CN102367951A - Light emitting diode (LED) lamp having light weight and quick heat radiation and manufacturing method thereof - Google Patents
Light emitting diode (LED) lamp having light weight and quick heat radiation and manufacturing method thereof Download PDFInfo
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- CN102367951A CN102367951A CN2010106078410A CN201010607841A CN102367951A CN 102367951 A CN102367951 A CN 102367951A CN 2010106078410 A CN2010106078410 A CN 2010106078410A CN 201010607841 A CN201010607841 A CN 201010607841A CN 102367951 A CN102367951 A CN 102367951A
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Abstract
The invention relates to a light emitting diode (LED) lamp and a manufacturing method thereof, in particular to an LED lamp having light weight and quick heat radiation and a manufacturing method thereof. The LED lamp having high equivalent-specific-surface brightness, closely-distributed LEDs and a good heat radiation effect and the manufacturing method thereof are provided for overcoming the weakneses of the prior art that the heat radiation effect is poor, the distribution density of the LED is low, the equivalent-specific-surface brightness is low and the like. The manufacturing method comprises the following steps that: an aluminum heat radiator is immersed by nitric acid, sulfuric acid or ammonium sulphate solution; then a copper-clad layer is formed on an oxidized film layer of the aluminum heat radiator; a layer of resin is paved on the copper-clad layer, a flexible circuit board substrate is bonded with the copper-clad layer through the resin, a layer of copper-clad layer is thermally pressed on the flexible circuit board substrate so the copper-clad layer, the flexible circuit board substrate, the resin and the copper-clad layer are firmly bonded; soldering tin is paved on the flexible circuit board substrate; and each LED is welded on the flexible circuit board substrate by adopting a reflow soldering way.
Description
Technical field
The present invention relates to a kind of LED light fixture and manufacturing approach thereof, relate in particular to a kind of LED light fixture and manufacturing approach thereof of light weight rapid heat dissipation.
Background technology
Light emitting diode (LED) has advantages such as low power consuming, power saving, life-span be long, durable, thereby will be replaced traditional lighting and become following lighting source by each side is good.Wherein, the LED street lamp is because it is energy-conservation, degree of intelligence Gao Ershen receives the high praise of urban construction and various enterprises and institutions.Yet along with power increases, the used heat that LED produces electric heating stream can't effectively shed, and causes luminous efficiency seriously to descend.Being defined as of LED service life, when the LED luminous efficiency be lower than former luminous efficiency 70% the time, can be considered the LED life termination.The LED luminous efficiency can reduce along with service time and number of times, too high connect surface temperature and then can quicken the decay of LED luminous efficiency.Factors such as therefore, the reliable life of LED street lamp is short, thermal diffusivity is undesirable have seriously restricted the development of this product.So heat radiation becomes the guardian technique problem that we need solve.
Present most of radiator is the problem that solves circuit and heat radiation by aluminium base.Aluminium base is that a kind of Metal Substrate copper-clad plate of uniqueness has good thermal conductivity, electrical insulation properties and machining property.LED heat-radiating aluminum plate mainly is to utilize its heat-radiating substrate material itself to have preferable heat conductivity, and thermal source is derived from LED crystal grain.Therefore; We can be respectively (1) LED crystal grain substrate and (2) system circuit board with LED heat-radiating substrate segmentation two big classifications from the narration of LED heat radiation approach; These two kinds of different radiating substrates are carrying the heat energy that LED crystal grain and LED wafer are produced LED crystal grain when luminous respectively;, then absorb to system circuit board via LED crystal grain heat-radiating substrate, to reach the diffusing effect of heat by atmospheric environment.
The drawback of this type of technology is that the inorganic material by insulation guarantees between conducting channel and the heat dissipation element, causes the bad or unfavorable hidden danger of quality of structural strength of heat radiation.
Can find out that the key technology that needs to solve is exactly the problem of street lamp heat radiator.And the traditional heat-dissipating utensil has the bad and unfavorable hidden danger of quality of structural strength of heat radiation, and therefore, we propose to utilize the insulating properties of the oxide-film of aluminium alloy own and the formedness of matrix adhesive force to avoid these hidden danger.
