CN101611483A - Utilize the method and apparatus of Vacuum Package electronic devices and components - Google Patents

Utilize the method and apparatus of Vacuum Package electronic devices and components Download PDF

Info

Publication number
CN101611483A
CN101611483A CNA2008800050817A CN200880005081A CN101611483A CN 101611483 A CN101611483 A CN 101611483A CN A2008800050817 A CNA2008800050817 A CN A2008800050817A CN 200880005081 A CN200880005081 A CN 200880005081A CN 101611483 A CN101611483 A CN 101611483A
Authority
CN
China
Prior art keywords
die cavity
encapsulating material
extracting channel
vacuumizes
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2008800050817A
Other languages
Chinese (zh)
Other versions
CN101611483B (en
Inventor
J·L·G·M·范如志
W·G·J·加尔
L·F·W·范·哈恩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Netherlands BV
Original Assignee
Fico BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico BV filed Critical Fico BV
Publication of CN101611483A publication Critical patent/CN101611483A/en
Application granted granted Critical
Publication of CN101611483B publication Critical patent/CN101611483B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76083—Position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76177—Location of measurement
    • B29C2945/7618—Injection unit
    • B29C2945/762—Injection unit injection piston
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76344—Phase or stage of measurement
    • B29C2945/76381—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76494—Controlled parameter
    • B29C2945/76498—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76655—Location of control
    • B29C2945/76732—Mould
    • B29C2945/76735—Mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76822—Phase or stage of control
    • B29C2945/76859—Injection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation

Abstract

The present invention relates to a kind of method of utilizing Vacuum Package to be arranged on the electronic component on the carrier, may further comprise the steps: A) with in the die cavity that electronic component to be packaged is arranged on carrier is connected, B) adding hot encapsulation material makes it become liquid state, C) by on liquid encapsulating material, exerting pressure encapsulating material is inserted in the die cavity that comprises electronic component, D) encapsulating material is filled up die cavity, E) encapsulation material solidifies at least a portion die cavity.The invention still further relates to the equipment that to realize this method.

