CN102254834A - 半导体封装结构与方法 - Google Patents
半导体封装结构与方法 Download PDFInfo
- Publication number
- CN102254834A CN102254834A CN201010183029XA CN201010183029A CN102254834A CN 102254834 A CN102254834 A CN 102254834A CN 201010183029X A CN201010183029X A CN 201010183029XA CN 201010183029 A CN201010183029 A CN 201010183029A CN 102254834 A CN102254834 A CN 102254834A
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- wafer
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- semiconductor element
- silicon
- chip
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 64
- 238000000034 method Methods 0.000 title claims abstract description 35
- 238000004806 packaging method and process Methods 0.000 title abstract description 6
- 239000010410 layer Substances 0.000 claims abstract description 86
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 29
- 239000010703 silicon Substances 0.000 claims abstract description 29
- 238000000576 coating method Methods 0.000 claims description 27
- 239000011248 coating agent Substances 0.000 claims description 26
- 239000011241 protective layer Substances 0.000 claims description 16
- 238000005538 encapsulation Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 14
- 238000012856 packing Methods 0.000 claims description 11
- 230000003287 optical effect Effects 0.000 claims description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000012780 transparent material Substances 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000012790 adhesive layer Substances 0.000 abstract 2
- 230000035515 penetration Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 65
- 238000012536 packaging technology Methods 0.000 description 4
- 230000001771 impaired effect Effects 0.000 description 3
- 206010058314 Dysplasia Diseases 0.000 description 1
- 229920000715 Mucilage Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
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- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (16)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010183029.XA CN102254834B (zh) | 2010-05-18 | 2010-05-18 | 半导体封装结构与方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010183029.XA CN102254834B (zh) | 2010-05-18 | 2010-05-18 | 半导体封装结构与方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102254834A true CN102254834A (zh) | 2011-11-23 |
CN102254834B CN102254834B (zh) | 2016-04-27 |
Family
ID=44982005
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201010183029.XA Expired - Fee Related CN102254834B (zh) | 2010-05-18 | 2010-05-18 | 半导体封装结构与方法 |
Country Status (1)
Country | Link |
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CN (1) | CN102254834B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870076A (zh) * | 2015-02-10 | 2016-08-17 | 日月光半导体制造股份有限公司 | 半导体封装结构及半导体制造工艺 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030122243A1 (en) * | 2001-12-31 | 2003-07-03 | Jin-Yuan Lee | Integrated chip package structure using organic substrate and method of manufacturing the same |
CN1431708A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆型态扩散型封装结构及其制造方法 |
CN1624888A (zh) * | 2003-12-03 | 2005-06-08 | 育霈科技股份有限公司 | 扩散式晶圆型态封装的结构与其形成方法 |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
CN101266990A (zh) * | 2007-03-15 | 2008-09-17 | 育霈科技股份有限公司 | 具有内建封装腔室之影像传感器模块及其方法 |
US20080277799A1 (en) * | 2004-08-27 | 2008-11-13 | Micron Technology, Inc. | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
CN101587903A (zh) * | 2008-05-23 | 2009-11-25 | 精材科技股份有限公司 | 电子元件封装体及其制作方法 |
-
2010
- 2010-05-18 CN CN201010183029.XA patent/CN102254834B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030122243A1 (en) * | 2001-12-31 | 2003-07-03 | Jin-Yuan Lee | Integrated chip package structure using organic substrate and method of manufacturing the same |
CN1431708A (zh) * | 2002-01-10 | 2003-07-23 | 裕沛科技股份有限公司 | 晶圆型态扩散型封装结构及其制造方法 |
CN1624888A (zh) * | 2003-12-03 | 2005-06-08 | 育霈科技股份有限公司 | 扩散式晶圆型态封装的结构与其形成方法 |
US20080277799A1 (en) * | 2004-08-27 | 2008-11-13 | Micron Technology, Inc. | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies |
US20080191335A1 (en) * | 2007-02-08 | 2008-08-14 | Advanced Chip Engineering Technology Inc. | Cmos image sensor chip scale package with die receiving opening and method of the same |
CN101266990A (zh) * | 2007-03-15 | 2008-09-17 | 育霈科技股份有限公司 | 具有内建封装腔室之影像传感器模块及其方法 |
CN101587903A (zh) * | 2008-05-23 | 2009-11-25 | 精材科技股份有限公司 | 电子元件封装体及其制作方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105870076A (zh) * | 2015-02-10 | 2016-08-17 | 日月光半导体制造股份有限公司 | 半导体封装结构及半导体制造工艺 |
Also Published As
Publication number | Publication date |
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CN102254834B (zh) | 2016-04-27 |
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Owner name: VIDOLED GROUP CO., LTD. Free format text: FORMER OWNER: HONGBAO TECHNOLOGY CO., LTD. Effective date: 20120703 |
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Effective date of registration: 20120703 Address after: Anguilla Valley Applicant after: Victoria Group Company Address before: Hsinchu City, Taiwan, China Applicant before: Hongbao Technology Co.,Ltd. |
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Owner name: YIGFEBOS YOULE LLC Free format text: FORMER OWNER: VIDOLED GROUP CO., LTD. Effective date: 20130227 |
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Effective date of registration: 20130227 Address after: Delaware Applicant after: Yigfebos Youle LLC Address before: Anguilla Valley Applicant before: Victoria Group Company |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20190518 |