Summary of the invention
The present invention is primarily aimed at that the prior art radiating effect is poor, LED arranges, and density is low, waits shortcomings such as the surface area light intensity is low, has invented that a kind of to wait that the surface area light intensity is high, LED arranges intensive, has had the LED light fixture and the manufacturing approach thereof of good heat dissipation effect simultaneously.
Above-mentioned technical problem of the present invention is able to implement through following technical scheme:
The manufacturing approach d step of the LED light fixture of light weight rapid heat dissipation comprises:
A, surface finish: with cloth wheel and softer antiscuffing paste with the aluminium radiator surface finish to leveling off to mirror effect;
B, paraffin removal: wash aluminium radiator with Wax removal water;
C, oil removing: alloy removes oil-bound distemper and adds water afterflush aluminium radiator;
D, Aluminium Radiator activation: with the solution soaking aluminium radiator of nitric acid, sulfuric acid or ammonium persulfate;
E, formation copper plate: on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, 1～3 micron of coating thickness is then 100～150 ℃ of bakings 2 hours;
B, sensitization: the solution with containing 2～5g/l stannous chloride and 2～5ml/l hydrochloric acid, at room temperature soaked aluminium radiator 3～10 minutes;
C, copper plate activation: the solution with containing 2～5g/l silver nitrate and 2～5ml/l ammoniacal liquor, at room temperature soaked aluminium radiator 5～10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soaked aluminium radiator 10～30 seconds;
E, electroless copper plating: with the solution that contains 12～15g/l copper sulphate and 20～30ml/l formaldehyde and 6～8g/l NaOH and 50～100g/l sodium potassium tartrate tetrahydrate, PH is controlled at 11～12, at room temperature soaks aluminium radiator 120～180 minutes;
F, on copper plate, lay one deck resin, the FPC substrate bonds through resin and copper plate, and hot pressing one deck copper-clad on the FPC substrate makes secure bond between copper-clad, FPC substrate, resin, the copper plate;
G, circuit moulding and reflow soldering: lay scolding tin at the FPC substrate; Adopt the mode of reflow soldering to be welded on LED on the FPC substrate.
As preferably, described step B paraffin removal is: Wax removal water thin up to 2～4wt%, and when 50～70 ℃ of temperature, flushing aluminium radiator 5～10 minutes;
As preferably, described step C oil removing is: alloy removes oil-bound distemper thin up to 30～80g/l, when 50～80 ℃ of temperature, and flushing aluminium radiator 5～10 minutes;
As preferably, the activation of described step D Aluminium Radiator is: with nitric acid 50% (volume ratio), at room temperature soaked 0.5～1 minute; With the solution that contains 80～120ml/l sulfuric acid and 70～100g/l ammonium persulfate, at room temperature, soaked aluminium radiator 0.5～1 minute then;
As preferably, step B carries out the washing of flowing of hot water wash and twice between step C.
As preferably, step C carries out the washing of flowing of hot water wash and twice between step D.
As preferably, carry out the mobile washing of twice between step D and the step e, use hot-water soak more than 10 minutes then, dry again.
As preferably, among the step G, the bonding machine bearing capacity that reflow soldering is used is 0.1～1 kilogram, and preheating power is 10～15 kilowatts of per kilograms.
The fast LED light fixture of heat conduction in light weight that said method is made; Comprised: be disposed with copper plate, resin bed, FPC substrate insulating barrier, copper-clad, soldering-tin layer between radiator base plate and the LED lamp pearl, pearl is welded on the copper-clad through soldering-tin layer the LED lamp; Central point of LED lamp pearl and copper plate are through the soldering-tin layer welding.
Preferably, described copper-clad is the circuit loop shape of LED lamp pearl, and LED lamp pearl both positive and negative polarity partly welds fixing through the circuit loop shape of soldering-tin layer and copper-clad.
In sum, the present invention compares with prior art and has following advantage:
The present invention utilizes the insulating properties of FPC to guarantee the insulation stability between circuit and the radiator; Utilize again that FPC and external object are assembled easily, connection characteristics; Make the LED light fixture realize the heat radiation of no mechanical device; Be that LED crystal grain does not exist high thermal resistance and unsettled mechanical fixation contact layer in the heat radiation process of atmospheric environment;, heat-sinking capability use simultaneously the radiator of little weight just can reach the LED light fixture own wt of 110W that good radiating effect adopts structure manufacturing of the present invention only about 3.9KG, the weight known far below present technology because strengthening; Because the flexible distortion of FPC, thereby the moulding of light fixture can variation.
