CN102404002B - 半导体集成电路装置 - Google Patents

半导体集成电路装置 Download PDF

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Publication number
CN102404002B
CN102404002B CN201110251651.4A CN201110251651A CN102404002B CN 102404002 B CN102404002 B CN 102404002B CN 201110251651 A CN201110251651 A CN 201110251651A CN 102404002 B CN102404002 B CN 102404002B
Authority
CN
China
Prior art keywords
circuit
conductive pattern
oscillation
conductor integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110251651.4A
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English (en)
Chinese (zh)
Other versions
CN102404002A (zh
Inventor
大村昌伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102404002A publication Critical patent/CN102404002A/zh
Application granted granted Critical
Publication of CN102404002B publication Critical patent/CN102404002B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/57—Protection from inspection, reverse engineering or tampering
    • H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
    • H03K3/03—Astable circuits
    • H03K3/0315—Ring oscillators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/19—Monitoring patterns of pulse trains
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Storage Device Security (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
CN201110251651.4A 2010-09-02 2011-08-30 半导体集成电路装置 Expired - Fee Related CN102404002B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-197143 2010-09-02
JP2010197143 2010-09-02
JP2011-138894 2011-06-22
JP2011138894A JP2012074674A (ja) 2010-09-02 2011-06-22 半導体集積回路装置

Publications (2)

Publication Number Publication Date
CN102404002A CN102404002A (zh) 2012-04-04
CN102404002B true CN102404002B (zh) 2015-09-23

Family

ID=45770240

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110251651.4A Expired - Fee Related CN102404002B (zh) 2010-09-02 2011-08-30 半导体集成电路装置

Country Status (3)

Country Link
US (1) US8970247B2 (enExample)
JP (1) JP2012074674A (enExample)
CN (1) CN102404002B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9959496B2 (en) * 2015-08-18 2018-05-01 Franklin J. Camper Microprocessor-controlled tamper detection system
US10140570B2 (en) * 2015-08-18 2018-11-27 William P Gulas Microprocessor-controlled tamper detection system
US10778679B2 (en) * 2016-02-12 2020-09-15 Industry-University Cooperation Foundation Hanyang University Secure semiconductor chip and operating method thereof
FR3057088A1 (fr) 2016-09-30 2018-04-06 Stmicroelectronics (Rousset) Sas Detecteur laser picosecondes
JP6945736B2 (ja) * 2017-11-02 2021-10-06 レイセオン カンパニー 警護領域の物理的又は電磁的侵入を検出するためのマルチＧＨｚ警護センサ
WO2020069541A1 (de) * 2018-10-04 2020-04-09 Riddle & Code Gmbh Elektronische markierung
KR102837893B1 (ko) * 2020-01-29 2025-07-25 삼성전자주식회사 반도체 장치의 테스트 방법
TWI755771B (zh) * 2020-06-24 2022-02-21 新唐科技股份有限公司 處理電路及處理方法
USD1003738S1 (en) * 2021-02-26 2023-11-07 Zhejiang Orient Gene Biotech Co., LTD Calibrator device
IT202100030482A1 (it) * 2021-12-01 2023-06-01 St Microelectronics Srl Rilevatore di crepe per piastrine a semiconduttore

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1256565A (zh) * 1998-12-04 2000-06-14 富士通株式会社 半导体集成电路
US7489204B2 (en) * 2005-06-30 2009-02-10 International Business Machines Corporation Method and structure for chip-level testing of wire delay independent of silicon delay

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940009250B1 (ko) * 1991-12-18 1994-10-01 삼성전자 주식회사 복수개의 동작전압에 대응하는 리프레쉬 타이머
EP0558879B1 (en) * 1992-03-04 1997-05-14 Astra Aktiebolag Disposable inhaler
JPH08115267A (ja) 1994-10-19 1996-05-07 Tech Res & Dev Inst Of Japan Def Agency 情報秘匿機構
WO1997004395A1 (en) * 1995-07-20 1997-02-06 Dallas Semiconductor Corporation Method and apparatus for encryption key creation
US5815043A (en) * 1997-02-13 1998-09-29 Apple Computer, Inc. Frequency controlled ring oscillator having by passable stages
JPH10270644A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体集積回路装置
DE10101330A1 (de) * 2001-01-13 2002-07-18 Philips Corp Intellectual Pty Elektrische oder elektronische Schaltungsanordnung und Verfahren zum Schützen der selben von Manipulation und/oder Missbrauch
JP4275110B2 (ja) * 2001-08-07 2009-06-10 株式会社ルネサステクノロジ 半導体装置およびｉｃカード
US20040212017A1 (en) 2001-08-07 2004-10-28 Hirotaka Mizuno Semiconductor device and ic card
US7525330B2 (en) 2001-11-28 2009-04-28 Nxp, B.V. Semiconductor device, card, system, and methods of initializing and checking the authenticity and the identity of the semiconductor device
JP3592316B2 (ja) * 2002-06-21 2004-11-24 株式会社半導体理工学研究センター 半導体特性評価装置
JP4748929B2 (ja) * 2003-08-28 2011-08-17 パナソニック株式会社 保護回路および半導体装置
US7986193B2 (en) * 2007-01-03 2011-07-26 Apple Inc. Noise reduction within an electronic device using automatic frequency modulation
JP2009277085A (ja) * 2008-05-15 2009-11-26 Nippon Telegr & Teleph Corp <Ntt> 情報削除機能付きｌｓｉ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1256565A (zh) * 1998-12-04 2000-06-14 富士通株式会社 半导体集成电路
US7489204B2 (en) * 2005-06-30 2009-02-10 International Business Machines Corporation Method and structure for chip-level testing of wire delay independent of silicon delay

Also Published As

Publication number Publication date
US20120056639A1 (en) 2012-03-08
JP2012074674A (ja) 2012-04-12
US8970247B2 (en) 2015-03-03
CN102404002A (zh) 2012-04-04

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150923