JP5795187B2 - 対熱膨張性樹脂および対熱膨張性金属 - Google Patents

対熱膨張性樹脂および対熱膨張性金属 Download PDF

Info

Publication number
JP5795187B2
JP5795187B2 JP2011097852A JP2011097852A JP5795187B2 JP 5795187 B2 JP5795187 B2 JP 5795187B2 JP 2011097852 A JP2011097852 A JP 2011097852A JP 2011097852 A JP2011097852 A JP 2011097852A JP 5795187 B2 JP5795187 B2 JP 5795187B2
Authority
JP
Japan
Prior art keywords
metal
resin
solid particles
thermally expandable
linear expansion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011097852A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012057142A5 (https=
JP2012057142A (ja
Inventor
久保田 純
純 久保田
三浦 薫
薫 三浦
薮田 久人
久人 薮田
喜彦 松村
喜彦 松村
島川 祐一
祐一 島川
東 正樹
正樹 東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Kyoto University NUC
Original Assignee
Canon Inc
Kyoto University NUC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc, Kyoto University NUC filed Critical Canon Inc
Priority to JP2011097852A priority Critical patent/JP5795187B2/ja
Priority to US13/205,258 priority patent/US8664316B2/en
Priority to EP11177211A priority patent/EP2418240B1/en
Priority to CN201110228962.9A priority patent/CN102399443B/zh
Publication of JP2012057142A publication Critical patent/JP2012057142A/ja
Priority to US14/152,404 priority patent/US8974729B2/en
Publication of JP2012057142A5 publication Critical patent/JP2012057142A5/ja
Application granted granted Critical
Publication of JP5795187B2 publication Critical patent/JP5795187B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/453Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zinc, tin, or bismuth oxides or solid solutions thereof with other oxides, e.g. zincates, stannates or bismuthates
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00Compounds of nickel
    • C01G53/40Complex oxides containing nickel and at least one other metal element
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G53/00Compounds of nickel
    • C01G53/80Compounds containing nickel, with or without oxygen or hydrogen, and containing one or more other elements
    • C01G53/82Compounds containing nickel, with or without oxygen or hydrogen, and containing two or more other elements
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/11Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/02Materials undergoing a change of physical state when used
    • C09K5/06Materials undergoing a change of physical state when used the change of state being from liquid to solid or vice versa
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/50Solid solutions
    • C01P2002/52Solid solutions containing elements as dopants
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00Crystal-structural characteristics
    • C01P2002/50Solid solutions
    • C01P2002/52Solid solutions containing elements as dopants
    • C01P2002/54Solid solutions containing elements as dopants one element only
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00Particle morphology
    • C01P2004/60Particles characterised by their size
    • C01P2004/61Micrometer sized, i.e. from 1-100 micrometer
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00Physical properties of inorganic compounds
    • C01P2006/32Thermal properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
JP2011097852A 2010-08-12 2011-04-26 対熱膨張性樹脂および対熱膨張性金属 Active JP5795187B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011097852A JP5795187B2 (ja) 2010-08-12 2011-04-26 対熱膨張性樹脂および対熱膨張性金属
US13/205,258 US8664316B2 (en) 2010-08-12 2011-08-08 Anti-thermally-expansive resin and anti-thermally-expansive metal
EP11177211A EP2418240B1 (en) 2010-08-12 2011-08-11 Anti-thermally-expansive resin and anti-thermally-expansive metal
CN201110228962.9A CN102399443B (zh) 2010-08-12 2011-08-11 抗热膨胀性树脂和抗热膨胀性金属
US14/152,404 US8974729B2 (en) 2010-08-12 2014-01-10 Anti-thermally-expansive resin and anti-thermally-expansive metal

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010180886 2010-08-12
JP2010180886 2010-08-12
JP2011097852A JP5795187B2 (ja) 2010-08-12 2011-04-26 対熱膨張性樹脂および対熱膨張性金属

Publications (3)

Publication Number Publication Date
JP2012057142A JP2012057142A (ja) 2012-03-22
JP2012057142A5 JP2012057142A5 (https=) 2014-06-19
JP5795187B2 true JP5795187B2 (ja) 2015-10-14

