CN111064163A - Management chip system for abnormal temperature of circuit board - Google Patents
Management chip system for abnormal temperature of circuit board Download PDFInfo
- Publication number
- CN111064163A CN111064163A CN201910999474.4A CN201910999474A CN111064163A CN 111064163 A CN111064163 A CN 111064163A CN 201910999474 A CN201910999474 A CN 201910999474A CN 111064163 A CN111064163 A CN 111064163A
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- Prior art keywords
- module
- temperature
- chip system
- management chip
- circuit board
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
- H02H5/00—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection
- H02H5/04—Emergency protective circuit arrangements for automatic disconnection directly responsive to an undesired change from normal non-electric working conditions with or without subsequent reconnection responsive to abnormal temperature
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B25/00—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
- G08B25/01—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium
- G08B25/08—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using communication transmission lines
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- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B25/00—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems
- G08B25/01—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium
- G08B25/10—Alarm systems in which the location of the alarm condition is signalled to a central station, e.g. fire or police telegraphic systems characterised by the transmission medium using wireless transmission systems
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
- G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C19/00—Electric signal transmission systems
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Business, Economics & Management (AREA)
- Emergency Management (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The application provides a management chip system of circuit board abnormal temperature relates to the electric data processing field. The management chip system includes: the temperature sensing device comprises at least two temperature sensing modules, an operation module, a storage module, an algorithm calculation module, a power supply module and an input/output module, wherein the algorithm calculation module is respectively connected with the operation module, the input/output module and the storage module, the storage module is respectively connected with the operation module, the input/output module and the temperature sensing module is connected with the operation module. The temperature information of the circuit board can be acquired in real time, and the temperature safety of the circuit board when the circuit board is used is guaranteed.
Description
Technical Field
The application belongs to the field of electric data processing, and particularly relates to a management chip system for abnormal temperature of a circuit board.
Background
At present, the circuit board is because of unable effectual control heat energy and is on fire because of high temperature, and the circuit board encapsulates usually inside unable taking out of equipment, and the conflagration that the circuit board arouses has the conflagration that can stretch to equipment or even the conflagration of mill, and this not only can bring huge economic loss for the mill, can cause the threat to workman staff's life safety even.
Disclosure of Invention
The embodiment of the invention mainly aims to provide a chip system for managing abnormal temperature of a circuit board.
In a first aspect, a chip system for managing abnormal temperature of a circuit board is provided, which includes:
the temperature sensing module comprises at least two temperature sensing modules, an operation module, a storage module, an algorithm calculation module, a power supply module and an input/output module, wherein the algorithm calculation module is respectively connected with the operation module, the input/output module and the storage module, the storage module is respectively connected with the operation module and the input/output module, the temperature sensing module is connected with the operation module, the power supply module is respectively used for supplying power to the temperature sensing module, the operation module, the storage module, the algorithm calculation module and the input/output module, the at least two temperature sensing modules acquire temperature information of a circuit board at the same time point, the operation module compares alarm temperature stored in the storage module with the temperature information, and when the temperature information is higher than the alarm temperature, the algorithm calculation module acquires the optimal temperature from the temperature information through a preset optimal algorithm.
In one possible implementation manner, the operation frequency of the operation module is 0.1 us-5000 s.
In another possible implementation, the preferred algorithm is an ant colony algorithm implemented with metal interconnects in a silicon wafer MOS structure.
In yet another possible implementation, the power supply module includes: a built-in battery and/or an external power supply.
In yet another possible implementation manner, the input-output module is configured to: outputting temperature control signals and inputting alarm temperature updating signals.
In yet another possible implementation manner, the transmission manner of the input/output module is wired transmission or wireless transmission.
In yet another possible implementation, the wireless transmission includes: zigbee, Wireless, ISA100.11a, Wi-Fi and Bluetooth.
In yet another possible implementation manner, the management chip system further includes:
and the display module is connected with the input and output module and is used for displaying the temperature information of the circuit board.
In yet another possible implementation manner, the display module is further configured to display an alarm message.
The beneficial effect that technical scheme that this application provided brought is: the temperature information of the circuit board is acquired in real time, so that the temperature of the circuit board is monitored, and the temperature safety of the circuit board is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments of the present application will be briefly described below.
Fig. 1 is a structural diagram of a chip system for managing abnormal temperature of a circuit board according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a temperature sensing module according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar modules or modules having the same or similar functionality throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present invention.
As used herein, the singular forms "a", "an", "the" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, integers, steps, operations, modules, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, modules, components, and/or groups thereof. It will be understood that when a module is referred to as being "connected" or "coupled" to another module, it can be directly connected or coupled to the other module or intervening modules may also be present. Further, "connected" or "coupled" as used herein may include wirelessly connected or wirelessly coupled. As used herein, the term "and/or" includes all or any element and all combinations of one or more of the associated listed items.
