CN202332975U - OLED (organic light-emitting diode) display device and packaging structure thereof - Google Patents
OLED (organic light-emitting diode) display device and packaging structure thereof Download PDFInfo
- Publication number
- CN202332975U CN202332975U CN2011202269917U CN201120226991U CN202332975U CN 202332975 U CN202332975 U CN 202332975U CN 2011202269917 U CN2011202269917 U CN 2011202269917U CN 201120226991 U CN201120226991 U CN 201120226991U CN 202332975 U CN202332975 U CN 202332975U
- Authority
- CN
- China
- Prior art keywords
- cover plate
- oled
- glass
- glass substrate
- display device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The utility model relates to an OLED (organic light-emitting diode) display device and a packaging structure thereof. The packaging structure comprises an uncut packaging glass cover plate located on a bottom and an uncut glass substrate located on a top, wherein a plurality of OLED units are arrayed and attached to the lower part of the glass substrate according to a matrix structure; a ring of sintered glass is disposed outside the surrounding edge of each OLED unit, connected between the packaging glass cover plate and the glass substrate, and used for sealing each OLED unit in an airtight space formed by the packaging glass cover plate, the glass substrate and the sintered glass; and UV (ultraviolet) resins are disposed on the surrounding edges of the uncut packaging glass cover plate and the uncut glass substrate, and used for sealing all OLED units in an airtight space formed by the packaging glass cover plate, the glass substrate and the UV resins. The OLED display device and the packaging structure thereof disclosed by the utility model have the following advantage that: the packaging structure using sintered glass of OLED display device and packaging method for same are better in sealing effect.
Description
Technical field
The utility model relates to the plane Display Technique, relates in particular to the encapsulation technology of organic luminescent device (OLED).
Background technology
Encapsulation technology is a core technology of OLED technology, this be because OLED unit itself to the unusual sensitivity of steam and oxygen, if contact the rapid degeneration that can cause the OLED unit with steam or oxygen.Traditional OLED encapsulating structure is as shown in Figure 1; Be to adopt 2 pairs of OLED unit 6 of UV resin to seal; But because UV resin 2 still has certain gas permeability, therefore generally adhere to drier 7 in the inside of packaged glass cover plate 1 and glass substrate 5 again, to strengthen adsorption capacity to steam and oxygen.
In the existing commercial process; In order to form OLED display device 3 as shown in Figure 1; Normally on one big packaged glass cover plate 1, form several and be the OLED display device of M * N (M, N are natural number) arranged; Wait to accomplish these are the encapsulation of OLED display device of arranged after, be cut into M * N independent O light-emitting diode display spare.
Before cutting; Need not have glass substrate 5, OLED unit 6, the packaged glass cover plate 1 before the cutting of OLED display be bonded together through UV resin 2, and in the closed cavity that glass substrate 5 and packaged glass cover plate 1 form applying drier 7, in encapsulation process; For UV resin 2 is solidified; Need to use UV light irradiation UV resin 2, but the irradiation of UV lamp can damage the organic luminous layer of OLED unit 6, for fear of when UV resin 2 solidifies; The UV light irradiation is to organic luminous layer 5; Need take measures to avoid the UV light irradiation to OLED unit 6, prior art is to adopt mask plate to solve this problem, adopts mask plate shielding for the place that can not shine.
Sintered glass has good sealing property; Can under 85 ℃, 85% relative humidity condition, in 7000 hours, keep sealing property, be far longer than the sealing property of existing UV resin; But because some materials of OLED display interior such as organic luminescent layer can not withstand high temperatures; Therefore sintered glass can influence the performance of other each layer when receiving the high-temp alloying sealing, and therefore existing OLED technical field also occurs adopting sintered glass to seal the OLED unit as encapsulant.
Summary of the invention
The purpose of the utility model is in order to improve the sealing property of OLED display device, to have proposed a kind of OLED display device and encapsulating structure thereof.
The technical scheme of the utility model: a kind of encapsulating structure of OLED display device; Comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top; A plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure; Have a circle sintered glass outside the edge of each OLED unit and be connected between packaged glass cover plate and the glass substrate in order to each OLED unit being sealed in the confined space that packaged glass cover plate, glass substrate and sintered glass form, the edge of said uncut packaged glass cover plate and uncut glass substrate has the UV resin in order in the confined space that all OLED unit is sealed in packaged glass cover plate, glass substrate and UV resin and forms.