Description of drawings
Fig. 1 is a stereogram of the present invention.
Fig. 2 is the sketch map of circuit of the present invention.
Fig. 3 is a partial sectional view of the present invention.
Label among the figure: 1, LED lamp pearl; 2, circuit loop shape; 3, radiator base plate; 4, soft circuit substrate insulating barrier; 5, copper-clad; 6, scolding tin copper layer; 7, copper plate; 8, fin; 9, resin bed; 10, central point.
The specific embodiment
Below through specific embodiment technical scheme of the present invention is described further.
Embodiment 1:
The step of manufacturing of LED light fixture of the present invention.
1. surface finish: with cloth wheel and softer antiscuffing paste aluminium heat sink is polished to and levels off to mirror effect.
2. paraffin removal: Wax removal water thin up to 2～4wt%, when 50～70 ℃ of temperature, flushing aluminium heat sink 5～10min.
3. carry out the washing of flowing of one hot water wash and twice.
4. oil removing: alloy removes oil-bound distemper thin up to 30～80g/l, when 50～80 ℃ of temperature, and flushing aluminium heat sink 5～10min.
5. carry out the washing of flowing of one hot water wash and twice.
6. aluminum thermal fin activation:, at room temperature soak 0.5～1min with nitric acid 50% (volume ratio); After mixing with 80～120ml/l sulfuric acid solution and 70～100g/l ammonium persulfate solution equal proportion then, at room temperature, soak aluminium heat sink 0.5～1min.
7. twice flow and wash
The washing 9. flow together uses hot-water soak more than 10 minutes then, dries again.
10. on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, 1～3 micron of coating thickness is then 100～150 ℃ of bakings 2 hours;
B, sensitization: the solution with containing 2～5g/l stannous chloride and 2～5ml/l hydrochloric acid, at room temperature soaked aluminium radiator 3～10 minutes;
C, copper plate activation: the solution with containing 2～5g/l silver nitrate and 2～5ml/l ammoniacal liquor, at room temperature soaked aluminium radiator 5～10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soaked aluminium radiator 10～30 seconds;
E, electroless copper plating: with the solution that contains 12～15g/l copper sulphate and 20～30ml/l formaldehyde and 6～8g/l NaOH and 50～100g/l sodium potassium tartrate tetrahydrate, PH is controlled at 11～12, at room temperature soaks aluminium radiator 120～180 minutes;
11. on copper plate, lay one deck resin, the FPC substrate bonds through resin and copper plate, hot pressing one deck copper-clad on the FPC substrate makes secure bond between copper-clad, FPC substrate, resin, the copper plate;
12, circuit moulding and reflow soldering: lay scolding tin, steel mesh printed solder paste at the FPC substrate; Adopt the mode of reflow soldering to be welded on LED on the FPC substrate.The bonding machine bearing capacity that reflow soldering is used is increased to 0.5～1 kilogram, and power is increased to 5～10 kilowatts of per kilograms.
13. connect driving power, optics and mechanics facility and assembling shell be installed.
Embodiment 2: the structure of the LED light fixture that the heat conduction in light weight that the inventive method is made is fast is like Fig. 1, shown in 3; The LED light fixture that a kind of heat conduction in light weight is fast is disposed with copper plate 7, epoxy resin layer 9, FPC substrate insulating barrier 4, copper-clad 5, soldering-tin layer 6 between radiator base plate 3 and the LED lamp pearl 1; Copper plate 7 is bonding through epoxy resin layer 9 with radiator base plate 3; FPC lightweight, softness adopt the agent of epoxy resin gluing to bind soft insulation material layer and radiator base plate, are comparatively cost-effective at present methods.
