WO2015180393A1

WO2015180393A1 - Organic light-emitting display device

Info

Publication number: WO2015180393A1
Application number: PCT/CN2014/089423
Authority: WO
Inventors: 洪瑞
Original assignee: 京东方科技集团股份有限公司
Priority date: 2014-05-28
Filing date: 2014-10-24
Publication date: 2015-12-03
Also published as: CN203850302U

Abstract

Disclosed is an organic light-emitting display device. The organic light-emitting display device comprises a first substrate (10); a second substrate (20); a packaging layer (60) disposed between the first substrate (10) and the second substrate (20), the packaging layer (60) being connected to the first substrate (10) and the second substrate (20) in a sealing mode; and a first reinforcing packaging structure (40) disposed between the first substrate (10) and the second substrate (20), the first reinforcing packaging structure (40) being located on the inner side of the packaging layer (60). By means of embodiments of the disclosure, the connection strength of the first substrate (10) and the second substrate (20) is increased, and the packaging effect of the organic light-emitting display device is improved.

Description

Organic light emitting display device

Technical field

The present invention relates to an organic light emitting display device.

Background technique

The organic light-emitting display device (OLED) has become a mainstream product in the small and medium-sized display market, and has a series of advantages that the conventional LCD does not have, such as light and thin, colorful, and can realize flexible display and transparent display. Since OLED devices are sensitive to water and oxygen attack, it is always the OLED practitioner's pursuit to select a suitable packaging technology to achieve high performance sealing.

Because of its simple principle, the frit sealing technology can obtain a good life without the need to provide a desiccant. The OLED light-emitting device capable of corresponding to the top emission structure has become the mainstream technology of the OLED package.

However, since the thickness of the frit applied during packaging is relatively thin and the bonding strength is weak in the side direction, it is likely to cause failure of the sealing if it is not reinforced.

Summary of the invention

The present disclosure provides an organic light emitting display device for improving the packaging effect of the organic light emitting display device and improving the package strength of the organic light emitting display device.

The present disclosure provides an organic light emitting display device including a first substrate, a second substrate, an encapsulation layer disposed between the first substrate and the second substrate, and the encapsulation layer sealingly connecting the a first substrate and a second substrate; and a first reinforcing package structure disposed between the first substrate and the second substrate, the first reinforcing package structure being located inside the package layer.

In the above technical solution, the first reinforcing structure and the encapsulating force are provided together with the encapsulating layer, thereby improving the connection strength between the first substrate and the second substrate, thereby improving the encapsulation effect of the organic light emitting display device.

In one example, the first reinforcing encapsulation structure is a continuous annular body, or a plurality of columnar bodies that are spaced apart and annularly distributed.

In one example, the first reinforcing package structure is spaced from the encapsulation layer by a distance of 0.1 to 0.3 mm. This ensures the separation distance between the first reinforcing package structure and the encapsulation layer.

In one example, the first reinforcing package structure has a width of 0.2 to 0.4 mm, and the first complement The height of the strong package structure is 5-10 μm. This guarantees good support.

In one example, the first reinforcing encapsulation structure is formed from any one of a curable liquid organic material selected from the group consisting of urethane acrylate, epoxy, epoxy acrylate, polyester acrylate, or cyanoacrylate. The material of the first reinforcing package structure is different from the material of the package layer.

In one example, the organic light emitting display device further includes a second reinforcing package structure disposed outside the encapsulation layer and sealingly connecting the first substrate and the second substrate. This further enhances the packaging effect of the organic light emitting display device.

In one example, the second reinforcing package structure is annular. This improves the sealing property at the time of packaging, and prevents foreign matter from entering the organic light-emitting display device.

In one example, the second reinforcing package structure has a width of 0.2 to 1.0 mm. This guarantees a certain strength.

In one example, the second reinforcing encapsulation structure is formed from any one of a curable liquid organic material selected from the group consisting of urethane acrylate, epoxy, epoxy acrylate, polyester acrylate, or cyanoacrylate.

In one example, the encapsulation layer is formed from a frit.

DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without any creative work.

1 is a schematic cross-sectional view of an organic light emitting display device according to Embodiment 1 of the present disclosure;

2 is a schematic plan view of a first reinforcing package structure according to an embodiment of the present disclosure;

3 is a schematic structural diagram of another first reinforcing package structure according to an embodiment of the present disclosure;

4 is a schematic cross-sectional view of an organic light emitting display device according to Embodiment 2 of the present disclosure;

FIG. 5 is a schematic structural diagram of a second reinforcing package structure according to an embodiment of the present disclosure.

detailed description

The technical solutions in the embodiments of the present disclosure are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. Based on the embodiments in the present disclosure, those of ordinary skill in the art are not making All other embodiments obtained under the premise of sexual work are within the scope of the present disclosure.

