CN107204405A - A kind of organic electroluminescence display panel and its method for packing - Google Patents
A kind of organic electroluminescence display panel and its method for packing Download PDFInfo
- Publication number
- CN107204405A CN107204405A CN201610158178.8A CN201610158178A CN107204405A CN 107204405 A CN107204405 A CN 107204405A CN 201610158178 A CN201610158178 A CN 201610158178A CN 107204405 A CN107204405 A CN 107204405A
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- China
- Prior art keywords
- cover board
- metal cover
- glue
- solidification glue
- line
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of organic electroluminescence display panel and its method for packing, by the cover plate for setting metal material, and then the mechanical strength that reinforcing glass substrate and metal cover board are pressed in glass cream packaging technology, the probability of follow-up glass substrate fragmentation failure can be effectively reduced, to improve the mechanical strength and the resistance to performance such as fall of product.Eventually with the display terminal device also because combination has a cover plate and glass substrate of metal material and with higher mechanical strength and preferably resistance to falls performance.
Description
Technical field
The present invention relates to display field, more precisely, be a kind of organic electroluminescence display panel and
Its method for packing.
Background technology
It is packaged in traditional AMOLED packaged types to AMOLED display device
The step of in, it usually needs after the outer ring coating outer ring UV glue of cover plate, then by a glass
Glass cover plate and a glass back plate are bonded, and will be single using solidification glue (glass cement)
Display unit device is packaged, but in view of cover plate and backboard are generally all to use glass base
Plate, causes glass material either handling process or to be easy to fragmentation in encapsulated phase, and most
The AMOLED display device applied on whole finished parts terminal is because also held based on glass material
Easy fragmentation.
In view of the combination material of display panel is generally by by glass cover-plate and glass base at present
Plate is combined, and there is a series of problems：Due to the tough strength relative deficiency of glass material, meeting
Subsequently such as pressed and cutting technique in cause such as product to split screen defect, it is serious
The damage of display module can be caused, and then substantially reduces product yield, the production of product is increased
Cost.Precisely in order to the problem is prevented effectively from, will be detailed in each embodiment of the present invention hereafter
It is thin to introduce, substitute glass cover-plate and the scheme of the easy fragmentation of glass substrate in traditional scheme.
The content of the invention
For above-mentioned technical problem, the embodiments of the invention provide a kind of organic light emitting display face
The method for packing of plate, the organic electroluminescence display panel, with viewing area and around the display
The encapsulation region that area is set, methods described includes：One substrate is provided, and formed on the substrate
At least one display unit；A metal cover board is provided, the metal cover board includes and the display
The display unit seal area that unit is correspondingly arranged；The display unit on the metal cover board
Solidification glue is formed in seal area；The metal cover board is conformed on the substrate；And solidification
The solidification glue.
The embodiment of the present invention additionally provides a kind of organic electroluminescence display panel, with viewing area and encloses
The encapsulation region set around the viewing area, the organic electroluminescence display panel includes：Substrate；Gold
Belong to cover plate, be oppositely arranged with the substrate；Wherein, the substrate is close to the metal cover board
At least one display unit is provided with surface；The metal cover board is close to the surface of the substrate
On be provided with display unit seal area corresponding with the display unit；And solidification glue, set
The region corresponding with the display unit seal area between the substrate and the metal cover board
It is interior.
Organic electroluminescence display panel and its method for packing provided in an embodiment of the present invention, by setting
The cover plate of metal material, and then reinforcing glass substrate and metal cover board in glass cream packaging technology
The mechanical strength of pressing, can effectively reduce the probability of follow-up glass substrate fragmentation failure, to improve
The mechanical strength of product and the resistance to performance such as fall.Eventually with the display terminal device also because
Combination have the cover plate and glass substrate of metal material and with higher mechanical strength and preferably
It is resistance to fall performance.
