CN102404002B - 半导体集成电路装置 - Google Patents

半导体集成电路装置 Download PDF

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Publication number
CN102404002B
CN102404002B CN201110251651.4A CN201110251651A CN102404002B CN 102404002 B CN102404002 B CN 102404002B CN 201110251651 A CN201110251651 A CN 201110251651A CN 102404002 B CN102404002 B CN 102404002B
Authority
CN
China
Prior art keywords
circuit
conductive pattern
oscillation
conductor integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201110251651.4A
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English (en)
Chinese (zh)
Other versions
CN102404002A (zh
Inventor
大村昌伸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Publication of CN102404002A publication Critical patent/CN102404002A/zh
Application granted granted Critical
Publication of CN102404002B publication Critical patent/CN102404002B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
    • H10W42/405—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering using active circuits
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G06F21/87—Secure or tamper-resistant housings by means of encapsulation, e.g. for integrated circuits
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K3/00—Circuits for generating electric pulses; Monostable, bistable or multistable circuits
    • H03K3/02—Generators characterised by the type of circuit or by the means used for producing pulses
    • H03K3/027—Generators characterised by the type of circuit or by the means used for producing pulses by the use of logic circuits, with internal or external positive feedback
    • H03K3/03—Astable circuits
    • H03K3/0315—Ring oscillators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K5/00—Manipulating of pulses not covered by one of the other main groups of this subclass
    • H03K5/19—Monitoring patterns of pulse trains

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Storage Device Security (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
CN201110251651.4A 2010-09-02 2011-08-30 半导体集成电路装置 Expired - Fee Related CN102404002B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010-197143 2010-09-02
JP2010197143 2010-09-02
JP2011138894A JP2012074674A (ja) 2010-09-02 2011-06-22 半導体集積回路装置
JP2011-138894 2011-06-22

Publications (2)

Publication Number Publication Date
CN102404002A CN102404002A (zh) 2012-04-04
CN102404002B true CN102404002B (zh) 2015-09-23

Family

ID=45770240

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201110251651.4A Expired - Fee Related CN102404002B (zh) 2010-09-02 2011-08-30 半导体集成电路装置

Country Status (3)

Country Link
US (1) US8970247B2 (cg-RX-API-DMAC10.html)
JP (1) JP2012074674A (cg-RX-API-DMAC10.html)
CN (1) CN102404002B (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10140570B2 (en) * 2015-08-18 2018-11-27 William P Gulas Microprocessor-controlled tamper detection system
US9959496B2 (en) * 2015-08-18 2018-05-01 Franklin J. Camper Microprocessor-controlled tamper detection system
US10972460B2 (en) * 2016-02-12 2021-04-06 Industry-University Cooperation Foundation Hanyang University Secure semiconductor chip and operating method thereof
FR3057088A1 (fr) 2016-09-30 2018-04-06 Stmicroelectronics (Rousset) Sas Detecteur laser picosecondes
WO2019089261A1 (en) * 2017-11-02 2019-05-09 Raytheon Company Multi-ghz guard sensor for detecting physical or electromagnetic intrusions of a guarded region
WO2020069541A1 (de) * 2018-10-04 2020-04-09 Riddle & Code Gmbh Elektronische markierung
KR102837893B1 (ko) * 2020-01-29 2025-07-25 삼성전자주식회사 반도체 장치의 테스트 방법
TWI755771B (zh) * 2020-06-24 2022-02-21 新唐科技股份有限公司 處理電路及處理方法
USD1003738S1 (en) * 2021-02-26 2023-11-07 Zhejiang Orient Gene Biotech Co., LTD Calibrator device
IT202100030482A1 (it) * 2021-12-01 2023-06-01 St Microelectronics Srl Rilevatore di crepe per piastrine a semiconduttore

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1256565A (zh) * 1998-12-04 2000-06-14 富士通株式会社 半导体集成电路
US7489204B2 (en) * 2005-06-30 2009-02-10 International Business Machines Corporation Method and structure for chip-level testing of wire delay independent of silicon delay

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR940009250B1 (ko) * 1991-12-18 1994-10-01 삼성전자 주식회사 복수개의 동작전압에 대응하는 리프레쉬 타이머
EP0558879B1 (en) * 1992-03-04 1997-05-14 Astra Aktiebolag Disposable inhaler
JPH08115267A (ja) 1994-10-19 1996-05-07 Tech Res & Dev Inst Of Japan Def Agency 情報秘匿機構
EP0850440A1 (en) * 1995-07-20 1998-07-01 Dallas Semiconductor Corporation Secure module with microprocessor and co-processor
US5815043A (en) * 1997-02-13 1998-09-29 Apple Computer, Inc. Frequency controlled ring oscillator having by passable stages
JPH10270644A (ja) * 1997-03-21 1998-10-09 Nec Corp 半導体集積回路装置
DE10101330A1 (de) * 2001-01-13 2002-07-18 Philips Corp Intellectual Pty Elektrische oder elektronische Schaltungsanordnung und Verfahren zum Schützen der selben von Manipulation und/oder Missbrauch
JP4275110B2 (ja) * 2001-08-07 2009-06-10 株式会社ルネサステクノロジ 半導体装置およびｉｃカード
US20040212017A1 (en) 2001-08-07 2004-10-28 Hirotaka Mizuno Semiconductor device and ic card
CN100378991C (zh) 2001-11-28 2008-04-02 Nxp股份有限公司 半导体器件,卡,系统以及初始化和检验半导体器件的真实性和身份的方法
JP3592316B2 (ja) * 2002-06-21 2004-11-24 株式会社半導体理工学研究センター 半導体特性評価装置
JP4748929B2 (ja) * 2003-08-28 2011-08-17 パナソニック株式会社 保護回路および半導体装置
US7986193B2 (en) * 2007-01-03 2011-07-26 Apple Inc. Noise reduction within an electronic device using automatic frequency modulation
JP2009277085A (ja) * 2008-05-15 2009-11-26 Nippon Telegr & Teleph Corp <Ntt> 情報削除機能付きｌｓｉ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1256565A (zh) * 1998-12-04 2000-06-14 富士通株式会社 半导体集成电路
US7489204B2 (en) * 2005-06-30 2009-02-10 International Business Machines Corporation Method and structure for chip-level testing of wire delay independent of silicon delay

Also Published As

Publication number Publication date
US20120056639A1 (en) 2012-03-08
CN102404002A (zh) 2012-04-04
US8970247B2 (en) 2015-03-03
JP2012074674A (ja) 2012-04-12

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150923