CN110048013A - Display substrate, display device and manufacturing method of display substrate - Google Patents
Display substrate, display device and manufacturing method of display substrate Download PDFInfo
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- CN110048013A CN110048013A CN201910159302.6A CN201910159302A CN110048013A CN 110048013 A CN110048013 A CN 110048013A CN 201910159302 A CN201910159302 A CN 201910159302A CN 110048013 A CN110048013 A CN 110048013A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
The invention provides a display substrate, a display device and a manufacturing method of the display substrate, belongs to the technical field of display, and can at least partially solve the problem that an organic light-emitting diode is damaged due to ultraviolet irradiation curing of ultraviolet curing glue for bonding an encapsulation layer and a color filter coating in the existing display substrate. The display substrate comprises a substrate, an organic light emitting diode arranged on the substrate, a color filter film positioned on one side of the organic light emitting diode, which faces away from the substrate, and an ultraviolet blocking packaging layer positioned between the organic light emitting diode and the color filter film, wherein the ultraviolet blocking packaging layer is bonded with the color filter film through an ultraviolet curing adhesive, and is used for blocking ultraviolet rays and packaging the organic light emitting diode.
Description
Technical field
The invention belongs to field of display technology, and in particular to a kind of display base plate, a kind of display device and a kind of display base
The manufacturing method of plate.
Background technique
In existing one kind organic LED display device, the Organic Light Emitting Diode in display base plate issues white
Light is changed to different colors after the optical filtering by the color filter film of Organic Light Emitting Diode light emission side, to form difference
The sub-pix of color.Usual Organic Light Emitting Diode is sealed by (TFE layers) of thin-film encapsulation layer encapsulation, color filter film and film
It fills and passes through ultra-violet curing gluing knot between layer.In the manufacturing process of this kind of display device, need to irradiate by ultraviolet light ultraviolet
Solidification glue solidifies ultra-violet curing agent, and some ultra violet rays can be irradiated to the organic luminous layer in Organic Light Emitting Diode, right
Organic luminous layer causes to damage.
Summary of the invention
The present invention at least partly solve in existing display base plate because to bonding encapsulated layer and color filter film it is ultraviolet solid
Change glue carry out it is UV radiation curing and the problem of damage Organic Light Emitting Diode, provide a kind of display base plate, a kind of display fills
It sets, a kind of manufacturing method of display base plate.
According to a first aspect of the present invention, a kind of display base plate is provided, including substrate, the organic light emission being arranged in substrate
Diode, positioned at Organic Light Emitting Diode backwards to the color filter film of substrate side, further include be located at Organic Light Emitting Diode with
Ultraviolet barrier encapsulation layer between color filter film, passes through uv-curable glue between ultraviolet barrier encapsulation layer and color filter film
Bonding, ultraviolet barrier encapsulation layer is for stopping ultraviolet light and being packaged to Organic Light Emitting Diode.
Optionally, ultraviolet barrier encapsulation layer includes the first sub- encapsulated layer, and the first sub- encapsulated layer includes thin-film package ontology material
The ultraviolet absorber expected and be incorporated in thin-film package bulk material, ultraviolet absorber switch to heat for absorbing ultraviolet light.
Optionally, ultraviolet barrier encapsulation layer further include: the second sub- encapsulated layer, the second sub- encapsulated layer are located at the first son encapsulation
Between layer and color filter film, the second sub- encapsulated layer includes thin-film package bulk material；And/or the sub- encapsulated layer of third, third
For sub- encapsulated layer between the first sub- encapsulated layer and Organic Light Emitting Diode, the sub- encapsulated layer of third includes thin-film package ontology material
Material.
Optionally, the material of ultraviolet absorber includes salicylic acid esters, benzophenone, benzotriazole, replaces propylene
At least one of nitrile, triazines.
Optionally, ultraviolet barrier encapsulation layer includes stacked ultraviolet conversion coating and thin-film encapsulation layer, and ultraviolet conversion coating is used for
Visible light is converted by ultraviolet light, thin-film encapsulation layer is for being packaged Organic Light Emitting Diode.
According to a second aspect of the present invention, a kind of display device is provided, the display base plate including first aspect present invention.
