CN102209448B - Protection box for circuit board and installation method of protection box - Google Patents
Protection box for circuit board and installation method of protection box Download PDFInfo
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- CN102209448B CN102209448B CN201010140658.4A CN201010140658A CN102209448B CN 102209448 B CN102209448 B CN 102209448B CN 201010140658 A CN201010140658 A CN 201010140658A CN 102209448 B CN102209448 B CN 102209448B
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- circuit board
- exhaust passage
- packing material
- exhaust
- protection box
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Abstract
The invention relates to a protection box for a circuit board. The protection box has a general an L-shaped exhaust channel; the air intake end of the exhaust channel is positioned in an air cavity of a box body; and the air exhaust end of the exhaust channel is positioned in a filling cavity of the box body. When a filling material is not filled into the filling cavity, the L-shaped exhaust channel is communicated with the air cavity and the filling cavity through air; and when the filling material is filled into the filling cavity, an air exhaust area is covered and sealed by the filling material. When the protection box is used, the packaging of the circuit board and the sealing of the exhaust channel are finished in a step of filling the filling material, so an additional process of sealing an exhaust hole is eliminated, the box body has a simple structure and is low in cost, and the circuit board is reliable in installation.
Description
Technical field
The present invention relates to a kind of box body structure, particularly in order to install and to protect the box body structure of the PCB of putting in the inner.
Background technology
Printed circuit board (PCB) (PCB) belongs to common electric connecting mode, usually on it is electrically connected various electric component by welding.Along with the raising of precision, the increase of components and parts, PCB seems all the more more fragile, and needing provides the protection box body of necessity to prevent various foreign impacts and erosion.
Particularly for car crass sensing system, have the electric component comprising crash sensor and be placed on PCB, then whole PCB is arranged in box body, and to be sealed it by resin and protect.But this seal process also can produce and residual fraction gas cannot discharge box body, thus cause in resin or surface generation bubble, and then affect sealing property.
US Patent No. 7628948B2 discloses a kind of discharge in installation and seal process and produces structure and the method for gas.As shown in Figure 1, first by the element 21 of PCB 22 upward and be arranged on the epicoele of box body 20, namely the back side of pcb board 22 is towards the cavity of resorption of box body 20, and box body cavity of resorption place is provided with perforate 23; Then on element, resin 24 is added; Again process solidification is carried out to resin 24, and the gas 28 being positioned at cavity of resorption produced in process is discharged along arrow 25 direction from perforate 23; Finally perforate 23 is sealed.The gas produced during resin solidification is discharged and follow-up sealing by this patent, has discharged gas and has prevented again wet gas passing hole to enter in box body.But this patent process is the gas produced in the resin solidification stage.
In fact, because packing material is generally viscosity, such as, add resin, it can cause residual gas in filling chamber and then enter air chamber, and the gas that this stage occurs also can form impact to the encapsulation of PCB and use.This residual gas from filling chamber is only the main object of exhaust.Meanwhile, prior art need after resin solidification process, more extra plugging technology is carried out to steam vent, therefore manufacture processing be economy, the time and processing cost excessive.
For solving PCB at the gas discharging adding resin stage, avoiding the blibbing after encapsulating to occur, reaching the technical problem that technique is simple, cost is low simultaneously, need the protection box that a kind of new PCB is provided.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of protection box and installation method thereof of PCB.Wherein, this protection box comprises: for placing and the brace table of support circuit plate, described protection box is separated and is formed filling chamber and the air chamber of gas connection by described brace table, in described filling chamber, accommodation states circuit board and to some extent by the packing material of described circuit board package in the filling chamber of described protection box, exhaust passage, described exhaust passage has the air inlet area being positioned at air chamber, it is characterized in that: described exhaust passage also has the exhaust area being positioned at described filling chamber, when not dosing packing material, described exhaust passage gas is communicated with described air chamber and fills chamber, when complete dose packing material time, described exhaust area cover by described packing material sealing.
As further improvement, described exhaust passage can be hole shape or flute profile.Described hole shape is the hole of L shape, and the one end in L shape hole is arranged in air chamber as air inlet area, and the other end is arranged in filling chamber as exhaust area.
