CN106571345A - Packaging structure, method for manufacturing same, and optoelectronic device comprising same - Google Patents
Packaging structure, method for manufacturing same, and optoelectronic device comprising same Download PDFInfo
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- CN106571345A CN106571345A CN201510649165.6A CN201510649165A CN106571345A CN 106571345 A CN106571345 A CN 106571345A CN 201510649165 A CN201510649165 A CN 201510649165A CN 106571345 A CN106571345 A CN 106571345A
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Abstract
The application provides a packaging structure, a method for manufacturing the same, and an optoelectronic device comprising the same. The packaging structure includes a substrate, a cover plate, a packaging glue portion and a polysilazane-based compound portion. wherein the first substrate surface of the substrate is provided with a light-emitting device; the first cover surface of the cover plate is disposed opposite to the first substrate surface; and a gap is arranged between the first substrate surface and the first cover plate surface; the packaging glue portion surrounds the light-emitting device and is disposed in the gap; the polysilazane-based compound portion surrounds the packaging glue portion and is disposed in the gap; and the substrate, the cover plate and the polysilazane-based compound portion form a confined space. The packaging structure can prevent water and oxygen from entering the packaging structure from the side of the packaging structure, avoids influence on the performance of the light-emitting device inside the packaging structure, ensuring that the light-emitting device has good performance.
Description
Technical field
The application is related to technical field of semiconductors, in particular to a kind of encapsulating structure, its preparation method and comprising its light
Electric equipment.
Background technology
Some semiconductor devices are very sensitive to water oxygen, and the requirement to encapsulating is very high, and the quality of encapsulation directly affects the final property of device
Energy and life-span.
In prior art, conventional method for packing is cover plate and base by the environment of device sealing to nitrogen or argon gas by cover plate
Plate is filled out by packaging plastic (such as UV glue) solidification sealing in the sealing space that cure package glue, cover plate and substrate are formed
Fill the drier such as calcium oxide or barium monoxide to absorb the steam that the external world penetrates, and then improve the life-span of device.
In prior art, frequently with the fluted cover plate packaged type of packaged type and plate glass liquid underfill packaged type.This
Although two ways process is simple, and possess certain endurance to external impacts, it is ensured that encapsulating structure front will not be oozed by water oxygen
Thoroughly, but both modes cannot effectively stop that water oxygen is penetrated into inside encapsulating structure by side, i.e., water oxygen can using encapsulation
Gap penetration between glue and cover plate and packaging plastic and substrate to encapsulating structure inside, so as to affect device performance and life-span.
Therefore, needing badly a kind of can effectively stop that water oxygen penetrates into the encapsulating structure inside encapsulating structure from side.
The content of the invention
The application aims to provide a kind of encapsulating structure, its preparation method and includes its optoelectronic device, of the prior art to solve
Encapsulating structure can not effectively stop the problem of water oxygen.
To achieve these goals, according to the one side of the application, there is provided a kind of encapsulating structure, the encapsulating structure includes：
Substrate, cover plate, packaging plastic portion and polysilazane based compound portion.Wherein, it is provided with the first substrate surface of aforesaid substrate and sends out
Optical device；First lid surface of above-mentioned cover plate is oppositely arranged with above-mentioned first substrate surface, and above-mentioned first substrate surface with it is upper
State and have between the first lid surface interval；Packaging plastic portion is arranged in above-mentioned interval around above-mentioned luminescent device；Polysilazane system
Compound portion is arranged in above-mentioned interval around above-mentioned packaging plastic portion, aforesaid substrate, above-mentioned cover plate and above-mentioned polysilazane system chemical combination
Thing portion forms confined space.
Further, above-mentioned polysilazane based compound portion is Perhydropolysilazane portion.
Further, there is gap between above-mentioned packaging plastic portion and above-mentioned polysilazane based compound portion, is provided with above-mentioned gap
Drier, the preferably drier are liquid desiccant.
Further, above-mentioned cover plate has groove, and the corresponding above-mentioned groove in above-mentioned gap is arranged.
Further, the one kind or many being provided with above-mentioned confined space in inert fluid, liquid drier and UV binding agents
Kind.
Further, above-mentioned luminescent device is quanta point electroluminescent device or organic electroluminescence device.