Another technical scheme of the utility model is: a kind of OLED display device; Comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top; The OLED unit is attached to the bottom of glass substrate; It is characterized in that having a circle sintered glass outside the edge of said OLED unit and be connected between packaged glass cover plate and the glass substrate in order in the confined space that the OLED unit is sealed in packaged glass cover plate, glass substrate and sintered glass formation.
Also be pasted with drier in the confined space that the packaged glass cover plate of above-mentioned OLED display device, glass substrate and sintered glass form.
The beneficial effect of the utility model is: because sintered glass has good sealing property than UV glue, therefore adopt the encapsulating structure and the method for packing thereof of the OLED display device of sintered glass to have better sealing effectiveness.In this structure, further strengthened packaging effect behind the interpolation drier.
Description of drawings
Accompanying drawing 1 is the structural representation of OLED display device.
Accompanying drawing 2 is the structural representation of encapsulating structure of the OLED display device of the utility model.
Accompanying drawing 3 is the structural representation on the encapsulating structure cross section of OLED display device of the utility model.
Accompanying drawing 4 is the structural representation of an embodiment of the OLED display device of the utility model.
Accompanying drawing 5 is the structural representation of another embodiment of the OLED display device of the utility model.
Description of reference numerals: packaged glass cover plate 1, UV resin 2, OLED display device 3, sintered glass 4, glass substrate 5, OLED unit 6, drier 7, sealing UV resin 8.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is described further.
As shown in Figures 2 and 3; A kind of encapsulating structure of OLED display device; Comprise uncut packaged glass cover plate 1 that is positioned at the bottom and the uncut glass substrate 5 that is positioned at the top; A plurality of OLED unit 6 is attached to the bottom of glass substrate 5 according to matrix structure; Spatial dimension among the figure in the frame of broken lines can be regarded as an OLED display device; Have a circle sintered glass 4 outside the edge of each OLED unit 6 and be connected between packaged glass cover plate 1 and the glass substrate 5 in order to each OLED unit 6 being sealed in the confined space that packaged glass cover plate 1, glass substrate 5 and sintered glass 4 form, the edge of said uncut packaged glass cover plate 1 and uncut glass substrate 5 has UV resin 2 in order in the confined space that all OLED unit 6 is sealed in packaged glass cover plate 1, glass substrate 5 and UV resin 2 and forms.UV resin 2 adopts identical materials with sealing UV resin 8 in the present embodiment.
As shown in Figure 4; The disclosed a kind of OLED display device of the utility model technical scheme; Comprise packaged glass cover plate 1 that is positioned at the bottom and the glass substrate 5 that is positioned at the top; OLED unit 6 is attached to the bottom of glass substrate 5, it is characterized in that, has a circle sintered glass 4 outside the edge of said OLED unit 6 and is connected between packaged glass cover plate 1 and the glass substrate 5 in order in the confined space that OLED unit 6 is sealed in glaze cover plate 1, glass substrate 5 and sintered glass 4 formation.
As shown in Figure 5, on the basis of scheme as shown in Figure 4, the OLED display device of another embodiment is provided, in the confined space that the packaged glass cover plate 1 of OLED display device, glass substrate 5 and sintered glass 4 form, also be pasted with drier 7.Drier 7 is attached on the packaged glass cover plate 1 among this embodiment.
