CN102428563B - 形成用于集成电路的电断金属熔丝的结构和方法 - Google Patents
形成用于集成电路的电断金属熔丝的结构和方法 Download PDFInfo
- Publication number
- CN102428563B CN102428563B CN200980159306.9A CN200980159306A CN102428563B CN 102428563 B CN102428563 B CN 102428563B CN 200980159306 A CN200980159306 A CN 200980159306A CN 102428563 B CN102428563 B CN 102428563B
- Authority
- CN
- China
- Prior art keywords
- fuse
- cap rock
- metal cap
- described metal
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (10)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2009/044952 WO2010134922A1 (en) | 2009-05-22 | 2009-05-22 | Structure and method of forming electrically blown metal fuses for integrated circuits |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102428563A CN102428563A (zh) | 2012-04-25 |
CN102428563B true CN102428563B (zh) | 2014-06-11 |
Family
ID=43126415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980159306.9A Expired - Fee Related CN102428563B (zh) | 2009-05-22 | 2009-05-22 | 形成用于集成电路的电断金属熔丝的结构和方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2433303A4 (zh) |
JP (1) | JP2012527768A (zh) |
CN (1) | CN102428563B (zh) |
WO (1) | WO2010134922A1 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104835800B (zh) * | 2014-02-08 | 2019-01-22 | 北大方正集团有限公司 | 一种集成电路的熔丝结构及其制造方法 |
CN108666262B (zh) * | 2017-03-31 | 2021-02-02 | 中芯国际集成电路制造(上海)有限公司 | 熔丝结构电路及其形成方法 |
US11756882B2 (en) | 2020-12-31 | 2023-09-12 | Texas Instruments Incorporated | Semiconductor die with blast shielding |
US11935844B2 (en) | 2020-12-31 | 2024-03-19 | Texas Instruments Incorporated | Semiconductor device and method of the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101150113A (zh) * | 2006-03-07 | 2008-03-26 | 株式会社瑞萨科技 | 半导体器件和提高电熔断器的电阻值的方法 |
CN101170097A (zh) * | 2006-10-26 | 2008-04-30 | 恩益禧电子股份有限公司 | 半导体器件及其制造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0969607A (ja) * | 1995-09-01 | 1997-03-11 | Sony Corp | 半導体装置およびその製造方法 |
TW476134B (en) * | 2000-02-22 | 2002-02-11 | Ibm | Method for forming dual-layer low dielectric barrier for interconnects and device formed |
US6603321B2 (en) | 2001-10-26 | 2003-08-05 | International Business Machines Corporation | Method and apparatus for accelerated determination of electromigration characteristics of semiconductor wiring |
JP2007184347A (ja) * | 2006-01-05 | 2007-07-19 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP4861051B2 (ja) * | 2006-05-09 | 2012-01-25 | ルネサスエレクトロニクス株式会社 | 半導体装置および電気ヒューズの切断方法 |
US7566593B2 (en) * | 2006-10-03 | 2009-07-28 | International Business Machines Corporation | Fuse structure including cavity and methods for fabrication thereof |
US7550323B2 (en) * | 2007-08-08 | 2009-06-23 | International Business Machines Corporation | Electrical fuse with a thinned fuselink middle portion |
-
2009
- 2009-05-22 WO PCT/US2009/044952 patent/WO2010134922A1/en active Application Filing
- 2009-05-22 EP EP09845033.1A patent/EP2433303A4/en not_active Withdrawn
- 2009-05-22 JP JP2012511797A patent/JP2012527768A/ja active Pending
- 2009-05-22 CN CN200980159306.9A patent/CN102428563B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101150113A (zh) * | 2006-03-07 | 2008-03-26 | 株式会社瑞萨科技 | 半导体器件和提高电熔断器的电阻值的方法 |
CN101170097A (zh) * | 2006-10-26 | 2008-04-30 | 恩益禧电子股份有限公司 | 半导体器件及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2010134922A1 (en) | 2010-11-25 |
EP2433303A4 (en) | 2014-09-17 |
JP2012527768A (ja) | 2012-11-08 |
CN102428563A (zh) | 2012-04-25 |
EP2433303A1 (en) | 2012-03-28 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171116 Address after: Grand Cayman, Cayman Islands Patentee after: GLOBALFOUNDRIES INC. Address before: American New York Patentee before: Core USA second LLC Effective date of registration: 20171116 Address after: American New York Patentee after: Core USA second LLC Address before: New York grams of Armand Patentee before: International Business Machines Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140611 Termination date: 20190522 |