WO2015070670A1 - Led支架、led灯单元及灯具 - Google Patents

Led支架、led灯单元及灯具 Download PDF

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Publication number
WO2015070670A1
WO2015070670A1 PCT/CN2014/086774 CN2014086774W WO2015070670A1 WO 2015070670 A1 WO2015070670 A1 WO 2015070670A1 CN 2014086774 W CN2014086774 W CN 2014086774W WO 2015070670 A1 WO2015070670 A1 WO 2015070670A1
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WO
WIPO (PCT)
Prior art keywords
led
lamp
cover body
solid crystal
crystal surface
Prior art date
Application number
PCT/CN2014/086774
Other languages
English (en)
French (fr)
Inventor
杨亚西
Original Assignee
深圳市西德利集团有限公司
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Publication of WO2015070670A1 publication Critical patent/WO2015070670A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/02—Cages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/007—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array enclosed in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/02—Arrangement of electric circuit elements in or on lighting devices the elements being transformers, impedances or power supply units, e.g. a transformer with a rectifier
    • F21V23/023—Power supplies in a casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention belongs to the technical field of LED illumination, in particular to an LED bracket carrying an LED chip, and also relates to an LED lamp unit and a lamp based on the bracket.
  • LED Light Emitting Diode
  • a light-emitting diode chip is a solid-state semiconductor device that converts electricity directly into light.
  • the heart of the LED chip is a semiconductor wafer. One end of the chip is attached to a holder, one end is a negative pole, and the other end is connected to the positive pole of the power source, so that the entire wafer is encapsulated by epoxy resin.
  • the semiconductor wafer is composed of two parts, one of which is a P-type semiconductor and the other end of which is an N-type semiconductor. When the two semiconductors are connected, a "P-N junction" is formed between them.
  • a current is applied to the wafer through the wire, the electrons are pushed toward the P region. In the P region, the electrons recombine with the holes, and then the energy is emitted in the form of photons. This is the principle of LED illumination. LED luminaires designed using this principle have been widely used.
  • the LED chip can not be directly connected to the lamp body to be energized and used.
  • the LED chip and the heat sink are packaged into an LED bracket through the gel base.
  • the LED holder is soldered to an aluminum substrate and then mounted to a heat sink for use in a variety of luminaires, as is well known to those skilled in the art.
  • the heat generated by the LED illuminating needs to be sequentially transmitted to the heat sink through the LED heat sink, thermal grease, insulating layer, aluminum substrate, thermal grease, etc. for heat dissipation and heat transfer.
  • the obstacle is long, the path is long, and the heat is difficult to transmit in time and effectively, which ultimately causes the life of the LED to be shortened. In particular, for high-power LED lamps, this problem is more prominent.
  • the LED lamp based on the above LED bracket needs to invest a large amount of equipment and labor in manufacturing, and the manufacturing and assembly processes are complicated, and there are disadvantages of high cost and no environmental protection.
  • the present invention provides an LED bracket that can directly dissipate heat, so that the aluminum substrate, the heat sink and the like can be omitted and used directly in the LED lamp, completely avoiding the generation of thermal resistance.
  • the invention also provides a lamp unit and a lamp based on the LED bracket, which has the characteristics of no heat resistance and simple structure because it does not need to be equipped with an auxiliary device such as an aluminum substrate and a radiator, and at the same time, due to the lamp unit and the lamp
  • the production and assembly process can be greatly simplified, and the labor and equipment can be saved in a large amount.
  • the utility model has the characteristics of less materials and environmental protection.
  • An LED bracket includes a solid crystal surface and at least one hollow wind flow tube extending from one side of the solid crystal surface, the solid crystal surface and the air flow tube are both made of a heat dissipating material, and the other of the solid crystal surface At least one LED chip is fixed to the side.
  • the wind pipe surrounds the circumference of the solid crystal surface.
  • the wind pipe and the solid crystal surface are integrally formed.
  • the present invention also provides an LED lamp unit comprising any one of the above LED holders.
