CN102449791A - 具有绝缘衬底的热电模块 - Google Patents

具有绝缘衬底的热电模块 Download PDF

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Publication number
CN102449791A
CN102449791A CN2010800237638A CN201080023763A CN102449791A CN 102449791 A CN102449791 A CN 102449791A CN 2010800237638 A CN2010800237638 A CN 2010800237638A CN 201080023763 A CN201080023763 A CN 201080023763A CN 102449791 A CN102449791 A CN 102449791A
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CN
China
Prior art keywords
thermoelectric module
substrate
thermoelectric
electrically conductive
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010800237638A
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English (en)
Chinese (zh)
Inventor
M·A·斯忒芬
K·希尔勒-阿恩特
G·胡贝尔
F·哈斯
J·S·布莱克本
I·W·琼斯
F·斯塔克浦
S·希文斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BASF SE
Original Assignee
BASF SE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BASF SE filed Critical BASF SE
Publication of CN102449791A publication Critical patent/CN102449791A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N3/00—Generators in which thermal or kinetic energy is converted into electrical energy by ionisation of a fluid and removal of the charge therefrom

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Non-Adjustable Resistors (AREA)
CN2010800237638A 2009-04-02 2010-03-31 具有绝缘衬底的热电模块 Pending CN102449791A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP09157158 2009-04-02
EP09157158.8 2009-04-02
PCT/EP2010/054268 WO2010115792A1 (en) 2009-04-02 2010-03-31 Thermoelectric module with insulated substrate

Publications (1)

Publication Number Publication Date
CN102449791A true CN102449791A (zh) 2012-05-09

Family

ID=42357317

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010800237638A Pending CN102449791A (zh) 2009-04-02 2010-03-31 具有绝缘衬底的热电模块

Country Status (10)

Country Link
US (1) US20120017963A1 (https=)
EP (1) EP2415090B1 (https=)
JP (1) JP2012523111A (https=)
KR (1) KR20120007027A (https=)
CN (1) CN102449791A (https=)
CA (1) CA2757530A1 (https=)
RU (1) RU2011144115A (https=)
SG (1) SG174559A1 (https=)
TW (1) TW201042788A (https=)
WO (1) WO2010115792A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107124108A (zh) * 2016-02-25 2017-09-01 西门子公司 热量管理方法、装置及包含大功率发热元件的设备

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010108912A2 (de) * 2009-03-24 2010-09-30 Basf Se Selbstorganisierende thermoelektrische materialien
US9082928B2 (en) 2010-12-09 2015-07-14 Brian Isaac Ashkenazi Next generation thermoelectric device designs and methods of using same
JP2013026334A (ja) * 2011-07-19 2013-02-04 National Institute Of Advanced Industrial & Technology 積層型熱電変換モジュール
US10454013B2 (en) * 2012-11-16 2019-10-22 Micropower Global Limited Thermoelectric device
US9276190B2 (en) 2013-10-01 2016-03-01 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material by modified MOCVD
US9040339B2 (en) 2013-10-01 2015-05-26 The Pen Practical method of producing an aerogel composite continuous thin film thermoelectric semiconductor material
CN105207529A (zh) * 2015-10-28 2015-12-30 蒋安为 一种红外光发电装置
NO341705B1 (en) * 2016-02-22 2018-01-02 Tegma As Thermoelectric half-cell and method of production
KR102050138B1 (ko) * 2017-12-07 2019-11-28 한국세라믹기술원 전극층/절연층 다층기판 및 그 제조방법과 이를 포함한 열전발전 모듈
DE102019207227B4 (de) * 2019-05-17 2021-10-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung thermoelektrischer Elemente mit elektrischen Anschlusskontakten sowie ein mit dem Verfahren hergestelltes thermoelektrisches Modul