According to further aspect of the application, there is provided a kind of preparation method of encapsulating structure, the preparation method includes：In substrate
First substrate surface arrange luminescent device；In the first lid surface of cover plate, polysilazane based compound portion is set；Above-mentioned
One lid surface arranges packaging plastic portion, and above-mentioned packaging plastic portion is surrounded by above-mentioned polysilazane based compound portion；By above-mentioned lid
Plate and aforesaid substrate are pressed in vacuum or inert atmosphere, make above-mentioned first substrate surface relative with above-mentioned first lid surface and
Every setting, and above-mentioned packaging plastic portion is set to surround above-mentioned luminescent device；Solidify above-mentioned packaging plastic portion；And the above-mentioned polysilazane of solidification
Based compound portion, forms above-mentioned encapsulating structure.
Further, before pressing with the substrate after the setting of packaging plastic portion and by the cover plate, the preparation method is also
Be included in above-mentioned packaging plastic portion away from above-mentioned polysilazane based compound portion side arrange inert fluid, liquid drier with
One or more in UV binding agents.
According to further aspect of the application, there is provided a kind of optoelectronic device, the equipment includes encapsulating structure, and the encapsulating structure is
Above-mentioned encapsulating structure.
Further, above-mentioned optoelectronic device is lighting apparatus or display device.
In using the encapsulating structure of the application, polysilazane based compound portion is enclosed in into the outside in packaging plastic portion, polysilazane system
There are a large amount of reactive group Si-H and N-H in the structure in compound portion, can at normal temperatures with water and oxygen reaction, formed fine and close
Property silica, thus water resistance is good, can stop that water oxygen enters the inside of encapsulating structure from the side of encapsulating structure, it is to avoid
The performance of the luminescent device inside encapsulating structure is affected, it is ensured that luminescent device has good performance.
Description of the drawings
The Figure of description for constituting the part of the application is used for providing further understanding of the present application, the schematic reality of the application
Apply example and its illustrate for explaining the application, do not constitute the improper restriction to the application.In the accompanying drawings：
Fig. 1 shows the generalized section of the encapsulating structure that a kind of exemplary embodiment of the application is proposed；
Fig. 2 shows a kind of generalized section of the encapsulating structure that preferred embodiment is provided；
Fig. 3 shows a kind of generalized section of the encapsulating structure cover plate that preferred embodiment is provided；
Fig. 4 shows a kind of top view of the encapsulating structure cover plate that preferred embodiment is provided；
Fig. 5 shows a kind of generalized section of the encapsulating structure that preferred embodiment is provided；
Fig. 6 shows a kind of generalized section of the encapsulating structure that preferred embodiment is provided；
Fig. 7 shows a kind of preparation method schematic flow sheet of the encapsulating structure that embodiment is provided；And
Fig. 8 shows that a kind of embodiment provides the top view of the first lid surface.
Specific embodiment
It is noted that described further below is all exemplary, it is intended to provide further instruction to the application.Unless otherwise finger
Bright, all technologies used herein and scientific terminology have and to be generally understood that with the application person of an ordinary skill in the technical field
Identical meanings.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root according to this Shen
Illustrative embodiments please.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to
Including plural form, additionally, it should be understood that, when in this manual using term "comprising" and/or " including "
When, it indicates existing characteristics, step, operation, device, component and/or combinations thereof.
As background technology is introduced, encapsulating structure of the prior art can not stop that water oxygen enters internal from side, in order to solve
As above technical problem, present applicant proposes a kind of encapsulating structure.
In a kind of typical embodiment of the application, it is proposed that a kind of encapsulating structure, as shown in figure 1, above-mentioned encapsulating structure includes：
Substrate 1, packaging plastic portion 3, polysilazane based compound portion 5 and cover plate 7.Wherein, the first substrate surface 11 of aforesaid substrate 1
On be provided with luminescent device 2；First lid surface 71 of above-mentioned cover plate 7 is oppositely arranged with above-mentioned first substrate surface 11, and on
State and have between first substrate surface 11 and above-mentioned first lid surface 71 interval；Packaging plastic portion 3 surrounds above-mentioned luminescent device 2
In being arranged on above-mentioned interval；Polysilazane based compound portion 5 is arranged in above-mentioned interval around above-mentioned packaging plastic portion 3, above-mentioned base
Plate 1, above-mentioned cover plate 7 form confined space 4 with above-mentioned polysilazane based compound portion 5.