  • the LED lamp unit further includes an upper cover body and a lower cover body, the upper cover body is fixedly connected to the wind flow tube, and the lower cover body is fixedly connected with the solid crystal surface to fix The crystal surface and the air flow tube are fixed between the upper cover body and the lower cover body.
  • the upper cover body is an integrally formed piece, and a lamp cap is disposed at an upper portion thereof.
  • Further improvement of the above technical solution further includes a power supply for supplying power to the LED chip, wherein a gap is formed between the air flow tubes, and the power source is placed in the gap position.
  • the bottom of the lower cover is provided with a lamp cover or a lens at a position of the LED chip.
  • the invention also provides an LED lamp comprising a lamp housing, wherein the lamp housing is provided with a plurality of the above-mentioned LED lamp units.
  • the solid crystal surface and the air flow tube of the bracket are made of heat dissipating material, and the LED chip is carried by the fixing surface. Since the air flow tube has a hollow tubular structure, it has a very large surface area, which is favorable for the LED chip to be emitted. The heat is quickly dissipated;
  • the auxiliary device such as aluminum substrate and heat sink can be omitted, and the bracket can be directly installed in the lamp housing as an LED lamp. Since there is no excessive transmission link, the generation of thermal resistance is avoided. ;
  • the LED lamp unit and the lamp based on the LED bracket can be greatly simplified due to the simplification of the structure, and the labor cost can be greatly reduced, and the amount of materials is also reduced, and the environment is more environmentally friendly.
  • FIG. 1 is a schematic structural view of an LED bracket according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of another angle of an LED bracket according to an embodiment of the present invention.
  • Figure 3 is a front elevational view of an LED holder in accordance with an embodiment of the present invention.
  • Figure 4 is a bottom plan view of an LED holder in accordance with an embodiment of the present invention.
  • Figure 5 is a front elevational view of an LED lamp according to an embodiment of the present invention.
  • FIG. 6 is a schematic structural view of an LED lamp according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural view of another angle of an LED lamp according to an embodiment of the present invention.
  • FIG. 8 is a structural split view of an LED lamp according to an embodiment of the present invention.
  • FIG. 9 is a schematic view showing the assembly of an LED bracket and a power supply according to an embodiment of the present invention.
  • FIG. 10 is another schematic diagram of assembly of an LED bracket and a power supply according to an embodiment of the present invention.
  • Figure 11 is a schematic structural view of an upper cover body according to an embodiment of the present invention.
  • Figure 12 is a plan view of the upper cover body of the embodiment of the present invention.
  • Figure 13 is a schematic structural view of a lower cover body according to an embodiment of the present invention.
  • Figure 14 is a front elevational view of the lampshade of the embodiment of the present invention.
  • 15 is a schematic view showing the cooperation of the lamp cover, the lower cover body and the LED bracket according to the embodiment of the present invention.
  • Figure 16 is a schematic view showing the structure of another embodiment of the present invention.
  • an LED holder includes a solid crystal surface 31 and a plurality of hollow wind flow tubes 32 extending from one side of the crystal growth surface 31, the solid crystal surface 31 and the air flow tube 32. Each is made of a heat dissipating material, and the other side of the crystallizing surface 31 is fixed with a plurality of LED chips 5.
  • the heat generated during operation of the LED chip 5 can be directly transmitted to the solid crystal surface 31 and the air flow tube 32, and further directly radiated through the solid crystal surface 31 and the air flow tube 32.
  • the air flow tube 32 is a hollow tube body, and a through passage 321 is formed in the air flow tube 32 through the entire air flow tube 32 and the solid crystal surface 31.
  • the arrangement of the through passages 321 can reduce the amount of material of the wind pipe 32, reduce the weight and cost, and on the other hand increase the heat dissipation surface area of the wind pipe 32, and help the air to flow through the through passages 321 to remove heat.
  • the solid crystal surface 31 and the air flow tube 32 are pure aluminum or pure copper metal parts, and may be some other metal or a non-metal material having a heat dissipation function.
