JP5795187B2 - 対熱膨張性樹脂および対熱膨張性金属 - Google Patents
対熱膨張性樹脂および対熱膨張性金属 Download PDFInfo
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- JP5795187B2 JP5795187B2 JP2011097852A JP2011097852A JP5795187B2 JP 5795187 B2 JP5795187 B2 JP 5795187B2 JP 2011097852 A JP2011097852 A JP 2011097852A JP 2011097852 A JP2011097852 A JP 2011097852A JP 5795187 B2 JP5795187 B2 JP 5795187B2
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/453—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G53/00—Compounds of nickel
- C01G53/40—Complex oxides containing nickel and at least one other metal element
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G53/00—Compounds of nickel
- C01G53/80—Compounds containing nickel, with or without oxygen or hydrogen, and containing one or more other elements
- C01G53/82—Compounds containing nickel, with or without oxygen or hydrogen, and containing two or more other elements
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/02—Materials undergoing a change of physical state when used
- C09K5/06—Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/50—Solid solutions
- C01P2002/52—Solid solutions containing elements as dopants
- C01P2002/54—Solid solutions containing elements as dopants one element only
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/32—Thermal properties
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011097852A JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
| US13/205,258 US8664316B2 (en) | 2010-08-12 | 2011-08-08 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
| EP11177211A EP2418240B1 (en) | 2010-08-12 | 2011-08-11 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
| CN201110228962.9A CN102399443B (zh) | 2010-08-12 | 2011-08-11 | 抗热膨胀性树脂和抗热膨胀性金属 |
| US14/152,404 US8974729B2 (en) | 2010-08-12 | 2014-01-10 | Anti-thermally-expansive resin and anti-thermally-expansive metal |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010180886 | 2010-08-12 | ||
| JP2010180886 | 2010-08-12 | ||
| JP2011097852A JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012057142A JP2012057142A (ja) | 2012-03-22 |
| JP2012057142A5 JP2012057142A5 (https=) | 2014-06-19 |
| JP5795187B2 true JP5795187B2 (ja) | 2015-10-14 |
Family
ID=44645548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011097852A Active JP5795187B2 (ja) | 2010-08-12 | 2011-04-26 | 対熱膨張性樹脂および対熱膨張性金属 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US8664316B2 (https=) |
| EP (1) | EP2418240B1 (https=) |
| JP (1) | JP5795187B2 (https=) |
| CN (1) | CN102399443B (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021015192A1 (ja) | 2019-07-23 | 2021-01-28 | キヤノン株式会社 | 樹脂組成物およびその樹脂成形体 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5781824B2 (ja) * | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
| WO2014010197A1 (ja) * | 2012-07-11 | 2014-01-16 | パナソニック株式会社 | 電子部品 |
| CN103982868B (zh) * | 2014-04-30 | 2018-09-07 | 合肥京东方显示光源有限公司 | 一种自缓冲元件及其制备方法、背光模组、显示装置 |
| DE102015100863B4 (de) | 2015-01-21 | 2022-03-03 | Infineon Technologies Ag | Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem |
| JP6546483B2 (ja) * | 2015-08-31 | 2019-07-17 | 地方独立行政法人神奈川県立産業技術総合研究所 | 負熱膨張性材料の製造方法 |
| JP6555473B2 (ja) * | 2015-08-31 | 2019-08-07 | 国立大学法人東京工業大学 | 負熱膨張性材料、及び複合体 |
| JP6619641B2 (ja) * | 2015-12-14 | 2019-12-11 | 株式会社小糸製作所 | 光源ユニット、及び、それを用いた灯具 |
| US10567508B2 (en) * | 2017-04-28 | 2020-02-18 | Facebook, Inc. | Media file upload awareness for online systems |