Description

Utilize the method and apparatus of Vacuum Package electronic devices and components
Technical field
The present invention relates to a kind of method of utilizing Vacuum Package to be arranged on the electronic component on the carrier, comprise step: A) with in the die cavity that electronic component to be packaged is arranged on carrier is connected, B) adding hot encapsulation material makes it become liquid state, C) by on liquid encapsulating material, exerting pressure it is inserted in the die cavity that comprises electronic component, D) use encapsulating material that die cavity is filled up, E) packing material at least a portion die cavity solidifies; Wherein, at least at step B)-D) to die cavity in vacuum dynamically control.
The invention still further relates to a kind of utilization and vacuumize the device that encapsulation is arranged on the electronic component on the carrier, comprising: mould part, its each part removably connects each other, can limit a die cavity that is used to place electronic component under closure state at least; Filling device is used for liquid encapsulating material is connected with die cavity, and uses at least one piston to be used for supplying with, and withdrawal device is connected with die cavity, is used for from the die cavity extracting gases.
Background technology
In the electronic devices and components encapsulation field, especially encapsulation is arranged on the semiconductor element (as: lead frame) on the carrier, has used the method that is called " transfer modling process ".The carrier that is provided with electronic devices and components is clamped by mould part, so die cavity is the cavity round element to be packaged.Liquid encapsulating material is filled in the die cavity, after solidifying to the small part encapsulating material, mould part is removed, and the carrier with packaged electronic devices and components removes then.Usually pass through to use one or more piston, and the method for encapsulating material being exerted pressure by piston provides encapsulating material.Piston can move in the shell of encapsulating material is housed.Encapsulating material is contained in the model with the nonfluid state usually, as the outside be surrounded by thin-film material, bead form, perhaps graininess.Can certainly use liquid material as encapsulating material.Encapsulating material is made up of epoxy thermosetting formed material or resin-encapsulated material usually.Piston adds hot encapsulation material when encapsulating material is exerted pressure, the result of heating makes encapsulating material become liquid.Under the piston pressure effect, liquid encapsulating material flows in the heated die cavity, and encapsulating material is full of die cavity.In order to replace encapsulating material, encapsulating material is heated; After filling was finished, encapsulating material to small part was solidified by chemical bonding (cross-couplings just) in the die cavity of heating.In order to improve package quality, might before being provided, encapsulating material provide the low pressure (air pressure around just air pressure is lower than) of setting for die cavity.This method is used in practice, but the quality fall flat of encapsulation, especially when handling thin carrier or large-scale encapsulation.
Summary of the invention
The purpose of this invention is to provide a kind of method and apparatus, this method and apparatus is used for further improving the controllability of utilizing the method encapsulating electronic components that vacuumizes in die cavity, and further raising makes the package quality of the electronic component of encapsulation in this way.
For achieving the above object, the invention discloses a kind of method for packing, narrate, wherein vacuumize dynamically at step B-D at least and control die cavity as the front.Particularly, vacuumize at step D and control effectively die cavity.Control vacuum effectively and can be understood as dynamic control here, vacuumize the gas pressure that decides in the die cavity by direct control.Before encapsulating material is filled into die cavity and/or in the filling process, control vacuumizing effectively in the die cavity, formation vacuumizes and can change according to the variation of the course of work.Reducing of wherein initial general air pressure only is because the filling of encapsulating material causes: the evaporation of encapsulating material and/or by leaking in the die cavity.By effective control vacuum, can accomplish the different phase in the process that encapsulating material is filled in the die cavity, select best gas pressure, also can improve the quality of electronic package simultaneously.The scope of extracting vacuum is usually between 900 millibars to 10 millibars.
Vacuumize control and comprise under certain conditions and carrying out, in one of step B-D, can improve the degree of vacuumizing at least.Raising vacuumizes degree, can be understood that to reduce absolute gas pressure, and in order to reach this purpose, gas must be moved out of die cavity (or being that part of die cavity that non-encapsulated material is filled at least).Particularly under the situation of using very thin carrier, before encapsulating material is filled into die cavity in a large number, excessive extracting vacuum amount can cause carrier to be lifted, and this lifting is unnecessary, can cause the damage of encapsulating products like this and/or not reach needed package dimension.Equally, vacuumize control and also be included under the particular state and carry out, in one of step B-D, can reduce the degree of extracting vacuum at least.Reduce vacuumizing degree, be understood that to increase absolute gas pressure, be filled into encapsulating material in the die cavity or in filling process, increasing relative pressure gas.For example, in order to offset the gas that encapsulating material produces; In order to prevent too fast the flowing of liquid front end; In order to prevent that encapsulating material from bubbling in (formation bubble), causes " line skew "; And/or in order to prevent that being provided with component carrier to be packaged is lifted.Can increase pressure in the die cavity in the encapsulation final stage, because can prevent that like this encapsulating material (or thin slice of encapsulating material) is by extracting opening outflow die cavity (also can refer to spill).Use the method among the present invention, also can produce thin, big relatively encapsulant, in big relatively encapsulant, can be in a packing with a large number of electronic package.