According to a third aspect of the present invention, a kind of manufacturing method of display base plate is provided, comprising:
Organic Light Emitting Diode is formed on the substrate；
Ultraviolet barrier encapsulation layer is formed backwards to substrate side in Organic Light Emitting Diode, ultraviolet barrier encapsulation layer is for hindering
It keeps off ultraviolet light and Organic Light Emitting Diode is packaged；
Color filter film, color filter film and ultraviolet barrier encapsulation are formed backwards to substrate side in ultraviolet barrier encapsulation layer
Layer passes through ultra-violet curing gluing knot.
Optionally, ultraviolet barrier encapsulation layer includes the first sub- encapsulated layer, and the first sub- encapsulated layer includes thin-film package ontology material
The ultraviolet absorber expected and be incorporated in thin-film package bulk material, ultraviolet absorber switch to heat for absorbing ultraviolet light；
It is described to include: the step of the based side of Organic Light Emitting Diode back forms ultraviolet barrier encapsulation layer
Ultraviolet absorber is dissolved in transparent ink, and the transparent ink for mixing ultraviolet absorber is coated in organic hair
Optical diode carries on the back based side, is solidified to transparent ink to obtain the first sub- encapsulated layer, wherein thin-film package sheet
The material of body includes transparent ink；Alternatively, using chemical vapor deposition process in Organic Light Emitting Diode backwards to substrate side
Ultraviolet absorber powder is added while deposition film encapsulation main body material, into processing chamber to obtain the first sub- encapsulated layer.
Optionally, the step for forming ultraviolet barrier encapsulation layer backwards to the side of the substrate in Organic Light Emitting Diode
Suddenly further include:
After forming the first sub- encapsulated layer, based side is carried on the back in the first sub- encapsulated layer and forms the second sub- encapsulated layer,
The material of second sub- encapsulated layer includes thin-film package bulk material；
And/or before forming the first sub- encapsulated layer, based side is carried on the back in Organic Light Emitting Diode and forms third
Sub- encapsulated layer, the material of the sub- encapsulated layer of third include thin-film package bulk material.
Optionally, described to carry on the back the step of based side forms ultraviolet barrier encapsulation layer packet in Organic Light Emitting Diode
It includes: ultraviolet absorber is dissolved in transparent ink；
The material of the ultraviolet absorber dissolved in transparent ink includes salicylic acid esters, benzophenone, benzotriazole
At least one of class, group-substituted acrylonitrile, triazines.
Optionally, described to include: backwards to substrate side formation color filter film in ultraviolet barrier encapsulation layer
Based side, which is carried on the back, in ultraviolet barrier encapsulation layer coats uv-curable glue；
Based side, which is carried on the back, in uv-curable glue forms color filter film；
Ultra-violet curing processing is carried out to uv-curable glue.
Optionally, described to carry on the back the step of based side forms ultraviolet barrier encapsulation layer packet in Organic Light Emitting Diode
It includes: forming the thin-film encapsulation layer for being packaged to Organic Light Emitting Diode；It is formed for converting visible light for ultraviolet light
Ultraviolet conversion coating；Wherein, ultraviolet conversion coating and thin-film encapsulation layer are stacked.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of display base plate of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of another display base plate of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another display base plate of the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another display base plate of the embodiment of the present invention；
Wherein, appended drawing reference are as follows: 1, substrate；2, Organic Light Emitting Diode；21, first electrode；22, organic luminous layer；
23, second electrode；3, ultraviolet barrier encapsulation layer；31, the first sub- encapsulated layer；32, the second sub- encapsulated layer；33, third encapsulates
Layer；34, ultraviolet conversion coating；35, thin-film encapsulation layer；4, uv-curable glue；5R, red filter film；5G, green filter film；5B,
Blue filter film.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention with reference to the accompanying drawing and is embodied
Present invention is further described in detail for mode.
Embodiment 1:
The present embodiment provides a kind of display base plate, including substrate 1, setting Organic Light Emitting Diode 2 on the base 1, position
It further include being located at Organic Light Emitting Diode 2 and colored filter in Organic Light Emitting Diode 2 backwards to the color filter film of 1 side of substrate
Ultraviolet barrier encapsulation layer 3 between light film, it is viscous by uv-curable glue 4 between ultraviolet barrier encapsulation layer 3 and color filter film
Knot, ultraviolet barrier encapsulation layer 3 is for absorbing ultraviolet light and being packaged to Organic Light Emitting Diode 2.
