CN102231429A - Organic light-emitting diode (OLED) display device, package structure and package method - Google Patents
Organic light-emitting diode (OLED) display device, package structure and package method Download PDFInfo
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- CN102231429A CN102231429A CN2011101808924A CN201110180892A CN102231429A CN 102231429 A CN102231429 A CN 102231429A CN 2011101808924 A CN2011101808924 A CN 2011101808924A CN 201110180892 A CN201110180892 A CN 201110180892A CN 102231429 A CN102231429 A CN 102231429A
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Abstract
The invention relates to an organic light-emitting diode (OLED) display device, a package structure and a package method. The OLED display device comprises a glass package cover plate at a bottom and a glass substrate at a top. OLED units are attached to the lower part of the glass substrate. The OLED display device is characterized in that: a circle of sealing ultraviolet (UV) resin is arranged on the four edges of each OLED unit, connected between the glass package cover plate and the glass substrate and used for sealing the OLED unit in a closed space formed by the glass package cover plate, the glass substrate and the sealing UV resin; a circle of sealing sintered glass surrounding the periphery of the UV resin is arranged on the four edges of each OLED unit; one surface of the OLED unit is attached to the lower part of the glass substrate; and a drying agent is wrapped on the unattached surface of the OLED unit. The invention has the advantage that: compared with UV glue, the sintered glass has higher sealing performance, so better sealing effects are achieved by the package structure and the package method thereof for the OLED display device adopting the combination of the sintered glass and the UV resin for sealing.
Description
Technical field
The present invention relates to the plane Display Technique, relate in particular to the encapsulation technology of organic luminescent device (OLED).
Background technology
Encapsulation technology is a core technology of OLED technology, this be because OLED unit itself to the unusual sensitivity of steam and oxygen, if contact the rapid degeneration that can cause the OLED unit with steam or oxygen.Traditional OLED encapsulating structure as shown in Figure 1, be to adopt 2 pairs of OLED unit 6 of UV resin to seal, but because UV resin 2 still has certain gas permeability, therefore generally adhere to drier 7 in the inside of packaged glass cover plate 1 and glass substrate 5 again, to strengthen adsorption capacity to steam and oxygen.
In the existing commercial process, in order to form OLED display device 3 as shown in Figure 1, normally on one big packaged glass cover plate 1, form several and be the OLED display device of M * N (M, N are natural number) arranged, wait to finish these are the encapsulation of OLED display device of arranged after, be cut into M * N independent O light-emitting diode display spare.
Before cutting, need with the OLED display do not have the cutting before glass substrate 5, OLED unit 6, packaged glass cover plate 1 bonds together by UV resin 2, and in the closed cavity that glass substrate 5 and packaged glass cover plate 1 forms applying drier 7, in encapsulation process, for UV resin 2 is solidified, need to use UV light irradiation UV resin 2, but the irradiation of UV lamp can damage the organic luminous layer of OLED unit 6, for fear of when UV resin 2 solidifies, the UV light irradiation is to organic luminous layer 5, need take measures to avoid the UV light irradiation to OLED unit 6, prior art is to adopt mask plate to solve this problem, adopts mask plate shielding for the place that can not shine.
Sintered glass has good sealing property, can be under 85 ℃, 85% relative humidity condition, in 7000 hours, keep sealing property, be far longer than the sealing property of existing UV resin, but because some materials of OLED display interior such as organic luminescent layer can not withstand high temperatures, therefore sintered glass can influence the performance of other each layer when being subjected to the high-temp alloying sealing, and therefore existing OLED technical field also occurs adopting sintered glass to seal the OLED unit as encapsulant.
Summary of the invention
The objective of the invention is to have proposed a kind of OLED display device and encapsulating structure and method for packing in order to improve the sealing property of OLED display device.
Technical scheme of the present invention: a kind of encapsulating structure of OLED display device, comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top, a plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure, having a circle sealing UV resin outside the edge of each OLED unit is connected between packaged glass cover plate and the glass substrate in order to each OLED unit is sealed in the glaze cover plate, in the confined space that glass substrate and sealing UV resin form, have the welding glass of a corral outside the edge of described each OLED unit around sealing UV resin periphery, the one side of described OLED unit is attached to the bottom of glass substrate, be enclosed with drier on the non-attaching face of OLED unit, the edge of described uncut packaged glass cover plate and uncut glass substrate has the UV resin in order to all OLED unit are sealed in the glaze cover plate, in the confined space that glass substrate and UV resin form.