Unless otherwise defined, technical terms or scientific terms used herein shall be taken to mean the ordinary meaning of the ordinary skill in the art to which the invention pertains. The words "first", "second" and similar terms used in the specification and claims of the present disclosure do not denote any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the words "a" or "an" and the like do not denote a quantity limitation, but mean that there is at least one. The words "connected" or "connected" and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Upper", "lower", "left", "right", etc. are only used to indicate the relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship is also changed accordingly.

In order to improve the packaging effect of the organic light emitting display device and improve the package strength of the organic light emitting display device, an embodiment of the present disclosure provides an organic light emitting display device. In the technical solution of the present disclosure, by adding a first reinforcing package structure on the inner side of the package layer, the strength of the connection between the first substrate and the second substrate is improved, thereby improving the packaging effect of the organic light emitting display device. In order to make the objects, the technical solutions and the advantages of the present disclosure more apparent, the present disclosure will be further described in detail by way of non-limiting examples.

1 is a schematic cross-sectional view of an organic light emitting display device according to a first embodiment of the present disclosure. As shown in FIG. 1, the organic light emitting display device includes a first substrate 10 and a second substrate 20. The first substrate 10 and the second substrate 20 are hermetically connected by an encapsulation layer 60. The organic light emitting display device further includes a first reinforcing package structure 40 disposed between the first substrate 10 and the second substrate 20, and the first reinforcing package structure 40 is located inside the package layer 60.

The organic light emitting display device in the above embodiment further includes an organic electroluminescent layer 30 disposed between the first substrate 10 and the second substrate 20, and the first reinforcing package structure 40 is disposed on the organic electroluminescent layer 30 and the package. Between layers 60. The additional first reinforcing package structure 40 provides the supporting force and the bonding force together with the encapsulating layer 60, thereby improving the connection strength between the first substrate 10 and the second substrate 20, thereby improving the packaging effect of the high organic light emitting display device.

The encapsulation layer 60 may be a frit material, and the first substrate 10 and the second substrate 20 are encapsulated by a frit. The first reinforcing package structure 40 is disposed between the frit sealing region and the organic electroluminescent layer 30. The first reinforcement package structure 40 is formed from a curable liquid organic material. The first reinforcing package structure 40 and the frit sealing area are maintained at a distance to ensure that the material of the first reinforcing package structure 40 does not overflow over the frit sealing material during subsequent pressing. For example, the distance between the first reinforcing package structure 40 and the encapsulation layer 60 is 0.1-0.3 mm, such as 0.1 mm, 0.2 mm, 0.3 mm, and the like. A value between 0.1 and 0.3 mm.

In addition, the width of the first reinforcing package structure 40 is 0.2-0.4 mm, and the height of the first reinforcing package structure 40 is 5-10 μm, thereby ensuring that the first reinforcing package structure 40 can provide sufficient adhesion and support. force.

The first reinforcing package structure 40 may be formed by screen printing or a dispenser. The curable liquid organic material forming the first reinforcing encapsulation structure 40 is, for example, any one of urethane acrylate resin, epoxy resin, epoxy acrylate, polyester acrylate or cyanoacrylate. Moreover, the viscosity of the curable liquid material forming the first reinforcing package structure 40 ranges from 20 to 100 Kcps, which ensures that the first reinforcing package structure 40 can firmly bond the first substrate 10 and the second substrate 20 together.

As shown in FIG. 2, the first reinforcing package structure 40 is formed by dispensing. At this time, the first reinforcing package structure 40 is a plurality of spaced-apart columnar bodies distributed in a ring shape, and the plurality of columnar bodies are uniformly distributed outside the organic electroluminescent layer. By adopting such a structure, the packaging effect of the organic light-emitting display device can be increased, and at the same time, the raw materials for fabricating the first reinforcing package structure can be minimized.

As shown in FIG. 3, the first reinforcing package structure 40 is formed by screen printing. At this time, the first reinforcing package structure 40 is a continuous ring shape. At this time, the first reinforcing package structure 40 further has a sealing function, and together with the encapsulation layer 60 blocks external impurities from entering the inside of the organic light emitting display device. The quality of the organic light emitting display device is improved.

The first reinforcing package structure 40 can also be provided with a film adhesive layer formation using, for example, laser transfer or lamination. The film adhesive layer and the frit sealing area are kept at a certain distance, and the thickness of the film adhesive layer is equal to or slightly higher than the thickness of the frit sealing material. The film adhesive layer has high adhesion and has a certain compressibility, and the film adhesive layer can be compressed to the same height as the glass frit sealing material at the time of pressing.

