CN102209448A - Protection box for circuit board and installation method of protection box - Google Patents
Protection box for circuit board and installation method of protection box Download PDFInfo
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- CN102209448A CN102209448A CN2010101406584A CN201010140658A CN102209448A CN 102209448 A CN102209448 A CN 102209448A CN 2010101406584 A CN2010101406584 A CN 2010101406584A CN 201010140658 A CN201010140658 A CN 201010140658A CN 102209448 A CN102209448 A CN 102209448A
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- circuit board
- protection box
- exhaust passage
- packing material
- chamber
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Abstract
The invention relates to a protection box for a circuit board. The protection box has a general an L-shaped exhaust channel; the air intake end of the exhaust channel is positioned in an air cavity of a box body; and the air exhaust end of the exhaust channel is positioned in a filling cavity of the box body. When a filling material is not filled into the filling cavity, the L-shaped exhaust channel is communicated with the air cavity and the filling cavity through air; and when the filling material is filled into the filling cavity, an air exhaust area is covered and sealed by the filling material. When the protection box is used, the packaging of the circuit board and the sealing of the exhaust channel are finished in a step of filling the filling material, so an additional process of sealing an exhaust hole is eliminated, the box body has a simple structure and is low in cost, and the circuit board is reliable in installation.
Description
Technical field
The present invention relates to a kind of box body structure, particularly in order to install and to protect the box body structure that places the PCB circuit board in it.
Background technology
Printed circuit board (PCB) (PCB) belongs to common electric connecting mode, is electrically connected various electric components by welding usually on it.Along with the raising of precision, the increase of components and parts, PCB seems all the more the comparison fragility need provide necessary protection box body to prevent various foreign impacts and erosion.
Particularly for the car crass sensing system, have the electric component that comprises crash sensor and be placed on the PCB, then whole PCB is arranged in the box body, and it is sealed and protects by resin.Yet this seal process also can produce and residual fraction gas can't be discharged box body, thereby causes in the resin or surface generation bubble, and then influences sealing property.
U.S. Pat 7628948B2 discloses a kind of structure and method that produces gas in installation and the seal process of discharging.As shown in Figure 1, at first with the element 21 of PCB circuit board 22 up and be installed in the epicoele of box body 20, promptly the back side of pcb board 22 is towards the cavity of resorption of box body 20, and box body cavity of resorption place is provided with perforate 23; On element, add resin 24 then; Again resin 24 is handled curing, and the gas that is positioned at cavity of resorption 28 that produces in the process is discharged along arrow 25 directions from perforate 23; At last perforate 23 is sealed.The gas that this patent is produced during with resin solidification is discharged and follow-up sealing, has discharged gas and has prevented that again wet gas from entering in the box body by the hole.But what this patent was handled is the gas that produces in the resin solidification stage.
In fact, owing to packing material is generally viscosity, for example add resin, its meeting cause residual gas and then enter air chamber in the filling chamber, and the gas that this stage occurs also can influence encapsulation and the use formation of PCB.This main object that is only exhaust from the residual gas of filling the chamber.Simultaneously, prior art need be carried out extra plugging technology to steam vent again after resin solidification is handled, and it is not economical therefore making processing, and time and processing cost are excessive.
Be to solve PCB at the gaseous emission that adds resin stage, the blibbing after avoiding encapsulating occurs, and reaches the technical problem that technology is simple, cost is low simultaneously, and a kind of protection box of new PCB circuit board need be provided.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of protection box and installation method thereof of PCB circuit board.Wherein, this protection box comprises: be used to place the also brace table of support circuit plate; described brace table is separated described protection box and form the filling chamber and the air chamber of gas connection; hold in the described filling chamber and state circuit board to some extent and described circuit board is encapsulated in packing material in the filling chamber of described protection box; the exhaust passage; described exhaust passage has the air inlet area that is positioned at air chamber; it is characterized in that: described exhaust passage also has the exhaust area that is positioned at described filling chamber; when not dosing packing material; described exhaust passage gas is communicated with described air chamber and fills the chamber; when finishing when dosing packing material, described exhaust area is by sealing that described packing material covers.
As further improvement, described exhaust passage can be hole shape or flute profile.Described hole shape is L shaped hole, and an end in L shaped hole is arranged in air chamber as air inlet area, and the other end is arranged in the filling chamber as exhaust area.
With the installation method of corresponding this structure of said structure be, at first circuit board be installed on the brace table of described protection box, then, in the protection box, inject packing material and reach the required thickness of dimensional packaged circuit board always.Preferably, the position of injection packing material is positioned at the opposite side of described exhaust passage.
After adopting technology of the present invention, in the encapsulation process initial period, original gas of filling the chamber that is positioned at that encapsulation is produced enters air chamber, and be discharged to through described exhaust passage and fill the chamber, and the not sealing of the filling chamber of this moment, so gas can freely be discharged, when continuing encapsulation, the exhaust gas region of exhaust passage just can be filled and encapsulate to packing material, and when finishing encapsulation, described exhaust gas region also is filled material and seals.This technology has only adopted once encapsulation to fill, and need not again exhaust outlet to be carried out extra shutoff operation, so technology is simple and save time.Simultaneously, also obtain discharge from the gas of filling the chamber in the filling process, guaranteed the encapsulation requirement.
Description of drawings
Fig. 1: prior art generalized section;
Fig. 2: the schematic perspective view of first embodiment of the invention;
Fig. 3: the schematic diagram of first embodiment of the invention mounting circuit boards step;
Fig. 4 A: the schematic diagram in the first embodiment of the invention encapsulation process;
Fig. 4 B: the schematic diagram that the first embodiment of the invention encapsulation finishes;
Fig. 5: the schematic diagram of second embodiment of the invention;
Fig. 6: the schematic diagram of third embodiment of the invention.