Brief description of the drawings
Read it is described further below and with reference to the following drawings after, feature and advantage of the invention will
Obviously：
Fig. 1 is the basic framework after glass substrate and metal cover board combination；
Fig. 2 is diagrammatic cross-section after glass substrate and metal cover board combination.
Embodiment
Below in conjunction with each embodiment, technical scheme is carried out to understand complete explain
State, but described embodiment is only of the invention with the embodiment being described herein used in explanation rather than complete
The embodiment in portion, based on the embodiment such as this, those skilled in the art is not making creativeness
The scheme obtained on the premise of work belongs to protection scope of the present invention.
Referring to Fig. 1 and Fig. 2, one is used to encapsulate active matrix organic light emitting diode
(Active-matrix organic light emitting diode, abbreviation AMOLED) device
The top view of cover plate (Cover glass) 201, the cover plate 201 being related in the present invention is not
Glass substrate used in routine techniques is same as, but uses metal material, such as stainless steel
Matter, aluminum alloy material, copper material, indium material, indium alloy, titanium alloy etc. have anti-corrosive properties and
Ductility preferably at least one of material.Although not showing substrate (OLED in Fig. 1
LTPS) 205 it should be appreciated that a substrate corresponding with cover plate 201 is (such as
LTPS substrates etc.) 205 it will be bonded or be fitted or be covered with cover plate 201, substrate
205 base materials used are typically glass substrate etc., so that finally we can be realized cover plate
201st, substrate 205 the rwo be bonded and give mechanical combination/link together.Purpose is to make
Organic light emitting diode device (OLED) device it is anticipated that be arranged on cover plate 201,
Give among crack between substrate 205 it is hermetically sealed, this hereafter will also may proceed in detail
Introduce.
Wait to paste with display unit 205A, it is necessary to provide one in advance referring to Fig. 1 and Fig. 2
The substrate 205 of conjunction, the wherein substrate 205 have a upper face 2051 and relative on this
The lower surface 2052 on portion surface 2051, and in the upper face 2051 positioned at substrate 205
Upper setting or definition have display device area (not identified in figure), in addition, also aobvious at this
Show device region substrate 205 upper face 2051 on prepare or be provided with several above
The display unit 205A referred to, the display unit 205A sayed here is, for example, OLED devices
Part.
The metal cover board 201 fitted based on substrate 205 described above and with the substrate 205,
The metal cover board 201 has top surface 2011 and the bottom relative to the top surface 2011
Display device area on surface 2012, and the cover plate 201 on counterpart substrate 205 is provided with aobvious
Show seal area, shape is carried out for being sealed in above-mentioned display device area after attaching process
Into closed atmosphere.In order to realize sealing, for above-mentioned several display units 205A
For, in the display seal area corresponding with display device area, at the bottom of metal cover board 201
It is provided with portion surface 2012 and several one-to-one display units of display unit 205A
Seal area, can will be each in the completed after continuous attaching process and solidification glue sealing technology
Display unit 205A is individually sealed.
Those skilled in the art both knows about, used in conventional AMOLED devices evaporation
Material is extreme sensitivity for external environmental factors such as water, oxygen, and they need to be after evaporation immediately
And perform the fabulous encapsulation flow of sealing, so as to ensure the external environmental factors such as water, oxygen not
As for each sensitive material part of attack device.It can be seen from Fig. 1~2, performing, industry is normal
, it is necessary to the lower surface 2012 of the leading cover plate 201 in the big version of monoblock before the bonding program of rule
Periphery edge at set or coating first solidify glue-line 202, it can be ultraviolet curing glue
(Ultraviolet Rays are also called UV glue for short), in addition, in addition it is also necessary to above-mentioned
Coating curing glue in some display unit seal areas pre-defined on metal cover board 201
(Ultraviolet Rays are also called UV glue for short) 204, to cause each display unit
In solidification glue 204 be respectively formed a closed figures (such as annular, square and circular closed
Shape), it should be noted that it is illustrated in the accompanying drawing of the present embodiment with annular, but its
It should not be construed as the limitation to present embodiment technical scheme.Solidification glue 204 is used for follow-up patch
Close and individually seal up each display unit 205A in technique.