In above-mentioned encapsulating structure, polysilazane based compound portion 5 is enclosed in into the outside in packaging plastic portion 3, polysilazane system chemical combination
There are a large amount of reactive group Si-H and N-H in the structure of thing, can at normal temperatures with water and oxygen reaction, formed compactness two
Silica, thus water resistance is good, can stop that water oxygen enters the inside of encapsulating structure from the side of encapsulating structure, it is to avoid envelope
The performance of the luminescent device 2 inside assembling structure is affected, it is ensured that luminescent device 2 has good performance.
In the manufacturing process of encapsulating structure, UV, high temperature, normal temperature or laser can be adopted to carry out the primary solidification of early stage, subsequently
Only need to for encapsulating structure to be put into temperature between 0 DEG C～150 DEG C, humidity a period of time, poly- silicon nitrogen in 30%～80% environment
Methane series compound portion 5 further solidifies, and the polysilazane based compound in polysilazane based compound portion 5 can progressively be converted into two
Silica, until being fully cured.Either the polysilazane based compound portion 5 of primary solidification or completely crued polysilazane
Based compound portion 5 all has water oxygen barrier functionality, can stop that water oxygen is entered inside it from the side of encapsulating structure, and then avoids
The degradation of the luminescent device 2 inside encapsulating structure.
In a kind of embodiment of the application, above-mentioned polysilazane based compound portion 5 be Perhydropolysilazane portion, Perhydropolysilazane portion
After completion of cure, the silica that density is 2.0 is generated, further can effectively stop that water oxygen enters it from the side of encapsulating structure
It is internal.
In another kind of embodiment of the application, above-mentioned packaging plastic portion 3 is UV glue portion.So UV glue-lines are consolidated by UV solidifications
Can also be to the primary solidification (not flowing) of polysilazane based compound portion 5 during change.
In another kind of embodiment of the application, there is gap, also between above-mentioned packaging plastic portion 3 and polysilazane based compound portion 5
That the two is not directly contacted with setting, as shown in figure 1, as such, it is possible in gap between it is desiccant-filled come it is further
Ensure the sealing and water resistant oxygen performance of sealing structure.
In order to better ensure that the sealing and water resistant oxygen performance of sealing structure, packaging plastic portion 3 and polysilazane based compound portion 5
Between gap in arrange liquid desiccant 9.
In another kind of embodiment of the application, as shown in Fig. 2 above-mentioned packaging plastic portion 3 with polysilazane based compound portion 5 direct
Contact is arranged, very close to each other therebetween.The sealing and water resistant oxygen performance of encapsulating structure can so be better ensured that.
In order to further improve the sealing of encapsulating structure, as shown in Figure 3 and Figure 4, the application preferably above-mentioned cover plate 7 has groove
8, the corresponding above-mentioned groove 8 in above-mentioned gap is arranged, i.e., drier respective slot is arranged, when drier is liquid desiccant 9, shape
Into the encapsulating structure shown in Fig. 5, so, the usage amount increase of drier can adsorb more steam, so as to preferably protect
Hair care optical device 2.
In a kind of preferred embodiment of the application, as shown in figs. 5 and 6, UV binding agents are provided with above-mentioned confined space 4
6.So when polysilazane based compound portion 5 is not fully cured, UV binding agents 6 can stop from envelope with packaging plastic portion 3
The water oxygen that assembling structure side is entered inside encapsulating structure, it is to avoid the performance of luminescent device 2 is affected, and UV binding agents 6
Cover plate 7 can be firmly bonded together with substrate 1, as such, it is possible to be further ensured that the sealing effectiveness of the sealing structure, be entered
One step ensures that device has good performance.
Those skilled in the art can fill different materials according to actual situation in sealing space 4, such as absorbing external
Impact of the object to encapsulating structure, can fill inert fluid or buffer thin film in confined space 4；For absorbing external thing
Impact of the body to encapsulating structure, while in the device entered into inside encapsulating structure in order to avoid water, can be in confined space 4
Liquid drier of the filling with absorbent function.Wherein, inert fluid is the liquid such as PFPE or acrylic resin.