The installation method of this structure corresponding with said structure is, is first arranged on by circuit board on the brace table of described protection box, then, injects packing material and reach thickness needed for dimensional packaged circuit board always in protection box.Preferably, the position injecting packing material is positioned at the opposite side of described exhaust passage.
After adopting technology of the present invention, in the encapsulation process initial period, original gas of filling chamber that is positioned at that encapsulation produces enters air chamber, and filling chamber is discharged to through described exhaust passage, and filling chamber now is not closed, therefore gas can freely be discharged, when continuing encapsulation, the exhaust gas region of exhaust passage just can be filled and encapsulate to packing material, when completing encapsulation, described exhaust gas region be also filled material close.This technology only have employed and once encapsulates filling, and without the need to carrying out extra shutoff operation to exhaust outlet again, therefore technique is simple and save time.Meanwhile, have also been obtained discharge from the gas of filling chamber in filling process, ensure that encapsulation requirement.
Accompanying drawing explanation
Fig. 1: prior art generalized section;
Fig. 2: the schematic perspective view of first embodiment of the invention;
Fig. 3: the schematic diagram of first embodiment of the invention mounting circuit boards step;
Fig. 4 A: the schematic diagram in first embodiment of the invention encapsulation process;
Fig. 4 B: first embodiment of the invention encapsulates complete schematic diagram;
Fig. 5: the schematic diagram of second embodiment of the invention;
Fig. 6: the schematic diagram of third embodiment of the invention.
Embodiment
Fig. 1 is the schematic diagram of prior art.As shown in Figure 1, first by the element 21 of PCB 22 upward and be arranged on the epicoele of box body 20, namely the back side of pcb board 22 is towards the cavity of resorption of box body 20, and box body cavity of resorption place is provided with perforate 23; Then on element, resin 24 is added; Again process solidification is carried out to resin 24, and the gas 28 being positioned at cavity of resorption produced in process is discharged along arrow 25 direction from perforate 23; Finally perforate 23 is sealed.The gas produced during resin solidification is discharged and follow-up sealing by this patent, has discharged gas and has prevented again wet gas passing hole to enter in box body.But this patent process is the gas produced in the resin solidification stage.
Fig. 2 to Fig. 4 B is the schematic diagram of the first embodiment of the present invention, as figure provides a kind of circuit board protection kit 1, usually protection box body 1 also has link 5 to realize PERCOM peripheral communication.This protection box 1 comprises: for placing and the brace table 7 of support circuit plate 2, described protection box 1 is separated and is formed filling chamber 10 and the air chamber 8 of gas connection by described brace table 7; The packing material 9 that in described filling chamber 10, accommodation is stated circuit board 2 to some extent and is encapsulated in by described circuit board 2 in the filling chamber 10 of described protection box 1; Exhaust passage 3, described exhaust passage 3 has the air inlet area 31 being positioned at air chamber 8; Wherein: described exhaust passage 3 also has the exhaust area 32 being positioned at described filling chamber 10, when not dosing packing material 9, described exhaust passage 3 gas is communicated with described air chamber 8 and fills chamber 10, when complete dose packing material 9 time, described exhaust area 32 cover by described packing material 9 sealing.
In a first embodiment, exhaust passage 3 is the exhaust passage 3 of hole shape, as shown is the hole of L shape, and the one end in described L shape hole is arranged in described air chamber 8 as inlet end 31, and its other end is arranged in described filling chamber 10 as exhaust end 32.Wherein filling chamber 10 comprises the fill area 4 above the exhaust end 32 being positioned at exhaust passage 3.Therefore, when not having packing material 9, as shown in Figures 2 and 3, exhaust passage 3 is communicated with filling chamber 10 and air chamber 8, and the gas in air chamber 8 can be discharged to along exhaust passage 3 fills chamber 10, reaches emptying.And when entering initial stage and the mid-term in filling stage, as shown in Figure 4 A, owing to adopting the hole of L shape, exhaust passage 3 still can be communicated with above-mentioned two chambeies, reaches the object of emission gases 11.When continuing to fill with the thickness reaching required dimensional packaged circuit board; due to above exhaust end 32 (in the side that namely gas is discharged) be positioned at fill the fill area 4 in chamber 10 be also filled material 9 cover sealing; therefore exhaust passage 3 is no longer communicated with the external world; reach the object of finally sealed, prevent outside air and dust etc. from again entering in protection box.
