CN102399443B - 抗热膨胀性树脂和抗热膨胀性金属 - Google Patents

抗热膨胀性树脂和抗热膨胀性金属 Download PDF

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CN102399443B
CN102399443B CN201110228962.9A CN201110228962A CN102399443B CN 102399443 B CN102399443 B CN 102399443B CN 201110228962 A CN201110228962 A CN 201110228962A CN 102399443 B CN102399443 B CN 102399443B
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metal
resin
thermal expansion
solid particles
preparation example
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CN102399443A (zh
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久保田纯
三浦薫
薮田久人
松村喜彦
岛川祐一
东正树
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Canon Inc
Kyoto University NUC
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Kyoto University NUC
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    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00—Compounds of nickel
    • C01G53/40—Complex oxides containing nickel and at least one other metal element
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00—Compounds of nickel
    • C01G53/80—Compounds containing nickel, with or without oxygen or hydrogen, and containing one or more other elements
    • C01G53/82—Compounds containing nickel, with or without oxygen or hydrogen, and containing two or more other elements
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02—Materials undergoing a change of physical state when used
    • C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/50—Solid solutions
    • C01P2002/52—Solid solutions containing elements as dopants
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/50—Solid solutions
    • C01P2002/52—Solid solutions containing elements as dopants
    • C01P2002/54—Solid solutions containing elements as dopants one element only
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/32—Thermal properties

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
CN201110228962.9A 2010-08-12 2011-08-11 抗热膨胀性树脂和抗热膨胀性金属 Active CN102399443B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010180886 2010-08-12
JP2010-180886 2010-08-12
JP2011097852A JP5795187B2 (ja) 2010-08-12 2011-04-26 対熱膨張性樹脂および対熱膨張性金属
JP2011-097852 2011-04-26

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CN102399443A CN102399443A (zh) 2012-04-04
CN102399443B true CN102399443B (zh) 2014-06-11

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US (2) US8664316B2 (https=)
EP (1) EP2418240B1 (https=)
JP (1) JP5795187B2 (https=)
CN (1) CN102399443B (https=)

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Publication number Priority date Publication date Assignee Title
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
WO2014010197A1 (ja) * 2012-07-11 2014-01-16 パナソニック株式会社 電子部品
CN103982868B (zh) * 2014-04-30 2018-09-07 合肥京东方显示光源有限公司 一种自缓冲元件及其制备方法、背光模组、显示装置
DE102015100863B4 (de) 2015-01-21 2022-03-03 Infineon Technologies Ag Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem
JP6546483B2 (ja) * 2015-08-31 2019-07-17 地方独立行政法人神奈川県立産業技術総合研究所 負熱膨張性材料の製造方法
JP6555473B2 (ja) * 2015-08-31 2019-08-07 国立大学法人東京工業大学 負熱膨張性材料、及び複合体
JP6619641B2 (ja) * 2015-12-14 2019-12-11 株式会社小糸製作所 光源ユニット、及び、それを用いた灯具
US10567508B2 (en) * 2017-04-28 2020-02-18 Facebook, Inc. Media file upload awareness for online systems
RU2676537C1 (ru) * 2017-09-06 2019-01-09 Дмитрий Александрович Серебренников Композитный материал с инварными свойствами
JP7846502B2 (ja) * 2018-06-21 2026-04-15 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 高温において安定した電気特性を有する固体電解キャパシタ
JP7351477B2 (ja) 2019-07-23 2023-09-27 国立大学法人東京工業大学 樹脂組成物およびその樹脂成形体

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CN1526029A (zh) * 2001-05-24 2004-09-01 热界面材料和受热器构型

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JPS61175035A (ja) * 1985-01-31 1986-08-06 株式会社日立製作所 樹脂と無機材料との複合体
US5694503A (en) 1996-09-09 1997-12-02 Lucent Technologies Inc. Article comprising a temperature compensated optical fiber refractive index grating
US6132676A (en) * 1997-06-30 2000-10-17 Massachusetts Institute Of Technology Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
US20050191515A1 (en) 2000-07-20 2005-09-01 Shipley Company, L.L.C. Very low thermal expansion composite
US6518609B1 (en) 2000-08-31 2003-02-11 University Of Maryland Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film
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WO2005036661A1 (ja) 2003-10-08 2005-04-21 National Institute Of Advanced Industrial Science And Technology 熱電変換材料接続用導電性ペースト
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Also Published As

Publication number Publication date
EP2418240A1 (en) 2012-02-15
CN102399443A (zh) 2012-04-04
JP5795187B2 (ja) 2015-10-14
US8664316B2 (en) 2014-03-04
US20140134038A1 (en) 2014-05-15
US20120037842A1 (en) 2012-02-16
US8974729B2 (en) 2015-03-10
JP2012057142A (ja) 2012-03-22
EP2418240B1 (en) 2012-11-28

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