Another technical scheme of the present invention is: a kind of OLED display device, comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top, the OLED unit is attached to the bottom of glass substrate, it is characterized in that, having a circle sealing UV resin outside the edge of described OLED unit is connected between packaged glass cover plate and the glass substrate in order to the OLED unit is sealed in the glaze cover plate, in the confined space that glass substrate and sealing UV resin form, have the sealing welding glass of a corral outside the edge of described each OLED unit around sealing UV resin periphery, the one side of described OLED unit is attached to the bottom of glass substrate, is enclosed with drier on the non-attaching face of OLED unit.
The technical scheme of the method for packing of the encapsulating structure of OLED display device of the present invention: a kind of method for packing of OLED display device comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass outside the edge of each corresponding position, OLED unit on uncut packaged glass cover plate, the thickness of sintered glass is 5～30 μ m, width is 0.3～6mm;
Step b: by hot plate or vacuum furnace equipment, the uncut glaze cover plate of completing steps a is toasted, sintered glass is solidified;
Step c: the uncut packaged glass cover plate of completing steps b is loaded into sealed in unit and is sent in the resin-coated chamber of UV, coat a circle sealing UV resin by the inside of the sintered glass of the resin-coated equipment of UV outside the edge of the corresponding position of each OLED unit of uncut packaged glass cover plate, in the edge of uncut packaged glass cover plate, be coated with a circle UV resin by the resin-coated equipment of UV then, thickness behind sealing UV resin and the UV resin solidification is 10～100 μ m, and width is 0.5～5mm;
Steps d: on completing steps c packaged glass cover plate, on the glass packaging cover plate, apply the drier that one deck is in a liquid state by screen printing mode;
Step e: under the pure nitrogen gas environment, with the uncut packaged glass cover plate of completing steps c with finish the uncut glass substrate that has loaded the OLED unit and fit, again by the UV irradiate light make the outer sintered glass in the edge of each OLED unit inside a circle sealing UV resin and be positioned at uncut packaged glass cover plate the edge the UV resin solidification and finish preliminary packaging technology and form preliminary encapsulating structure;
Step f: the drier that is in a liquid state that is filled between uncut packaged glass cover plate and the glass substrate is solidified by mode of heating;
Step g: the uncut packaged glass cover plate of preliminary packaging technology and the preliminary encapsulating structure that glass substrate constitutes have been finished in taking-up from sealed in unit, make sintered glass fusing and welding by laser radiation, thereby make the OLED unit finish encapsulation, the laser that described laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers.
Step h: the encapsulating structure of finishing in the step g is sent into the cutting equipment cutting obtain the OLED display device.
The invention has the beneficial effects as follows:, therefore adopt the encapsulating structure and the method for packing thereof of the OLED display device of sintered glass and UV resin-bonded sealing to have better sealing effectiveness because sintered glass has good sealing property than UV glue.In this structure, add in the encapsulation process and further strengthened packaging effect after the drier that is in a liquid state solidifies.
Description of drawings
Accompanying drawing 1 is the structural representation of OLED display device.
Accompanying drawing 2 is the structural representation of the encapsulating structure of OLED display device of the present invention.
Accompanying drawing 3 is the structural representation on the encapsulating structure cross section of OLED display device of the present invention.
Accompanying drawing 4 is the structural representation of OLED display device of the present invention.
Description of reference numerals: packaged glass cover plate 1, UV resin 2, OLED display device 3, sintered glass 4, glass substrate 5, OLED unit 6, drier 7, sealing UV resin 8.
Embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments.
As shown in Figures 2 and 3, a kind of encapsulating structure of OLED display device, comprise uncut packaged glass cover plate 1 that is positioned at the bottom and the uncut glass substrate 5 that is positioned at the top, a plurality of OLED unit 6 is attached to the bottom of glass substrate 5 according to matrix structure, spatial dimension among the figure in the frame of broken lines can be regarded as an OLED display device, having a circle sealing UV resin 8 outside the edge of each OLED unit 6 is connected between packaged glass cover plate 1 and the glass substrate 5 in order to each OLED unit 6 is sealed in glaze cover plate 1, in the confined space that glass substrate 5 and sealing UV resin 8 form, have the welding glass 4 of a corral outside the edge of described each OLED unit 6 around sealing UV resin 8 peripheries, the one side of described OLED unit 6 is attached to the bottom of glass substrate 5, be enclosed with drier 7 on the non-attaching face of OLED unit, the edge of described uncut packaged glass cover plate 1 and uncut glass substrate 5 has UV resin 2 in order to all OLED unit 6 are sealed in glaze cover plate 1, in the confined space that glass substrate 5 and UV resin 2 form.
