CN202103100U - OLED display device and packaging structure thereof - Google Patents

OLED display device and packaging structure thereof Download PDF

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Publication number
CN202103100U
CN202103100U CN2011202259332U CN201120225933U CN202103100U CN 202103100 U CN202103100 U CN 202103100U CN 2011202259332 U CN2011202259332 U CN 2011202259332U CN 201120225933 U CN201120225933 U CN 201120225933U CN 202103100 U CN202103100 U CN 202103100U
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CN
China
Prior art keywords
glass
cover plate
oled
glass substrate
display device
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Expired - Fee Related
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CN2011202259332U
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Chinese (zh)
Inventor
高昕伟
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Sichuan CCO Display Technology Co Ltd
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Sichuan CCO Display Technology Co Ltd
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Priority to CN2011202259332U priority Critical patent/CN202103100U/en
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Publication of CN202103100U publication Critical patent/CN202103100U/en
Anticipated expiration legal-status Critical
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Abstract

The utility model relates to an OLED display device and a packaging structure thereof. The OLED display device comprises a packaging glass cover plate arranged at the bottom thereof and a glass substrate arranged on the top thereof, with a plurality of OLED units being applied to the lower portion of the glass substrate. The OLED display device is characterized in that a loop of sintered glass, arranged at the peripheral edges of the OLED units, is connected between the packaging glass cover plate and the glass substrate for enclosing the OLED unit in an enclosed space formed by the packaging glass cover plate, the glass substrate, and the sintered glass, wherein the peripheral edges of every OLED unit are provided with a loop of sealing UV resin surrounding the periphery of the sintered glass. As the sintered glass has better sealing performance than the UV glue, the packaging structure for an OLED display device, which adopts the combination of sintered glass and UV resin for sealing, has better sealing effect.

