CN102244093A - 一种降低对通隔离扩散横向扩散宽度的结构及方法 - Google Patents
一种降低对通隔离扩散横向扩散宽度的结构及方法 Download PDFInfo
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104934464A (zh) * | 2014-09-03 | 2015-09-23 | 安徽省祁门县黄山电器有限责任公司 | 一种晶闸管芯片的结终端结构 |
CN105448807A (zh) * | 2015-11-20 | 2016-03-30 | 浙江正邦电力电子有限公司 | 一种半导体器件芯片对通隔离制造工艺 |
CN105453250A (zh) * | 2013-08-08 | 2016-03-30 | 夏普株式会社 | 半导体元件衬底及其制造方法 |
CN105552122A (zh) * | 2016-03-14 | 2016-05-04 | 江苏捷捷微电子股份有限公司 | 一种带有深阱终端环结构的平面可控硅芯片及其制造方法 |
CN109103242A (zh) * | 2018-09-30 | 2018-12-28 | 江苏明芯微电子股份有限公司 | 一种穿通结构的可控硅芯片及其生产方法 |
CN109950308A (zh) * | 2019-03-20 | 2019-06-28 | 江苏东晨电子科技有限公司 | 双曲率台面晶闸管及其制作方法 |
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US4298881A (en) * | 1979-04-06 | 1981-11-03 | Hitachi, Ltd. | Semiconductor device with double moat and double channel stoppers |
JPS57181164A (en) * | 1982-04-23 | 1982-11-08 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
CN101587895A (zh) * | 2009-04-29 | 2009-11-25 | 启东市捷捷微电子有限公司 | 门极灵敏触发单向晶闸管芯片及其制造方法 |
CN101866948A (zh) * | 2009-04-29 | 2010-10-20 | 启东市捷捷微电子有限公司 | 半导体高压器件芯片及其制造方法 |
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- 2011-07-28 CN CN 201110213223 patent/CN102244093B/zh active Active
Patent Citations (4)
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US4298881A (en) * | 1979-04-06 | 1981-11-03 | Hitachi, Ltd. | Semiconductor device with double moat and double channel stoppers |
JPS57181164A (en) * | 1982-04-23 | 1982-11-08 | Mitsubishi Electric Corp | Manufacture of semiconductor device |
CN101587895A (zh) * | 2009-04-29 | 2009-11-25 | 启东市捷捷微电子有限公司 | 门极灵敏触发单向晶闸管芯片及其制造方法 |
CN101866948A (zh) * | 2009-04-29 | 2010-10-20 | 启东市捷捷微电子有限公司 | 半导体高压器件芯片及其制造方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105453250A (zh) * | 2013-08-08 | 2016-03-30 | 夏普株式会社 | 半导体元件衬底及其制造方法 |
CN104934464A (zh) * | 2014-09-03 | 2015-09-23 | 安徽省祁门县黄山电器有限责任公司 | 一种晶闸管芯片的结终端结构 |
CN104934464B (zh) * | 2014-09-03 | 2018-07-17 | 安徽省祁门县黄山电器有限责任公司 | 一种晶闸管芯片的结终端结构 |
CN105448807A (zh) * | 2015-11-20 | 2016-03-30 | 浙江正邦电力电子有限公司 | 一种半导体器件芯片对通隔离制造工艺 |
CN105448807B (zh) * | 2015-11-20 | 2017-11-10 | 浙江正邦电子股份有限公司 | 一种半导体器件芯片对通隔离制造工艺 |
CN105552122A (zh) * | 2016-03-14 | 2016-05-04 | 江苏捷捷微电子股份有限公司 | 一种带有深阱终端环结构的平面可控硅芯片及其制造方法 |
CN109103242A (zh) * | 2018-09-30 | 2018-12-28 | 江苏明芯微电子股份有限公司 | 一种穿通结构的可控硅芯片及其生产方法 |
CN109103242B (zh) * | 2018-09-30 | 2023-12-15 | 江苏明芯微电子股份有限公司 | 一种穿通结构的可控硅芯片及其生产方法 |
CN109950308A (zh) * | 2019-03-20 | 2019-06-28 | 江苏东晨电子科技有限公司 | 双曲率台面晶闸管及其制作方法 |
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