CN102239021B - 用于喷出具有高温的流体液滴的装置 - Google Patents
用于喷出具有高温的流体液滴的装置 Download PDFInfo
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- CN102239021B CN102239021B CN200980148402.3A CN200980148402A CN102239021B CN 102239021 B CN102239021 B CN 102239021B CN 200980148402 A CN200980148402 A CN 200980148402A CN 102239021 B CN102239021 B CN 102239021B
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- 239000012530 fluid Substances 0.000 title claims abstract description 208
- 229910052751 metal Inorganic materials 0.000 claims description 54
- 239000002184 metal Substances 0.000 claims description 54
- 239000000463 material Substances 0.000 claims description 40
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000009413 insulation Methods 0.000 claims description 10
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 9
- 229910052721 tungsten Inorganic materials 0.000 claims description 9
- 239000010937 tungsten Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- 238000003763 carbonization Methods 0.000 claims description 7
- 238000005229 chemical vapour deposition Methods 0.000 claims description 6
- 238000002955 isolation Methods 0.000 claims description 6
- 239000000696 magnetic material Substances 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 229910001172 neodymium magnet Inorganic materials 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 3
- 229910052582 BN Inorganic materials 0.000 claims 1
- -1 and wherein Substances 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000003475 lamination Methods 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 abstract 1
- 238000002347 injection Methods 0.000 description 18
- 239000007924 injection Substances 0.000 description 18
- 238000005507 spraying Methods 0.000 description 10
- 239000010949 copper Substances 0.000 description 9