It is relevant with the filling extent of die cavity vacuumizing control preferably, changeably, can be understood as, and under specific filling extent situation (for example, 50% of die cavity is filled), the degree that vacuumizes is set to a particular value.According to the degree of filling, in canned program subsequently, identical gas pressure will be repeated in die cavity.Like this, will reach unified standard for the encapsulation that is arranged on the electronic component on the carrier.For example, constant coupling can realize by selecting the piston diverse location.Piston is used for encapsulating material jacking die cavity, but vacuumizes Be Controlled in the die cavity whereby.Accordingly, directly measuring the passage or the pressure in the space that are connected with die cavity also can realize.
Control vacuumizes and can realize by the action that changes the withdrawal device that is connected with die cavity.The operation of more violent withdrawal device can cause the higher effect that vacuumizes, and simultaneously, low weight withdrawal device operation (or even stop withdrawal device operation) can access the low effect that vacuumizes.Withdrawal device can be pump or venturi system.Venturi system can provide power by gas pressure, by controlling this system, vacuumizes and can use economic mode-proportional pressure control valve door to realize.
Vacuumize in order dynamically to be controlled in the die cavity, the size of the extracting channel opening that hope is connected with die cavity is transformable.For the purpose of dynamic controlled pressure, the size of a predefined minimum of opening needs of the extracting channel that is connected with die cavity.Shortcoming when the extracting channel opening size is excessive is: encapsulating material can flow out (also can refer to " spilling " or " spilling ") die cavity from opening, the function that the present invention therefore also provides the size of the extracting channel opening that can be connected to die cavity to select, this function is, for example: can on the extracting channel wall that is connected with die cavity, movable part be set, be more preferably rotatable form.By regulating the size of the extracting channel opening size that is connected with die cavity, also can realize dynamic control like this to the die cavity internal pressure.And the minimum open dimension by the extracting channel that reduces to be connected with die cavity realizes preventing that encapsulating material from flowing out from die cavity, for the gas that the stage of filling in the end produces in the die cavity is discharged from, this mobilizable part wall energy realizes that enough passage is not fully closed.Another advantage of the extracting channel of variable-sized (or part) is to use multiple encapsulating material to encapsulate; Another advantage of the extracting channel of variable-sized (or part) is, can prevent that cleaning material or gas from discharging from die cavity in cleaning course.Be pointed out that in addition if also have other passages, at least one passing away has the size of qualification, and continues to open, also be connected simultaneously that variable-sized passage then can be by complete closed with die cavity.This passage will be described further in the back.
Another advantage of method is among the present invention, vacuumize and be controlled to be menu control, and with changes in process parameters.Technological parameter is transfused in the menu, for example comprises the type of encapsulating material, working temperature, the type of carrier material and thickness, ambient pressure, required operating rate, the position of element, lowest quality level or the like.According to the parameter of input, menu can be controlled vacuumizing in the die cavity according to relevant (and preferred) pattern along with the filling process of encapsulating material, and only input variable just can reach the purpose that control vacuumizes.
The present invention also provides method noted earlier employed equipment, and wherein, this equipment has controller, can carry out ACTIVE CONTROL to vacuumizing by this controller.ACTIVE CONTROL here can be understood that, dynamically controls right to choose, increases or reduce the amount that vacuumizes according to required deciding in the inherent filling process of die cavity.Explained as top that according to the fundamental method of the present invention, the process of extracting vacuum can be passed through this method Be Controlled, and, make control become possibility to encapsulation process.This also certainly improves the package quality of electronic component.Controller generally includes intelligent control unit, and this controller can directly be interfered the work of withdrawal device, realizes the control to vacuumizing in the die cavity.This controller can also be connected with withdrawal device, can be used as a pump or Wen system and uses, and the advantage of Wen system is that its structure is a kind of structure of very economical.
In the another one preferred embodiment, different is, described sealed in unit has an extracting channel, and this extracting channel is connected with die cavity, and the part of extracting channel wall is mobilizable, and like this, the extracting channel opening is changeable.This its activity form of mobilizable part is rotatable, and withdrawal device links to each other with die cavity by this extracting channel, and by mobilizable wall part, the extracting channel opening can get clogged, and realizes bigger or littler adjusting.So mobilizable wall part be single, operate reliable structure.For mobilizable purpose, withdrawal device can move under the driving of the driving mechanism of a part of forming controller, for example, and motor or air or hydraulically powered driving mechanism.
This equipment can also be concrete comprise the extracting channel that at least one and die cavity are connected with withdrawal device, and this passage has mobilizable a part of wall.Have fixing wall construction with at least one extracting channel that is connected with die cavity.The extracting channel (for example " blast pipe " of standard) that has the fixation wall structure has a relatively little opening, so just make encapsulating material not flow out die cavity by this passage, and the extracting channel that has movable wall can have big relatively opening, be in order to control the pressure in the die cavity dynamically like this, this extracting channel can realize complete closure of openings.The a limited number of gases that produce in the last filling stage of die cavity can be discharged by (little) extracting channel that has fixation wall.