Substrate 1 can be rigid substrate 1, such as glass, be also possible to flexible substrates 1, such as polyimide resin
(PI).Driving circuit (not shown) can be also set usually between substrate 1 and Organic Light Emitting Diode 2, for driving organic hair
Optical diode 2 is lighted.
Organic Light Emitting Diode 2 includes stacked first electrode 21, organic luminous layer 22, second electrode 23.Fig. 1-Fig. 3
In the display base plate shown, multiple Organic Light Emitting Diodes 2 share second electrode 23, and certainly, they are also possible to be separated from each other
's.Organic luminous layer 22 includes composite luminescence layer, certainly further can also include electron transfer layer, hole transmission layer etc..
The effect of color filter film is so that the light that goes out of light emitting diode has different colors, to form different face
The sub-pix of color.Color filter film is, for example, red filter film 5R, green filter film 5G or blue filter film 5B etc..
Ultraviolet 3 one side of barrier encapsulation layer is packaged Organic Light Emitting Diode 2, on the other hand absorbs ultraviolet light.Such as
This, when carrying out ultraviolet irradiation solidification to uv-curable glue 4, ultraviolet barrier encapsulation layer 3 can be absorbed across uv-curable glue 4
Ultraviolet light, avoid ultraviolet light irradiate organic luminous layer 22, so that organic luminous layer 22 be avoided to be irradiated with ultraviolet radiation damage.
Optionally, referring to Fig. 1, ultraviolet barrier encapsulation layer 3 includes the first sub- encapsulated layer 31, and the first sub- encapsulated layer 31 includes
Thin-film package bulk material and the ultraviolet absorber being incorporated in thin-film package bulk material.
Ultraviolet absorber can be inorganic material, such as cerium oxide, titanium oxide etc., be in ultra micron state.
Ultraviolet absorber is also possible to organic material, such as salicylic acid esters, benzophenone, benzotriazole, substitution
At least one of vinyl cyanide, triazines.
Ultraviolet absorber in first sub- encapsulated layer 31 for absorbing ultraviolet light, and thin-film package bulk material for pair
Organic Light Emitting Diode 2 is packaged.The selection of thin-film package bulk material can be transparent ink and silicon nitride, silicon
Oxide, silicon oxynitride etc..
Optionally, ultraviolet barrier encapsulation layer 3 further include: the second sub- encapsulated layer 32, the second sub- encapsulated layer 32 are located at the first son
Between encapsulated layer 31 and color filter film, the second sub- encapsulated layer 32 includes thin-film package bulk material；And/or third encapsulation
Layer 33, between the first sub- encapsulated layer 31 and Organic Light Emitting Diode 2, the sub- encapsulated layer 33 of third wraps the sub- encapsulated layer 33 of third
Include thin-film package bulk material.
The purpose that second sub- encapsulated layer 32 is arranged is to glue ultraviolet barrier encapsulation layer 3 preferably with uv-curable glue 4
Knot, the purpose that the sub- encapsulated layer 33 of third is arranged are to glue ultraviolet barrier encapsulation layer 3 preferably with Organic Light Emitting Diode 2
It ties (being specifically bonded in second electrode 23).
Referring to fig. 4, in another embodiment, ultraviolet barrier encapsulation layer 3 includes stacked ultraviolet conversion coating 34 and thin
Film encapsulated layer 35, ultraviolet conversion coating 34 are used to convert ultraviolet light to visible light, and thin-film encapsulation layer is used for organic light-emitting diodes
Pipe is packaged.
Thin-film encapsulation layer 35 is for example formed by the oxide of silicon nitride or silicon.Preferably, thin-film encapsulation layer 35 is directly covered
It covers in second electrode 23, so more preferably to the protecting effect of second electrode 23.Certain thin-film encapsulation layer 35 and ultraviolet conversion coating
What 34 position was also possible to exchange.Thin film encapsulated layer can also be arranged in the top of ultraviolet conversion coating 34 in certain Fig. 4
35。
The material of ultraviolet conversion coating 34 is, for example, that can convert the complex of ultraviolet light, it is specific be, for example, by europium -4,
The complex of 7- phenyl -1 and 10- Phen as substituent group.