- 239000007921 spray Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000010931 gold Substances 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 230000006698 induction Effects 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000013590 bulk material Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- UFGZSIPAQKLCGR-UHFFFAOYSA-N chromium carbide Chemical compound [Cr]#C[Cr]C#[Cr] UFGZSIPAQKLCGR-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 229910003470 tongbaite Inorganic materials 0.000 description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910001338 liquidmetal Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000006060 molten glass Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000010944 silver (metal) Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/06—Solid state diffusion of only metal elements or silicon into metallic material surfaces using gases
- C23C10/08—Solid state diffusion of only metal elements or silicon into metallic material surfaces using gases only one element being diffused
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- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
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- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
- C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
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- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
- C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
- C23C10/22—Metal melt containing the element to be diffused
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
- C23C10/34—Embedding in a powder mixture, i.e. pack cementation
- C23C10/36—Embedding in a powder mixture, i.e. pack cementation only one element being diffused
- C23C10/38—Chromising
- C23C10/40—Chromising of ferrous surfaces
- C23C10/42—Chromising of ferrous surfaces in the presence of volatile transport additives, e.g. halogenated substances
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- C—CHEMISTRY; METALLURGY
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- C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
- C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
- C23C10/34—Embedding in a powder mixture, i.e. pack cementation
- C23C10/52—Embedding in a powder mixture, i.e. pack cementation more than one element being diffused in one step
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- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/0836—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid with electric or magnetic field or induction
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- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
- B22F2009/088—Fluid nozzles, e.g. angle, distance
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- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/04—Heads using conductive ink
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
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- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Coating Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
在用于喷出相对热流体的液滴的喷射装置中,流体腔本体由耐热材料制成,并且流体腔本体的内表面可由流体湿化,所述内表面限定喷射装置的流体腔。该配置使得,不需要施加附加力来强制流体进入到孔中,即,窄管件导向到喷嘴中。
Description
技术领域
本发明涉及用于喷出具有高温的流体液滴的装置,所述流体例如熔融金属或熔融半导体。
背景技术
从US 5377961已知的是,熔融金属(例如,焊料)可使用已知为洛伦兹力的力喷出成相对小的液滴。当布置在磁场中时,洛伦兹力源自于流动通过金属的电流。得到力的方向和大小与电流和磁场矢量的叉积相关: 。
然而,在US 5377961中公开的装置仅针对喷出焊料液滴进行描述,其具有相对低的熔点(大约500 K)。对于喷出具有较高熔点(例如,高于大约1200 K)的金属液滴(例如,金、银、铜和钛等等),该装置需要尤其配置成能够以这种高温操作。
进一步,熔融金属可能不流动通过喷射装置的孔,可能需要用于强制熔融金属进入到孔中的恒定力,从而使得熔融金属喷出。在已知喷射装置中,通过在熔融金属上施加基本上恒定的气体压力,提供这种力。然而,施加这种力需要其它(昂贵的)设备并且使得组装复杂。
此外,从US 5876615已知,流体腔本体可以是单个可替换单元,例如是一次性的或可再填充的。在US 5876615中公开的流体腔本体由密封有釉(熔化玻璃)的陶瓷材料制成。这种密封件可适用于具有相对低熔点的印刷焊料,用于印刷诸如金、银和铜等等的金属,玻璃不是合适的,因为其熔点是相同大小,这将导致釉的熔化,从而使得流体腔壁不可湿化且从而喷射装置不能如上所述地操作。
为了提供经济可行的喷射装置,这种可替换流体腔本体应当是成本有效的。因此,本发明的目的在于提供一种简易流体喷射装置,其具有可替换流体腔本体并且配置成喷出具有相对高温度的流体液滴。
发明内容
上述目的在根据权利要求1的装置中实现。
根据本发明的装置包括:可替换布置的流体腔本体,其限定流体腔并且具有从流体腔延伸至流体腔元件外表面的孔。流体液滴可从流体腔驱出通过孔。提供致动机构用于产生流体中的压力,用于将流体液滴从流体腔喷出并且通过孔。根据本发明,流体腔本体由耐热材料制成,所述耐热材料可由要喷出的上述流体湿化。
如从用于喷出热流体液滴的装置的需求中显而易见,形成流体腔并且保持热流体的本体需要耐热,尤其耐受熔融金属的热量。优选地,该本体耐受高达3000 K的温度,其使得能够处理大范围的金属。此外,材料优选地是成本节约的可机加工的。同样,优选的是,该材料耐受熔融金属的腐蚀。此外,流体腔尤其在孔处的材料可由流体湿化。如果流体不在该材料上湿化,则流体可自身收缩成珠状物且因此在无(外)力施加到流体上时将不流动通过孔。通过确保流体腔本体可由流体湿化,在没有附加力时该流体将不会流动到孔中。此外,在实施例中且由于孔的尺寸,毛细作用力可促进流动到孔中并且通过孔。