To make the objects, technical solutions and advantages of the present application more clear, embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
At present, the circuit board is because of unable effectual control heat energy and is on fire because of high temperature, and the circuit board encapsulates usually inside unable taking out of equipment, and the conflagration that the circuit board arouses has the conflagration that can stretch to equipment or even the conflagration of mill, and this not only can bring huge economic loss for the mill, can cause the threat to workman staff's life safety even.
The application provides a management chip system of circuit board abnormal temperature aims at solving prior art technical problem as above.
The following describes the technical solutions of the present application and how to solve the above technical problems with specific embodiments. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Fig. 1 is a structural diagram of a chip system for managing abnormal temperature of a circuit board according to an embodiment of the present invention, including:
the temperature sensing device comprises at least two temperature sensing modules 101, an operation module 102, a storage module 103, an algorithm calculation module 104, a power supply module 105 and an input/output module 106, wherein the algorithm calculation module is respectively connected with the operation module, the input/output module and the storage module, the storage module is respectively connected with the operation module, the input/output module and the temperature sensing module, the power supply module is respectively used for supplying power to the temperature sensing module, the operation module, the storage module, the algorithm calculation module and the input/output module, the at least two temperature sensing modules acquire temperature information of a circuit board at the same time point, the operation module compares alarm temperature stored in the storage module with the temperature information, and when the temperature information is higher than the alarm temperature, the algorithm calculation module acquires the optimal temperature from the temperature information through a preset optimal algorithm.
In the embodiment of the invention, the circuit board is provided with at least two temperature sensing modules, the temperature sensing modules can sense and record the temperature information of the circuit board in real time, and in order to ensure the accuracy of the subsequent use of the temperature information, the management chip system can acquire the temperature information of the at least two temperature sensing modules at the same time point.
The storage module arranged on the circuit board stores the preset alarm temperature of the circuit board, the management chip system compares the acquired temperature information with the alarm temperature through the operation module in the circuit board, and subsequent processing is carried out according to the comparison result. It should be noted that the operation frequency of the operation module can be set according to the actual use requirement, and the invention is not limited. Preferably, the operation frequency of the operation module is 0.1 us-5000 s.
According to the result of the comparison, two different treatments are performed: if the temperature information is lower than the alarm temperature, the temperature of the circuit board is normal, and the management chip system does not perform any operation; if the temperature information is higher than the alarm temperature, the temperature of the circuit board is abnormal, and the management chip system calls a preset optimal algorithm to obtain the optimal temperature from at least two pieces of temperature information.
Preferably, the preferred algorithm is an ant colony algorithm implemented by metal interconnects in a silicon wafer MOS structure.
The ant colony algorithm is an algorithm for obtaining an optimal solution from a combination including a plurality of parameters, and since the management chip system receives a plurality of temperature information, it is necessary to obtain an optimal temperature from the plurality of temperature information through the ant colony algorithm.
The power supply module supplies power for the temperature sensing module, the operation module, the storage module, the algorithm calculation module and the input and output module respectively, is the basis for ensuring the normal operation of the management chip system, and can only use a built-in battery or an external power supply or can be a combination of the built-in battery and the external power supply.
The input and output module can transmit signals through wireless transmission or wired transmission, and the functions of the input and output module include but are not limited to: outputting temperature control signals and inputting alarm temperature updating signals. In terms of use, signals transmitted by a wire are more stable, wireless transmission is more convenient, a wire technology or a wireless technology can be selected according to actual use requirements, and the transmission mode is not limited in the application. Wherein, the wireless transmission includes but is not limited to: zigbee, Wireless, ISA100.11a, Wi-Fi and Bluetooth.
For the output temperature control signal, the temperature also changes in real time along with the increase of the service time of the circuit board, so that the input and output module needs to output the acquired temperature information in real time and display the temperature information for monitoring personnel, and the monitoring personnel can know the temperature information of the circuit board at any time.
For inputting the alarm temperature update signal, the adaptable temperature of the circuit board changes along with the increase of the service time of the circuit board, so when the adaptable temperature changes, the adaptive temperature of the circuit board needs to be adjusted by external equipment or an operator, and the adjustment mode is realized by inputting the alarm temperature update information.
As an optional embodiment of the present invention, the management chip system further includes: and the display module is connected with the input and output module and is used for displaying the temperature information of the circuit board.
Preferably, the display module is further configured to display alarm information.
When the temperature of the circuit board is normal, the display module can display the temperature information of the circuit board in real time, accurate basis can be provided for judgment of monitoring personnel, and when the temperature of the circuit board is abnormal, the display module can also provide warning through slight vibration, occurrence, high-brightness flicker and other modes.
Fig. 2 is a schematic structural diagram of a temperature sensing module according to an embodiment of the present invention.
It should be understood that, although the steps in the flowcharts of the figures are shown in order as indicated by the arrows, the steps are not necessarily performed in order as indicated by the arrows. The steps are not performed in the exact order shown and may be performed in other orders unless explicitly stated herein. Moreover, at least a portion of the steps in the flow chart of the figure may include multiple sub-steps or multiple stages, which are not necessarily performed at the same time, but may be performed at different times, which are not necessarily performed in sequence, but may be performed alternately or alternately with other steps or at least a portion of the sub-steps or stages of other steps.
