CN102367951B - Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation - Google Patents
Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation Download PDFInfo
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- CN102367951B CN102367951B CN201010607841.0A CN201010607841A CN102367951B CN 102367951 B CN102367951 B CN 102367951B CN 201010607841 A CN201010607841 A CN 201010607841A CN 102367951 B CN102367951 B CN 102367951B
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Abstract
The invention relates to a light emitting diode (LED) lamp and a manufacturing method thereof, in particular to an LED lamp having light weight and quick heat radiation and a manufacturing method thereof. The LED lamp having high equivalent-specific-surface brightness, closely-distributed LEDs and a good heat radiation effect and the manufacturing method thereof are provided for overcoming the weakneses of the prior art that the heat radiation effect is poor, the distribution density of the LED is low, the equivalent-specific-surface brightness is low and the like. The manufacturing method comprises the following steps that: an aluminum heat radiator is immersed by nitric acid, sulfuric acid or ammonium sulphate solution; then a copper-clad layer is formed on an oxidized film layer of the aluminum heat radiator; a layer of resin is paved on the copper-clad layer, a flexible circuit board substrate is bonded with the copper-clad layer through the resin, a layer of copper-clad layer is thermally pressed on the flexible circuit board substrate so the copper-clad layer, the flexible circuit board substrate, the resin and the copper-clad layer are firmly bonded; soldering tin is paved on the flexible circuit board substrate; and each LED is welded on the flexible circuit board substrate by adopting a reflow soldering way.
Description
Technical field
The present invention relates to a kind of LED lamp and manufacture method thereof, particularly relate to LED lamp and the manufacture method thereof of the light rapid heat dissipation of a kind of quality.
Background technology
Light emitting diode (LED) has the advantages such as low power consuming, power saving, life-span be long, durable, thus replacement traditional lighting is become following lighting source by each side is good.Wherein, LED street lamp dark high praise being subject to urban construction and various enterprises and institutions because it is energy-conservation, degree of intelligence is high.But along with power increases, the used heat that LED produces electric heating stream cannot effectively shed, and causes luminous efficiency degradation.LED is defined as service life, when LED luminous efficiency lower than former luminous efficiency 70% time, can be considered LED life termination.LED luminous efficiency can reduce along with service time and number of times, and too high junction temperature then can accelerate the decay of LED luminous efficiency.Therefore, the factors such as the reliable life of LED street lamp is short, thermal diffusivity is undesirable seriously constrain the development of this product.Therefore heat radiation becomes the crucial technical problem that we need to solve.
Current most of radiator is the problem solving circuit and heat radiation by aluminium base.Aluminium base is that a kind of metal-based copper-clad plate of uniqueness has good thermal conductivity, electrical insulation properties and machining property.LED radiator aluminium base plate mainly utilizes its heat-radiating substrate material itself to have preferably heat conductivity, is derived by thermal source from LED grain.Therefore; we are from LED sinking path describes; LED heat radiation substrate can be segmented two large classifications; be respectively (1) LED grain substrate and (2) system circuit board; these two kinds different heat-radiating substrates carry the heat energy that LED grain and LED wafer will produce time luminous for LED grain respectively; via LED grain heat-radiating substrate to system circuit board, then absorbed by atmospheric environment, to reach the loose effect of heat.
The drawback of this type of technique is to ensure by the inorganic material of insulation between conducting channel and heat dissipation element, causes the hidden danger of quality that heat radiation is bad or structural strength is undesirable.
Can find out, the key technology that need solve is exactly the problem of street lamp heat radiator.And traditional heat sinks has the hidden danger of quality that heat radiation is bad and structural strength is undesirable, therefore, we propose to utilize the insulating properties of the oxide-film of aluminium alloy own and the formedness of matrix adhesive force to avoid these hidden danger.
Summary of the invention
The present invention is poor mainly for prior art radiating effect, LED arranges, and density is low, waits the shortcomings such as surface area light intensity is low, has invented a kind of light intensity such as surface area such as grade is high, LED arrangement is intensive, have good heat dissipation effect simultaneously LED lamp and manufacture method thereof.