Also solidify glue-line 202 in the edge coating first of above-mentioned display device seal area simultaneously
(such as UV glue), i.e., (exist in the outermost of the lower surface 2012 of metal cover board 201
It is provided with the position outside several OLED display unit areas) use with closed figures
Ultraviolet curing UV glue is as inside casing fluid sealant, to be mainly used in metal cover board 201 and base
Support between plate 205.And be located in the lower surface 2011 of above-mentioned metal cover board 201
The outside coating second of first solidification glue-line 202 solidifies glue-line 203, such as uses thermic swelling agent
Or photoexpansion agent or UV glue etc., so this second solidification glue-line 203 material with it is above-mentioned
The material of first solidification glue-line 202 both can be the same or different), the second solidification glue-line
203 also have closed figures (such as annular, square and circular close-shaped；It should be noted
It is to be illustrated in the accompanying drawing of the present embodiment with annular, but it should not be construed as to this reality
Apply the limitation of mode technical scheme.Wherein, above-mentioned the first solidification glue 202 and the second solidification glue
203 can also can be sequentially prepared according to sequencing simultaneously, and specific sequencing can be according to actual work
Skill demand and set.Second solidification glue-line 203 is by the first above-mentioned solidification glue-line 202 and by this
The first display device unit seal area that is surrounded of solidification glue-line 202 is surrounded, using as
Housing fluid sealant is sealed the area of space in it.The first above-mentioned solidification glue as can be seen here
The first purpose of the solidification glue-line 203 of layer 202 and second can temporarily fix cover plate 201 and base
Plate 205 can also maintain cover plate 201 and substrate 205 between the two to prevent them to be excessively close to
The atmosphere of crack inner sealing, here ultraviolet curing UV glue etc. can be sealed as inside casing
Glue is playing physical support substrate 205 and metal cover board 201, can also realize substrate 205
Gap space region between metal cover board 201 is sealed.
Referring specifically to shown in Fig. 1~2, in order that metal cover board 201 fitted with substrate 205 after position
Display unit 205A between metal cover board 201 and substrate 205 is in preferably closed loop
, it is necessary to first be applied at the periphery edge position of the lower surface 2011 of metal cover board 201 in border
The first solidification glue-line 202 in closed hoop is covered, this point is critically important, can cutting in Fig. 2
It is readily observed in the figure of face, because a circle ultraviolet curing UV glue of closed hoop is in metal
The centre position surrounded on cover plate 201 is exactly to be used to dispose to accommodate each LED device
(corresponding to the above-mentioned viewing area for being provided with several OLED display units), so one
The central interior region that circle first solidifies glue-line 202 will realize isolation to water, oxygen.This first
Solidify glue-line 202 should close proximity near the periphery edge of cover plate 201 so as to it is reserved compared with
Big intermediate space avoids impacting AMOLED devices.According to AMOLED's
Conventional encapsulation flow, coating forms the gluing material of solidification glue 204 etc on metal cover board 201
After material, in addition it is also necessary to by substrate 205 and bonding work of the metal cover board 201 using solidification glue 204
With being bonded or covering together, if observed along the vertical cross-sectional view in Fig. 2, Ye Jiru
Shown in Fig. 2, substrate 205 and metal cover board 201 have been fitted in together, a circle of closure
The central interior region of first solidification glue-line 202 is also by substrate 205, metal cover board 201 in fact
Between the prepsetting gap that is confined to or say it is hollow chamber, have for accommodating each active matrix
Machine light-emittingdiode.Solidification glue 204 can subsequently be fitted, solidify and realize substrate 205 and gold
Belong to the docking of cover plate 201, before two editions are binded, the first solidification is used in whole big version outermost
The solidification glue-line 203 of glue-line 202 and second does housing fluid sealant and temporarily fixes the He of substrate 205
Cover plate 201 and the atmosphere for keeping substrate and cover plate inner sealing.