Family

ID=44645548

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011097852A Active JP5795187B2 (ja) 2010-08-12 2011-04-26 対熱膨張性樹脂および対熱膨張性金属

Country Status (4)

Country Link
US (2) US8664316B2 (https=)
EP (1) EP2418240B1 (https=)
JP (1) JP5795187B2 (https=)
CN (1) CN102399443B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021015192A1 (ja) 2019-07-23 2021-01-28 キヤノン株式会社 樹脂組成物およびその樹脂成形体

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5781824B2 (ja) * 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材
WO2014010197A1 (ja) * 2012-07-11 2014-01-16 パナソニック株式会社 電子部品
CN103982868B (zh) * 2014-04-30 2018-09-07 合肥京东方显示光源有限公司 一种自缓冲元件及其制备方法、背光模组、显示装置
DE102015100863B4 (de) 2015-01-21 2022-03-03 Infineon Technologies Ag Verfahren zur Handhabung eines Produktsubstrats und ein verklebtes Substratsystem
JP6546483B2 (ja) * 2015-08-31 2019-07-17 地方独立行政法人神奈川県立産業技術総合研究所 負熱膨張性材料の製造方法
JP6555473B2 (ja) * 2015-08-31 2019-08-07 国立大学法人東京工業大学 負熱膨張性材料、及び複合体
JP6619641B2 (ja) * 2015-12-14 2019-12-11 株式会社小糸製作所 光源ユニット、及び、それを用いた灯具
US10567508B2 (en) * 2017-04-28 2020-02-18 Facebook, Inc. Media file upload awareness for online systems
RU2676537C1 (ru) * 2017-09-06 2019-01-09 Дмитрий Александрович Серебренников Композитный материал с инварными свойствами
JP7846502B2 (ja) * 2018-06-21 2026-04-15 キョーセラ・エイブイエックス・コンポーネンツ・コーポレーション 高温において安定した電気特性を有する固体電解キャパシタ

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4999336A (en) * 1983-12-13 1991-03-12 Scm Metal Products, Inc. Dispersion strengthened metal composites
JPS61175035A (ja) * 1985-01-31 1986-08-06 株式会社日立製作所 樹脂と無機材料との複合体
US5694503A (en) 1996-09-09 1997-12-02 Lucent Technologies Inc. Article comprising a temperature compensated optical fiber refractive index grating
US6132676A (en) * 1997-06-30 2000-10-17 Massachusetts Institute Of Technology Minimal thermal expansion, high thermal conductivity metal-ceramic matrix composite
US20050191515A1 (en) 2000-07-20 2005-09-01 Shipley Company, L.L.C. Very low thermal expansion composite
US6518609B1 (en) 2000-08-31 2003-02-11 University Of Maryland Niobium or vanadium substituted strontium titanate barrier intermediate a silicon underlayer and a functional metal oxide film
CN1255563C (zh) 2001-05-24 2006-05-10 弗莱氏金属公司 热界面材料和受热器构型
CA2547358C (en) 2001-05-24 2013-08-06 Fry's Metals, Inc. Thermal interface material and solder preforms
US7105235B2 (en) * 2002-05-17 2006-09-12 Her Majesty The Queen In Right Of Canada As Represented By The Minister Of Natural Resources Isotropic zero CTE reinforced composite materials
WO2005036661A1 (ja) 2003-10-08 2005-04-21 National Institute Of Advanced Industrial Science And Technology 熱電変換材料接続用導電性ペースト
JP4446064B2 (ja) 2004-07-07 2010-04-07 独立行政法人産業技術総合研究所 熱電変換素子及び熱電変換モジュール
US7632480B2 (en) 2004-07-30 2009-12-15 Riken Thermal expansion inhibitor, zero thermal expansion material, negative thermal expansion material, method for inhibiting thermal expansion, and method for producing thermal expansion inhibitor
US20070135550A1 (en) * 2005-12-14 2007-06-14 Nirupama Chakrapani Negative thermal expansion material filler for low CTE composites
JP2008260892A (ja) * 2007-04-13 2008-10-30 Sekisui Chem Co Ltd 電子部品用接着剤
JP2010021429A (ja) 2008-07-11 2010-01-28 Murata Mfg Co Ltd 電子機器およびその製造方法
JP2010029990A (ja) * 2008-07-29 2010-02-12 National Institute Of Advanced Industrial & Technology 負熱膨張率材料および該負熱膨張率材料を含む複合材料
JP5781824B2 (ja) 2010-08-12 2015-09-24 キヤノン株式会社 熱膨張抑制部材および対熱膨張性部材