| RU2676537C1 (ru) * | 2017-09-06 | 2019-01-09 | Дмитрий Александрович Серебренников | Композитный материал с инварными свойствами |
| JP7846502B2 (ja) * | 2018-06-21 | 2026-04-15 | キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション | 高温において安定した電気特性を有する固体電解キャパシタ |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4999336A (en) * | 1983-12-13 | 1991-03-12 | Scm Metal Products, Inc. | Dispersion strengthened metal composites |
| JPS61175035A (ja) * | 1985-01-31 | 1986-08-06 | 株式会社日立製作所 | 樹脂と無機材料との複合体 |
| US5694503A (en) | 1996-09-09 | 1997-12-02 | Lucent Technologies Inc. | Article comprising a temperature compensated optical fiber refractive index grating |
| US6132676A (en) * | 1997-06-30 | 2000-10-17 | Massachusetts Institute Of Technology | Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite |
| US20050191515A1 (en) | 2000-07-20 | 2005-09-01 | Shipley Company, L.L.C. | Very low thermal expansion composite |
| US6518609B1 (en) | 2000-08-31 | 2003-02-11 | University Of Maryland | Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film |
| CN1255563C (zh) | 2001-05-24 | 2006-05-10 | 弗莱氏金属公司 | 热界面材料和受热器构型 |
| CA2547358C (en) | 2001-05-24 | 2013-08-06 | Fry's Metals, Inc. | Thermal interface material and solder preforms |
| US7105235B2 (en) * | 2002-05-17 | 2006-09-12 | Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Natural Resources | Isotropic zero CTE reinforced composite materials |
| WO2005036661A1 (ja) | 2003-10-08 | 2005-04-21 | National Institute Of Advanced Industrial Science And Technology | 熱電変換材料接続用導電性ペースト |
| JP4446064B2 (ja) | 2004-07-07 | 2010-04-07 | 独立行政法人産業技術総合研究所 | 熱電変換素子及び熱電変換モジュール |
| US7632480B2 (en) | 2004-07-30 | 2009-12-15 | Riken | Thermal expansion inhibitor, zero thermal expansion material, negative thermal expansion material, method for inhibiting thermal expansion, and method for producing thermal expansion inhibitor |
| US20070135550A1 (en) * | 2005-12-14 | 2007-06-14 | Nirupama Chakrapani | Negative thermal expansion material filler for low CTE composites |
| JP2008260892A (ja) * | 2007-04-13 | 2008-10-30 | Sekisui Chem Co Ltd | 電子部品用接着剤 |
| JP2010021429A (ja) | 2008-07-11 | 2010-01-28 | Murata Mfg Co Ltd | 電子機器およびその製造方法 |
| JP2010029990A (ja) * | 2008-07-29 | 2010-02-12 | National Institute Of Advanced Industrial & Technology | 負熱膨張率材料および該負熱膨張率材料を含む複合材料 |
| JP5781824B2 (ja) | 2010-08-12 | 2015-09-24 | キヤノン株式会社 | 熱膨張抑制部材および対熱膨張性部材 |
-
2011
- 2011-04-26 JP JP2011097852A patent/JP5795187B2/ja active Active
- 2011-08-08 US US13/205,258 patent/US8664316B2/en active Active
- 2011-08-11 CN CN201110228962.9A patent/CN102399443B/zh active Active
- 2011-08-11 EP EP11177211A patent/EP2418240B1/en active Active
-
2014
- 2014-01-10 US US14/152,404 patent/US8974729B2/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021015192A1 (ja) | 2019-07-23 | 2021-01-28 | キヤノン株式会社 | 樹脂組成物およびその樹脂成形体 |
| US12479972B2 (en) | 2019-07-23 | 2025-11-25 | Institute Of Science Tokyo | Resin composition and resin molded body thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2418240A1 (en) | 2012-02-15 |
| CN102399443A (zh) | 2012-04-04 |
| CN102399443B (zh) | 2014-06-11 |
| US8664316B2 (en) | 2014-03-04 |
| US20140134038A1 (en) | 2014-05-15 |
| US20120037842A1 (en) | 2012-02-16 |
| US8974729B2 (en) | 2015-03-10 |
| JP2012057142A (ja) | 2012-03-22 |
| EP2418240B1 (en) | 2012-11-28 |
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