在下文中要注意的是,要从该装置喷出的流体被描述为熔融金属。然而,要求保护的装置也可用于喷射其它相对暖热的流体。如果使用其它类型的流体,该装置当然需要适于这种流体。在下文中,例如被描述的是,通过使用在流体上产生并且施加到流体上的洛伦兹力喷出流体。然而,在流体不导电的情形中,不能产生洛伦兹力,且要使用其它类型的致动。同样,可需要其它适应。
根据本发明,流体腔本体可替换地布置。因此,简单的有成本效益的流体腔本体可被提供成具有用于要从流体腔喷出的流体的合适性质。由于流体腔本体是可替换的,可省除流体供应组件,因为流体(可能处于固态)可被提供在喷射装置之外的流体腔中。例如,保持固态金属的流体腔本体可接着布置在喷射装置中,且在喷射装置中,金属可被加热以变为流体,使得其可被喷射。省除流体供应组件可以是有利的,因为流体金属具有相对高的温度,从而需要相对昂贵的供应组件。
可替换流体腔本体还使得能够使用用于印刷许多不同金属的喷射装置。通过用保持第二金属的流体腔本体简单替换保持第一金属的流体腔本体,喷射装置可用于喷射不同金属和/或其它材料。此外,流体腔本体可被选择成专用于被保持在流体腔本体中的特定金属或其它流体,用于提供用于每种不同材料的良好流量和喷射性质。
在实施例中,流体腔本体包括导电材料,其可有利地用于要喷射的金属的感应加热,因为流体腔本体的材料将被加热,从而导致更有效的加热。在具体实施例中,材料包括可有成本效益地机加工的石墨,其具有高熔点且可例如通过碱金属、钠(Na)、锂(Li)和钛(Ti)湿化。
在另一实施例中,流体腔本体的材料是不导电的。这对于防止电致动电流流入到流体腔本体中可能是有利的,因为这种进入到本体材料中的流动可减少所产生的致动力。在具体实施例中,流体本体腔包括氮化硼(BN)。
在实施例中,流体腔本体的至少内表面设置有湿化涂层,所述内表面限定流体腔。湿化涂层可为该流体而湿化。优选地,该涂层可由相对大范围的流体材料湿化。在用于喷射熔融金属的实施例中,湿化涂层可包括碳化一钨、碳化二钨、碳化三钨(WC、W2C和W3C)中的至少一种。在优选的实施例中,碳化三钨(W3C)被包括在湿化涂层中,碳化钨可由相对大量的金属湿化,包括如金、银和铜(分别为Au, Ag, Cu)的金属。在另一实施例中,内表面设置有金属涂层。已知的是,许多熔融金属被湿化在金属表面上。因此,金属涂层可以是合适的涂层。该涂层(例如,包括碳化钨的涂层或金属涂层)可通过化学气相沉积(CVD)提供。
在实施例中,在流体腔本体的外表面上,尤其在直接围绕孔的开口的外表面的一部分处不提供湿化涂层。围绕孔开口剩余的流体的量可干扰液滴喷出。省除湿化涂层可使得外表面不湿化,从而防止流体的量可保持在靠近孔开口的外表面处。在具体实施例中,在直接围绕孔开口的外表面处提供非湿化涂层。
在实施例中,致动装置包括至少两个导电电极,每个电极布置成使得每个电极的一端与流体腔中的流体电接触。因此,可在流体中产生电流。在流体中产生的电流可引起力,其中流体布置在磁场中。合适布置的磁场结合合适产生的电流导致该力被导向并且具有足以强制流体液滴通过孔的大小。
在具体实施例中,电极是销形的,且其中,电极布置在流体腔本体的通孔中,所述通孔从外表面延伸到流体腔中。这提供用于具有与流体电接触的电极的简单且有效的布置。
在具体实施例中,延伸通过该通孔的电极一端是锥形,且其中弹性力被施加到销形电极上,使得在电极与流体腔本体之间获得流密连接。被强制进入到通孔中的锥形导致紧密连接,从而防止流体从流体腔泄漏通过该孔,该孔接收电极。此外,通过施加到电极上的弹性力,当流体腔本体和/或电极由于相对大的温度改变而膨胀/收缩时,保持紧密连接。此外,这种弹性布置的电极使得能够从流体腔本体容易地断开电极用于更换流体腔本体以及将该电极连接到其它流体腔本体,使得得到免受泄漏的联接。
在实施例中,通过弹簧提供弹性力,所述弹簧通过诸如氮化铝(AlN)的电绝缘和导热材料的层隔离。该弹簧力被电绝缘,以防止电流泄漏到装置的其它部件上,而导热率是重要的,以防止弹簧变得相对暖热,因为弹簧力会由于这种弹簧的高温而降低。
在实施例中,由永磁材料提供磁场,所述磁场使用由例如铁的磁场导向材料制成的磁性聚集器在流体腔处被聚集。具体地,磁性材料是NdFeB且磁性材料可被热隔离和/或冷却,以便防止由材料的(太)高温引起的磁化作用的部分或全部损失。
在实施例中,该装置还包括支撑框架。在该实施例中,流体腔本体通过支撑板被支撑框架支撑。所述支撑板在至少一个尺寸上是刚性的并且包括诸如氮化硼(BN)和/或氧化铝(Al2O3)的热隔离和电绝缘材料。因此,流体腔本体从装置的其余部件热隔离以及电绝缘。考虑在使用中可出现的相对高温,因此防止其它部件变得太暖热并且防止热能丧失到不需要被加热的装置部件中。类似考虑可应用到电绝缘中,从而防止损失电流以及防止对装置的其它部件充电。
在实施例中,流体材料包括金属,且流体腔本体布置在线圈的中心,所述线圈配置成承载电流,用于感应流体材料和/或流体腔本体材料中的感应电流从而加热流体材料。布置在电流承载线圈中的金属导致金属的感应加热。这是用于加热流体的有效且快速的方法。