Embodiment 2:
The present embodiment provides a kind of display device, the display base plate including embodiment 1.
Specifically, the display device can be Organic Light Emitting Diode (OLED) display panel, mobile phone, tablet computer, TV
Any products or components having a display function such as machine, display, laptop, Digital Frame, navigator.
Embodiment 3:
The present embodiment provides a kind of manufacturing methods of display base plate, comprising:
Organic Light Emitting Diode 2 is formed on the base 1；
Ultraviolet barrier encapsulation layer 3 is formed backwards to 1 side of substrate in Organic Light Emitting Diode 2, ultraviolet barrier encapsulation layer 3 is used
In blocking ultraviolet light and Organic Light Emitting Diode 2 is packaged；
Color filter film is formed backwards to 1 side of substrate in ultraviolet barrier encapsulation layer 3, color filter film and ultraviolet blocking are sealed
Dress layer 3 is bonded by uv-curable glue 4.
When carrying out UV radiation curing to uv-curable glue 4, due to ultraviolet barrier encapsulation layer 3 stop it is ultraviolet
Line avoids the Organic Light Emitting Diode 2 covered by ultraviolet barrier encapsulation layer 3 by ultraviolet irradiation, to protect organic light emission
Organic luminous layer 22 in diode 2 personally instructs ultraviolet radiation damage.
Optionally, ultraviolet barrier encapsulation layer 3 includes the first sub- encapsulated layer 31, and the first sub- encapsulated layer 31 includes thin-film package
Bulk material and the ultraviolet absorber being incorporated in thin-film package bulk material；It is described in Organic Light Emitting Diode 2 backwards to base
The side at bottom 1 formed the step of ultraviolet barrier encapsulation layer 3 include: ultraviolet absorber is dissolved in transparent ink, and will incorporation
The transparent ink of ultraviolet absorber is coated in Organic Light Emitting Diode 2 backwards to the side of substrate 1, solidifies to transparent ink
To obtain the first sub- encapsulated layer 31, wherein thin-film package bulk material includes transparent ink；Or utilize chemical vapor deposition
Technique adds while Organic Light Emitting Diode 2 is backwards to 1 side deposition film encapsulation main body material of substrate into processing chamber
Add ultraviolet absorber powder, to obtain the first sub- encapsulated layer 31.
In the first above-mentioned embodiment, the material of the ultraviolet absorber dissolved in transparent ink include salicylic acid esters,
At least one of benzophenone, benzotriazole, group-substituted acrylonitrile, triazines.
In above-mentioned second of embodiment, thin-film package bulk material is, for example, the inorganic material such as silicon nitride, silica.
Optionally, described to form ultraviolet barrier encapsulation layer 3 backwards to the side of the substrate 1 in Organic Light Emitting Diode 2
Step further include: after forming the first sub- encapsulated layer 31, form second backwards to the side of substrate 1 in the first sub- encapsulated layer 31
The material of sub- encapsulated layer 32, the second sub- encapsulated layer 32 includes thin-film package bulk material；And/or forming the first son encapsulation
Before layer 31, the sub- encapsulated layer 33 of third is formed backwards to the side of substrate 1 in Organic Light Emitting Diode 2, the sub- encapsulated layer 33 of third
Material includes thin-film package bulk material.
Ultraviolet barrier encapsulation layer 3 shown in fig. 1 only includes the first sub- encapsulated layer 31.Ultraviolet barrier encapsulation layer shown in Fig. 2
3 include the first sub- encapsulated layer 31 and the second sub- encapsulated layer 32.The effect of second sub- encapsulated layer 32 is the ultraviolet barrier encapsulation layer of enhancing
Bonding between 3 and the uv-curable glue 4 that subsequently forms.Ultraviolet barrier encapsulation layer 3 shown in Fig. 3 includes the first sub- encapsulated layer
31, the second sub- encapsulated layer 32 and the sub- encapsulated layer 33 of third.Wherein the effect of the sub- encapsulated layer 33 of third is the ultraviolet barrier encapsulation of enhancing
Bonding between layer 3 and previously formed Organic Light Emitting Diode 2 (specially second electrode 23).