Description

A kind of OLED display device and encapsulating structure thereof
Technical field
The utility model relates to the plane Display Technique, relates in particular to the encapsulation technology of organic luminescent device (OLED).
Background technology
Encapsulation technology is a core technology of OLED technology, this be because OLED unit itself to the unusual sensitivity of steam and oxygen, if contact the rapid degeneration that can cause the OLED unit with steam or oxygen.Traditional OLED encapsulating structure is as shown in Figure 1; Be to adopt 2 pairs of OLED unit 6 of UV resin to seal; But because UV resin 2 still has certain gas permeability, therefore generally adhere to drier 7 in the inside of packaged glass cover plate 1 and glass substrate 5 again, to strengthen adsorption capacity to steam and oxygen.
In the existing commercial process; In order to form OLED display device 3 as shown in Figure 1; Normally on one big packaged glass cover plate 1, form several and be the OLED display device of M * N (M, N are natural number) arranged; Wait to accomplish these are the encapsulation of OLED display device of arranged after, be cut into M * N independent O light-emitting diode display spare.
Before cutting; Need not have glass substrate 5, OLED unit 6, the packaged glass cover plate 1 before the cutting of OLED display be bonded together through UV resin 2, and in the closed cavity that glass substrate 5 and packaged glass cover plate 1 form applying drier 7, in encapsulation process; For UV resin 2 is solidified; Need to use UV light irradiation UV resin 2, but the irradiation of UV lamp can damage the organic luminous layer of OLED unit 6, for fear of when UV resin 2 solidifies; The UV light irradiation is to organic luminous layer 5; Need take measures to avoid the UV light irradiation to OLED unit 6, prior art is to adopt mask plate to solve this problem, adopts mask plate shielding for the place that can not shine.
Sintered glass has good sealing property; Can under 85 ℃, 85% relative humidity condition, in 7000 hours, keep sealing property, be far longer than the sealing property of existing UV resin; But because some materials of OLED display interior such as organic luminescent layer can not withstand high temperatures; Therefore sintered glass can influence the performance of other each layer when receiving the high-temp alloying sealing, and therefore existing OLED technical field also occurs adopting sintered glass to seal the OLED unit as encapsulant.
The utility model content
The purpose of the utility model is in order to improve the sealing property of OLED display device, to have proposed a kind of OLED display device and encapsulating structure thereof.
The technical scheme of the utility model: a kind of encapsulating structure of OLED display device; Comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top; A plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure; Having a circle sintered glass outside the edge of each OLED unit is connected between packaged glass cover plate and the glass substrate in order in the confined space that each OLED unit is sealed in glaze cover plate, glass substrate and sintered glass formation; Have a corral outside the edge of said each OLED unit around the peripheral sealing UV resin of sintered glass, have the UV resin in the edge of said uncut packaged glass cover plate and uncut glass substrate in order in the confined space that all OLED unit is sealed in glaze cover plate, glass substrate and the formation of UV resin.
Another technical scheme of the utility model is: a kind of OLED display device; Comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top; The OLED unit is attached to the bottom of glass substrate; It is characterized in that; Have a circle sintered glass outside the edge of said OLED unit and be connected between packaged glass cover plate and the glass substrate, have a corral outside the edge of said each OLED unit around the peripheral sealing UV resin of sintered glass in order to the OLED unit is sealed in the confined space that glaze cover plate, glass substrate and sintered glass form.
Also be pasted with drier in the confined space that the glaze cover plate of above-mentioned OLED display device, glass substrate and sintered glass form.
The beneficial effect of the utility model is: because sintered glass has good sealing property than UV glue, therefore adopt the encapsulating structure and the method for packing thereof of the OLED display device of sintered glass and UV resin-bonded sealing to have better sealing effectiveness.In this structure, further strengthened packaging effect behind the interpolation drier.
Description of drawings
Accompanying drawing 1 is the structural representation of OLED display device.
Accompanying drawing 2 is the structural representation of encapsulating structure of the OLED display device of the utility model.
Accompanying drawing 3 is the structural representation on the encapsulating structure cross section of OLED display device of the utility model.
Accompanying drawing 4 is the structural representation of an embodiment of the OLED display device of the utility model.
Accompanying drawing 5 is the structural representation of another embodiment of the OLED display device of the utility model.
Description of reference numerals: packaged glass cover plate 1, UV resin 2, OLED display device 3, sintered glass 4, glass substrate 5, OLED unit 6, drier 7, sealing UV resin 8.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is described further.
As shown in Figures 2 and 3; A kind of encapsulating structure of OLED display device; Comprise uncut packaged glass cover plate 1 that is positioned at the bottom and the uncut glass substrate 5 that is positioned at the top; A plurality of OLED unit 6 is attached to the bottom of glass substrate 5 according to matrix structure; Spatial dimension among the figure in the frame of broken lines can be regarded as an OLED display device; Having a circle sintered glass 4 outside the edge of each OLED unit 6 is connected between packaged glass cover plate 1 and the glass substrate 5 in order in the confined space that each OLED unit 6 is sealed in glaze cover plate 1, glass substrate 5 and sintered glass 4 formation; Have the sealing UV resin 8 of a corral outside the edge of said each OLED unit 6, have UV resin 2 in the edge of said uncut packaged glass cover plate 1 and uncut glass substrate 5 in order in the confined space that all OLED unit 6 is sealed in glaze cover plate 1, glass substrate 5 and 2 formation of UV resin around sintered glass 4 peripheries.UV resin 2 adopts identical materials with sealing UV resin 8 in the present embodiment.
As shown in Figure 4; Another technical scheme of the utility model is: a kind of OLED display device; Comprise packaged glass cover plate 1 that is positioned at the bottom and the glass substrate 5 that is positioned at the top; OLED unit 6 is attached to the bottom of glass substrate 5; It is characterized in that having a circle sintered glass 4 outside the edge of said OLED unit 6 and be connected between packaged glass cover plate 1 and the glass substrate 5, have a corral outside the edge of said each OLED unit 6 around the peripheral sealing UV resin 8 of sintered glass 4 in order to OLED unit 6 is sealed in the confined space that glaze cover plate 1, glass substrate 5 and sintered glass 4 form.
As shown in Figure 5, on the basis of scheme as shown in Figure 4, also be pasted with drier 7 in the confined space that the packaged glass cover plate 1 of above-mentioned OLED display device, glass substrate 5 and sintered glass 4 form.Drier 7 is attached on the packaged glass cover plate 1 among this embodiment.
Technical scheme to the method for packing of OLED display device as shown in Figure 4 is: a kind of method for packing of OLED display device comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass 4 outside the edge of each 6 corresponding position, OLED unit on uncut packaged glass cover plate 1, the thickness of sintered glass 4 is 5~30 μ m, width is 0.3~6mm;
Step b: through hot plate or vacuum furnace equipment, the uncut glaze cover plate 1 of completing steps a is toasted, sintered glass 4 is solidified;
Step c: the uncut packaged glass cover plate 1 of completing steps b is loaded into sealed in unit and is sent in the UV resin 2 coating chambeies; Coat a circle sealing UV resin 8 through the periphery of the sintered glass 4 of the resin-coated equipment of UV outside the edge of each 6 corresponding position, OLED unit of uncut packaged glass cover plate 1; In the edge of uncut packaged glass cover plate 1, be coated with a circle UV resin 2 through the resin-coated equipment of UV then; Thickness after UV resin 2 solidifies is 10~100 μ m, and width is 0.5~5mm;
Steps d: under the pure nitrogen gas environment; With the uncut packaged glass cover plate of completing steps c 1 with accomplish the uncut glass substrate 5 that has loaded OLED unit 6 and fit, again through the UV irradiate light make the outer sintered glass 4 in the edge of each OLED unit 6 the periphery a circle sealing UV resin 8 and the edge that is positioned at uncut packaged glass cover plate 12 curing of UV resin and accomplish preliminary packaging technology and form preliminary encapsulating structure;
Step e: the uncut packaged glass cover plate 1 of preliminary packaging technology and the preliminary encapsulating structure of glass substrate 5 formations have been accomplished in taking-up from sealed in unit; Make sintered glass 4 fusings and welding through laser radiation; Thereby make OLED unit 6 accomplish encapsulation; The laser that said laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers;
Step f: the encapsulating structure of accomplishing among the step e is sent into the cutting equipment cutting obtain the OLED display device.
Through above-mentioned steps, obtained OLED display device as shown in Figure 4.
Technical scheme to the method for packing of OLED display device as shown in Figure 5 is: a kind of method for packing of OLED display device comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass 4 outside the edge of each 6 corresponding position, OLED unit on uncut packaged glass cover plate 1, the thickness of sintered glass 4 is 5~30 μ m, width is 0.3~6mm;
Step b: through hot plate or vacuum furnace equipment, the uncut glaze cover plate 1 of completing steps a is toasted, sintered glass 4 is solidified;
Step c: the uncut packaged glass cover plate 1 of completing steps b is loaded into sealed in unit attaches drier for each corresponding position, OLED unit and the uncut packaged glass cover plate 1 that will attach drier is sent in the UV resin 2 coating chambeies; Coat a circle sealing UV resin 8 through the periphery of the sintered glass 4 of the resin-coated equipment of UV outside the edge of each OLED unit 6 of uncut packaged glass cover plate 1; In the edge of uncut packaged glass cover plate 1, be coated with a circle UV resin 2 through the resin-coated equipment of UV then; Thickness after UV resin 2 solidifies is 10~100 μ m, and width is 0.5~5mm
Steps d: under the pure nitrogen gas environment; With the uncut packaged glass cover plate of completing steps c 1 with accomplish the uncut glass substrate 5 that has loaded OLED unit 6 and fit, again through the UV irradiate light make the outer sintered glass 4 in the edge of each OLED unit 6 the periphery a circle sealing UV resin 8 and the edge that is positioned at uncut packaged glass cover plate 12 curing of UV resin and accomplish preliminary packaging technology and form preliminary encapsulating structure;
Step e: the uncut packaged glass cover plate 1 of preliminary packaging technology and the preliminary encapsulating structure of glass substrate 5 formations have been accomplished in taking-up from sealed in unit; Make sintered glass 4 fusings and welding through laser radiation; Thereby make OLED unit 6 accomplish encapsulation; The laser that said laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers;
Step f: the encapsulating structure of accomplishing among the step e is sent into the cutting equipment cutting obtain the OLED display device.
After accomplishing above-mentioned steps, obtain OLED display device as shown in Figure 5.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help the principle of reader understanding's the utility model, should to be understood that the protection range of the utility model is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from the utility model essence according to disclosed these teachings of the utility model, and these distortion and combination are still in the protection range of the utility model.

