LED灯具，其特征在于：进一步的，还包括有安装LED芯片用PCB板；该安装LED芯片用PCB板固接在灯杯的上部的上端的安装面上，所述LED芯片固定在安装LED芯片用PCB板上。
  13. 根据权利要求11或12所述的一种LED灯具，其特征在于：所述灯杯的下部的空腔的侧壁为沿周向封闭的环形结构，所述散热条设在灯杯的下部的空腔的侧壁外，在在所述侧壁中，对应于相邻的散热条之间所形成散热缝的顶端设有能够连通灯杯的空腔的散热孔，LED灯泡外部的空气通过导流孔、导流腔、灯杯的散热孔和灯杯的散热缝之间进行流动。
  14. 根据权利要求11所述的一种LED灯具，其特征在于：所述灯杯的上部的上端的安装面为平面或曲面。
  15. 根据权利要求11所述的一种LED灯具，其特征在于：所述灯杯的上部的上端的安装面为若干个斜面或若干个曲面。
  16. 根据权利要求11或12所述的一种LED灯具，其特征在于：所述灯杯的上部的上端的安装面与灯杯的空腔的内壁之间形成板式结构。
  17. 根据权利要求16所述的一种LED灯具，其特征在于：所述灯杯的空腔的内壁面上还设有若干条沿着竖向设置的散热片。
  18. 根据权利要求17所述的一种LED灯具，其特征在于：所述的散热片与灯杯为一体式结构。
  19. 根据权利要求17所述的一种LED灯具，其特征在于：所述的散热片为单体式结构，散热片与灯杯的空腔的内壁面相固定。
  20. 根据权利要求11所述的一种LED灯具，其特征在于：所述导流腔的顶端设有遮板，该遮板上设有一个或多个透气小孔。
  21. 根据权利要求11或12或20所述的一种LED灯具，其特征在于：所述的导流腔与灯罩为一体式结构。
  22. 根据权利要求11或12或20所述的一种LED灯具，其特征在于：所述的导流为单体式结构，在灯罩的顶端设有大透孔，导流腔的顶端的周沿配合在灯罩的大透孔中，导流腔的底端与灯杯的空腔的上端相固定。
  23. 根据权利要求15所述的一种LED灯具，其特征在于：所述灯杯的上部的上端的若干个斜面或若干个曲面至少设为两个。
  24. 根据权利要求22所述的一种LED灯具，其特征在于：进一步的，还包括罩板，罩板罩在安装LED芯片用PCB板上，罩板上装有能够与安装LED芯片用PCB板上的LED芯片对应配合的透镜。
  25. 根据权利要求11所述的一种LED灯具，其特征在于：所述的灯杯的上部和下部可以是一体式结构；也可以是分体式结构，灯杯的上部和灯杯的下部之间通过螺纹连接相固定或胶水粘接相固定或卡扣配合相固定。
PCT/CN2012/083834 2012-03-07 2012-10-31 一种led灯具 WO2013131376A1 (zh)

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CN201210059278.7 2012-03-07
CN2012100592787A CN102644866A (zh) 2012-03-07 2012-03-07 一种具有良好散热的led灯泡
CN201210098656.2 2012-04-06
CN2012100986562A CN102679212A (zh) 2012-04-06 2012-04-06 一种一体化led灯具

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EP2982905A4 (en) * 2014-06-02 2016-08-17 Icepipe Corp LED LIGHTING DEVICE
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EP2982905A4 (en) * 2014-06-02 2016-08-17 Icepipe Corp LED LIGHTING DEVICE
CN106247194A (zh) * 2016-09-27 2016-12-21 正屋(厦门)电子有限公司 一种灯头散热结构

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