The foregoing is only a partial embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.
Claims (9)
1. A chip system for managing abnormal temperature of a circuit board is characterized by comprising:
the temperature sensing module comprises at least two temperature sensing modules, an operation module, a storage module, an algorithm calculation module, a power supply module and an input/output module, wherein the algorithm calculation module is respectively connected with the operation module, the input/output module and the storage module, the storage module is respectively connected with the operation module and the input/output module, the temperature sensing module is connected with the operation module, the power supply module is respectively used for supplying power to the temperature sensing module, the operation module, the storage module, the algorithm calculation module and the input/output module, the at least two temperature sensing modules acquire temperature information of a circuit board at the same time point, the operation module compares alarm temperature stored in the storage module with the temperature information, and when the temperature information is higher than the alarm temperature, the algorithm calculation module acquires the optimal temperature from the temperature information through a preset optimal algorithm.
2. The management chip system according to claim 1, wherein the operation frequency of the operation module is 0.1 us-5000 s.
3. The system on a management chip of claim 1 wherein the preferred algorithm is an ant colony algorithm implemented with metal interconnects in a silicon wafer MOS structure.
4. The management chip system of claim 1, wherein the power module comprises: a built-in battery and/or an external power supply.
5. The management chip system according to any one of claims 1 to 4, wherein the input-output module is configured to: outputting temperature control signals and inputting alarm temperature updating signals.
6. The management chip system according to claim 5, wherein the transmission mode of the input/output module is wired transmission or wireless transmission.
7. The management chip system of claim 6, wherein the wireless transmission comprises: zigbee, Wireless, ISA100.11a, Wi-Fi and Bluetooth.
8. The management chip system of claim 1, wherein the management chip system further comprises:
and the display module is connected with the input and output module and is used for displaying the temperature information of the circuit board.
9. The management chip system of claim 8, wherein the display module is further configured to display an alarm message.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999474.4A CN111064163B (en) | 2019-10-21 | 2019-10-21 | Management chip system for abnormal temperature of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910999474.4A CN111064163B (en) | 2019-10-21 | 2019-10-21 | Management chip system for abnormal temperature of circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111064163A true CN111064163A (en) | 2020-04-24 |
| CN111064163B CN111064163B (en) | 2022-03-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910999474.4A Expired - Fee Related CN111064163B (en) | 2019-10-21 | 2019-10-21 | Management chip system for abnormal temperature of circuit board |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101047310A (en) * | 2006-03-28 | 2007-10-03 | 泰安电脑科技（上海）有限公司 | Overheat protection circuit and system circuit board |
| CN201331391Y (en) * | 2008-12-31 | 2009-10-21 | 郑晓亮 | Main circuit board for long-distance multipoint temperature monitoring |
| CN102055454A (en) * | 2009-10-29 | 2011-05-11 | 喜来健株式会社 | Overheat prevention circuit of PCB plate for thermotherapy device |
| CN102346079A (en) * | 2010-08-03 | 2012-02-08 | 英业达股份有限公司 | Method for monitoring circuit board temperature by employing computer program |
| CN203570302U (en) * | 2013-11-13 | 2014-04-30 | 张惠莲 | Device for detecting temperature of front circuit board of comprehensive logging instrument |
| CN205068282U (en) * | 2015-10-27 | 2016-03-02 | 龙芯中科技术有限公司 | Temperature control system |
| CN105762760A (en) * | 2016-01-18 | 2016-07-13 | 浪潮电子信息产业股份有限公司 | Method of preventing board from being burnt down by over current through built-in temperature detector |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
-
2019
- 2019-10-21 CN CN201910999474.4A patent/CN111064163B/en not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101047310A (en) * | 2006-03-28 | 2007-10-03 | 泰安电脑科技（上海）有限公司 | Overheat protection circuit and system circuit board |
| CN201331391Y (en) * | 2008-12-31 | 2009-10-21 | 郑晓亮 | Main circuit board for long-distance multipoint temperature monitoring |
| CN102055454A (en) * | 2009-10-29 | 2011-05-11 | 喜来健株式会社 | Overheat prevention circuit of PCB plate for thermotherapy device |
| CN102346079A (en) * | 2010-08-03 | 2012-02-08 | 英业达股份有限公司 | Method for monitoring circuit board temperature by employing computer program |
| CN203570302U (en) * | 2013-11-13 | 2014-04-30 | 张惠莲 | Device for detecting temperature of front circuit board of comprehensive logging instrument |
| CN205068282U (en) * | 2015-10-27 | 2016-03-02 | 龙芯中科技术有限公司 | Temperature control system |
| CN105762760A (en) * | 2016-01-18 | 2016-07-13 | 浪潮电子信息产业股份有限公司 | Method of preventing board from being burnt down by over current through built-in temperature detector |
| CN106793490A (en) * | 2016-12-28 | 2017-05-31 | 苏州寅初信息科技有限公司 | The PCB and its detection method of circuit abnormality are detected based on temperature fluctuation |
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| CN111064163B (en) | 2022-03-11 |
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