Present embodiment also discloses the method for packing to OLED display device as shown in Figure 4, comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass 4 outside the edge of each 6 corresponding position, OLED unit on uncut packaged glass cover plate 1, the thickness of sintered glass 4 is 5～30 μ m, width is 0.3～6mm;
Step b: through hot plate or vacuum furnace equipment, the uncut packaged glass cover plate 1 of completing steps a is toasted, sintered glass 4 is solidified;
Step c: the uncut packaged glass cover plate 1 of completing steps b is loaded into sealed in unit and is sent in the UV resin 2 coating chambeies; In the edge of uncut packaged glass cover plate 1, be coated with a circle UV resin 2 through the resin-coated equipment of UV; Thickness after UV resin 2 solidifies is 10～100 μ m, and width is 0.5～5mm;
Steps d: under the pure nitrogen gas environment; The uncut packaged glass cover plate 1 of completing steps c is fitted with the uncut glass substrate 5 that OLED unit 6 has been loaded in completion, make UV resin 2 solidify and accomplish preliminary packaging technology through the UV irradiate light again and form preliminary encapsulating structure;
Step e: the uncut packaged glass cover plate 1 of preliminary packaging technology and the preliminary encapsulating structure of glass substrate 5 formations have been accomplished in taking-up from sealed in unit; Make sintered glass 4 fusings and welding through laser radiation; Thereby make OLED unit 6 accomplish encapsulation; The laser that said laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers;
Step f: the encapsulating structure of accomplishing among the step e is sent into the cutting equipment cutting obtain the OLED display device.
Through above-mentioned steps, obtained OLED display device as shown in Figure 4.
The utility model also provides the method for packing to OLED display device as shown in Figure 5, comprises the steps:
Step a: utilize screen printing apparatus, coating one circle sintered glass 4 outside the edge of each 6 corresponding position, OLED unit on uncut packaged glass cover plate 1, the thickness of sintered glass 4 is 5～30 μ m, width is 0.3～6mm;
Step b: through hot plate or vacuum furnace equipment, the uncut packaged glass cover plate 1 of completing steps a is toasted, sintered glass 4 is solidified;
On the packaged glass cover plate 1 of each 6 corresponding position, OLED unit, attach the process of drier
Step c: the uncut packaged glass cover plate 1 of completing steps b is loaded into sealed in unit and on the packaged glass cover plate 1 of each 6 corresponding position, OLED unit, attaches drier 7; The uncut packaged glass cover plate 1 that has attached drier is sent in the UV resin 2 coating chambeies; In the edge of uncut packaged glass cover plate 1, be coated with a circle UV resin 2 through the resin-coated equipment of UV; Thickness after UV resin 2 solidifies is 10～100 μ m, and width is 0.5～5mm;
Steps d: under the pure nitrogen gas environment; The uncut packaged glass cover plate 1 of completing steps c is fitted with the uncut glass substrate 5 that OLED unit 6 has been loaded in completion, make UV resin 2 solidify and accomplish preliminary packaging technology through the UV irradiate light again and form preliminary encapsulating structure;
Step e: the uncut packaged glass cover plate 1 of preliminary packaging technology and the preliminary encapsulating structure of glass substrate 5 formations have been accomplished in taking-up from sealed in unit; Make sintered glass 4 fusings and welding through laser radiation; Thereby make OLED unit 6 accomplish encapsulation; The laser that said laser radiation is adopted is infrared band laser, and wavelength is between 780 to 900 nanometers;
Step f: the encapsulating structure of accomplishing among the step e is sent into the cutting equipment cutting obtain the OLED display device.
After accomplishing above-mentioned steps, obtain OLED display device as shown in Figure 5.
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help the principle of reader understanding's the utility model, should to be understood that the protection range of the utility model is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from the utility model essence according to disclosed these teachings of the utility model, and these distortion and combination are still in the protection range of the utility model.
Claims (3)
1. the encapsulating structure of an OLED display device; Comprise uncut packaged glass cover plate that is positioned at the bottom and the uncut glass substrate that is positioned at the top; A plurality of OLED unit is attached to the bottom of glass substrate according to matrix structure; It is characterized in that; Have a circle sintered glass outside the edge of each OLED unit and be connected between packaged glass cover plate and the glass substrate in order to each OLED unit being sealed in the confined space that packaged glass cover plate, glass substrate and sintered glass form, the edge of said uncut packaged glass cover plate and uncut glass substrate has the UV resin in order in the confined space that all OLED unit is sealed in packaged glass cover plate, glass substrate and UV resin and forms.
2. a kind of OLED display device according to claim 1 is characterized in that, also is pasted with drier in the confined space that the packaged glass cover plate of said OLED display device, glass substrate and sintered glass form.