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319571A (zh) * 2000-03-06 2001-10-31 株式会社村田制作所 绝缘陶瓷、多层陶瓷基片和层叠的陶瓷电子部件
US20020162338A1 (en) * 2001-04-24 2002-11-07 Mamoru Shimada Laser module, peltier module, and peltier module integrated heat spreader
CN1736945A (zh) * 2005-06-22 2006-02-22 中国科学院上海硅酸盐研究所 提高与铜共烧的含钛微波介质陶瓷绝缘电阻率的方法
CN1899999A (zh) * 2005-07-19 2007-01-24 宁波材料技术与工程研究所 纳米复合低熔点玻璃绝缘涂层的制备方法
CN1937273A (zh) * 2005-08-02 2007-03-28 株式会社东芝 热电装置及其制造方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4794048A (en) * 1987-05-04 1988-12-27 Allied-Signal Inc. Ceramic coated metal substrates for electronic applications
US5209786A (en) * 1990-10-09 1993-05-11 Thermo Electron Technologies Corporation Integrity-enhanced thermoelectrics
US5439528A (en) 1992-12-11 1995-08-08 Miller; Joel Laminated thermo element
US5448109B1 (en) 1994-03-08 1997-10-07 Tellurex Corp Thermoelectric module
JPH09139525A (ja) * 1995-11-15 1997-05-27 Hitachi Chem Co Ltd ペルチェ冷却ユニット構造
AU6783598A (en) 1997-03-31 1998-10-22 Research Triangle Institute Thin-film thermoelectric device and fabrication method of same
JP2000164941A (ja) * 1998-11-30 2000-06-16 Yamaha Corp 熱電変換モジュール
JP2000286467A (ja) * 1999-03-31 2000-10-13 Nhk Spring Co Ltd 電気絶縁材料、モジュールおよびその製造方法
JP3163380B2 (ja) * 1999-08-05 2001-05-08 科学技術庁航空宇宙技術研究所長 電気絶縁材とその製造方法
DE19955788A1 (de) 1999-11-19 2001-05-23 Basf Ag Thermoelektrisch aktive Materialien und diese enthaltende Generatoren
JP2002280621A (ja) * 2001-01-15 2002-09-27 Furukawa Electric Co Ltd:The レーザーモジュール、ペルチェモジュールおよびペルチェモジュール一体型ヒートスプレッダー
JP2003174202A (ja) * 2001-09-25 2003-06-20 Sumitomo Electric Ind Ltd 熱電装置とこれを用いた光モジュール及びこれらの製造方法
JP2005033095A (ja) * 2003-07-10 2005-02-03 Hitachi Powdered Metals Co Ltd 熱電変換素子用熱応力緩和パッドの製造方法
CN1969398A (zh) 2004-06-17 2007-05-23 阿鲁策株式会社 热电转换模块
JP2006066822A (ja) * 2004-08-30 2006-03-09 Denso Corp 熱電変換装置
FR2882371B1 (fr) * 2005-02-24 2008-01-18 Centre Nat Rech Scient Materiau composite constitue par une matrice poreuse et des nanoparticules de metal ou d'oxyde de metal
JP2007035907A (ja) * 2005-07-27 2007-02-08 Kyocera Corp 熱電モジュール
JP4901350B2 (ja) * 2005-08-02 2012-03-21 株式会社東芝 熱電変換装置及びその製造方法
WO2007104603A2 (de) 2006-03-16 2007-09-20 Basf Se Blei-germanium-telluride fuer thermoelektrische anwendungen
EP1999066A2 (de) 2006-03-16 2008-12-10 Basf Se Dotierte bleitelluride fuer thermoelektrische anwendungen

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319571A (zh) * 2000-03-06 2001-10-31 株式会社村田制作所 绝缘陶瓷、多层陶瓷基片和层叠的陶瓷电子部件
US20020162338A1 (en) * 2001-04-24 2002-11-07 Mamoru Shimada Laser module, peltier module, and peltier module integrated heat spreader
CN1736945A (zh) * 2005-06-22 2006-02-22 中国科学院上海硅酸盐研究所 提高与铜共烧的含钛微波介质陶瓷绝缘电阻率的方法
CN1899999A (zh) * 2005-07-19 2007-01-24 宁波材料技术与工程研究所 纳米复合低熔点玻璃绝缘涂层的制备方法
CN1937273A (zh) * 2005-08-02 2007-03-28 株式会社东芝 热电装置及其制造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107124108A (zh) * 2016-02-25 2017-09-01 西门子公司 热量管理方法、装置及包含大功率发热元件的设备

Also Published As

Publication number Publication date
JP2012523111A (ja) 2012-09-27
SG174559A1 (en) 2011-10-28
KR20120007027A (ko) 2012-01-19
CA2757530A1 (en) 2010-10-14
EP2415090A1 (en) 2012-02-08
RU2011144115A (ru) 2013-05-10
EP2415090B1 (en) 2013-10-23
WO2010115792A1 (en) 2010-10-14
TW201042788A (en) 2010-12-01
US20120017963A1 (en) 2012-01-26

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