CN102428556B - 具有用于所有阱间和阱内隔离的深沟槽隔离区并且具有到达相邻装置扩散区和下面的浮置阱区之间的结的共享接触的集成电路装置 - Google Patents

具有用于所有阱间和阱内隔离的深沟槽隔离区并且具有到达相邻装置扩散区和下面的浮置阱区之间的结的共享接触的集成电路装置 Download PDF

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CN102428556B
CN102428556B CN201080021329.6A CN201080021329A CN102428556B CN 102428556 B CN102428556 B CN 102428556B CN 201080021329 A CN201080021329 A CN 201080021329A CN 102428556 B CN102428556 B CN 102428556B
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trap
type
diffusion region
source area
conduction type
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CN102428556A (zh
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B.A.安德森
A.布赖恩特
E.J.诺瓦克
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Core Usa Second LLC
GlobalFoundries Inc
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International Business Machines Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
    • H10D89/10—Integrated device layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B10/00—Static random access memory [SRAM] devices
    • H10B10/12—Static random access memory [SRAM] devices comprising a MOSFET load element
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0151—Manufacturing their isolation regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0156—Manufacturing their doped wells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85—Complementary IGFETs, e.g. CMOS

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  • Semiconductor Memories (AREA)
  • Element Separation (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
CN201080021329.6A 2009-05-28 2010-05-04 具有用于所有阱间和阱内隔离的深沟槽隔离区并且具有到达相邻装置扩散区和下面的浮置阱区之间的结的共享接触的集成电路装置 Active CN102428556B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/473,324 US7902608B2 (en) 2009-05-28 2009-05-28 Integrated circuit device with deep trench isolation regions for all inter-well and intra-well isolation and with a shared contact to a junction between adjacent device diffusion regions and an underlying floating well section
US12/473,324 2009-05-28
PCT/US2010/033469 WO2010138278A2 (en) 2009-05-28 2010-05-04 Integrated circuit device with deep trench isolation regions for all inter-well and intra-well isolation and with a shared contact to a junction between adjacent device diffusion regions and an underlying floating well section

Publications (2)

Publication Number Publication Date
CN102428556A CN102428556A (zh) 2012-04-25
CN102428556B true CN102428556B (zh) 2014-03-12

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US (1) US7902608B2 (enExample)
EP (1) EP2401761A4 (enExample)
JP (1) JP5561801B2 (enExample)
CN (1) CN102428556B (enExample)
CA (1) CA2757776A1 (enExample)
TW (1) TW201104840A (enExample)
WO (1) WO2010138278A2 (enExample)

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US8183639B2 (en) * 2010-10-07 2012-05-22 Freescale Semiconductor, Inc. Dual port static random access memory cell layout
DE112011104408B4 (de) 2010-12-15 2025-09-18 Efficient Power Conversion Corporation Halbleitervorrichtungen mit rückseitiger Isolierung
JP5891678B2 (ja) * 2011-09-22 2016-03-23 ソニー株式会社 電気光学装置および表示装置
US10529866B2 (en) 2012-05-30 2020-01-07 X-Fab Semiconductor Foundries Gmbh Semiconductor device
US9214378B2 (en) 2012-06-29 2015-12-15 International Business Machines Corporation Undercut insulating regions for silicon-on-insulator device
US9478736B2 (en) * 2013-03-15 2016-10-25 International Business Machines Corporation Structure and fabrication of memory array with epitaxially grown memory elements and line-space patterns
US9105691B2 (en) * 2013-04-09 2015-08-11 International Business Machines Corporation Contact isolation scheme for thin buried oxide substrate devices
US11037937B2 (en) * 2019-11-20 2021-06-15 Globalfoundries U.S. Inc. SRAM bit cells formed with dummy structures

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US3628069A (en) * 1968-04-30 1971-12-14 Ibm Integrated circuit having monolithic inversely operated transistors
US4395812A (en) * 1980-02-04 1983-08-02 Ibm Corporation Forming an integrated circuit
US4949142A (en) * 1984-12-18 1990-08-14 Claudio Contiero Integrated N-channel power MOS bridge circuit
US5156989A (en) * 1988-11-08 1992-10-20 Siliconix, Incorporated Complementary, isolated DMOS IC technology
CN1674291A (zh) * 2004-03-23 2005-09-28 联华电子股份有限公司 深沟渠式电容以及单晶体管静态随机存取内存单元的结构
US20070222024A1 (en) * 2006-03-22 2007-09-27 Infineon Technologies Ag Integrated circuit and production method

Also Published As

Publication number Publication date
WO2010138278A3 (en) 2011-02-03
EP2401761A4 (en) 2012-04-25
TW201104840A (en) 2011-02-01
JP5561801B2 (ja) 2014-07-30
CN102428556A (zh) 2012-04-25
JP2012528484A (ja) 2012-11-12
WO2010138278A2 (en) 2010-12-02
US20100301419A1 (en) 2010-12-02
CA2757776A1 (en) 2010-12-02
EP2401761A2 (en) 2012-01-04
US7902608B2 (en) 2011-03-08

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