As shown in Figure 4, another technical scheme of the present invention is: a kind of OLED display device, comprise packaged glass cover plate 1 that is positioned at the bottom and the glass substrate 5 that is positioned at the top, OLED unit 6 is attached to the bottom of glass substrate 5, it is characterized in that, having a circle sealing UV resin 8 outside the edge of described OLED unit 6 is connected between packaged glass cover plate 1 and the glass substrate 5 in order to OLED unit 6 is sealed in glaze cover plate 1, in the confined space that glass substrate 5 and sealing UV resin 8 form, have the sealing welding glass 4 of a corral outside the edge of described each OLED unit 6 around sealing UV resin 8 peripheries, the one side of described OLED unit 6 is attached to the bottom of glass substrate 5, is enclosed with drier 7 on the non-attaching face of OLED unit.
Technical scheme at the method for packing of as shown in Figure 4 OLED display device is: a kind of method for packing of OLED display device comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass 4 outside the edge of each 6 corresponding position, OLED unit on uncut packaged glass cover plate 1, the thickness of sintered glass 4 is 5～30 μ m, width is 0.3～6mm;
Step b: by hot plate or vacuum furnace equipment, the uncut glaze cover plate 1 of completing steps a is toasted, sintered glass 4 is solidified;
Step c: the uncut packaged glass cover plate 1 of completing steps b is loaded into sealed in unit and is sent in the UV resin 2 coating chambeies, coat a circle sealing UV resin 8 by the inside of the sintered glass 4 of the resin-coated equipment of UV outside the edge of the corresponding position of each OLED unit 6 of uncut packaged glass cover plate 1, in the edge of uncut packaged glass cover plate 1, be coated with a circle UV resin 2 by the resin-coated equipment of UV then, thickness after sealing UV resin 8 and UV resin 2 solidify is 10～100 μ m, and width is 0.5～5mm;
Steps d: on completing steps c packaged glass cover plate, on the glass packaging cover plate, apply the drier 7 that one deck is in a liquid state by modes such as silk screen printings;
Step e: under the pure nitrogen gas environment, with the uncut packaged glass cover plate 1 of completing steps c with finish the uncut glass substrate 5 that has loaded OLED unit 6 and fit, again by the UV irradiate light make the outer sintered glass 4 in the edge of each OLED unit 6 inside a circle sealing UV resin 8 and be positioned at uncut packaged glass cover plate 1 the edge 2 curing of UV resin and finish preliminary packaging technology and form preliminary encapsulating structure;
Step f: the drier that is in a liquid state that is filled between uncut packaged glass cover plate 1 and the glass substrate 5 is solidified by mode of heating;
Step g: the uncut packaged glass cover plate 1 of preliminary packaging technology and the preliminary encapsulating structure that glass substrate 5 constitutes have been finished in taking-up from sealed in unit, make sintered glass 4 fusings and welding by laser radiation, thereby make OLED unit 6 finish encapsulation, the laser that described laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers.
Step h: the encapsulating structure of finishing in the step g is sent into the cutting equipment cutting obtain the OLED display device.
After finishing above-mentioned steps, obtain OLED display device as shown in Figure 4.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help reader understanding's principle of the present invention, should to be understood that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from essence of the present invention according to these technology enlightenments disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
Claims (3)
1. the encapsulating structure of an OLED display device, comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top, a plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure, having a circle sealing UV resin outside the edge of each OLED unit is connected between packaged glass cover plate and the glass substrate in order to each OLED unit is sealed in the glaze cover plate, in the confined space that glass substrate and sealing UV resin form, have the welding glass of a corral outside the edge of described each OLED unit around sealing UV resin periphery, the one side of described OLED unit is attached to the bottom of glass substrate, be enclosed with drier on the non-attaching face of OLED unit, the edge of described uncut packaged glass cover plate and uncut glass substrate has the UV resin in order to all OLED unit are sealed in the glaze cover plate, in the confined space that glass substrate and UV resin form.
2. OLED display device, comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top, the OLED unit is attached to the bottom of glass substrate, it is characterized in that, having a circle sealing UV resin outside the edge of described OLED unit is connected between packaged glass cover plate and the glass substrate in order to the OLED unit is sealed in the glaze cover plate, in the confined space that glass substrate and sealing UV resin form, have the sealing welding glass of a corral outside the edge of described each OLED unit around sealing UV resin periphery, the one side of described OLED unit is attached to the bottom of glass substrate, is enclosed with drier on the non-attaching face of OLED unit.