Above-mentioned technical problem of the present invention is implemented by the following technical programs:
The manufacture method Step d of the LED lamp of the light rapid heat dissipation of quality comprises:
A, surface finish: with cloth wheel and softer antiscuffing paste by aluminium radiator surface finish to leveling off to mirror effect;
B, paraffin removal: rinse aluminium radiator with Wax removal water;
C, oil removing: alloy degreasing powder adds water afterflush aluminium radiator;
D, Aluminium Radiator activate: soak aluminium radiator with the solution of nitric acid, sulfuric acid or ammonium persulfate;
E, formation copper plate: on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, coating thickness 1 ~ 3 micron, then 100 ~ 150 DEG C of bakings 2 hours;
B, sensitization: with the solution containing 2 ~ 5g/l stannous chloride and 2 ~ 5ml/l hydrochloric acid, at room temperature soak aluminium radiator 3 ~ 10 minutes;
C, copper plate activate: with the solution containing 2 ~ 5g/l silver nitrate and 2 ~ 5ml/l ammoniacal liquor, at room temperature soak aluminium radiator 5 ~ 10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soak aluminium radiator 10 ~ 30 seconds;
E, electroless copper plating: with the solution containing 12 ~ 15g/l copper sulphate and 20 ~ 30ml/l formaldehyde and 6 ~ 8g/l NaOH and 50 ~ 100g/l sodium potassium tartrate tetrahydrate, PH controls 11 ~ 12, at room temperature soaks aluminium radiator 120 ~ 180 minutes;
F, on copper plate, lay one deck resin, FPC substrate is bondd by resin and copper plate, and hot pressing one deck copper-clad on FPC substrate, makes secure bond between copper-clad, FPC substrate, resin, copper plate;
Shaping and the reflow soldering of G, circuit: lay scolding tin at FPC substrate; Adopt the mode of reflow soldering that LED is welded on FPC substrate.
As preferably, described step B paraffin removal is: Wax removal water is diluted with water to 2 ~ 4wt%, when temperature 50 ~ 70 DEG C, rinses aluminium radiator 5 ~ 10 minutes;
As preferably, described step C oil removing is: alloy degreasing powder is diluted with water to 30 ~ 80g/l, when temperature 50 ~ 80 DEG C, rinses aluminium radiator 5 ~ 10 minutes;
As preferably, described step D Aluminium Radiator activation is: with nitric acid 50% (volume ratio), at room temperature soak 0.5 ~ 1 minute; Then with the solution containing 80 ~ 120ml/l sulfuric acid and 70 ~ 100g/l ammonium persulfate, at room temperature, aluminium radiator is soaked 0.5 ~ 1 minute;
As preferably, hot water wash and twice flowing washing together with carrying out between step B with step C.
As preferably, hot water wash and twice flowing washing together with carrying out between step C with step D.
As preferably, carry out twice flowing washing between step D and step e, then use hot-water soak more than 10 minutes, then dry.
As preferably, in step G, the bonding machine bearing capacity that reflow soldering uses is 0.1 ~ 1 kilogram, and warm-up power is per kilogram 10 ~ 15 kilowatts.
The LED lamp that the lightweight heat conduction that said method manufactures is fast, include: be disposed with copper plate, resin bed, FPC substrate insulation layer, copper-clad, soldering-tin layer between radiator base plate and LED lamp bead, LED lamp bead is welded on copper-clad by soldering-tin layer; The central point of LED lamp bead is welded by soldering-tin layer with copper plate.
Preferably, described copper-clad is the circuit loop shape of LED lamp bead, and LED lamp bead both positive and negative polarity is welded and fixed by the circuit loop shape of soldering-tin layer and copper-clad.
In sum, the present invention compared to the prior art tool have the following advantages:
The present invention utilizes the insulation stability between the insulating properties guarantee circuit of FPC and radiator; Utilize again the feature that FPC easily assembles with external object, is connected, LED lamp is made to realize the heat radiation of mechanical device, namely there is not high thermal resistance in LED grain to the radiation processes of atmospheric environment and contact layer fixed by the machinery of instability, as long as use the radiator of little weight just can reach LED lamp own wt only about the 3.9KG of the 110W that excellent radiating effect adopts structure of the present invention to manufacture, the weight known far below current technology because heat-sinking capability strengthens simultaneously; Due to the flexible distortion of FPC, thus the moulding of light fixture can variation.