Eliminated the adverse effect of high temperature in the present embodiment to luminous efficiency; Thereby guarantee circuit and can just reach good radiating effect with radiator owing to improved heat-sinking capability greatly simultaneously with very little weight; The 110W light fixture own wt that employing this method is made is 3.9KG only, is the minimum own wt of publish data already of going together both at home and abroad, and the insulating properties between the diffusing element is to improve light fixture stability in the course of the work; Increase the service life, reach energy-efficient purpose.
Comparative Examples 1:
Adopting the LED street lamp of aluminium base manufacturing is present universal method; Key step is: road lamp cap contains luminous unit base, is installed in the mounting base of luminous unit base bottom central position, is fixed on LED aluminium base and power supply box on the mounting base; The front of aluminium base has printed circuit, and the LED lamp is arranged at the front of aluminium base.
Table 1 performance comparison table
Weight is the overall weight of radiator and LED lamp pearl and the circuit block between them in the table 1, does not comprise the weight of extraneous adornment thing.
Operating temperature in the table 1-20～40 ℃.
Can be got by table 1, existing is the LED street lamp that make on the basis with the aluminium base, because poor heat radiation; When having equal-wattage with LED street lamp of the present invention; Weight is big, volume is big, brightness is low, and the unit are light intensity is low, and main cause is that poor heat radiation causes; More than comprehensive, the present invention has well solved above problem.
Claims (10)
1. the manufacturing approach of the LED light fixture of a light weight rapid heat dissipation, its step comprises:
A, surface finish: with cloth wheel and softer antiscuffing paste with the aluminium radiator surface finish to leveling off to mirror effect;
B, paraffin removal: wash aluminium radiator with Wax removal water;
C, oil removing: alloy removes oil-bound distemper and adds water afterflush aluminium radiator;
D, Aluminium Radiator activation: with the solution soaking aluminium radiator of nitric acid, sulfuric acid or ammonium persulfate;
E, formation copper plate: on the oxidation film layer of aluminium radiator, form a copper plate, step comprises:
A, spraying copper plate: at aluminium radiator surface spraying copper nanoparticle, 1～3 micron of coating thickness is then 100～150 ℃ of bakings 2 hours;
B, sensitization: the solution with containing 2～5g/l stannous chloride and 2～5ml/l hydrochloric acid, at room temperature soaked aluminium radiator 3～10 minutes;
C, copper plate activation: the solution with containing 2～5g/l silver nitrate and 2～5ml/l ammoniacal liquor, at room temperature soaked aluminium radiator 5～10 minutes;
D, acceleration: use 100ml/l formalin, at room temperature soaked aluminium radiator 10～30 seconds;
E, electroless copper plating: with the solution that contains 12～15g/l copper sulphate and 20～30ml/l formaldehyde and 6～8g/l NaOH and 50～100g/l sodium potassium tartrate tetrahydrate, PH is controlled at 11～12, at room temperature soaks aluminium radiator 120～180 minutes;
F, on copper plate, lay one deck resin, the FPC substrate bonds through resin and copper plate, and hot pressing one deck copper-clad on the FPC substrate makes secure bond between copper-clad, FPC substrate, resin, the copper plate;
G, circuit moulding and reflow soldering: lay scolding tin at the FPC substrate; Adopt the mode of reflow soldering to be welded on LED on the FPC substrate.
2. the manufacturing approach of the LED light fixture of light weight rapid heat dissipation according to claim 1 is characterized in that, described step B paraffin removal is: Wax removal water thin up to 2～4wt%, and when 50～70 ℃ of temperature, flushing aluminium radiator 5～10 minutes.
3. the manufacturing approach of the LED light fixture of light weight rapid heat dissipation according to claim 1 is characterized in that, described step C oil removing is: alloy removes oil-bound distemper thin up to 30～80g/l, when 50～80 ℃ of temperature, and flushing aluminium radiator 5～10 minutes.
4. the manufacturing approach of the LED light fixture of light weight rapid heat dissipation according to claim 1 is characterized in that, the activation of described step D Aluminium Radiator is: with nitric acid 50% (volume ratio), at room temperature soaked 0.5～1 minute; With the solution that contains 80～120ml/l sulfuric acid and 70～100g/l ammonium persulfate, at room temperature, soaked aluminium radiator 0.5～1 minute then.