3. the method for packing of an OLED display device comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass outside the edge of each corresponding position, OLED unit on uncut packaged glass cover plate, the thickness of sintered glass is 5～30 μ m, width is 0.3～6mm;
Step b: by hot plate or vacuum furnace equipment, the uncut glaze cover plate of completing steps a is toasted, sintered glass is solidified;
Step c: the uncut packaged glass cover plate of completing steps b is loaded into sealed in unit and is sent in the resin-coated chamber of UV, coat a circle sealing UV resin by the inside of the sintered glass of the resin-coated equipment of UV outside the edge of the corresponding position of each OLED unit of uncut packaged glass cover plate, in the edge of uncut packaged glass cover plate, be coated with a circle UV resin by the resin-coated equipment of UV then, thickness behind sealing UV resin and the UV resin solidification is 10～100 μ m, and width is 0.5～5mm;
Steps d: on completing steps c packaged glass cover plate, on the glass packaging cover plate, apply the drier that one deck is in a liquid state by screen printing mode;
Step e: under the pure nitrogen gas environment, with the uncut packaged glass cover plate of completing steps c with finish the uncut glass substrate that has loaded the OLED unit and fit, again by the UV irradiate light make the outer sintered glass in the edge of each OLED unit inside a circle sealing UV resin and be positioned at uncut packaged glass cover plate the edge the UV resin solidification and finish preliminary packaging technology and form preliminary encapsulating structure;
Step f: the drier that is in a liquid state that is filled between uncut packaged glass cover plate and the glass substrate is solidified by mode of heating;
Step g: the uncut packaged glass cover plate of preliminary packaging technology and the preliminary encapsulating structure that glass substrate constitutes have been finished in taking-up from sealed in unit, make sintered glass fusing and welding by laser radiation, thereby make the OLED unit finish encapsulation, the laser that described laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers.
Step h: the encapsulating structure of finishing in the step g is sent into the cutting equipment cutting obtain the OLED display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110180892 CN102231429B (en) | 2011-06-30 | 2011-06-30 | Organic light-emitting diode (OLED) display device, package structure and package method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110180892 CN102231429B (en) | 2011-06-30 | 2011-06-30 | Organic light-emitting diode (OLED) display device, package structure and package method |
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| Publication Number | Publication Date |
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| CN102231429A true CN102231429A (en) | 2011-11-02 |
| CN102231429B CN102231429B (en) | 2013-10-16 |
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| CN 201110180892 Expired - Fee Related CN102231429B (en) | 2011-06-30 | 2011-06-30 | Organic light-emitting diode (OLED) display device, package structure and package method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103972262A (en) * | 2013-11-19 | 2014-08-06 | 厦门天马微电子有限公司 | Organic light-emitting display device and manufacture method thereof |
| CN104505466A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED (Organic Light Emitting Diode) packaging structure and method |
| CN104505465A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED packaging structure and packaging method thereof |
| CN104576972A (en) * | 2014-12-02 | 2015-04-29 | 深圳市华星光电技术有限公司 | OLED (organic light-emitting diode) packaging method and OLED packaging structure |
| CN105044997A (en) * | 2015-08-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Liquid crystal display panel, a preparation method thereof and liquid crystal display device |
| WO2015196519A1 (en) * | 2014-06-24 | 2015-12-30 | 深圳市华星光电技术有限公司 | Oled packaging apparatus and packaging method for oled panel |
| CN107204405A (en) * | 2016-03-18 | 2017-09-26 | 上海和辉光电有限公司 | A kind of organic electroluminescence display panel and its method for packing |
| CN107884971A (en) * | 2017-09-16 | 2018-04-06 | 合肥惠科金扬科技有限公司 | A kind of liquid crystal panel manufacture process drier coating machine |
| CN112018272A (en) * | 2020-09-10 | 2020-12-01 | 紫旸升光电科技(苏州)有限公司 | Wafer laminating and packaging method of silicon-based OLED |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103972262A (en) * | 2013-11-19 | 2014-08-06 | 厦门天马微电子有限公司 | Organic light-emitting display device and manufacture method thereof |
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| CN104576972A (en) * | 2014-12-02 | 2015-04-29 | 深圳市华星光电技术有限公司 | OLED (organic light-emitting diode) packaging method and OLED packaging structure |
| CN104505466A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED (Organic Light Emitting Diode) packaging structure and method |
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| CN105044997A (en) * | 2015-08-27 | 2015-11-11 | 京东方科技集团股份有限公司 | Liquid crystal display panel, a preparation method thereof and liquid crystal display device |
| CN107204405A (en) * | 2016-03-18 | 2017-09-26 | 上海和辉光电有限公司 | A kind of organic electroluminescence display panel and its method for packing |
| CN107884971A (en) * | 2017-09-16 | 2018-04-06 | 合肥惠科金扬科技有限公司 | A kind of liquid crystal panel manufacture process drier coating machine |
| CN112018272A (en) * | 2020-09-10 | 2020-12-01 | 紫旸升光电科技(苏州)有限公司 | Wafer laminating and packaging method of silicon-based OLED |
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| CN102231429B (en) | 2013-10-16 |
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Granted publication date: 20131016 Termination date: 20210630 |