  • the solid crystal surface 31 and the air flow tube 32 are integrally formed, and the structural strength is high, which is beneficial to prolonging the service life of the entire LED bracket and improving the heat transfer efficiency between the solid crystal surface 31 and the air flow tube 32; It can reduce the assembly steps and facilitate assembly.
  • the LED lamp unit includes the above-mentioned LED bracket, and further includes an upper cover body 1 and a lower cover body 2, and the upper cover body 1 and the lower cover body 2 are provided.
  • the fixed surface 31 and the air flow tube 32 are fixedly connected to each other, and the fixed surface 31 and the air flow tube 32 are fixed between the upper cover 1 and the lower cover 2 .
  • the upper cover 1 and the lower cover 2 are respectively provided with an upper through hole 11 and a lower through hole 21 that communicate with the through passage 321 .
  • the upper cover body 1 is an integrally formed member, and the upper through holes 11 are evenly distributed on the outer and outer edges of the lower portion of the upper cover body 1, and the number and size thereof are matched with the air flow tube 32. Quantity and size.
  • the upper portion of the air flow tube 32 is inserted into the upper through hole 11 and fixedly connected to the upper through hole 11. The manner of fixing the connection may be through an interference fit between the two, or may be adhered by inorganic glue.
  • the upper portion of the cover 1 is provided with a base 12 for mounting the base.
  • the lamp cap 12 is threaded so that the LED lamp unit can be conveniently mounted in a separately provided lamp holder.
  • the lower cover body 2 is provided with a screw through hole 23, and the fixing surface 31 is provided with a screw fitting hole 311 which cooperates with the screw through hole 23, and the screw through hole 23 and the screw fitting hole 311 are installed.
  • the structure of the lower cover body 2 is fixedly connected to the solid crystal surface 31, and the heat dissipation channel formed by the upper through hole 11, the through hole 321 and the lower through hole 21 is used for heat dissipation, and the heat generated by the LED chip 5 can be quickly taken. go.
  • the LED lamp unit further includes a power source 4 for supplying power to the LED chip 5, and a gap 33 is formed between the air flow tubes 32, and the power source 4 is placed in the gap position 33.
  • the P and N poles of the LED chip 5 are electrically connected to the power source 4 through wires.
  • the bottom of the lower cover 2 is provided with a lamp cover 6 which covers the LED chip 5 therein.
  • the lampshade 6 can scatter the illumination of the LED chip 5 and on the other hand protect the LED chip 5 from damage.
  • the number of the LED chips 5 is at least one, and the lamp cover 6 is a semi-spherical casing, and the lamp cover 6 is reversed on the lower surface of the solid crystal surface 31 and the LED chip 5 is covered by the lamp cover 6.
  • the cover body 2 is provided with a lamp cover fixing hole 22 for matching the lamp housing 6 and fixing the lamp cover 6 at a central position.
  • the fixing manner of the two covers can be performed by inorganic glue or by mutual fastening. Fix it in the usual way.
  • a lens can also be installed here to redistribute the light.
  • FIG. 16 is a schematic structural view of a second embodiment of the present invention.
  • the difference between the embodiment 2 and the above embodiment is that the solid crystal surface 31 is square, and the air flow tube 32 is evenly distributed along the periphery of the solid crystal surface 31, and other technical features remain unchanged. .
  • the embodiment of the invention further provides an LED lamp, the LED lamp comprising a lamp housing, wherein the lamp housing is provided with a plurality of LED lamp units, such as street lamps.
  • the length of the air flow tube 32 may be as needed.