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021015192A1 (ja) 2019-07-23 2021-01-28 キヤノン株式会社 樹脂組成物およびその樹脂成形体
US12479972B2 (en) 2019-07-23 2025-11-25 Institute Of Science Tokyo Resin composition and resin molded body thereof

Also Published As

Publication number Publication date
EP2418240A1 (en) 2012-02-15
CN102399443A (zh) 2012-04-04
CN102399443B (zh) 2014-06-11
US8664316B2 (en) 2014-03-04
US20140134038A1 (en) 2014-05-15
US20120037842A1 (en) 2012-02-16
US8974729B2 (en) 2015-03-10
JP2012057142A (ja) 2012-03-22
EP2418240B1 (en) 2012-11-28

Similar Documents

Publication Publication Date Title
JP5795187B2 (ja) 対熱膨張性樹脂および対熱膨張性金属
JP5781824B2 (ja) 熱膨張抑制部材および対熱膨張性部材
Hajra et al. Lead-free flexible Bismuth Titanate-PDMS composites: A multifunctional colossal dielectric material for hybrid piezo-triboelectric nanogenerator to sustainably power portable electronics
Kumar et al. Oxygen vacancy induced electrical conduction and room temperature ferromagnetism in system BaSn1− x Ni x O3 (0⩽ x⩽ 0.20)
Rousset et al. Electrical properties of Mn 3− x Co x O 4 (0≤ x≤ 3) ceramics: an interesting system for negative temperature coefficient thermistors
Zhou et al. Fully-dense Mn3Zn0. 7Ge0. 3N/Al composites with zero thermal expansion behavior around room temperature
CN112876232B (zh) 一种高温ntc热敏陶瓷材料及其放电等离子烧结方法
KR20130095936A (ko) 방열 코팅 조성물, 이를 코팅시킨 방열판 및 그 제조방법
Wang et al. Kirigami–Origami‐Inspired Lead‐Free Piezoelectric Ceramics
Fleming et al. Tailoring negative thermal expansion via tunable induced strain in La–Fe–Si-based multifunctional material
Ali et al. Thermal and mechanical properties of epoxy resin functionalized copper and graphene hybrids using in-situ polymerization method
WO2008133153A1 (ja) 熱電変換材料、その製造方法および熱電変換素子
JP6038244B2 (ja) 熱膨張抑制部材および対熱膨張性部材
Zheng et al. 3D Printing High‐Performance Piezoelectric Ceramic with Complex Structure for Ultrasonic Array Transducer
Yang et al. Low driving field and large strain in Bi0. 5Na0. 5TiO3-based relaxor/ferroelectric composite ceramics
JP6493642B1 (ja) 蓄熱粒子、恒温デバイス用組成物および恒温デバイス
CN103540806A (zh) 一种新型复合材料Al-Y2W3O12及其制备方法
Chou et al. Thermal, mechanical, and electrical properties of LSCo/mullite composite contact materials for solid oxide fuel cells
Zeng et al. Enhanced Dielectric and Mechanical Performances of the (La+ Nb) Codoped TiO2/Silicone Rubber Composites
Wu et al. Compositionally tunable high temperature Mn-doped BiFeO3–BaTiO3 lead-free piezoceramics
JP6831017B2 (ja) 組成物、膜及び膜の製造方法
Cai et al. Enhanced dielectric properties of PVDF-based three-phase composite films through introducing the semiconductive ZnO and ferroelectric NKBT filler
WO2015033689A1 (ja) 冷却デバイス
Zhang et al. Preparation and characterization of Mn1. 2Co0. 6Ni1. 2O4 NTC ceramic materials by rheological phase reaction method

Legal Events

Date Code Title Description
RD03 Notification of appointment of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7423

Effective date: 20120914

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140423

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140423

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20141031

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141225

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150223

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20150716

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20150812

R150 Certificate of patent or registration of utility model

Ref document number: 5795187

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150