In another embodiment, position sensor may detect the motion of piston, and this position sensor links to each other with controller, and the initial position of supposing piston is known, and piston position can be used for the accurate measurement to filling extent in the die cavity.Position of piston can determine that by the position sensing instrument externally measured (for example, in the die cavity external pelivimetry) can represent filling extent quickly and accurately.It is pointed out that in addition that here the air pressure in the exit that can be connected with die cavity by direct measurement is determined the die cavity internal gas pressure.
The present invention has also comprised the mould part that can use in the described in the present invention sealed in unit, this mould part comprises that at least has the extracting channel of removable wall as described above, utilizes this passage to make cavity pressure is carried out becoming possibility with dynamically controlling fast.And this extracting channel can be in the needed moment Be Controlled of setting, and this advantage was described in front.
The present invention not only is confined to described in the embodiment and shown in the accompanying drawings structure.
Description of drawings
Fig. 1 is the schematic diagram of equipment among the present invention.
Fig. 2 is the gas pressure in the sealed in unit die cavity and the correspondence graph of die cavity filling extent.
Fig. 3 A is the perspective view that the rotation wall part is shown in an open position in the present device.
Fig. 3 B is in the perspective view of detent position for rotation wall part among Fig. 3 A.
Fig. 3 C is the perspective view of Fig. 3 A and 3B device activity wall part.
Embodiment
Illustrated among Fig. 1, be used to encapsulate the equipment 1 of the electronic component 3 that is arranged on the carrier 2.Carrier is clamped in the middle of two mould parts 4,5, and electronic component 3 is in this can be incorporated in die cavity 6 like this, and die cavity 6 is in the left side of mold part 4.Encapsulating material 8 becomes liquid after heating, entered in the die cavity 6 by cast gate 9 under the promotion of piston 7.In order to make encapsulating material 8 be full of die cavity better, gas (being generally air, also may be the gas that volatilizes in the encapsulating material) can be extracted to the outside in the environment (referring to arrow P by extracting chamber 11 and extracting channel 12 under the effect of pump 10 1).
Equipment 1 also further comprises an intelligent controller 13, in this figure, be shown as computer, preferred this computer is equipped with that the program of many menus is available, and the interface is suitable for importing preset parameters, can dynamically control vacuum in the die cavity 6 in conjunction with correlation circumstance.Intelligent controller 13 is connected to inductor 14, can select wireless connections.Inductor 14 can transmit the position of piston 7.Full level in the die cavity 6 directly depends on the position (position of the quantity of encapsulating material 8 and piston 7 is determined in the time of can beginning by operation) of piston 7.To be used for selecting to relate to the relevant parameter that vacuumizes the pattern particular items dynamically and the measured value of transducer 14 be offered intelligent controller 13, control so that vacuumize in 13 pairs of die cavitys of intelligent controller, as shown in FIG., intelligent controller 13 direct control pumps 10.
As shown in Figure 2, be example with the line in the form 20 21, shown the pressure history in the die cavity (see among Fig. 1 6).What show on the X-axis 22 is filling extent (or position of piston (7, see Fig. 1)) in the die cavity, corresponding with the absolute value of pressure in the die cavity that shows on the Y-axis 23.From figure, can clearly be seen that, during beginning (for example: do not fill encapsulating material in the die cavity, or filling encapsulating material seldom), pressure in the die cavity compare higher (for example, pressure in the die cavity is only than a little bit smaller point of atmospheric pressure), when die cavity is further filled, owing to be filled with encapsulating material in the die cavity, it is very little vacuumizing the lifting of carrier of causing in the die cavity, and pressure can further reduce.Subsequently part in chart, pressure raises once more, and this is in order to prevent that encapsulating material begins at this moment " foaming ".When die cavity further is filled, pressure can be by minimizing clearly, even reaches only than high tens handkerchiefs of vacuum state (mbar).
What show among Fig. 3 A is the part contact-making surface of mould 30, and contact-making surface is provided with extracting channel 31, and extracting channel links to each other with die cavity 32 on one side, and connects the extracting channel 37 of passing mould at another side.Extracting channel 31 is provided with rotating wall 33, and the position of this wall that shows in Fig. 3 A is that extracting channel 31 is opened fully.It is pointed out that mould part 30 can adopt various ways, identical mirror-image structure has other die cavity 34, and extracting channel 35 and rotatable wall 36 also are simultaneously displayed among Fig. 3 A.
Fig. 3 B has shown the rotating wall 33 shown in Fig. 3 A, yet in this figure, its present position has rotated with respect to residing position among Fig. 3 A, and extracting channel 31 is closed owing to being rotated in to a great extent of wall 33.When to vacuumizing dynamic control still when carrying out in the die cavity 32, can stop encapsulating material by flowing out in the die cavity by rotation wall 33.
What show among Fig. 3 C is the side schematic view of extracting channel 31 and rotation wall 33.In die cavity 32, encapsulating material flows through on carrier 39, and the packed material of electronic component that is provided with on the carrier 39 floods and can't see.Cylinder 42 drives straight plate shape action bars 41 motions (referring to arrow P 3), action bars 41 drives the rotating shaft 40 that is connected on the rotation wall 33 and rotates (referring to arrow P 2), rotating shaft 40 driven rotary walls 33 rotate.The dynamic control of pressure in the die cavity 32 also can realize by manipulating cylinder 42 like this.

