CN102346079A - Method for monitoring circuit board temperature by employing computer program - Google Patents
Method for monitoring circuit board temperature by employing computer program Download PDFInfo
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- CN102346079A CN102346079A CN2010102494987A CN201010249498A CN102346079A CN 102346079 A CN102346079 A CN 102346079A CN 2010102494987 A CN2010102494987 A CN 2010102494987A CN 201010249498 A CN201010249498 A CN 201010249498A CN 102346079 A CN102346079 A CN 102346079A
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- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000012544 monitoring process Methods 0.000 title claims abstract description 16
- 238000004590 computer program Methods 0.000 title claims abstract description 14
- 238000009529 body temperature measurement Methods 0.000 claims abstract description 23
- 238000012360 testing method Methods 0.000 claims abstract description 21
- 238000005070 sampling Methods 0.000 claims abstract description 16
- 238000005476 soldering Methods 0.000 claims abstract description 10
- 239000003990 capacitor Substances 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000004458 analytical method Methods 0.000 abstract description 2
- 230000006870 function Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000007405 data analysis Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004861 thermometry Methods 0.000 description 1
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Abstract
The invention discloses a method for monitoring circuit board temperature by employing a computer program. The method comprises the following steps: laying a plurality of temperature measurement points on a circuit board; providing a temperature sensor at each temperature measurement point; sampling circuit board temperature by utilizing the temperature sensors of the temperature measurement points; determining whether a plurality of sampling values corresponding to the temperature measurement points meet a predetermined standard or not, and displaying disqualification of a circuit board temperature test when the values do not meet the standard. By utilizing a detection method in the invention, temperature peak values in a circuit board preheating interval and temperature maximal values when going through a wave-soldering interval of all temperature measurement points can be read automatically, and whether the temperature test meets a requirement or not is indicated according to a predetermined standard value. In addition, the method can be merged into embedded software to automatically analysis key temperature data in a temperature measurement curve with assistance.
Description
Technical Field
The invention relates to a testing technology of a circuit board, in particular to a monitoring and processing technology of the temperature of the circuit board.
Background
Currently, printed circuit boards designed to perform certain functions are often subjected to oven temperature tests either during a line break/change or at intervals, such as 12 hours. In short, the printed circuit board is preheated and heated in advance by the heater, and the temperature of the circuit board is detected in real time by arranging the temperature sensor at a plurality of temperature measuring points on the circuit board. For example, the temperature sensor at each temperature measurement point can draw a temperature measurement curve from the collected temperature data, and different temperature measurement points can generate a plurality of temperature measurement curves (approximately 5 to 10 curves depending on the type of the circuit board). The graph is then manually translated or enlarged for a certain thermometry curve and it is checked according to a predetermined specification whether the specified value is within the range required by the specification.
However, in the data analysis process of the temperature measurement curve chart, each temperature measurement curve needs to be checked manually, which is troublesome and sometimes results in reading the wrong temperature value in the preheating interval manually. Furthermore, the manual analysis personnel must know and become familiar with the predetermined specifications of the different types of circuit boards in advance to check for compliance with the specifications.
In view of this, it is a subject faced by the related technical personnel how to design a method for detecting the temperature of the circuit board, especially for automatically analyzing data of temperature measurement curves generated by different temperature measurement points on the circuit board.
Disclosure of Invention
In view of the above-mentioned defects in the temperature testing of the circuit board in the prior art, the present invention provides a method for monitoring the temperature of the circuit board by using a computer program, wherein a series of instruction sets are executed by a computer to analyze the critical temperature data in the temperature measurement curve, and whether the temperature testing meets the requirements of symbols is detected according to the predetermined specification of the circuit board.
According to one aspect of the present invention, there is provided a method of monitoring the temperature of a circuit board using a computer program, the method comprising the steps of:
arranging a plurality of temperature measuring points on the circuit board;
arranging a temperature sensor at each temperature measuring point;
sampling the temperature of the circuit board by using a plurality of temperature sensors of a plurality of temperature measuring points; and
and judging whether the plurality of temperature sampling values corresponding to the plurality of temperature measuring points meet a preset standard or not, and displaying that the circuit board temperature test is unqualified when the plurality of temperature sampling values do not meet the standard.