Accompanying drawing explanation
Fig. 1 is stereogram of the present invention.
Fig. 2 is the schematic diagram of circuit of the present invention.
Fig. 3 is partial sectional view of the present invention.
Number in the figure: 1, LED lamp bead; 2, circuit loop shape; 3, radiator base plate; 4, flexible wire roadbed sheet insulating barrier; 5, copper-clad; 6, scolding tin layers of copper; 7, copper plate; 8, fin; 9, resin bed; 10, central point.
Detailed description of the invention
Below by way of specific embodiment, technical scheme of the present invention is described further.
Embodiment 1:
The step of the manufacture method of LED lamp of the present invention.
1. surface finish: with cloth wheel and softer antiscuffing paste aluminium heat sink is polished to and levels off to mirror effect.
2. paraffin removal: Wax removal water is diluted with water to 2 ~ 4wt%, when temperature 50 ~ 70 DEG C, rinses aluminium heat sink 5 ~ 10min.
3. carry out one hot water wash and twice flowing washing.
4. oil removing: alloy degreasing powder is diluted with water to 30 ~ 80g/l, when temperature 50 ~ 80 DEG C, rinses aluminium heat sink 5 ~ 10min.
5. carry out one hot water wash and twice flowing washing.
6. aluminum thermal fin activation: with nitric acid 50% (volume ratio), at room temperature soak 0.5 ~ 1min; Then with after 80 ~ 120ml/l sulfuric acid solution and the mixing of 70 ~ 100g/l ammonium persulfate solution equal proportion, at room temperature, aluminium heat sink 0.5 ~ 1min is soaked.
7. twice flowing washing
9. one flowing washing, then uses hot-water soak more than 10 minutes, then dries.
10. on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, coating thickness 1 ~ 3 micron, then 100 ~ 150 DEG C of bakings 2 hours;
B, sensitization: with the solution containing 2 ~ 5g/l stannous chloride and 2 ~ 5ml/l hydrochloric acid, at room temperature soak aluminium radiator 3 ~ 10 minutes;
C, copper plate activate: with the solution containing 2 ~ 5g/l silver nitrate and 2 ~ 5ml/l ammoniacal liquor, at room temperature soak aluminium radiator 5 ~ 10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soak aluminium radiator 10 ~ 30 seconds;
E, electroless copper plating: with the solution containing 12 ~ 15g/l copper sulphate and 20 ~ 30ml/l formaldehyde and 6 ~ 8g/l NaOH and 50 ~ 100g/l sodium potassium tartrate tetrahydrate, PH controls 11 ~ 12, at room temperature soaks aluminium radiator 120 ~ 180 minutes;
11. lay one deck resin on copper plate, and FPC substrate is bondd by resin and copper plate, and hot pressing one deck copper-clad on FPC substrate, makes secure bond between copper-clad, FPC substrate, resin, copper plate;
12, the shaping and reflow soldering of circuit: lay scolding tin at FPC substrate, steel mesh printed solder paste; Adopt the mode of reflow soldering that LED is welded on FPC substrate.The bonding machine bearing capacity that reflow soldering uses is increased to 0.5 ~ 1 kilogram, and power is increased to per kilogram 5 ~ 10 kilowatts.
13. connect driving power, install optics and mechanics facility and assembling shell.
Embodiment 2: the structure of the LED lamp that the lightweight heat conduction that the inventive method manufactures is fast as shown in Figure 1,3, the LED lamp that lightweight heat conduction is fast, is disposed with copper plate 7, epoxy resin layer 9, FPC substrate insulation layer 4, copper-clad 5, soldering-tin layer 6 between radiator base plate 3 and LED lamp bead 1; Copper plate 7 and radiator base plate 3 are bonded by epoxy resin layer 9; FPC lightweight, softness, adopt epoxy resin adhesive to bind soft insulating material layer and radiator base plate, is current comparatively cost-effective method.