Claims (16)

1, a kind of utilization vacuumizes the method that encapsulation is arranged on the electronic component on the carrier, the steps include:
A) with in the die cavity that electronic component to be packaged is arranged on carrier is connected,
B) add hot encapsulation material and make it become liquid state,
C) by on liquid encapsulating material, exerting pressure encapsulating material inserted in the die cavity that comprises electronic component and
D) encapsulating material is filled up die cavity and
E) encapsulation material solidifies at least a portion die cavity;
It is characterized in that, at least at step B)-to vacuumize in to die cavity in the step in D) be effectively control.
2, the method described in claim 1 is characterized in that, vacuumizes control and is included in step B)-amount that vacuumizes increased in the step among D).
3, the method described in claim 1 or 2 is characterized in that, vacuumizes control and is included in step B)-amount that vacuumizes reduced in the step among D).
4, the method described in arbitrary as described above claim is characterized in that, vacuumize control relevant with the loading of die cavity.
5, the method described in arbitrary as described above claim is characterized in that, vacuumizes control and is effect realization by the withdrawal device that is connected with die cavity.
6, the method described in arbitrary as described above claim is characterized in that, the opening size of the extracting channel that is connected with die cavity is transformable.
7, the method described in claim 6 is characterized in that, can realize changing the extracting channel opening size of die cavity by the part in the rotation extracting channel.
8, the method described in arbitrary as described above claim is characterized in that, vacuumizes the variation that is controlled to be menu control and adapts to the course of work.
9, a kind of device that utilizes Vacuum Package to be arranged on the electronic component on the carrier comprises:
Mould part, its each part removably connects each other, can limit a die cavity that is used to place electronic component under closure state at least;
Filling device is used for the encapsulating material of liquid state is connected with die cavity, and uses at least one piston to be used for the supply of encapsulating material; With
Withdrawal device is connected with die cavity, is used for from the die cavity extracting gases;
It is characterized in that, have controller on the device, can control vacuumizing in the die cavity by this controller.
10, the device described in claim 9 is characterized in that, controller is connected with withdrawal device.
11, the device described in claim 9 or 10 is characterized in that, device comprises also and being arranged on the mould part that with the extracting channel that die cavity is connected with withdrawal device, the part wall of extracting channel can be movable, is used for adjusting the opening of extracting channel.
12, the device described in claim 11 is characterized in that, removable wall part is rotatable part wall.
13, as claim 11 or 12 described devices, it is characterized in that, device has at least one extracting channel that links to each other with die cavity and withdrawal device, and the part wall of extracting channel is movable, with at least one extracting channel that has the fixation wall structure that links to each other with die cavity.
14, as the described device of arbitrary claim among the claim 9-13, it is characterized in that piston is provided with position transducer, described position transducer links to each other with controller.
15, as the described device of arbitrary claim among the claim 9-14, it is characterized in that controller comprises driving mechanism.
As the mould part in the described device of arbitrary claim among the claim 9-15, it is characterized in that 16, mould part has a removable wall part described in claim 11-13 at least.
CN2008800050817A 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure Active CN101611483B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2000488 2007-02-15
NL2000488A NL2000488C2 (en) 2007-02-15 2007-02-15 Method and device for enveloping electronic components with the aid of underpressure.
PCT/NL2008/050088 WO2008100146A2 (en) 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure

Publications (2)

Publication Number Publication Date
CN101611483A true CN101611483A (en) 2009-12-23
CN101611483B CN101611483B (en) 2011-11-30

Family

ID=38514193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008800050817A Active CN101611483B (en) 2007-02-15 2008-02-15 Method and device for encapsulating electronic components using underpressure

Country Status (6)

Country Link
KR (1) KR101609276B1 (en)
CN (1) CN101611483B (en)
MY (1) MY158346A (en)
NL (1) NL2000488C2 (en)
TW (1) TWI441266B (en)
WO (1) WO2008100146A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102203927A (en) * 2011-06-22 2011-09-28 华为终端有限公司 Method for device plastic packaging and packaging structure
CN102209448A (en) * 2010-03-29 2011-10-05 奥托立夫开发公司 Protection box for circuit board and installation method of protection box
CN103213245A (en) * 2013-03-27 2013-07-24 国家电网公司 Vacuum cover for manufacturing mutual inductor and mutual inductor manufacturing device utilizing same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008022596A1 (en) * 2008-05-07 2009-11-12 Kraussmaffei Technologies Gmbh Method and device for producing a coated component
NL2003792C2 (en) * 2009-07-17 2011-01-18 Fico Bv METHOD AND DEVICE FOR COATING ELECTRONIC COMPONENTS WITH CONTROLLED GAS PRESSURE
KR102376487B1 (en) * 2015-02-12 2022-03-21 삼성전자주식회사 Manufacturing device of semiconductor package and method for manufacturing the same
DE102015011735B3 (en) * 2015-09-04 2016-11-10 Audi Ag Apparatus for producing a plastic molding and method for producing a plastic molding