  • the length of the air flow tube 32 may be elliptical, square, or circular, and the shape of the solid crystal surface 31 may be other shapes such as an ellipse or a polygon.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

一种LED支架、基于上述LED支架的LED灯单元和灯具，该LED支架包括固晶面（31）和至少一个从固晶面（31）的一侧延伸出的中空的风流管（32），所述固晶面（31）和风流管（32）均由散热材料制成，所述固晶面（31）的另一侧固定有至少一个LED芯片（5）。该LED支架、灯单元以及灯具中，由固晶面（31）直接承载LED芯片（5），由散热材质制成的固晶面（31）和固晶面（31）上的风流管（32）所起到的通风式的散热作用，LED芯片（5）所产生的热量可被直接散发，从而在LED灯具中可以完全省略其他部件，无需额外使用散热器。

Description

[根据细则37.2由ISA制定的发明名称]　LED支架、LED灯单元及灯具
技术领域
本发明属于LED照明技术领域，特别是涉及一种承载LED芯片的LED支架，还涉及基于该支架的LED灯单元及灯具。
背景技术
LED（Light Emitting Diode，发光二极）芯片是一种固态的半导体器件，它可以直接把电转化为光。LED芯片的心脏是一个半导体的晶片，晶片的一端附在一个支架上，一端是负极，另一端连接电源的正极，使整个晶片被环氧树脂封装起来。半导体晶片由两部分组成，一部分是P型半导体，另一端是N型半导体。当这两种半导体连接起来的时候，它们之间就形成一个“P-N结”。当电流通过导线作用于这个晶片的时候，电子就会被推向P区，在P区里电子跟空穴复合，然后就会以光子的形式发出能量，这就是LED发光的原理。利用该原理而设计的LED灯具已被广泛应用。
LED芯片并不能直接接入到灯体中通电而被使用，现有技术中都是将LED芯片与热沉等通过胶体基座封装成为LED支架的， LED支架则焊接到铝基板上后再安装到散热器上从而在各类灯具中使用，这是本领域技术人员公知的。对于这种形式的LED灯具，LED发光所产生的热量需要依次通过LED热沉、导热硅脂、绝缘层、铝基板、导热硅脂等多个环节才能最终传导到散热器进行散热，热传递的阻碍多、路径长，热量难以及时、有效地传递出去，最终造成LED的使用寿命缩短，特别是，对于大功率的LED灯具，这个问题更为突出。
此外，基于上述LED支架的LED灯在在制造时需要投入大量设备和人工，制造、装配工艺繁杂，存在成本高、不环保的缺点。
发明内容
为了克服现有技术的不足，本发明提供了一种自身直接可进行散热的LED支架，从而可以省去铝基板、散热器等部分而直接在LED灯具中使用，完全避免了热阻的产生。
本发明还提供一种基于该LED支架的灯单元和灯具，该灯具由于无需配备铝基板、散热器等附属装置，从而具有无热阻、结构简单的特点，同时，由于这种灯单元和灯具的生产、装配工艺可大幅度精简，可大量节省人工和设备，相对于现有的灯具，具有用料少、环保的特点。
本发明解决其技术问题所采用的技术方案是：
一种LED支架，包括固晶面和至少一个从固晶面的一侧延伸出的中空的风流管，所述固晶面和风流管均由散热材料制成，所述固晶面的另一侧固定有至少一个LED芯片。
作为上述技术方案的改进，所述风流管环绕在固晶面的周延。
作为上述技术方案的进一步改进，所述风流管与固晶面是一体成型的。
本发明还提供一种LED灯单元，该LED灯单元包括上述任意一种LED支架。
作为上述技术方案的改进，该LED灯单元还包括上盖体和下盖体，所述上盖体与所述风流管固定连接,所述下盖体与所述固晶面固定连接,将固晶面、风流管固定在上盖体、下盖体之间。
作为上述技术方案的进一步改进，所述的上盖体为一体成型件，并在其上部设置有灯头。