On the basis of based on above-mentioned embodiment, it can be seen from Fig. 1~2, the application is also disclosed
A kind of AMOLED structures or display device, the main metal cover for including being provided with OLED
Plate 201 and substrate 205, and the metal cover board 201 with above-mentioned substrate 205 for fitting.
Further, above-mentioned substrate 205 has upper face and the bottom table relative to upper face
There is the display device for being provided with several display units on face, and the upper face of substrate 205
Area, metal cover board 201 then has lower surface and the top surface relative to lower surface, gold
Belong to the display device area in the lower surface of cover plate 201 then on counterpart substrate 205 and be provided with display
It is provided with seal area, and the display seal area of metal cover board 201 and above-mentioned some display units
One-to-one some display unit seal areas.AMOLED display device in the present embodiment
It may include solidification glue 204, and the solidification glue 204 is arranged at the display unit of metal cover board 201
In seal area, each display unit is given independence by it together with cover plate 201 and substrate 205
Seal.
Further, the AMOLED display device in the present embodiment also includes the first solidification glue
The solidification glue-line 203 of layer 202 and/or second, and the edge of metal cover board 201 and substrate 205 is equal
Solidify glue-line sealing 203 by the first solidification glue-line 202 and/or second to seal.Above-mentioned
One solidification glue-line 202 surrounds several above-mentioned display units, and the second solidification glue-line 203 is wrapped
The first solidification glue 202 is enclosed, and by the first above-mentioned solidification after the second solidification glue-line 203 solidifies
Glue 202 and solidification glue 204 and some display units are sealed.
Current product mix material is that glass adds glass material, and technical key point is
Glass material cover-plate glass is replaced as with stronger corrosion resistance and all of tough characteristic of extending
Such as metal material, while product resistant to breakage characteristic is lifted, also obtains product mechanical strength
Resistance to characteristic is fallen to increase, and then reach.In corresponding method for packing step, substrate glass is used
Glass, is being coated on product size housing surrounding in metal substrate by UV glue, row metal is entered afterwards
Cover plate is with base plate glass process for pressing, after process for pressing, then carries out UV solidifications, and then completes
Packaging operation, after subsequently being cut again to metal cover board and glass substrate, that is, completes product chi
It is very little.Because metal cover board toughness is strong more than glass cover-plate, therefore metal cover board and glass substrate are combined
Afterwards, the mechanical strength of product is far longer than the combination of glass substrate and glass after cutting.This
Invent the equipment used and the compatible current mainstream scheme of material：Glass substrate and metal cover board,
UV types adhesion glue and glue spreader, pressing machine.Metal cover board applies UV types with glue spreader and sticked together
Material, glue material is applied to progress pressing laminating after product size four weeks, and cutting operation is carried out after laminating and is
Complete product.
More than, by explanation and accompanying drawing, give the typical case of the specific structure of embodiment
Embodiment, foregoing invention proposes existing preferred embodiment, but these contents are not intended as office
Limit.For a person skilled in the art, read after described above, various changes and modifications
Undoubtedly it will be evident that.Therefore, appended claims, which should be regarded as, covers the true of the present invention
Whole variations and modifications of sincere figure and scope.It is any and all etc. in Claims scope
The scope and content of valency, are all considered as still belonging to the intent and scope of the invention.
Claims (15)
1. a kind of method for packing of organic electroluminescence display panel, it is characterised in that methods described
Including：
One substrate is provided, and forms at least one display unit on the substrate；
A metal cover board is provided, the metal cover board includes what is be correspondingly arranged with the display unit
Display unit seal area；
Solidification glue is formed in the display unit seal area on the metal cover board；
The metal cover board is conformed on the substrate；And
Solidify the solidification glue.