Preferably, the circuit board is preheated and heated in advance using a heater. In addition, when the circuit board is in a preheating interval and any temperature measuring point is different from two adjacent temperature sampling values by more than 3 ℃, the temperature test of the circuit board is indicated to be unqualified. In addition, when the circuit board is in a preheating interval and any temperature measuring point is different from two non-adjacent temperature sampling values by more than 5 ℃, the temperature test of the circuit board is indicated to be unqualified.
Preferably, the detection method can also detect whether the circuit board is a lead or lead-free circuit board, and further configure the predetermined specification as a lead specification or a lead-free specification accordingly.
According to an embodiment, the method further comprises: and acquiring a first temperature peak value of the circuit board in a preheating interval, and judging whether the first temperature peak value exceeds the standard or not according to the WI specification. According to another embodiment, the method further comprises: and acquiring a second temperature peak value of the circuit board in the wave soldering interval, and judging whether the second temperature peak value exceeds the standard or not according to the WI specification. Preferably, the method can further obtain the position coordinates of the first temperature peak value of the preheating interval on the temperature curve and the position coordinates of the second temperature peak value of the over-wave soldering interval on the temperature curve.
Preferably, the temperature measuring points are substantially distributed on the upper surface of the circuit board, the lower surface of the circuit board and the middle layer of the circuit board. Furthermore, the temperature measuring points are distributed on the capacitor grounding pin, the capacitor power pin, the capacitor body, the solder ball of the BGA component, the surface of the memory slot and the SMT component on the upper surface of the circuit board or the lower surface of the circuit board.
By adopting the circuit board temperature detection method, a series of instruction sets are executed by a computer, and the method can be respectively used for automatically reading the temperature peak value of all temperature measuring points in the preheating interval of the circuit board and the temperature maximum value of all temperature measuring points in the wave soldering interval and indicating whether the temperature test meets the requirements according to the preset standard value. In addition, the detection method can automatically switch the preset specification into a lead specification or a lead-free specification according to the type of the circuit board, and can be combined into embedded software according to the realized technical function so as to automatically analyze the key temperature data in the temperature measurement curve in an auxiliary manner.
Drawings
The various aspects of the present invention will become more apparent to the reader after reading the detailed description of the invention with reference to the attached drawings. Wherein,
FIG. 1 is a flow chart of a method for monitoring a temperature of a circuit board using a computer program according to an embodiment of the present invention.
Detailed Description
Embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.
FIG. 1 is a flow chart of a method for monitoring a temperature of a circuit board using a computer program according to an embodiment of the present invention. Referring to fig. 1, first, in step S1, a plurality of temperature measurement points are arranged on a circuit board to be tested, and temperature data from the temperature measurement points is analyzed to determine whether a temperature test for the circuit board during a certain period of time is satisfactory. In an embodiment of the present invention, the temperature measuring points are distributed on the upper surface of the circuit board, the lower surface of the circuit board, and the middle layer of the circuit board, and more specifically, the temperature measuring points are distributed on the capacitor ground pin, the capacitor power pin, the capacitor body, the solder ball of the BGA component, the surface of the memory socket, and the SMT component on the upper surface of the circuit board or the lower surface of the circuit board.
Next, in step S3 and step S5, a temperature sensor is disposed at each of the arranged temperature measuring points, and when the circuit board is heated, a plurality of temperature sampling data of the circuit board are obtained by using a plurality of temperature sensors corresponding to the plurality of temperature measuring points. In an embodiment of the present invention, for example, the circuit board is preheated and heated by a heater, and accordingly, the temperature measurement curve of the circuit board can be divided into a preheating interval and a heating interval.