Claims (3)

1. the encapsulating structure of an OLED display device; Comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top; A plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure; Having a circle sintered glass outside the edge of each OLED unit is connected between packaged glass cover plate and the glass substrate in order in the confined space that each OLED unit is sealed in glaze cover plate, glass substrate and sintered glass formation; Have a corral outside the edge of said each OLED unit around the peripheral sealing UV resin of sintered glass, have the UV resin in the edge of said uncut packaged glass cover plate and uncut glass substrate in order in the confined space that all OLED unit is sealed in glaze cover plate, glass substrate and the formation of UV resin.
2. OLED display device; Comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top; The OLED unit is attached to the bottom of glass substrate; It is characterized in that; Have a circle sintered glass outside the edge of said OLED unit and be connected between packaged glass cover plate and the glass substrate, have a corral outside the edge of said each OLED unit around the peripheral sealing UV resin of sintered glass in order to the OLED unit is sealed in the confined space that glaze cover plate, glass substrate and sintered glass form.
3. OLED display device according to claim 2 is characterized in that, also is pasted with drier in the confined space that the glaze cover plate of said OLED display device, glass substrate and sintered glass form.
CN2011202259332U 2011-06-30 2011-06-30 OLED display device and packaging structure thereof Expired - Fee Related CN202103100U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011202259332U CN202103100U (en) 2011-06-30 2011-06-30 OLED display device and packaging structure thereof

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Application Number Priority Date Filing Date Title
CN2011202259332U CN202103100U (en) 2011-06-30 2011-06-30 OLED display device and packaging structure thereof

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102231427A (en) * 2011-06-30 2011-11-02 四川虹视显示技术有限公司 OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102231427A (en) * 2011-06-30 2011-11-02 四川虹视显示技术有限公司 OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120104

Termination date: 20150630

EXPY Termination of patent right or utility model