要注意的是,本文所使用的湿化和可湿化性旨在意味着,该流体具有相对于可湿化材料的相对小接触角度。
附图说明
在下文中,参照示出了非限制性实施例的附图来说明本发明,在附图中:
图1示出了根据本发明的装置实施例的一部分的透视图;
图2a示出了图1中实施例的一部分的截面图;
图2b示出了图1中实施例的一部分的截面图;
图2c示出了图1中实施例的一部分的截面图;
图3a示出了图1中实施例的一部分的透视图;
图3b示出了图1中实施例的一部分的透视和部分截面图;以及
图4示出了图1中实施例的一部分的透视图。
具体实施方式
在附图中,相同的附图标记指代相同的元件。图1示出了用于喷出相对热流体的液滴(尤其是熔融金属,例如铜、银和金等等)的喷射装置1的一部分。喷射装置1包括支撑框架2,其由耐热材料、优选地导热材料制成。如在下文描述的,支撑框架2由冷却液体冷却。良好的导热性增加了通过支撑框架2的热量分布且从而增加热量的散播。此外,支撑框架2优选地配置成仅吸收来自于喷射装置1的任何加热部分相对小量的热量。例如,支撑框架2可由铝制成并且抛光,使得铝反射来自于喷射装置1的任何热部分的热辐射的相对大量,例如95%甚至更多。
喷射装置1设置有喷出喷嘴4,流体液滴可通过该喷嘴喷出。喷嘴或孔4是延伸通过流体腔本体6的壁的通孔。在流体腔本体6中,布置流体腔。流体腔配置成保持流体。因此,流体腔本体6需要是耐热的。此外,流体腔本体6被制造成使得诸如熔融金属的流体能够流动到表面、尤其是流体腔本体6的内表面上,所述内表面形成流体腔的壁。同样,形成孔4的通孔的内壁需要为流体而湿化,以便使得流体能够流动通过孔4。要注意的是,这与诸如喷墨装置的已知流体喷射装置相比甚至更相关,因为熔融金属通常具有相对高的表面张力,这是因为熔融金属趋于形成珠状物。这种珠状物通常将不会流动通过诸如孔4的小孔。如果流体腔本体6的表面相对于流体被湿化,那么流体将不趋于形成珠状物,但是将容易地在该表面上散播并流动且因此被使得能够流入到孔4中并且通过该孔。
流体腔本体6可例如在图2b和图4中更详细示出那样可替换地布置,如将在下文描述的。此外,要注意的是,流体腔本体6优选地有成本效益地制造,使得可替换流体腔本体6是经济上合算的。此外,例如由于熔融金属趋于与氧气化学反应,在熔融金属从流体腔本体6喷出之后,流体腔本体6在留在空气中时可能不会是可重用的,因为保持在流体腔中的金属将最可能与氧气反应。氧化金属趋于阻塞孔4和/或改变流体腔壁的可湿化特征,从而使得喷射装置1不可再用于进一步的喷出。
对于喷出熔融金属液滴,喷射装置1设置有两个永磁体8a、8b(在下文中称为磁体8)。磁体8布置在两个磁场聚集元件10a、10b(在下文中,也称为聚集器10)之间,所述磁场聚集元件由诸如铁的磁场导向材料制成。喷射装置1还设置有两个电极12a、12b(在下文还称为电极12),两者都通过合适通孔延伸到流体腔本体6中,使得每个电极12的至少尖端直接电接触存在于流体腔中的熔融金属。电极12由合适电极支撑件14支撑并且每个可操作地连接到合适电流发生器(未示出)上,使得通过电极12和存在于电极12尖端之间的熔融金属可产生合适电流。
磁体8和聚集器10配置并布置成使得在孔4的位置处和位置附近得到相对高的磁场,尤其是在两个电极12a、12b的两个相应尖端之间的位置的熔融金属处。如在背景技术部分指出的,电流和磁场的组合导致施加到熔融金属上的力,其可导致熔融金属液滴被推动通过孔4,从而喷出液滴。
永磁体8从流体腔本体6热隔离至至少这样的程度,磁体8的温度不超过预定阈值温度。该阈值温度基于超过磁体8可部分或全部丧失其磁性的温度而预定。例如,使用由NdFeB制造的永磁体8,这种阈值温度可以是大约80℃。为了实现这种低温,在实施例中,磁体8还可例如使用诸如冷却液体的合适冷却装置被主动冷却。
电极12由用于承载相对高电流的合适材料制成,同时耐高温。电极12可合适地由钨(W)制成,但是可想到其它合适材料。
图2a-2c还示出了流体腔本体6,其具有作为内部空间的流体腔16。图2a示出了图1中所示出实施例的截面图,所述截面沿着线a-a(图1)截取。图2b-2c示出了图1中所示出实施例的截面图,其中截面沿着线b-b(图1)截取。在图2a中,示出了流体腔16。流体腔本体6限定流体腔16的内壁按照本发明相对于要喷出通过孔4的流体湿化。例如,流体腔本体6由石墨制成,而要喷出的流体是熔融钛(Ti)。在其它实施例中,要喷出的流体是金(Au)、银(Ag)或铜(Cu)。这些金属不在石墨上湿化且因此趋于形成珠状物。没有施加诸如气压的附加力时,这种珠状物不能喷出通过孔4。根据本发明,形成流体腔16的内壁因此被合适地涂敷。在具体实施例中,涂层包括碳化钛(WC, W2C, W3C)。例如,涂层可由化学气相沉积(CVD)来提供。包括碳化钛的涂层为大量熔融金属而湿化且因此是十分合适的。涂层的其它合适实施例包括碳化铬(CrxCy)。碳化铬为铜(Cu)而湿化且具有相对低的熔点。因此,虽然是根据本发明涂层的合适实施例,但是其仅适用于有限数量的金属。