In another kind of preferred embodiment of the application, as shown in figs. 5 and 6, filler is full of whole confined space 4, this
Sample can further avoid inside from space occur, further avoid water oxygen in the space in confined space 4, and then avoid
Water oxygen is entered in the internal illumination device 2 of encapsulating structure.
In a kind of embodiment of the application, above-mentioned luminescent device 2 be electroluminescent device, due to electroluminescent device it is quicker to water oxygen
Sense, once there is water oxygen to enter device inside, its performance will be affected, therefore, when in above-mentioned encapsulating structure have electroluminescent
During optical device, can well ensure that the performance of the electroluminescent device is unaffected.Luminescent device 2 in the application is not limited
In electroluminescent device, those skilled in the art can be arranged different luminescent devices 2 on substrate 1 according to actual conditions,
These luminescent devices 2 are packaged.
In another kind of embodiment of the application, above-mentioned electroluminescent device is quanta point electroluminescent device or organic electroluminescence
Part.
For the luminescent device 2 in preferably protection packaging structure, the preferred aforesaid substrate 1 of the application is glass substrate, polymer matrix
One or more in plate, metal substrate and alloy substrate.Substrate 1 in the application is not limited to aforesaid substrate, this area skill
Art personnel can select suitable substrate 1 according to actual conditions, conventional substrate 1 have polyimide substrate, polyamide substrate with
Polyamideimide-based plate etc..
In another kind of embodiment of the application, above-mentioned cover plate 7 is glass cover-plate, in polymer cover plate, metal cover board and alloy cover plate
One or more.Cover plate 7 in the application is not limited to above-mentioned cover plate, those skilled in the art can according to actual conditions,
Select suitable cover plate 7.
In the another embodiment of the application, there is provided a kind of preparation method of encapsulating structure, as shown in fig. 7, the preparation method
Including：Luminescent device 2 is set on the first substrate surface 11 of substrate 1, the luminescent device 2 can be any structure, and should
Luminescent device 2 can be arranged on by any way on first substrate surface 11, and conventional mode is to adopt adhesive bond；In lid
First lid surface 71 of plate 7 arranges polysilazane based compound portion 5, frequently with mode be coating；In above-mentioned first cover plate
Surface 71 arranges packaging plastic portion 3, can be coated with packaging plastic along the inside edge of polysilazane based compound portion 5 using spot gluing equipment,
And above-mentioned packaging plastic portion 3 is surrounded by above-mentioned polysilazane based compound portion 5.The set-up mode in packaging plastic portion 3 is not limited to
Above-mentioned set-up mode；Above-mentioned cover plate 7 and aforesaid substrate 1 are pressed in vacuum or inert atmosphere, above-mentioned first substrate table is made
Face 11 is relative with above-mentioned first lid surface 71 and interval setting, and makes above-mentioned packaging plastic portion 3 surround above-mentioned luminescent device 2；Gu
Change above-mentioned packaging plastic portion 3；And solidify above-mentioned polysilazane based compound portion 5, form the encapsulating structure shown in Fig. 1 or Fig. 2.
Liquid is additionally provided with as shown in figure 8, working as and having in gap, and gap between packaging plastic portion 3 and polysilazane based compound portion 5
During state drier 9, the encapsulating structure shown in Fig. 1 is formed.
When not having gap between packaging plastic portion 3 and polysilazane based compound portion 5, when the two directly contact is arranged, Fig. 2 is formed
Shown encapsulating structure.
In above-mentioned preparation method, cure package glue portion 3 can be carried out simultaneously with solidification polysilazane based compound portion 5, also may not be used
Carry out simultaneously.When solidifying simultaneously, can be solidified using UV；When solidifying when difference, packaging plastic portion 3 can be solid using UV
Change, polysilazane based compound portion 5 can be using normal temperature or hot setting.
The preparation method is simpler, it is possible to increase prepare the efficiency of the encapsulating structure, and the encapsulating structure formed using the method,
Polysilazane based compound portion 5 is enclosed in into the outside in packaging plastic portion 3, stops that water oxygen enters encapsulation knot from the side of encapsulating structure
The inside of structure, it is to avoid the performance of the luminescent device 2 inside encapsulating structure is affected, it is ensured that luminescent device 2 has good
Performance.