Optionally, described to include: backwards to 1 side of substrate formation color filter film in ultraviolet barrier encapsulation layer 3
Uv-curable glue 4 is coated backwards to the side of substrate 1 in ultraviolet barrier encapsulation layer 3；
Color filter film is formed backwards to the side of substrate 1 in uv-curable glue 4；
Ultra-violet curing processing is carried out to uv-curable glue 4.
In this embodiment, color filter film is formed on display base plate, after completing ultra-violet curing processing,
It also will form the encapsulated layer of one layer of covering color filter film.Certainly, color filter film is also possible to be formed in encapsulation cover plate (not
Show) on, it then will pass through uv-curable glue 4 between encapsulation cover plate and the ultraviolet barrier encapsulation layer 3 of display base plate top layer and glue
Knot is together.
Optionally, packet the step of Organic Light Emitting Diode 3 forms ultraviolet barrier encapsulation layer 3 backwards to the side of substrate 1
It includes: forming the thin-film encapsulation layer 35 for being packaged to Organic Light Emitting Diode 2；Formation can for converting ultraviolet light to
Light-exposed ultraviolet conversion coating 34；Wherein, ultraviolet conversion coating 34 and thin-film encapsulation layer 35 are stacked.
In conjunction with Fig. 4, in this embodiment, ultraviolet conversion coating 34 and thin-film encapsulation layer 35 are sequentially formed.It is preferred that shape first
At thin-film encapsulation layer 35, i.e., Organic Light Emitting Diode 2 is packaged first in the fabrication process.
It is by europium -4,7- phenyl -1 and 10- phenanthroline as the ligand compound of substituent group using the material of ultraviolet conversion coating
For object, the step of forming ultraviolet conversion coating may is that weighs europium -4,7- diphenyl -1,10- ferrosin and six hydrations respectively
Europium nitrate is dissolved in ethyl alcohol, is stirred continuously lower mixing, then generates white precipitate after lasting stirring.It is washed with dehydrated alcohol,
Then it is dried to obtain complex.It takes the complex to be dissolved in the PVP ethanol solution of certain content later, then will
It is uniformly coated in thin-film encapsulation layer 35 and forms a film, and then dries to it, to obtain ultraviolet conversion coating 34.
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary reality that uses
Mode is applied, however the present invention is not limited thereto.For those skilled in the art, the present invention is not being departed from
Spirit and essence in the case where, various changes and modifications can be made therein, these variations and modifications are also considered as guarantor of the invention
Protect range.
Claims (12)
1. a kind of display base plate including substrate, the Organic Light Emitting Diode being arranged in substrate, is located at Organic Light Emitting Diode back
The color filter film of basad side, which is characterized in that further include between Organic Light Emitting Diode and color filter film
Ultraviolet barrier encapsulation layer passes through ultra-violet curing gluing knot, ultraviolet barrier encapsulation between ultraviolet barrier encapsulation layer and color filter film
Layer is for stopping ultraviolet light and being packaged to Organic Light Emitting Diode.
2. display base plate according to claim 1, which is characterized in that ultraviolet barrier encapsulation layer includes the first sub- encapsulated layer,
First sub- encapsulated layer includes thin-film package bulk material and the ultraviolet absorber that is incorporated in thin-film package bulk material, ultraviolet
Absorbent switchs to heat for absorbing ultraviolet light.
3. display base plate according to claim 2, spy are, ultraviolet barrier encapsulation layer further include:
Second sub- encapsulated layer, the second sub- encapsulated layer is between the first sub- encapsulated layer and color filter film, the second sub- encapsulated layer packet
Include thin-film package bulk material；
And/or the sub- encapsulated layer of third, the sub- encapsulated layer of third is between the first sub- encapsulated layer and Organic Light Emitting Diode, third
Sub- encapsulated layer includes thin-film package bulk material.
4. display base plate according to claim 2, which is characterized in that the material of ultraviolet absorber include salicylic acid esters,
At least one of benzophenone, benzotriazole, group-substituted acrylonitrile, triazines.