It should be understood that any of the above first reinforcing packaging structures 40 can improve the effect of the organic light emitting display device during packaging, and the manufacturer can select different first reinforcing packaging structures according to actual conditions.

As shown in FIG. 4 , in order to further improve the packaging effect of the organic light emitting display device, the organic light emitting display device according to the second embodiment of the present disclosure includes: a first substrate 10 and a second substrate 20 . The first substrate 10 and the second substrate 20 are hermetically connected by an encapsulation layer 60. The organic light emitting display device further includes a first reinforcing package structure 40 disposed on the inner side of the encapsulation layer 60 and disposed between the first substrate 10 and the second substrate 20; and is disposed outside the encapsulation layer 60 and sealingly connected to the first substrate 10 and Second substrate 20 The second reinforcing package structure 50.

In the above embodiment, the encapsulation effect of the organic light emitting display device is further increased by the added second reinforcing package structure 50. At this time, the package structure of the organic light emitting display device includes: a second reinforcing package structure 50 disposed at the outermost layer, an encapsulation layer 60 located inside the second reinforcement package structure 50, and a first portion located inside the encapsulation layer 60 The package structure 40 is reinforced. The first substrate 10 and the second substrate 20 are packaged together by the second reinforcing package structure 50, the encapsulation layer 60, and the first reinforcement package structure 40.

Referring to Figure 5, a second reinforcing package structure 50 is disposed on the outside of the frit encapsulation layer 60, having a width from the edge of the substrate to the outer edge of the frit sealing material, typically having a width of 0.2-1.0 mm.

The second reinforcing package structure 50 is, for example, a ring-shaped sealing structure, or the second reinforcing package structure 50 is disposed on three sides of the substrate, that is, the side of the IC driving region is not provided with the second reinforcing package structure 50. The side frit material is reinforced by the first reinforcing package structure 40.

The second reinforcing package structure 50 is formed, for example, of a material selected from any one of urethane acrylate, epoxy resin, epoxy acrylate, polyester acrylate, or cyanoacrylate, and the viscosity of the material is 10 Kcps-20 Kcps. between. The material of this viscosity has good fluidity and can be freely filled between the two substrates, and at the same time, it is also ensured that the first substrate 10 and the second substrate 20 can be firmly bonded together.

As can be seen from the above description, the encapsulation effect of the organic light emitting display device can be further improved by the additional second reinforcing package structure 50.

The above embodiments are merely illustrative of the disclosure, and are not intended to limit the scope of the disclosure, and various changes and modifications can be made without departing from the spirit and scope of the disclosure. Equivalent technical solutions are also within the scope of the disclosure, and the scope of patent protection of the disclosure should be defined by the claims.

The present application claims the priority of the Chinese Patent Application No. 201420279075.3, filed on May 28, 2014, the entire disclosure of which is hereby incorporated by reference.

Claims

An organic light emitting display device comprising: a first substrate; a second substrate; an encapsulation layer disposed between the first substrate and the second substrate, the encapsulation layer sealingly connecting the first substrate and the second substrate; a first reinforcing package structure disposed between the first substrate and the second substrate, the first reinforcing package structure being located inside the package layer.
The organic light-emitting display device according to claim 1, wherein the first reinforcing package structure is a continuous annular body or a plurality of columnar bodies arranged at intervals and annularly.
The organic light-emitting display device of claim 2, wherein the first reinforcing package structure is spaced apart from the encapsulation layer by a distance of 0.1 to 0.3 mm.
The organic light-emitting display device of claim 3, wherein the first reinforcing package structure has a width of 0.2 to 0.4 mm, and the first reinforcing package structure has a height of 5 to 10 μm.
The organic light-emitting display device according to claim 4, wherein said first reinforcing package structure is any one selected from the group consisting of urethane acrylate, epoxy resin, epoxy acrylate, polyester acrylate or cyanoacrylate. A curable liquid organic material is formed.
The organic light-emitting display device according to any one of claims 1 to 5, further comprising a second reinforcing package structure disposed outside the package layer and sealingly connecting the first substrate and the second substrate.
The organic light emitting display device of claim 6, wherein the second reinforcing package structure is annular.
The organic light emitting display device of claim 6, wherein the second reinforcing package structure has a width of 0.2 to 1.0 mm.
The organic light-emitting display device according to claim 6, wherein the second reinforcing package structure is any one selected from the group consisting of urethane acrylate, epoxy resin, epoxy acrylate, polyester acrylate or cyanoacrylate. A curable liquid organic material is formed.
The organic light-emitting display device according to any one of claims 1 to 9, wherein the encapsulation layer is formed of a glass frit.