In order to further improve barrier properties of the encapsulating structure to water oxygen, and then the performance of luminescent device 2 is avoided to be affected, this Shen
In a kind of embodiment please, before pressing with the substrate after packaging plastic portion is arranged and by the cover plate, the preparation side
Method also includes, in inner side (away from the side in above-mentioned polysilazane based compound portion 5) the setting inert liquid in above-mentioned packaging plastic portion 3
One or more in body, liquid drier and UV binding agents, forms the encapsulating structure shown in Fig. 5 or Fig. 6.
In a kind of embodiment of the application, above-mentioned polysilazane based compound portion 5 is Perhydropolysilazane portion.
In the application another embodiment, there is provided a kind of optoelectronic device, the equipment includes encapsulating structure, and the encapsulating structure is upper
The encapsulating structure stated.
The optoelectronic device can be lighting apparatus, or display device, and both equipment, art technology were not limited at that time
Personnel can apply above-mentioned encapsulating structure in suitable equipment according to actual conditions.
Above-mentioned encapsulating structure is included in above-mentioned equipment, can preferably avoid the luminescent device 2 in equipment from not receiving water oxygen shadow
Ring, and then ensure its performance, and then ensure that the performance of equipment is unaffected.
As can be seen from the above description, the application the above embodiments realize following technique effect：
1), in the encapsulating structure of the application, Perhydropolysilazane portion is enclosed in into the outside in packaging plastic portion, polysilazane system chemical combination
There are a large amount of reactive group Si-H and N-H in the structure of thing, can at normal temperatures with water and oxygen reaction, formed compactness two
Silica, thus water resistance is good, can stop that water oxygen enters the inside of encapsulating structure from the side of encapsulating structure, it is to avoid envelope
The performance of the luminescent device inside assembling structure is affected, it is ensured that luminescent device has good performance.
2), the preparation method of the application is simpler, it is possible to increase prepare the efficiency of the encapsulating structure, and using the method formation
Encapsulating structure, by polysilazane based compound portion the outside in packaging plastic portion is enclosed in, and stops that water oxygen is entered from the side of encapsulating structure
The inside of encapsulating structure, it is to avoid the performance of the luminescent device inside encapsulating structure is affected, it is ensured that luminescent device has good
Good performance.
3), above-mentioned encapsulating structure is included in the optoelectronic device of the application, can preferably avoids the luminescent device 2 in equipment
Do not affected by water oxygen, and then ensured its performance, and then ensure that the performance of equipment is unaffected.
The preferred embodiment of the application is the foregoing is only, the application is not limited to, for those skilled in the art
For, the application can have various modifications and variations.All any modifications within spirit herein and principle, made, etc.
With replacement, improvement etc., should be included within the protection domain of the application.
Claims (10)
1. a kind of encapsulating structure, it is characterised in that the encapsulating structure includes：
Substrate (1), on the first substrate surface (11) of the substrate (1) luminescent device (2) is provided with；
Cover plate (7), first lid surface (71) of the cover plate (7) is relative with the first substrate surface (11) to be set
Put, and there is interval between the first substrate surface (11) and first lid surface (71)；
Packaging plastic portion (3), is arranged in the interval around the luminescent device (2)；And
Polysilazane based compound portion (5), is arranged in the interval around the packaging plastic portion (3), the substrate (1),
The cover plate (7) forms confined space (4) with the polysilazane based compound portion (5).
2. encapsulating structure according to claim 1, it is characterised in that the polysilazane based compound portion (5) is poly- for perhydro
Silazane portion.
3. encapsulating structure according to claim 1 and 2, it is characterised in that the packaging plastic portion (3) and the polysilazane
There is gap between based compound portion (5), in the gap drier is provided with, preferably the drier is liquid drying
Agent (9).
4. encapsulating structure according to claim 3, it is characterised in that the cover plate (7) is with groove (8), the gap
The correspondence groove (8) is arranged.
5. encapsulating structure according to claim 1, it is characterised in that be provided with the confined space (4) inert fluid,
One or more in liquid drier and UV binding agents.
6. encapsulating structure according to claim 1, it is characterised in that the luminescent device (2) is quanta point electroluminescent device
Part or organic electroluminescence device.