5. display base plate according to claim 1, which is characterized in that ultraviolet barrier encapsulation layer includes stacked ultraviolet conversion
Layer and thin-film encapsulation layer, ultraviolet conversion coating are used to convert ultraviolet light to visible light, and thin-film encapsulation layer is used for organic light emission two
Pole pipe is packaged.
6. a kind of display device, which is characterized in that including display base plate described in -5 any one according to claim 1.
7. a kind of manufacturing method of display base plate characterized by comprising
Organic Light Emitting Diode is formed on the substrate；
Ultraviolet barrier encapsulation layer is formed backwards to substrate side in Organic Light Emitting Diode, ultraviolet barrier encapsulation layer is ultraviolet for stopping
Line and Organic Light Emitting Diode is packaged；
Color filter film is formed backwards to substrate side in ultraviolet barrier encapsulation layer, color filter film passes through with ultraviolet barrier encapsulation layer
Ultra-violet curing gluing knot.
8. manufacturing method according to claim 7, which is characterized in that ultraviolet barrier encapsulation layer includes the first sub- encapsulated layer,
First sub- encapsulated layer includes thin-film package bulk material and the ultraviolet absorber that is incorporated in thin-film package bulk material, ultraviolet
Absorbent switchs to heat for absorbing ultraviolet light；
It is described to include: the step of the based side of Organic Light Emitting Diode back forms ultraviolet barrier encapsulation layer
Ultraviolet absorber is dissolved in transparent ink, and the transparent ink for mixing ultraviolet absorber is coated in organic light-emitting diodes
Pipe carries on the back based side, is solidified to transparent ink to obtain the first sub- encapsulated layer, wherein the material of thin-film package ontology
Including transparent ink；
Alternatively,
Using chemical vapor deposition process in Organic Light Emitting Diode backwards to the same of substrate side deposition film encapsulation main body material
When into processing chamber add ultraviolet absorber powder, to obtain the first sub- encapsulated layer.
9. manufacturing method according to claim 8, which is characterized in that
It is described the step of Organic Light Emitting Diode forms ultraviolet barrier encapsulation layer backwards to the side of the substrate further include:
After forming the first sub- encapsulated layer, based side is carried on the back in the first sub- encapsulated layer and forms the second sub- encapsulated layer, second
The material of sub- encapsulated layer includes thin-film package bulk material；
And/or before forming the first sub- encapsulated layer, based side is carried on the back in Organic Light Emitting Diode and forms the encapsulation of third
Layer, the material of the sub- encapsulated layer of third includes thin-film package bulk material.
10. manufacturing method according to claim 8, which is characterized in that described based in Organic Light Emitting Diode back
It includes: to dissolve in ultraviolet absorber in transparent ink that side, which forms the step of ultraviolet barrier encapsulation layer,；
The material of the ultraviolet absorber dissolved in transparent ink includes salicylic acid esters, benzophenone, benzotriazole, substitution
At least one of vinyl cyanide, triazines.
11. manufacturing method according to claim 7, which is characterized in that it is described in ultraviolet barrier encapsulation layer backwards to substrate one
Side forms color filter film
Based side, which is carried on the back, in ultraviolet barrier encapsulation layer coats uv-curable glue；
Based side, which is carried on the back, in uv-curable glue forms color filter film；
Ultra-violet curing processing is carried out to uv-curable glue.
12. manufacturing method according to claim 7, which is characterized in that described based in Organic Light Emitting Diode back
Side forms the step of ultraviolet barrier encapsulation layer and includes:
Form the thin-film encapsulation layer for being packaged to Organic Light Emitting Diode；
Form the ultraviolet conversion coating for converting ultraviolet light to visible light；
Wherein, ultraviolet conversion coating and thin-film encapsulation layer are stacked.
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| WO2022056886A1 (en) * | 2020-09-19 | 2022-03-24 | Huawei Technologies Co., Ltd. | Organic electroluminescent display |
| WO2022227051A1 (en) * | 2021-04-30 | 2022-11-03 | Huawei Technologies Co., Ltd. | Organic electroluminescent display |
| CN114171572B (en) * | 2021-12-08 | 2023-05-02 | 武汉华星光电半导体显示技术有限公司 | Display module |
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