3. OLED display device; Comprise packaged glass cover plate that is positioned at the bottom and the glass substrate that is positioned at the top; The OLED unit is attached to the bottom of glass substrate; It is characterized in that having a circle sintered glass outside the edge of said OLED unit and be connected between packaged glass cover plate and the glass substrate in order in the confined space that the OLED unit is sealed in packaged glass cover plate, glass substrate and sintered glass formation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202269917U CN202332975U (en) | 2011-06-30 | 2011-06-30 | OLED (organic light-emitting diode) display device and packaging structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202269917U CN202332975U (en) | 2011-06-30 | 2011-06-30 | OLED (organic light-emitting diode) display device and packaging structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202332975U true CN202332975U (en) | 2012-07-11 |
Family
ID=46444942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202269917U Expired - Fee Related CN202332975U (en) | 2011-06-30 | 2011-06-30 | OLED (organic light-emitting diode) display device and packaging structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202332975U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022378A (en) * | 2012-12-17 | 2013-04-03 | 京东方科技集团股份有限公司 | OLED (organic light emitting diode) device, package method thereof and display device |
| CN105932168A (en) * | 2016-06-03 | 2016-09-07 | 京东方科技集团股份有限公司 | Method for preparing OLED (Organic Light-Emitting Device) panel |
-
2011
- 2011-06-30 CN CN2011202269917U patent/CN202332975U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103022378A (en) * | 2012-12-17 | 2013-04-03 | 京东方科技集团股份有限公司 | OLED (organic light emitting diode) device, package method thereof and display device |
| CN103022378B (en) * | 2012-12-17 | 2015-09-09 | 京东方科技集团股份有限公司 | A kind of OLED and method for packing, display unit |
| CN105932168A (en) * | 2016-06-03 | 2016-09-07 | 京东方科技集团股份有限公司 | Method for preparing OLED (Organic Light-Emitting Device) panel |
| US10476041B2 (en) | 2016-06-03 | 2019-11-12 | Boe Technology Group Co., Ltd. | Method for manufacturing OLED panel |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102231427B (en) | OLED (Organic Light Emitting Diode) display device as well as packaging structure and method thereof | |
| CN102231429B (en) | Organic light-emitting diode (OLED) display device, package structure and package method | |
| CN102237494A (en) | OLED (Organic Light Emitting Diode) display device and packaging structure thereof and as well as packaging method thereof | |
| CN102231428B (en) | Organic light-emitting diode (OLED) display device, package structure and package method | |
| CN202178257U (en) | OLED display device and packaging structure thereof | |
| CN103474580A (en) | Flexible organic electroluminescence device packaging structure, method and flexible displaying device | |
| WO2016026182A1 (en) | Oled encapsulation method and structure | |
| CN104299981B (en) | OLED display panel, packaging method of OLED display panel and OLED display device | |
| CN103956435A (en) | Adhesive tape encapsulating structure of organic light emitting diode | |
| CN101548578B (en) | Organic electroluminescence panel, organic electroluminescence display, organic electroluminescence illumination and method of manufacturing them | |
| JP2007531238A5 (en) | ||
| CN202183375U (en) | OLED (Organic Light Emitting Diode) display device and packaging structure thereof | |
| CN103872264A (en) | Inflation pressure-controllable packaging system for manufacturing organic electroluminescent devices | |
| CN105810710A (en) | OLED device and preparing method thereof | |
| JP2010108905A (en) | Light-emitting display device and method of manufacturing the same | |
| MX2015007999A (en) | Module assembly for thin solar cells. | |
| CN104157799A (en) | OLED package method and OLED package structure | |
| CN202332975U (en) | OLED (organic light-emitting diode) display device and packaging structure thereof | |
| KR20100106018A (en) | Method of fabricating solar cell module and product thereof | |
| CN202103100U (en) | OLED display device and packaging structure thereof | |
| CN103078063B (en) | A kind of OLED encapsulating structure | |
| CN103078064A (en) | Organic light-emitting diode (OLED) panel packaging structure and packaging method | |
| CN106784383A (en) | The OLED encapsulated with the cover plate for having Back Word connected in star | |
| JP6854456B2 (en) | Manufacturing method of gas adsorption unit | |
| CN201820801U (en) | Encapsulating structure for OLED (Organic Light Emitting Diode) device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120711 Termination date: 20150630 |
|
| EXPY | Termination of patent right or utility model |