LED lamp bead 1 both positive and negative polarity is welded on circuit loop 2 shape of copper-clad 5 by soldering-tin layer 6, as shown in Figure 2, forms complete electric charge loop, LED lamp bead 1 normal luminous; The central point 10 of LED lamp bead does not contact with circuit loop shape 2 part in copper-clad 5, and be welded on copper plate 7 by soldering-tin layer 6, the central point of LED lamp bead is fixing point, also be the passage of heat transfer, and the heat of produce when LED lamp bead works as good heat transfer medium by soldering-tin layer 6 98% reach radiator base plate 3; Radiator base plate 3 has the fin 8 that vertically disposed thickness is little, quality is light, can accelerate radiating rate, the quantity of fin 8 is determined according to the heat radiation power of reality.
The adverse effect of high temperature to luminous efficiency is eliminated in the present embodiment, ensure circuit with simultaneously owing to substantially increasing heat-sinking capability thus just can reach good heat-radiating effect with the radiator with very little weight, adopt the 110W light fixture own wt only 3.9KG that this method manufactures, it is the minimum own wt of publish data already of going together both at home and abroad, insulating properties between loose element is to improve light fixture stability in the course of the work, increase the service life, reach energy-efficient object.
Comparative example 1:
The LED street lamp adopting aluminium base manufacture is current universal method, key step is: road lamp cap contains luminous unit base, be arranged on the mounting base of luminous unit base lower center position, be fixed on LED aluminum base plate on mounting base and power supply box, the front of aluminium base has printed circuit, and LED is arranged at the front of aluminium base.
Table 1 performance comparison table
In table 1, weight is the overall weight of radiator and LED lamp bead and the circuit block between them, does not comprise the weight of extraneous adornment thing.
Operating temperature-20 ~ 40 DEG C in table 1.
Can be obtained by table 1, the existing LED street lamp manufactured based on aluminium base, due to poor heat radiation, when there is equal-wattage with LED street lamp of the present invention, weight is large, volume is large, brightness is low, and unit are light intensity is low, and main cause is that poor heat radiation caused, more than comprehensive, the present invention well solves above problem.
Claims (8)
1. a manufacture method for the LED lamp of the light rapid heat dissipation of quality, its step comprises:
A, surface finish: with cloth wheel and softer antiscuffing paste by aluminium radiator surface finish to leveling off to mirror effect;
B, paraffin removal: rinse aluminium radiator with Wax removal water;
C, oil removing: alloy degreasing powder adds water afterflush aluminium radiator;
D, Aluminium Radiator activate: soak aluminium radiator with the solution of nitric acid, sulfuric acid or ammonium persulfate;
E, formation copper plate: on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, coating thickness 1 ~ 3 micron, then 100 ~ 150 DEG C of bakings 2 hours;
B, sensitization: with the solution containing 2 ~ 5g/l stannous chloride and 2 ~ 5ml/l hydrochloric acid, at room temperature soak aluminium radiator 3 ~ 10 minutes;
C, copper plate activate: with the solution containing 2 ~ 5g/l silver nitrate and 2 ~ 5ml/l ammoniacal liquor, at room temperature soak aluminium radiator 5 ~ 10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soak aluminium radiator 10 ~ 30 seconds;
E, electroless copper plating: with the solution containing 12 ~ 15g/l copper sulphate and 20 ~ 30ml/l formaldehyde and 6 ~ 8g/l NaOH and 50 ~ 100g/l sodium potassium tartrate tetrahydrate, PH controls 11 ~ 12, at room temperature soaks aluminium radiator 120 ~ 180 minutes;
F, on copper plate, lay one deck resin, FPC substrate is bondd by resin and copper plate, and hot pressing one deck copper-clad on FPC substrate, makes secure bond between copper-clad, FPC substrate, resin, copper plate;
Shaping and the reflow soldering of G, circuit: lay scolding tin at FPC substrate; Adopt the mode of reflow soldering that LED is welded on FPC substrate.
2. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1, is characterized in that, described step B paraffin removal is: Wax removal water is diluted with water to 2 ~ 4wt%, when temperature 50 ~ 70 DEG C, rinses aluminium radiator 5 ~ 10 minutes.
3. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1, is characterized in that, described step C oil removing is: alloy degreasing powder is diluted with water to 30 ~ 80g/l, when temperature 50 ~ 80 DEG C, rinses aluminium radiator 5 ~ 10 minutes.
4. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1, is characterized in that, described step D Aluminium Radiator activation is: be the nitric acid of 50% by volume ratio, at room temperature soaks 0.5 ~ 1 minute; Then with the solution containing 80 ~ 120ml/l sulfuric acid and 70 ~ 100g/l ammonium persulfate, at room temperature, aluminium radiator is soaked 0.5 ~ 1 minute.
5. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1 or 2 or 3 or 4, is characterized in that, hot water wash and twice flowing washing together with carrying out between step B with step C.
6. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1 or 2 or 3 or 4, is characterized in that, hot water wash and twice flowing washing together with carrying out between step C with step D.
7. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1 or 2 or 3 or 4, is characterized in that, carries out twice flowing washing, then use hot-water soak more than 10 minutes, then dry between step D and step e.
8. the manufacture method of the LED lamp of the light rapid heat dissipation of quality according to claim 1 or 2 or 3 or 4, is characterized in that, in step G, the bonding machine bearing capacity that reflow soldering uses is 0.1 ~ 1 kilogram, and warm-up power is per kilogram 10 ~ 15 kilowatts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010607841.0A CN102367951B (en) | 2010-12-28 | 2010-12-28 | Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010607841.0A CN102367951B (en) | 2010-12-28 | 2010-12-28 | Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation |
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| Publication Number | Publication Date |
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| CN102367951A CN102367951A (en) | 2012-03-07 |
| CN102367951B true CN102367951B (en) | 2015-05-13 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101509650A (en) * | 2009-03-13 | 2009-08-19 | 东莞市翔龙能源科技有限公司 | High power LED lamp heat conducting and heat radiating device, heat conducting base and producing technique |
| CN101572994A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on radiating substrate in a vacuum sputtering way |
| CN101826580A (en) * | 2010-04-23 | 2010-09-08 | 江门市低碳照明科技有限公司 | Production process and application of novel LED substrate |
| CN201885020U (en) * | 2010-12-08 | 2011-06-29 | 浙江德胜新能源科技股份有限公司 | LED (light-emitting diode) lamp with light weight and rapid heat conduction |
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- 2010-12-28 CN CN201010607841.0A patent/CN102367951B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572994A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on radiating substrate in a vacuum sputtering way |
| CN101509650A (en) * | 2009-03-13 | 2009-08-19 | 东莞市翔龙能源科技有限公司 | High power LED lamp heat conducting and heat radiating device, heat conducting base and producing technique |
| CN101826580A (en) * | 2010-04-23 | 2010-09-08 | 江门市低碳照明科技有限公司 | Production process and application of novel LED substrate |
| CN201885020U (en) * | 2010-12-08 | 2011-06-29 | 浙江德胜新能源科技股份有限公司 | LED (light-emitting diode) lamp with light weight and rapid heat conduction |
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| CN102367951A (en) | 2012-03-07 |
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Effective date of registration: 20151123 Address after: 318000 village three village 127, Feng Feng street, Tiantai County, Zhejiang, Taizhou Patentee after: Chen Yitong Address before: 321000 Zhejiang city of Jinhua province qiubin Street Qiutao No. 318 North Street Patentee before: ZHEJIANG TECSUN NEW ENERGY TECHNOLOGY Co.,Ltd. Effective date of registration: 20151123 Address after: 321000 FZ building, 2 bright moonlight court, Wucheng District, Zhejiang, Jinhua Patentee after: Zhang Xiangyang Address before: 318000 village three village 127, Feng Feng street, Tiantai County, Zhejiang, Taizhou Patentee before: Chen Yitong |
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