Preferred using method is, the filling position of packing material is the opposite side being positioned at described exhaust passage.Due to the viscosity of packing material, it is by progressively close to the side being positioned at exhaust passage, and in the process can enter from exhaust passage discharged to the gas of air chamber and fill chamber, be i.e. in the air of top.When packing material reaches the side of exhaust passage, because exhaust passage is L shape, therefore its exhaust end can't seal by packing material, and the packing material of viscosity is pushed the gas entering air chamber and still can be discharged to outside chamber.When packing material be accumulated at exhaust passage place gradually to reach above it and to cover sealing time, the gas be pushed through in air chamber is discharged completely, even if packing material all seals the exhaust end of exhaust passage, also will not have gas and discharges and form bubble.Therefore structure of the present invention and the opposite side in exhaust passage are filled, and both ensure that speed and the time of filling, also ensure that the gas purging time simultaneously, to reach the object preventing bubble.
The technique effect that visible said structure completes in the filling stage while of in use achieving exhaust and sealing; gas in protection box can be avoided to form bubble at packing material; such as resin material, also can avoid the additional process of shutoff steam vent after completing encapsulation simultaneously.
As preferred embodiment, the exhaust end 32 of described L shape exhaust passage 3 be usually located at upper surface near described packing material 9 and be filled with a sealing by described packing material 9.This set when filling cohesive material, can extend the gas purging time, make by fill chamber enter the gas of air chamber can smooth discharge.And simultaneously, be positioned at the fill area 4 for covering sealing exhaust end 32 of filling chamber 10 also need there is rational area and thickness, to ensure the thorough sealing to exhaust passage, prevent the generation of bubble and extraneous intrusion.
As further preferred, the electric component 12 on described circuit board 2 is arranged in described air chamber 8, and is electrically connected with the external world by the pin 6 being positioned at link 5.In preferred mode, electric component 12, towards air chamber below, avoids the direct effect of same packing material, it also avoid the stress to electric component pin that packing material produces in solidification simultaneously.Electric component 12 is protected more perfect.Meanwhile, the electric component 12 towards air chamber also occupies the volume of air chamber, and inner air is reduced, and this also reduces gas in solidification process and to expand because being heated produced pressure, make the dimensional packaged circuit board that packing material is more airtight.
Fig. 2 to 4B display be the first embodiment of exhaust passage adopting L shape hole.As disclosed other specific embodiment, shown exhaust passage can also be the hole of other shape or the combination in groove or groove and hole.Conceivable, described flute profile exhaust passage is the straight-line groove being located at connection described filling chamber on described box body and described air chamber.Because the curvature of groove is less, the packing material of viscosity cannot seal in filling process in the early stage, and therefore it still can continue to discharge cavity of resorption, the gas namely in air chamber, and when packing material reaches to when completing encapsulation after certain thickness, groove is capped and with extraneous sealing.
As shown in Figure 5, as an embodiment, the combination shape exhaust passage of described hole and groove is that the hole shape part being positioned at described brace table less than 7 forms with the flute profile incorporating aspects being positioned at more than described brace table.This combination also has above-mentioned technical characteristic essence and can solve existing technical problem.Gas in air chamber is entered by hole shape part and discharges from the part of flute profile.This kind of structure makes box body processing more simple, and structure is compacter.
As another kind of embodiment, described protection box comprises the situation in L shape hole described at least one.Fig. 6 reality be the situation with 3 L shape holes.Certainly, as improvement, exhaust passage also can be a L shape passage with larger aperture area, such as rectangular inlet port and exhaust outlet.
Claims (10)
1. a circuit board protection kit, it comprises:
For placing and the brace table of support circuit plate, described protection box is separated and is formed filling chamber and the air chamber of gas connection by described brace table;
In described filling chamber, accommodation states circuit board and to some extent by the packing material of described circuit board package in the filling chamber of described protection box;
Exhaust passage, described exhaust passage has the air inlet area being positioned at air chamber; It is characterized in that:
Described exhaust passage also has the exhaust area being positioned at described filling chamber, when not dosing packing material, described exhaust passage gas be communicated with described air chamber and fill chamber, when complete dose packing material time, described exhaust area cover by described packing material sealing.