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58155727A (en) * 1982-03-10 1983-09-16 Mitsubishi Electric Corp Mold for resin sealing of semiconductor device
JPS6395636A (en) * 1986-10-09 1988-04-26 Mitsubishi Electric Corp Resin sealing apparatus of semiconductor device
JP3305842B2 (en) * 1993-12-15 2002-07-24 住友ベークライト株式会社 Resin encapsulation method, semiconductor encapsulation device, and resin encapsulation semiconductor component
JP2806268B2 (en) * 1994-08-22 1998-09-30 日本電気株式会社 Resin sealing method for semiconductor device and resin sealing device used in the resin sealing method
JP3486557B2 (en) * 1998-07-30 2004-01-13 宮崎沖電気株式会社 Transfer molding apparatus and semiconductor device manufacturing method
JP4752576B2 (en) 2006-03-31 2011-08-17 豊田合成株式会社 Injection molding method and injection molding apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102209448A (en) * 2010-03-29 2011-10-05 奥托立夫开发公司 Protection box for circuit board and installation method of protection box
CN102209448B (en) * 2010-03-29 2015-03-25 奥托立夫开发公司 Protection box for circuit board and installation method of protection box
CN102203927A (en) * 2011-06-22 2011-09-28 华为终端有限公司 Method for device plastic packaging and packaging structure
WO2011150879A3 (en) * 2011-06-22 2012-05-24 华为终端有限公司 Method for encapsulating component and structure thereof
CN102203927B (en) * 2011-06-22 2013-04-24 华为终端有限公司 Method for device plastic packaging and packaging structure
US9082777B2 (en) 2011-06-22 2015-07-14 Huawei Device Co., Ltd. Method for encapsulating semiconductor and structure thereof
CN103213245A (en) * 2013-03-27 2013-07-24 国家电网公司 Vacuum cover for manufacturing mutual inductor and mutual inductor manufacturing device utilizing same
CN103213245B (en) * 2013-03-27 2015-11-18 国家电网公司 Transformer manufacture vacuum (-tight) housing and use the transformer manufacturing installation of this vacuum (-tight) housing

Also Published As

Publication number Publication date
KR20090118939A (en) 2009-11-18
CN101611483B (en) 2011-11-30
WO2008100146A3 (en) 2008-11-27
KR101609276B1 (en) 2016-04-05
TWI441266B (en) 2014-06-11
NL2000488C2 (en) 2008-08-18
MY158346A (en) 2016-09-30
TW200847303A (en) 2008-12-01
WO2008100146A2 (en) 2008-08-21

Similar Documents

Publication Publication Date Title
CN101611483B (en) Method and device for encapsulating electronic components using underpressure
CN110043038A (en) Vehicle-mounted wet shot arm-and-hand system and its application method
JP2019152205A (en) Suction device and suction moving method of suctioned body
CN203538338U (en) Static variable pressure curing machine for food
CN109624161B (en) Perfusion apparatus and control method thereof
CN209729276U (en) A kind of filling of sandpack column pipe and compacting apparatus
JP2012112358A (en) Mounting medium injector and method for manufacturing hollow engine valve
CN206013033U (en) A kind of honey can packing machine for being accurately controlled flow
CN207663870U (en) A kind of resistor filling sand device of automatic speed regulation
CN104150419A (en) Supercharged high viscosity filling machine
CN209115420U (en) A kind of ensilage binding apparatus invariable power hydraulic drive and control system
KR100963568B1 (en) Actuator for electronic valve
CN220931492U (en) Preassembled food cooling device
CN207698161U (en) A kind of semifluid packing machine
CN207199736U (en) Nitrogen injection device is vacuumized for lithium battery Soft Roll filling machine
JP4269070B2 (en) Discharge device for fluid substances
CN111791483A (en) Pulse type powder quantitative supply device and method thereof
Seah et al. Molding technology development of large QFN packages
EP1810765B1 (en) Method for pulsed pressure molding
CN213679765U (en) Flow monitoring device for granular liquid fertilizer containing filling machine
CN214875749U (en) Negative pressure type filling machine
JP3541292B2 (en) Coagulant supply device
CN220302571U (en) Bearing seat heat dissipation device for single-screw pump
CN203976361U (en) Pressure charged heavy body bottle placer
CN114601302B (en) City landscape design display simulation system

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: BESI NETHERLANDS B. V.

Free format text: FORMER NAME: FICO BV

CP01 Change in the name or title of a patent holder

Address after: Holland

Patentee after: Besi Netherlands BV

Address before: Holland

Patentee before: Fico BV