7. a kind of preparation method of encapsulating structure, it is characterised in that the preparation method includes：
On the first substrate surface of substrate, luminescent device is set；
In the first lid surface of cover plate, polysilazane based compound portion is set；
Packaging plastic portion is set in first lid surface, and makes the packaging plastic portion by the polysilazane based compound
Portion surrounds；
The cover plate is pressed with the substrate in vacuum or inert atmosphere, the first substrate surface and described first is made
Lid surface is relative and interval setting, and makes the packaging plastic portion surround the luminescent device；
Solidify the packaging plastic portion；And
Solidify the polysilazane based compound portion, form the encapsulating structure.
8. preparation method according to claim 7, it is characterised in that after packaging plastic portion is arranged and by the cover plate and institute
Before stating substrate pressing, the preparation method also includes：
In the side away from the polysilazane based compound portion in the packaging plastic portion, inert fluid, liquid drier are set
With one or more in UV binding agents.
9. a kind of optoelectronic device, including encapsulating structure, it is characterised in that the encapsulating structure is any one of claim 1 to 6
Described encapsulating structure.
10. optoelectronic device according to claim 9, it is characterised in that the optoelectronic device is lighting apparatus or display device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649165.6A CN106571345A (en) | 2015-10-09 | 2015-10-09 | Packaging structure, method for manufacturing same, and optoelectronic device comprising same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510649165.6A CN106571345A (en) | 2015-10-09 | 2015-10-09 | Packaging structure, method for manufacturing same, and optoelectronic device comprising same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106571345A true CN106571345A (en) | 2017-04-19 |
Family
ID=58507685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510649165.6A Pending CN106571345A (en) | 2015-10-09 | 2015-10-09 | Packaging structure, method for manufacturing same, and optoelectronic device comprising same |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611282A (en) * | 2017-09-27 | 2018-01-19 | 京东方科技集团股份有限公司 | Encapsulating structure and display device |
| CN107623084A (en) * | 2017-10-13 | 2018-01-23 | 京东方科技集团股份有限公司 | Encapsulation cover plate and preparation method thereof |
| CN108735914A (en) * | 2018-05-30 | 2018-11-02 | 深圳市华星光电半导体显示技术有限公司 | OLED display encapsulating structure |
| CN112310175A (en) * | 2020-09-30 | 2021-02-02 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
| CN112420892A (en) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | Ultraviolet LED lamp bead bonded by silazane and preparation method thereof |
| CN112490384A (en) * | 2019-09-11 | 2021-03-12 | 星宸光电股份有限公司 | Packaging structure |
| CN113782522A (en) * | 2020-06-09 | 2021-12-10 | 佛山市国星光电股份有限公司 | Display module and manufacturing method thereof |
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2015
- 2015-10-09 CN CN201510649165.6A patent/CN106571345A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107611282A (en) * | 2017-09-27 | 2018-01-19 | 京东方科技集团股份有限公司 | Encapsulating structure and display device |
| US10490775B2 (en) | 2017-09-27 | 2019-11-26 | Boe Technology Group Co., Ltd. | Package structure of display panel and display device |
| CN107623084A (en) * | 2017-10-13 | 2018-01-23 | 京东方科技集团股份有限公司 | Encapsulation cover plate and preparation method thereof |
| US11228017B2 (en) | 2017-10-13 | 2022-01-18 | Boe Technology Group Co., Ltd. | Packaging cover plate, method for manufacturing the same and light emitting diode display |
| CN108735914A (en) * | 2018-05-30 | 2018-11-02 | 深圳市华星光电半导体显示技术有限公司 | OLED display encapsulating structure |
| CN112490384A (en) * | 2019-09-11 | 2021-03-12 | 星宸光电股份有限公司 | Packaging structure |
| CN113782522A (en) * | 2020-06-09 | 2021-12-10 | 佛山市国星光电股份有限公司 | Display module and manufacturing method thereof |
| CN112310175A (en) * | 2020-09-30 | 2021-02-02 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
| CN112310175B (en) * | 2020-09-30 | 2022-10-25 | 上海怡美装饰工程设计有限公司 | Outdoor advertisement display structure based on flexible OLED technology |
| CN112420892A (en) * | 2020-10-28 | 2021-02-26 | 吉安市木林森半导体材料有限公司 | Ultraviolet LED lamp bead bonded by silazane and preparation method thereof |
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