在实施例中,尤其在围绕孔4的外表面,该表面为要喷出的流体而不湿化,以便防止由存在于孔4周围的流体引起的喷出干扰。如果也在外表面提供上述湿化涂层,可能优选的是移除围绕孔4的湿化涂层。
此外,参照图2a和图1,在所示出的实施例中,聚集器10a、10b都包括至少两个部件。例如,聚集器10a包括第一部件11a和第二部件11b。第一部件11a基本上在线a-a的方向上延伸。第一部件11a具有的形式和形状使得磁场靠近孔4聚集。第二部件11b基本上在线b-b的方向上延伸并且配置成将磁体8的磁场导向到第一部件11a,因此导致磁体8的磁场被导向到孔4并且在该孔4处聚集。当然,第一部件11a和第二部件11b可以是分离部件或每个可以是单个元件的一部分。
现参照图2b和图2c,示出了支撑框架2和磁体8。在示出的实施例中,支撑框架2设置有冷却通道34,冷却液体可流动通过该冷却通道,用于主动地冷却支撑框架2和磁体8。示出了感应线圈18。流体腔本体6被布置在感应线圈18的中心,使得流动通过感应线圈18的电流导致布置在流体腔16中的金属的加热。由于这种加热,该金属可熔化且因此变为流体。这种感应加热确保功率有效的加热且在任何加热元件与流体之间无接触,从而限制喷射装置1与流体之间大量(可能的)相互作用。
在实施例中,流体腔本体6由通过感应加热而受热的材料制成。如上所述,这增加了加热效率且尤其减少了用于熔化在流体腔中以固态存在的金属所需的时间段。
在图2b中示出了流体腔本体6设置有第一脊部26a和第二脊部26b。这些脊部26a、26b被提供用于使得支撑联接件适用于容易地更换流体腔本体6,如在图4中更详细地所示。
图2b和图2c还示出了两个电极12a、12b,它们每个都具有锥形端。这些锥形端分别通过合适电极通道36a、36b延伸到流体腔16中。尤其,参照图2c,流体腔16被分为流体贮存器16a、流体通道16b以及致动腔16c。电极12的端部布置成使得该端部直接电接触致动腔16c中的金属流体。如从图2c显而易见,每个电极12a、12b的锥形尖端的直径小于相应电极通道36a、36b的直径,而电极12a、12b的直径增加到基本大于相应电极通道36a、36b直径的直径,使得电极12a、12b的尖端能够布置在电极通道36a、36b中,使得每个电极通道36a、36b可由相应电极12a、12b液密地密封,而电极12a、12b的端部均接触流体。如本领域技术人员显而易见的,电极12a、12b和电极通道36a、36b的直径可被合适地选择,使得电极端部不彼此接触,同时在操作中得到并保持电极通道36a、36b的流密密封。
为了保持电极通道36a、36b的流密密封,在实施例中,弹簧力被施加到电极12上,从而强制电极12进入到流体腔16中。当流体腔本体6和电极12的温度在操作期间增加时,由不同材料制成的不同部件的尺寸改变。使用例如由弹簧提供的弹性力,防止了电极通道36a、36b直径的任何改变以及电极12直径的任何改变可导致的流体通过电极通道36a、36b的泄漏。要注意的是,这种泄漏导致通过致动产生的压力的减少且因此可导致降低的致动效率。
图3a示出了其中使用弹簧20在电极12上施加弹性力的实施例。弹簧20被支撑框架2支撑,而电绝缘本体24被布置在弹簧20与支撑框架2之间,用于防止来自于电极12b的电流能够流动通过弹簧20到达支撑框架2。此外,本体24是导热的,以便将弹簧通过与相对冷的支撑框架2良好热接触而保持在低温。保持弹簧20的温度相对低可能是重要的,因为如果温度高于预定温度则弹簧20的弹簧力可降低,如这是本领域所熟知的。用于电绝缘和导热本体24的合适材料可以是氮化铝(AlN)。
弹簧20连接到联接元件38,该联接元件38还连接到电极12b。因此,弹簧20被使得通过联接元件38将其弹簧力施加到电极12b上。联接元件38还可用于提供至电流发生器的合适电耦合,例如使用导电电线22。
图3b示出了与图3a中所示基本上类似的透视图,不同之处在于许多部件被移除且流体腔本体6以截面示出,从而示出了流体腔16。
图4示出了支撑流体腔本体6的支撑框架2的俯视透视图。围绕限定流体腔16的流体腔本体6,布置感应线圈18。流体腔本体6由三个支撑元件28a、28b、28c支撑。支撑元件28a、28b、28c的尺寸基本上等于流体腔本体6的第一脊部26a与第二脊部28b之间的距离。三个支撑元件28a、28b、28c均实施为刚性支撑板。三个支撑元件28a、28b、28c彼此以基本上60°的角度围绕流体腔本体6布置。因此,流体腔本体6可被夹持在支撑元件28a、28b、28c之间。支撑元件28a、28b、28c被夹持在支撑框架2和相应夹子30a、30b、30c之间,其允许支撑元件28a、28b、28c被释放用于容易移除以及用于容易地引入和定位流体腔本体6,使得孔4定位在磁场聚集器10之间。支撑元件28a、28b、28c优选地将流体腔本体6从支撑框架2电绝缘和热隔离。因此,支撑元件28a、28b、28c适于由氧化铝(Al2O3)或氮化硼(BN)制成。