作为上述技术方案的进一步改进，还包括为上述LED芯片供电的电源，所述风流管之间形成有间隙位，所述的电源置于所述间隙位中。
作为上述技术方案的进一步改进，所述下盖体的底部位于LED芯片的位置设置有灯罩或透镜。
本发明还提供一种LED灯具，该LED灯具包括一灯壳，所述灯壳内设置有多个以上所述的LED灯单元。
采用上述技术方案的LED支架、LED灯单元和LED灯具的优点是：
（1）、该支架的固晶面、风流管均有散热材料制成，由固定面来承载LED芯片，由于风流管是中空的管状构造，因而具有非常大的表面积，有利于LED芯片散发出来的热量被迅速散发；
（2）、在由于热空气上升、冷空气下降，风流管中会出现气流的流动，从而可将支架负荷的热量迅速带走；
（3）、当风流管与固晶面时一体成型时，风流管与固晶面之间不存在接触热阻，具有更好的散热效果；
（4）、使用本LED支架，可以省去铝基板、散热器等附属装置，直接将本支架安装在灯壳内作为LED灯具使用，由于无过多传递环节的产生，避免了热阻的产生；
（5）、基于本LED支架的LED灯单元、灯具由于结构上的简化，生产、装配工艺可以大为精简，可极大地节省人力成本，同时，也减少了材料的用量，更为环保。
附图说明
下面结合附图和实施例对本发明进一步说明。
图1是本发明实施例的LED支架的结构示意图；
图2是本发明实施例的LED支架另一角度的结构示意图；
图3是本发明实施例的LED支架的主视图；
图4是本发明实施例的LED支架的仰视图；
图5是本发明实施例的LED灯具的主视图；
图6是本发明实施例的LED灯具的结构示意图；
图7是本发明实施例的LED灯具另一角度的结构示意图；
图8是本发明实施例的LED灯具的结构拆分图；
图9是本发明实施例的LED支架与电源的装配示意图；
图10是本发明实施例的LED支架与电源的另一装配示意图；
图11是本发明实施例的上盖体的结构示意图；
图12是本发明实施例的上盖体的俯视图；
图13是本发明实施例的下盖体的结构示意图；
图14是本发明实施例的灯罩的主视图；
图15是本发明实施例的灯罩、下盖体与LED支架的配合示意图；
图16是本发明另一实施例的结构示意图。
具体实施方式
参照图1-4，本发明一个实施例的LED支架，包括固晶面31和从固晶面31的一侧延伸出的多个中空的风流管32，所述固晶面31和风流管32均由散热材料制成，所述固晶面31的另一侧固定有多个LED芯片5。
LED芯片5封装在固晶面31后，LED芯片5工作时的发热可以直接传导到固晶面31和风流管32，并进一步通过固晶面31、风流管32直接散热。
参照图1、图4，所述风流管32为中空管体，风流管32内部开设有贯穿整个风流管32和固晶面31的贯穿通道321。贯穿通道321的设置一方面可以减少风流管32的材料用量，降低重量和成本，另一方面可以增加风流管32的散热表面积，有助于空气流过贯穿通道321带走热量。
在本实施例中，所述的固晶面31和风流管32为纯铝或纯铜金属件，也可以是一些其他金属或具有散热功能的非金属材料。所述的固晶面31和风流管32是一体成型的，结构强度高，有利于延长整个LED支架的使用寿命和提高固晶面31和风流管32之间的热传递效率；另一方面亦可以减少装配步骤，方便组装。
参照图5-8，基于上述的LED支架，本发明实施例的LED灯单元，包括前述的LED支架，还包括上盖体1、下盖体2，所述上盖体1、下盖体2分别与所述的固晶面31、风流管32固定连接并将固晶面31、风流管32固定在上盖体1、下盖体2之间。
参照图11、图12、图13，所述上盖体1、下盖体2分别开设有与上述贯穿通道321相连通的上通孔11、下通孔21。
参照图11、图12，所述的上盖体1为一体成型件，上述的上通孔11均匀分布于上盖体1下部的周向外沿，其数量与大小匹配于上述风流管32的数量与大小。在装配时，风流管32的上部插入到所述上通孔11中并与上通孔11固定连接，固定连接的方式可以通过两者间的过盈配合，也可以通过无机胶水进行粘连，上盖体1的上部设置有用于安装灯头的灯头12。灯头12上设有螺纹，从而可很方便地将该LED灯单元安装到另外设置的灯座中。