The process further proceeds to step S7, where it is determined whether the sampled temperature value meets the predetermined specification. For example, the maximum temperature value (also referred to as a first temperature peak value, pretreater-Max) of the circuit board in the preheating interval may be obtained, and whether the obtained maximum temperature value exceeds the standard or not may be determined according to the WI specification; the maximum temperature value (also called as a second temperature Peak value) of the circuit board in the wave soldering interval can be obtained, and whether the obtained maximum temperature value exceeds the standard or not is judged according to the WI specification. In addition, the detection method of the invention can also judge a specific temperature measuring point by comparing the temperature measuring point longitudinally in time. Specifically, one of the determination methods is that when the circuit board is preheated by the heater, if the temperature sampling values of any two adjacent temperature measuring points on the board are different by more than 3 ℃, the temperature test of the circuit board is determined to be not satisfactory, that is, the difference between the temperature data acquired by the temperature sensor in two adjacent sampling periods is generally less than 3 ℃. Another judgment method is that in the preheating interval of the circuit board, if the difference between two temperature sampling values of any temperature measuring point on the board which is not adjacent is more than 5 ℃, the temperature test of the circuit board is also determined to be not qualified. For example, at a certain temperature measuring point, the difference between the 1 st temperature data and the 3 rd temperature data should be generally less than 5 ℃, and the difference between the 2 nd temperature data and the 4 th temperature data should also be generally less than 5 ℃. As a result of the determination at step S7, when the temperature data does not meet the specification, it is indicated that the temperature test of the circuit board is not qualified at step S9. For example, a test failing situation may be identified in red and a test passing situation may be indicated in green in the graphical interface of the display device.
In addition, the detection method can also automatically detect whether the circuit board is of a lead type or a lead-free type according to whether the circuit board contains lead components. When the circuit board is of the lead type, the lead specification corresponding to the lead circuit board is automatically configured, and when the circuit board is of the lead-free type, the lead specification corresponding to the lead-free circuit board is automatically configured. As can be seen here, the reference values for the lead and lead-free specifications of the circuit board are generally not the same during the temperature test.
In an embodiment of the present invention, for a temperature curve of a certain temperature measurement point, the detection method may further obtain a position coordinate corresponding to the maximum temperature value of the preheating interval on the temperature curve, and a position coordinate corresponding to the maximum temperature value of the over-wave soldering interval on the temperature curve. The temperature rise process of the circuit board in the preheating interval and the wave soldering interval can be known specifically through the position coordinates.
It should be noted that the detection function realized by the detection method of the present invention can also be combined into an embedded software to assist in automatically analyzing the key temperature data in the temperature measurement curve. By adopting the circuit board temperature detection method, a series of instruction sets are executed by a computer, and the method can be respectively used for automatically reading the temperature peak value of all temperature measuring points in the preheating interval of the circuit board and the temperature maximum value of all temperature measuring points in the wave soldering interval and indicating whether the temperature test meets the requirements according to the preset standard value. In addition, the detection method can automatically switch the preset specification into a lead specification or a lead-free specification according to the type of the circuit board, and can be combined into embedded software according to the realized technical function so as to automatically analyze the key temperature data in the temperature measurement curve in an auxiliary manner.
Hereinbefore, specific embodiments of the present invention are described with reference to the drawings. However, those skilled in the art will appreciate that various modifications and substitutions can be made to the specific embodiments of the present invention without departing from the spirit and scope of the invention. Such modifications and substitutions are intended to be included within the scope of the present invention as defined by the appended claims.
Claims (10)
1. A method of monitoring a temperature of a circuit board using a computer program, the method comprising the steps of:
arranging a plurality of temperature measuring points on the circuit board;
arranging a temperature sensor at each temperature measuring point;
sampling the temperature of the circuit board by using a plurality of temperature sensors of the plurality of temperature measuring points; and judging whether a plurality of temperature sampling values corresponding to the plurality of temperature measuring points meet a preset standard or not, and displaying that the circuit board temperature test is unqualified when the temperature sampling values do not meet the standard.
2. The method of claim 1, wherein the board is preheated and heated by a heater.
3. The method for monitoring the temperature of the circuit board by using the computer program according to claim 2, wherein when the circuit board is in a preheating interval and any temperature measuring point is different from two adjacent temperature sampling values by more than 3 ℃, the temperature test of the circuit board is indicated to be unqualified.
4. The method for monitoring the temperature of the circuit board by using the computer program according to claim 2, wherein when the circuit board is in a preheating interval and any temperature measuring point is different from two non-adjacent temperature sampling values by more than 5 ℃, the temperature test of the circuit board is indicated to be unqualified.
5. The method of claim 1, further comprising detecting whether the circuit board is a leaded or unleaded circuit board, and configuring the predetermined specification as a leaded or unleaded specification accordingly.