2. according to the method described in claim 1, it is characterised in that also include：
Formed in the display unit seal area on the metal cover board after solidification glue, in institute
The fringe region on metal cover board is stated to coat to be formed after the first solidification glue-line of close ring shape,
The first solidification glue-line outer application forms close ring shape on the metal cover board again
Second solidification glue-line.
3. according to the method described in claim 1, it is characterised in that also include：
Formed in the display unit seal area on the metal cover board after solidification glue, in institute
State the fringe region on metal cover board coat to be formed close ring shape first solidification glue-line it is same
When, the first solidification glue-line outer application formation close ring shape on the metal cover board
Second solidification glue-line.
4. according to the method in claim 2 or 3, it is characterised in that described first consolidates
Change glue-line is ultraviolet curing glue.
5. according to the method in claim 2 or 3, it is characterised in that described second consolidates
Change glue-line is ultraviolet curing glue.
6. according to the method described in claim 1, it is characterised in that the metal cover board
Material is at least one of stainless steel, indium, indium alloy, titanium alloy.
7. according to the method in claim 2 or 3, it is characterised in that also include：
Solidify after the first solidification glue-line and the second solidification glue-line, the solidification glue is consolidated
Change, so that each display unit is independent sealed.
8. according to the method in claim 2 or 3, it is characterised in that complete described
After the solidification of first solidification glue-line and the second solidification glue-line, in addition to：
Cut the organic electroluminescence display panel.
9. a kind of organic electroluminescence display panel, it is characterised in that including：
Substrate；
Metal cover board, is oppositely arranged with the substrate；Wherein, the substrate is close to the metal
At least one display unit is provided with the surface of cover plate；The metal cover board is close to the substrate
Surface on be provided with display unit seal area corresponding with the display unit；And
Solidification glue, is arranged on close with the display unit between the substrate and the metal cover board
Seal in the corresponding region in area.
10. organic electroluminescence display panel according to claim 9, it is characterised in that also
Including：First solidification glue, is arranged between the metal cover board and the substrate, to seal
State the fringe region of metal cover board and the substrate.
11. organic electroluminescence display panel according to claim 10, it is characterised in that
Also include：Second solidification glue, is arranged between the metal cover board and the substrate and positioned at institute
State on the outside of the first solidification glue-line, with together with first solidification glue by the metal cover board and institute
Backboard is stated to be sealed.
12. organic electroluminescence display panel according to claim 10, it is characterised in that
The first solidification glue-line is ultraviolet curing glue.
13. organic electroluminescence display panel according to claim 11, it is characterised in that
The second solidification glue-line is ultraviolet curing glue.
14. organic electroluminescence display panel according to claim 11, it is characterised in that
The first solidification glue-line surrounds the display unit, and the second solidification glue-line surrounds described the
One solidification glue.
15. organic electroluminescence display panel according to claim 9, it is characterised in that institute
It is at least one of stainless steel, indium, indium alloy, titanium alloy to state the material of metal cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610158178.8A CN107204405A (en) | 2016-03-18 | 2016-03-18 | A kind of organic electroluminescence display panel and its method for packing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610158178.8A CN107204405A (en) | 2016-03-18 | 2016-03-18 | A kind of organic electroluminescence display panel and its method for packing |
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| Publication Number | Publication Date |
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| CN107204405A true CN107204405A (en) | 2017-09-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201610158178.8A Pending CN107204405A (en) | 2016-03-18 | 2016-03-18 | A kind of organic electroluminescence display panel and its method for packing |
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Cited By (3)
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| CN108382059A (en) * | 2018-02-26 | 2018-08-10 | 京东方科技集团股份有限公司 | A kind of glass cement printing equipment |
| CN110165077A (en) * | 2019-05-28 | 2019-08-23 | 深圳市华星光电半导体显示技术有限公司 | Organic LED display panel and its packaging method |
| CN111477656A (en) * | 2020-03-16 | 2020-07-31 | 福建华佳彩有限公司 | Processing method of adhesive layer of AMO L ED panel |
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