所述下盖体2上开设有螺钉通孔23，所述固晶面31上设有与该螺钉通孔23相配合的螺钉配合孔311，所述螺钉通孔23、螺钉配合孔311中安装有固定螺钉7，所述固定螺钉7将下盖体2固定连接于固晶面31底部且下盖体2上设置的下通孔21与上述的贯穿通道321一一配合连通。该种结构将下盖体2与固晶面31固定连接，同时利用上通孔11、贯穿通道321、下通孔21组成的通风通道进行散热，可快速将LED芯片5工作时的发热迅速带走。
参照图9、图10，该种LED灯单元还包括为上述LED芯片5供电的电源4，所述风流管32之间形成了间隙位33，所述的电源4置于所述的间隙位33中，LED芯片5的P、N两极通过导线与电源4电性连接。
参照图14，所述的下盖体2的底部设置有灯罩6，该灯罩6将LED芯片5罩在其中。灯罩6一方面可以对LED芯片5的发光起到散射作用，另一方面也可以保护LED芯片5免遭破坏。
在本实施例中，LED芯片5的数量至少为1个，上述的灯罩6为一半球形壳体，灯罩6倒扣于固晶面31下表面并使LED芯片5处于灯罩6所罩住的范围之内，所述下盖体2中心位置设有与灯壳6相配合且用于将灯罩6固定的灯罩固定孔22，两者的固定方式可以通过无机胶水进行粘连，也可以通过相互扣合等常规方式进行固定。此处还可以安装透镜，以对光线进行重新分配。
图16是本发明第二实施例的结构示意图，实施例2与上述实施例的不同点在于固晶面31为方形，风流管32沿固晶面31的四周均匀分布，其他的技术特征不变。
本发明实施例还提供一种LED灯具，该LED灯具包括一灯壳，所述灯壳内设置有多个LED灯单元，例如路灯。
需要说明的是，实施例及其附图并不是对本发明的保护范围进行限定，在实际实施本发明的过程中，可以根据不同的客观条件进行适当的变形，例如风流管32的长度可根据需要选取不同的长度，风流管32的截面可以为椭圆、方形、圆形等形状，而固晶面31的形状也可以采用椭圆、多边形等其他形状。
以上是对本发明的较佳实施进行了具体说明，但本发明创造并不限于所述实施例，熟悉本领域的技术人员在不违背本发明精神的前提下还可做出种种的等同变形或替换，这些等同的变形或替换均包含在本申请权利要求所限定的范围内。

Claims (9)

  1. 一种LED支架，其特征在于：包括固晶面和至少一个从固晶面的一侧延伸出的中空的风流管，所述固晶面和风流管均由散热材料制成，所述固晶面的另一侧固定有至少一个LED芯片。
  2. 根据权利要求1所述的LED支架，其特征在于：所述风流管环绕在固晶面的周延。
  3. 根据权利要求1或2所述的LED支架，其特征在于：所述风流管与固晶面是一体成型的。
  4. 一种LED灯单元，其特征在于：包括权利要求1、2或3所述的LED支架。
  5. 根据权利要求4所述的LED灯单元，其特征在于：还包括上盖体和下盖体，所述上盖体与所述风流管固定连接,所述下盖体与所述固晶面固定连接,将固晶面、风流管固定在上盖体、下盖体之间。
  6. 根据权利要求5所述的LED灯单元，其特征在于：所述上盖体为一体成型件，并在其上部设置有灯头。
  7. 根据权利要求4至5任一项所述的LED灯单元，其特征在于：还包括为上述LED芯片供电的电源，所述风流管之间形成有间隙位，所述的电源置于所述间隙位中。
  8. 根据权利要求5或6所述的LED灯单元，其特征在于：所述下盖体的底部位于LED芯片的位置设置有灯罩或透镜。
  9. 一种LED灯具，其特征在于：包括一灯壳，所述灯壳内设置有多个权利要求4至8任一项所述的LED灯单元。
PCT/CN2014/086774 2013-11-14 2014-09-18 Led支架、led灯单元及灯具 WO2015070670A1 (zh)

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