6. The method for monitoring the temperature of a circuit board using a computer program of claim 1, further comprising: and acquiring a first temperature peak value of the circuit board in a preheating interval, and judging whether the first temperature peak value exceeds the standard or not according to WI specifications.
7. The method for monitoring the temperature of a circuit board using a computer program of claim 1, further comprising: and acquiring a second temperature peak value of the circuit board in a wave soldering interval, and judging whether the second temperature peak value exceeds the standard or not according to WI specifications.
8. The method for monitoring the temperature of the circuit board by using the computer program according to claim 6 or 7, wherein the method further comprises obtaining the position coordinates of the first temperature peak in the preheating interval on the temperature curve or the second temperature peak in the over-wave soldering interval on the temperature curve.
9. A method of monitoring the temperature of a circuit board using a computer program according to claim 1, wherein the temperature measurement points are distributed substantially over the upper surface of the circuit board, the lower surface of the circuit board and the intermediate layer of the circuit board.
10. The method for monitoring the temperature of the circuit board according to claim 9, wherein the temperature measuring points are distributed on the capacitor ground pin, the power pin, the capacitor body, the solder ball of the BGA package, the surface of the memory socket and the SMT package on the upper surface or the lower surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102494987A CN102346079A (en) | 2010-08-03 | 2010-08-03 | Method for monitoring circuit board temperature by employing computer program |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102494987A CN102346079A (en) | 2010-08-03 | 2010-08-03 | Method for monitoring circuit board temperature by employing computer program |
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| CN102346079A true CN102346079A (en) | 2012-02-08 |
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| CN2010102494987A Pending CN102346079A (en) | 2010-08-03 | 2010-08-03 | Method for monitoring circuit board temperature by employing computer program |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402065A (en) * | 2013-08-09 | 2013-11-20 | 广州长嘉电子有限公司 | Temperature detection method and system for smart television |
| CN105467254A (en) * | 2016-01-20 | 2016-04-06 | 淄博职业学院 | Electric appliance detection method utilizing temperature gatherer |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
| CN106793464A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB that a kind of combination waterproof is detected with circuit abnormality |
| CN110806271A (en) * | 2018-08-06 | 2020-02-18 | 英业达科技有限公司 | Furnace temperature monitoring system and method thereof |
| CN111064163A (en) * | 2019-10-21 | 2020-04-24 | 张国基 | Management chip system for abnormal temperature of circuit board |
| CN112004629A (en) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN112268630A (en) * | 2020-10-09 | 2021-01-26 | 佛山市顺德区美的饮水机制造有限公司 | Temperature determination method, processor and device for temperature sensor |
-
2010
- 2010-08-03 CN CN2010102494987A patent/CN102346079A/en active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402065A (en) * | 2013-08-09 | 2013-11-20 | 广州长嘉电子有限公司 | Temperature detection method and system for smart television |
| CN105467254A (en) * | 2016-01-20 | 2016-04-06 | 淄博职业学院 | Electric appliance detection method utilizing temperature gatherer |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
| CN106793464A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB that a kind of combination waterproof is detected with circuit abnormality |
| CN106793490B (en) * | 2016-12-28 | 2018-12-11 | 云南保利天同仪器有限公司 | PCB circuit board and its detection method based on temperature fluctuation detection circuit exception |
| CN112004629A (en) * | 2018-04-27 | 2020-11-27 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN112004629B (en) * | 2018-04-27 | 2022-05-03 | 三菱电机株式会社 | Brazing monitoring device, brazing monitoring method, and brazing device |
| CN110806271A (en) * | 2018-08-06 | 2020-02-18 | 英业达科技有限公司 | Furnace temperature monitoring system and method thereof |
| CN111064163A (en) * | 2019-10-21 | 2020-04-24 | 张国基 | Management chip system for abnormal temperature of circuit board |
| CN111064163B (en) * | 2019-10-21 | 2022-03-11 | 张国基 | Management chip system for abnormal temperature of circuit board |
| CN112268630A (en) * | 2020-10-09 | 2021-01-26 | 佛山市顺德区美的饮水机制造有限公司 | Temperature determination method, processor and device for temperature sensor |
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Application publication date: 20120208 |
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