2. the circuit board protection kit as described in claim l, is characterized in that: described exhaust passage is the combination of hole shape, flute profile or hole and groove.
3. circuit board protection kit as claimed in claim 2, it is characterized in that: described hole shape exhaust passage is L shape, the one end in described L shape hole is arranged in described air chamber as inlet end, and its other end is arranged in described filling chamber as exhaust end.
4. circuit board protection kit as claimed in claim 3, is characterized in that: the exhaust end in described L shape hole near described packing material upper surface and be filled with a sealing by described packing material.
5. the circuit board protection kit as described in claim l, is characterized in that: the electric component on described circuit board is arranged in described air chamber.
6. circuit board protection kit as claimed in claim 2, is characterized in that: described flute profile exhaust passage be located at described circuit board protection kit box body on connection described filling chamber and the straight-line groove of described air chamber.
7. circuit board protection kit as claimed in claim 2, is characterized in that: the combination shape exhaust passage of described hole and groove is be positioned at the hole shape part of below described brace table and be positioned at the flute profile incorporating aspects of more than described brace table.
8. circuit board protection kit as claimed in claim 3, is characterized in that: described protection box comprises L shape hole described at least one.
9. the installation method of circuit board protection kit: a step one mounting circuit boards step, is arranged on the brace table of protection box as claimed in claim 1 by circuit board; Step 2 injects packing material step, in described protection box, inject packing material to the thickness reached needed for dimensional packaged circuit board; Step 3 curing filler material step.
10. the installation method of circuit board protection kit as claimed in claim 9, it is characterized in that: in step 2, the position injecting described packing material is positioned at the opposite side of described exhaust passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010140658.4A CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010140658.4A CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102209448A CN102209448A (en) | 2011-10-05 |
| CN102209448B true CN102209448B (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010140658.4A Active CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
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| Country | Link |
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| CN (1) | CN102209448B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171310A (en) * | 1996-04-19 | 1998-01-28 | 新东工业株式会社 | Method of filling cores with molding sand |
| CN1525910A (en) * | 2001-07-09 | 2004-09-01 | 诺德森公司 | Method and apparatus for underfilling electronic components using vacuum assist |
| CN101023521A (en) * | 2004-07-29 | 2007-08-22 | 菲科公司 | Mould part and method for encapsulating electronic components |
| CN101611483A (en) * | 2007-02-15 | 2009-12-23 | 飞科公司 | Utilize the method and apparatus of Vacuum Package electronic devices and components |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259652A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Manufacturing system for thin-film multilayer substrate |
| US7628948B2 (en) * | 2004-06-24 | 2009-12-08 | Continental Automotive Systems Us, Inc. | Alternate vent hole sealing method |
| DE102007035386B4 (en) * | 2007-07-26 | 2011-09-29 | Takata-Petri Ag | venting device |
-
2010
- 2010-03-29 CN CN201010140658.4A patent/CN102209448B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1171310A (en) * | 1996-04-19 | 1998-01-28 | 新东工业株式会社 | Method of filling cores with molding sand |
| CN1525910A (en) * | 2001-07-09 | 2004-09-01 | 诺德森公司 | Method and apparatus for underfilling electronic components using vacuum assist |
| CN101023521A (en) * | 2004-07-29 | 2007-08-22 | 菲科公司 | Mould part and method for encapsulating electronic components |
| CN101611483A (en) * | 2007-02-15 | 2009-12-23 | 飞科公司 | Utilize the method and apparatus of Vacuum Package electronic devices and components |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102209448A (en) | 2011-10-05 |
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Effective date of registration: 20180706 Address after: Sweden Wogaerda Patentee after: Vennell Sweden Address before: Wal Valley, Sweden Patentee before: AUTOLIV DEVELOPMENT AB |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230506 Address after: Stockholm, SWE Patentee after: Vinier Passive Systems Co.,Ltd. Address before: Sweden Wogaerda Patentee before: Vennell Sweden |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Stockholm, SWE Patentee after: Vinninger Swedish Security Systems Address before: Stockholm, SWE Patentee before: Vinier Passive Systems Co.,Ltd. |