CN102315191A - 新型有基岛预填塑封料引线框结构 - Google Patents

新型有基岛预填塑封料引线框结构 Download PDF

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CN102315191A
CN102315191A CN201110268347A CN201110268347A CN102315191A CN 102315191 A CN102315191 A CN 102315191A CN 201110268347 A CN201110268347 A CN 201110268347A CN 201110268347 A CN201110268347 A CN 201110268347A CN 102315191 A CN102315191 A CN 102315191A
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pin
lead frame
frame structure
packaging material
island
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梁志忠
谢洁人
吴昊
耿丛正
夏文斌
郁科峰
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JCET Group Co Ltd
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Jiangsu Changjiang Electronics Technology Co Ltd
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Priority to CN201110268347A priority Critical patent/CN102315191A/zh
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Priority to PCT/CN2012/001161 priority patent/WO2013037187A1/en
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Abstract

本发明涉及一种引线框结构，具体涉及一种新型有基岛预填塑封料引线框结构，属于半导体封装技术领域。它包括基岛（1）和引脚（2），所述引脚（2）背面延伸到基岛（1）旁边，使得引脚（2）正面长度小于背面长度，形成上小下大的引脚结构。本发明涉及一种新型有基岛预填塑封料引线框结构，其引脚正面长度小于背面长度，形成上小下大的引脚结构，能够适用于封装尺寸较大的芯片，使芯片与引脚不易产生短路，有利于提高封转芯片密度。

Description

新型有基岛预填塑封料引线框结构
技术领域
本发明涉及一种引线框结构，具体涉及一种新型有基岛预填塑封料引线框结构，属于半导体封装技术领域。
背景技术
以往的四面扁平无引脚封装（QFN）引线框（如图1所示），通常情况下在封装时要求芯片尺寸必须比基岛小，以防止装片时装片胶（导电或不导电）沾污引脚（如图2所示），因此限制了封装芯片的尺寸，芯片密度（chip scale）较低。
发明内容
本发明的目的在于克服上述不足，提供一种新型有基岛预填塑封料引线框结构，能够适用于大尺寸芯片的封装，有利于提高芯片的封装密度。
本发明的目的是这样实现的：一种新型有基岛预填塑封料引线框结构，它包括基岛和引脚，其特点是：所述引脚背面延伸到基岛旁边，使得引脚正面长度小于背面长度，形成上小下大的引脚结构。
与现有技术相比，本发明的有益效果是：
本发明涉及一种新型有基岛预填塑封料引线框结构，其引脚正面长度小于背面长度，形成上小下大的引脚结构，能够适用于封装尺寸较大的芯片，使芯片装片胶（导电或不导电）不易沾污引脚，有利于提高封转芯片密度。 
附图说明
图1为现有有基岛预填塑封料引线框的结构示意图。
图2为现有有基岛预填塑封料引线框在封装大尺寸芯片时沾污引脚的示意图。
图3为本发明有基岛预填塑封料引线框的结构示意图。
图4为本发明有基岛预填塑封料引线框封装大尺寸芯片的示意图。
其中：
基岛1
引脚2
芯片3
装片胶4
塑封料5。
具体实施方式
参见图3~图4，本发明一种新型有基岛预填塑封料引线框结构，它包括基岛1和引脚2，所述引脚2背面延伸到基岛1旁边，使得引脚2正面长度小于背面长度，形成上小下大的引脚结构。

Claims (1)

1.一种新型有基岛预填塑封料引线框结构，它包括基岛（1）和引脚（2），其特征在于：所述引脚（2）背面延伸到基岛（1）旁边，使得引脚（2）正面长度小于背面长度，形成上小下大的引脚结构。
CN201110268347A 2011-09-13 2011-09-13 新型有基岛预填塑封料引线框结构 Pending CN102315191A (zh)

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CN201110268347A CN102315191A (zh) 2011-09-13 2011-09-13 新型有基岛预填塑封料引线框结构
PCT/CN2012/001161 WO2013037187A1 (en) 2011-09-13 2012-08-28 A pre-encapsulated lead frame structure with island and manufacturing method

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CN201110268347A CN102315191A (zh) 2011-09-13 2011-09-13 新型有基岛预填塑封料引线框结构

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