CN102375101A - 采用不同层金属引线连出的无源器件测试去嵌方法 - Google Patents
采用不同层金属引线连出的无源器件测试去嵌方法 Download PDFInfo
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839921A (zh) * | 2012-11-26 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | 硅通孔的射频测试结构及寄生提取方法 |
CN105203852A (zh) * | 2014-06-10 | 2015-12-30 | 中国科学院微电子研究所 | 用于集成无源器件的测试板以及测试方案 |
CN111929558A (zh) * | 2020-09-28 | 2020-11-13 | 浙江铖昌科技有限公司 | 一种基于自校准的去嵌方法、系统、存储介质及终端 |
CN113436974A (zh) * | 2021-06-28 | 2021-09-24 | 深圳市时代速信科技有限公司 | 一种半导体器件及其制备方法 |
Citations (4)
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US20050027469A1 (en) * | 2003-07-31 | 2005-02-03 | Brunsman Michael D. | De-embedding devices under test |
CN1735815A (zh) * | 2002-05-16 | 2006-02-15 | 皇家飞利浦电子股份有限公司 | 用于校准和去嵌入的方法、用于去嵌入的装置组和矢量网络分析仪 |
CN101140305A (zh) * | 2006-09-08 | 2008-03-12 | 上海华虹Nec电子有限公司 | 可去除测试结构上寄生效应的射频片上电感测量方法 |
US20090216480A1 (en) * | 2008-02-26 | 2009-08-27 | Freescale Semiconductor, Inc. | Device under test de-embedding |
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Patent Citations (4)
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CN1735815A (zh) * | 2002-05-16 | 2006-02-15 | 皇家飞利浦电子股份有限公司 | 用于校准和去嵌入的方法、用于去嵌入的装置组和矢量网络分析仪 |
US20050027469A1 (en) * | 2003-07-31 | 2005-02-03 | Brunsman Michael D. | De-embedding devices under test |
CN101140305A (zh) * | 2006-09-08 | 2008-03-12 | 上海华虹Nec电子有限公司 | 可去除测试结构上寄生效应的射频片上电感测量方法 |
US20090216480A1 (en) * | 2008-02-26 | 2009-08-27 | Freescale Semiconductor, Inc. | Device under test de-embedding |
Non-Patent Citations (1)
Title |
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刘军等: "RF-CMOS建模:MOST在片测试结构寄生分析", 《半导体学报》, vol. 2, no. 2, 28 February 2007 (2007-02-28) * |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103839921A (zh) * | 2012-11-26 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | 硅通孔的射频测试结构及寄生提取方法 |
CN103839921B (zh) * | 2012-11-26 | 2016-06-08 | 上海华虹宏力半导体制造有限公司 | 硅通孔的射频测试结构及寄生提取方法 |
CN105203852A (zh) * | 2014-06-10 | 2015-12-30 | 中国科学院微电子研究所 | 用于集成无源器件的测试板以及测试方案 |
CN105203852B (zh) * | 2014-06-10 | 2019-07-02 | 中国科学院微电子研究所 | 用于集成无源器件的测试板以及测试方案 |
CN111929558A (zh) * | 2020-09-28 | 2020-11-13 | 浙江铖昌科技有限公司 | 一种基于自校准的去嵌方法、系统、存储介质及终端 |
CN111929558B (zh) * | 2020-09-28 | 2021-01-15 | 浙江铖昌科技股份有限公司 | 一种基于自校准的去嵌方法、系统、存储介质及终端 |
CN113436974A (zh) * | 2021-06-28 | 2021-09-24 | 深圳市时代速信科技有限公司 | 一种半导体器件及其制备方法 |
CN113436974B (zh) * | 2021-06-28 | 2022-06-24 | 深圳市时代速信科技有限公司 | 一种半导体器件及其制备方法 |
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