CN102263056A - 一种金属互连方法 - Google Patents
一种金属互连方法 Download PDFInfo
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- CN102263056A CN102263056A CN2010101927967A CN201010192796A CN102263056A CN 102263056 A CN102263056 A CN 102263056A CN 2010101927967 A CN2010101927967 A CN 2010101927967A CN 201010192796 A CN201010192796 A CN 201010192796A CN 102263056 A CN102263056 A CN 102263056A
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- metal
- copper
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CN2010101927967A CN102263056A (zh) | 2010-05-26 | 2010-05-26 | 一种金属互连方法 |
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CN2010101927967A CN102263056A (zh) | 2010-05-26 | 2010-05-26 | 一种金属互连方法 |
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CN102263056A true CN102263056A (zh) | 2011-11-30 |
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CN2010101927967A Pending CN102263056A (zh) | 2010-05-26 | 2010-05-26 | 一种金属互连方法 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5447887A (en) * | 1994-04-01 | 1995-09-05 | Motorola, Inc. | Method for capping copper in semiconductor devices |
CN1449015A (zh) * | 2002-04-01 | 2003-10-15 | 海力士半导体有限公司 | 在半导体装置中形成金属互连层的方法 |
CN1552096A (zh) * | 2000-07-26 | 2004-12-01 | �Ƚ�װ�ù�˾ | 形成具有改进的界面和粘合力的铜互连封盖层的方法 |
CN101515563A (zh) * | 2007-11-27 | 2009-08-26 | 台湾积体电路制造股份有限公司 | 覆盖层的制造方法及半导体装置 |
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2010
- 2010-05-26 CN CN2010101927967A patent/CN102263056A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5447887A (en) * | 1994-04-01 | 1995-09-05 | Motorola, Inc. | Method for capping copper in semiconductor devices |
CN1552096A (zh) * | 2000-07-26 | 2004-12-01 | �Ƚ�װ�ù�˾ | 形成具有改进的界面和粘合力的铜互连封盖层的方法 |
CN1449015A (zh) * | 2002-04-01 | 2003-10-15 | 海力士半导体有限公司 | 在半导体装置中形成金属互连层的方法 |
CN101515563A (zh) * | 2007-11-27 | 2009-08-26 | 台湾积体电路制造股份有限公司 | 覆盖层的制造方法及半导体装置 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121116 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121116 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111130 |