5. according to the manufacturing approach of the LED light fixture of claim 1 or 2 or 3 or 4 described light weight rapid heat dissipations, it is characterized in that step B carries out the washing of flowing of hot water wash and twice between step C.
6. according to the manufacturing approach of the LED light fixture of claim 1 or 2 or 3 or 4 described light weight rapid heat dissipations, it is characterized in that step C carries out the washing of flowing of hot water wash and twice between step D.
7. according to the manufacturing approach of the LED light fixture of claim 1 or 2 or 3 or 4 described light weight rapid heat dissipations, it is characterized in that, carry out the twice washing of flowing between step D and the step e, use hot-water soak more than 10 minutes then, dry again.
8. according to the manufacturing approach of the LED light fixture of claim 1 or 2 or 3 or 4 described light weight rapid heat dissipations, it is characterized in that among the step G, the bonding machine bearing capacity that reflow soldering is used is 0.1～1 kilogram, preheating power is 10～15 kilowatts of per kilograms.
9. LED light fixture that heat conduction in light weight is fast; It is characterized in that; Be disposed with copper plate (7), resin bed (9), FPC substrate insulating barrier (4), copper-clad (5), soldering-tin layer (6) between radiator base plate (3) and the LED lamp pearl (1), pearl is welded on the copper-clad through soldering-tin layer the LED lamp; The central point (10) of LED lamp pearl welds through soldering-tin layer with copper plate.
10. the LED light fixture that heat conduction in light weight according to claim 9 is fast is characterized in that, described copper-clad is circuit loop (2) shape of LED lamp pearl, and LED lamp pearl both positive and negative polarity partly welds fixing through the circuit loop shape of soldering-tin layer and copper-clad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010607841.0A CN102367951B (en) | 2010-12-28 | 2010-12-28 | Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010607841.0A CN102367951B (en) | 2010-12-28 | 2010-12-28 | Manufacturing method of light emitting diode (LED) lamp having light weight and quick heat radiation |
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| CN102367951A true CN102367951A (en) | 2012-03-07 |
| CN102367951B CN102367951B (en) | 2015-05-13 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101509650A (en) * | 2009-03-13 | 2009-08-19 | 东莞市翔龙能源科技有限公司 | High power LED lamp heat conducting and heat radiating device, heat conducting base and producing technique |
| CN101572994A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on radiating substrate in a vacuum sputtering way |
| CN101826580A (en) * | 2010-04-23 | 2010-09-08 | 江门市低碳照明科技有限公司 | Production process and application of novel LED substrate |
| CN201885020U (en) * | 2010-12-08 | 2011-06-29 | 浙江德胜新能源科技股份有限公司 | LED (light-emitting diode) lamp with light weight and rapid heat conduction |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101572994A (en) * | 2008-04-29 | 2009-11-04 | 汉达精密电子(昆山)有限公司 | Method for forming conducting wire on radiating substrate in a vacuum sputtering way |
| CN101509650A (en) * | 2009-03-13 | 2009-08-19 | 东莞市翔龙能源科技有限公司 | High power LED lamp heat conducting and heat radiating device, heat conducting base and producing technique |
| CN101826580A (en) * | 2010-04-23 | 2010-09-08 | 江门市低碳照明科技有限公司 | Production process and application of novel LED substrate |
| CN201885020U (en) * | 2010-12-08 | 2011-06-29 | 浙江德胜新能源科技股份有限公司 | LED (light-emitting diode) lamp with light weight and rapid heat conduction |
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Effective date of registration: 20151123 Address after: 318000 village three village 127, Feng Feng street, Tiantai County, Zhejiang, Taizhou Patentee after: Chen Yitong Address before: 321000 Zhejiang city of Jinhua province qiubin Street Qiutao No. 318 North Street Patentee before: ZHEJIANG TECSUN NEW ENERGY TECHNOLOGY Co.,Ltd. Effective date of registration: 20151123 Address after: 321000 FZ building, 2 bright moonlight court, Wucheng District, Zhejiang, Jinhua Patentee after: Zhang Xiangyang Address before: 318000 village three village 127, Feng Feng street, Tiantai County, Zhejiang, Taizhou Patentee before: Chen Yitong |
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Granted publication date: 20150513 Termination date: 20171228 |