图4还示出了在流体腔本体6的壁中的孔32,所述孔具有引入合适热电偶(或任何其它合适温度传感元件)的合适尺寸,用于使得能够确定流体腔本体6的实际温度,用于控制流体和/或流体腔本体6的加热。
在本文公开了本发明的详细实施例,但是要理解的是,所公开的实施例仅仅是本发明的示例,其可以各种形式来实施。因此,本文所公开的具体结构和功能细节应被认为不是限制性的,而仅仅是用于权利要求书的基础以及用于教导本领域技术人员宽泛地采用具有实质上任何合适详细结构的本发明的代表性基础。具体地,在独立从属权利要求中示出并描述的特征可结合使用,并且这种权利要求的任何组合在此被公开。
此外,本文所使用的术语和短语不旨在是限制性的,而是为了提供对本发明的可理解的描述。本文所使用的术语“一”、“一个”被限定为一个或不止一个。本文所使用的术语“多个”被限定为两个或不止两个。本文所使用的术语“其它”被限定为至少第二个或多个。本文所使用的术语“包括”和/或“具有”被限定为包含(即,开放式语言)。本文所使用的术语“联接”被限定为连接,但是不必要直接连接。
Claims (21)
1.一种用于喷出流体液滴的装置,所述流体具有高于1200 K的温度,所述装置包括:
可替换布置的流体腔本体,其限定流体腔并且具有从流体腔延伸至流体腔本体外表面的孔;和
致动装置,所述致动装置用于将流体液滴从流体腔喷出并且通过孔;
其中,流体腔本体由耐热材料制成,所述耐热材料可由所述流体湿化,至少流体腔本体的内表面设置有湿化涂层,所述湿化涂层可为所述流体而湿化,且所述孔的内壁可为流体而湿化。
2.根据权利要求1所述的装置,其中,所述耐热材料是基本上导电的。
3.根据权利要求2所述的装置,其中,所述耐热材料包括石墨和金属中的至少一种。
4.根据权利要求3所述的装置,其中,所述金属是钨。
5.根据权利要求1所述的装置,其中,所述耐热材料是基本上不导电的。
6.根据权利要求5所述的装置,其中,所述耐热材料包括氮化硼(BN)。
7.根据权利要求1所述的装置,其中,所述流体是熔融金属,且其中,湿化涂层包括碳化一钨、碳化二钨、碳化三钨(WC、W2C和W3C)中的至少一个。
8.根据权利要求7所述的装置,其中,通过化学气相沉积(CVD)提供包括碳化一钨、碳化二钨、碳化三钨中的至少一个的湿化涂层。
9.根据权利要求1至8中任一项所述的装置,其中,在围绕孔的流体腔本体外表面处不存在湿化涂层。
10.根据权利要求1至8中任一项所述的装置,其中,致动装置包括至少两个导电电极,每个电极布置成使得每个电极的一端与流体腔中的流体电接触。
11.根据权利要求10所述的装置,其中,电极是销形的,且其中,电极布置在流体腔本体的通孔中,所述通孔从所述外表面延伸到流体腔中。
12.根据权利要求11所述的装置,其中,延伸通过所述通孔的一端是锥形的,且其中,弹性力被施加到销形电极上,使得在电极与流体腔本体之间得到流密连接。
13.根据权利要求12所述的装置,其中,通过弹簧提供弹性力,所述弹簧被电绝缘和导热材料的层电绝缘。
14.根据权利要求13所述的装置,其中,所述弹簧被氮化铝层电绝缘。
15.根据权利要求1至8中任一项所述的装置,其中,流体腔至少部分地布置在磁场中,所述磁场从磁性材料得到并且使用铁聚集器元件在流体腔处被聚集。
16.根据权利要求15所述的装置,其中,磁性材料是NdFeB,且磁性材料适于被冷却并热隔离。
17.根据权利要求1至8中任一项所述的装置,其中,所述装置还包括支撑框架,所述流体腔本体通过支撑板被支撑框架支撑,所述支撑板在至少一个尺寸上是刚性的并且包括热隔离和电绝缘材料。
18.根据权利要求17所述的装置,其中,所述热隔离和电绝缘材料是氮化硼和/或氧化铝。
19.根据权利要求17所述的装置,其中,流体腔至少部分地布置在磁场中,磁场从磁性材料得到并且使用铁聚集器元件在流体腔处被聚集,且其中,多个支撑板支撑流体腔本体,所述支撑板布置成用于定位流体腔本体,使得流体腔定位在聚集磁场中。
20.根据权利要求1至8中任一项所述的装置,其中,流体材料包括金属,且其中,流体腔本体布置在线圈的中心,所述线圈配置成承载电流,用于感应流体材料中的感应电流从而加热流体材料。
21.一种流体腔本体,其限定了流体腔并具有从流体腔延伸至流体腔本体外表面的孔,所述流体腔本体构造成被布置在如权利要求1所述的装置内,所述流体腔本体由耐热材料制成,所述耐热材料可由所述流体湿化,其中至少所述流体腔本体的内表面设置有湿化涂层,所述湿化涂层可为所述流体而湿化,且所述孔的内壁可为流体而湿化。
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