CN102469704A - 多层板的制造方法 - Google Patents

多层板的制造方法 Download PDF

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Publication number
CN102469704A
CN102469704A CN2011100208453A CN201110020845A CN102469704A CN 102469704 A CN102469704 A CN 102469704A CN 2011100208453 A CN2011100208453 A CN 2011100208453A CN 201110020845 A CN201110020845 A CN 201110020845A CN 102469704 A CN102469704 A CN 102469704A
Authority
CN
China
Prior art keywords
pcb
copper foil
cushion pad
heat source
layer board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100208453A
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English (en)
Chinese (zh)
Inventor
洪种国
金智恩
孙暻镇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electro Mechanics Co Ltd
Original Assignee
Samsung Electro Mechanics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mechanics Co Ltd filed Critical Samsung Electro Mechanics Co Ltd
Publication of CN102469704A publication Critical patent/CN102469704A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN2011100208453A 2010-11-15 2011-01-11 多层板的制造方法 Pending CN102469704A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100113520A KR101156810B1 (ko) 2010-11-15 2010-11-15 다층기판의 제조방법
KR10-2010-0113520 2010-11-15

Publications (1)

Publication Number Publication Date
CN102469704A true CN102469704A (zh) 2012-05-23

Family

ID=46072663

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100208453A Pending CN102469704A (zh) 2010-11-15 2011-01-11 多层板的制造方法

Country Status (2)

Country Link
KR (1) KR101156810B1 (ko)
CN (1) CN102469704A (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030006402A (ko) * 2001-07-12 2003-01-23 삼성전기주식회사 균일한 압력전달이 가능한 다층 인쇄회로기판의 제조방법
JP2005053076A (ja) * 2003-08-04 2005-03-03 Denso Corp 多層基板の製造方法及び熱プレス機
JP2007180317A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
KR20080102930A (ko) * 2007-09-14 2008-11-26 대덕전자 주식회사 소형 인쇄 회로 기판 처리 방법

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100602595B1 (ko) * 2003-11-18 2006-07-19 차성숙 인쇄회로기판 가압성형용 쿠션패드 및 그 쿠션패드의제조방법
JP5532601B2 (ja) 2008-12-22 2014-06-25 三菱マテリアル株式会社 パワーモジュール用基板およびその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030006402A (ko) * 2001-07-12 2003-01-23 삼성전기주식회사 균일한 압력전달이 가능한 다층 인쇄회로기판의 제조방법
JP2005053076A (ja) * 2003-08-04 2005-03-03 Denso Corp 多層基板の製造方法及び熱プレス機
JP2007180317A (ja) * 2005-12-28 2007-07-12 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
KR20080102930A (ko) * 2007-09-14 2008-11-26 대덕전자 주식회사 소형 인쇄 회로 기판 처리 방법

Also Published As

Publication number Publication date
KR20120052065A (ko) 2012-05-23
KR101156810B1 (ko) 2012-06-18

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20120523