Embodiment
Fig. 1 is the schematic diagram of prior art.As shown in Figure 1, at first with the element 21 of PCB circuit board 22 up and be installed in the epicoele of box body 20, promptly the back side of pcb board 22 is towards the cavity of resorption of box body 20, and box body cavity of resorption place is provided with perforate 23; On element, add resin 24 then; Again resin 24 is handled curing, and the gas that is positioned at cavity of resorption 28 that produces in the process is discharged along arrow 25 directions from perforate 23; At last perforate 23 is sealed.The gas that this patent is produced during with resin solidification is discharged and follow-up sealing, has discharged gas and has prevented that again wet gas from entering in the box body by the hole.But what this patent was handled is the gas that produces in the resin solidification stage.
Fig. 2 to Fig. 4 B is the schematic diagram of the first embodiment of the present invention, provides a kind of circuit board protection box 1 as figure, protects usually to also have link 5 on the box body 1 to realize PERCOM peripheral communication.Comprise on this protection box 1: be used to place the also brace table 7 of support circuit plate 2, described brace table 7 is separated described protection box 1 and form the filling chamber 10 and the air chamber 8 of gas connection; Hold the packing material 9 in the filling chamber 10 of stating circuit board 2 to some extent and described circuit board 2 being encapsulated in described protection box 1 in the described filling chamber 10; Exhaust passage 3, described exhaust passage 3 has the air inlet area 31 that is positioned at air chamber 8; Wherein: described exhaust passage 3 also has the exhaust area 32 that is positioned at described filling chamber 10, when not dosing packing material 9, described exhaust passage 3 gases are communicated with described air chamber 8 and fill chamber 10, and when finishing when dosing packing material 9, described exhaust area 32 is by described packing material 9 sealing that covers.
In first embodiment, exhaust passage 3 is the exhaust passage 3 of hole shape, as shown is L shaped hole, and an end in described L shaped hole is arranged in described air chamber 8 as inlet end 31, and its other end is arranged in described filling chamber 10 as exhaust end 32.Wherein fill chamber 10 and comprise the fill area 4 of exhaust end 32 tops that are positioned at exhaust passage 3.Therefore, when not having packing material 9, shown in Fig. 2 and 3, exhaust passage 3 is being communicated with filling chamber 10 and air chamber 8, and the gas in the air chamber 8 can be along the exhaust passage 3 be discharged to and fills chamber 10, reaches emptying.And when the initial stage and the mid-term that enter the filling stage, shown in Fig. 4 A, owing to adopt L shaped hole, exhaust passage 3 still can be communicated with above-mentioned two chambeies, reaches the purpose of emission gases 11.When continue filling when reaching the thickness of required dimensional packaged circuit board; also be filled material 9 sealing that covers owing to be positioned at the fill area 4 of filling chamber 10 (being in the side of gas discharge) above the exhaust end 32; therefore exhaust passage 3 no longer is communicated with the external world; reached the purpose of finally sealed, prevented that outside air and dust etc. from entering in the protection box once more.
Preferred using method is that the filling position of packing material is the opposite side that is positioned at described exhaust passage.Because the viscosity of packing material, it will be progressively close to a side that is positioned at the exhaust passage, and row can enter the filling chamber from the exhaust passage to the gas of air chamber in this process, promptly in Shang Fang the air.When packing material reached a side of exhaust passage, because the exhaust passage is L shaped, so packing material can't be with its exhaust end sealing, and the packing material of viscosity is pushed the gas that enters air chamber and still can be discharged to outside the chamber.Reach above it and when covering sealing, the gas that is pushed through in the air chamber is discharged fully, even packing material all seals the exhaust end of exhaust passage, also will not have gas and discharge and form bubble when packing material is accumulated at exhaust passage place gradually.Therefore structure of the present invention and fill at the opposite side of exhaust passage has both guaranteed the speed and the time of filling, and has also guaranteed the gas purging time simultaneously, to reach the purpose that prevents bubble.
As seen said structure has in use been realized the technique effect that exhaust and sealing are finished in the filling stage simultaneously; can avoid protecting the interior gas of box to form bubble at packing material; for example resin material also can be avoided in the additional process of finishing encapsulation back shutoff steam vent simultaneously.
As preferred embodiment, the exhaust end 32 of described L shaped exhaust passage 3 is located at usually near the upper surface of described packing material 9 and by described packing material 9 sealing of filling.This set can prolong the gas purging time when filling cohesive material, make can discharge smoothly by filling the gas that the chamber enters air chamber.And simultaneously, be positioned at fill chamber 10 be used to cover sealing exhaust end 32 fill area 4 also need have rational area and thickness, to guarantee thorough sealing, prevent the generation of bubble and the intrusion in the external world to the exhaust passage.
As further preferred, the electric component 12 on the described circuit board 2 is arranged in described air chamber 8, and the pin by being positioned at link 56 is electrically connected with the external world.In preferred mode, electric component 12 has been avoided the direct effect with packing material towards following air chamber, the stress to the electric component pin of also having avoided packing material to be produced in curing simultaneously.Make that electric component 12 protections are more perfect.Simultaneously, also occupied the volume of air chamber, made inner air reduce, so also reduced the pressure of gas because of being heated and expanding and produced in the solidification process, made the dimensional packaged circuit board that packing material is more airtight towards the electric component 12 of air chamber.
That Fig. 2 to 4B shows is first embodiment that adopts the exhaust passage in L shaped hole.As disclosed other specific embodiment, shown in the exhaust passage can also be other the hole of shape or the combination in groove or groove and hole.Conceivablely be that described flute profile exhaust passage is to be located at the connection described filling chamber on the described box body and the straight-line groove of described air chamber.Because the curvature of groove is less, the packing material of viscosity can't seal in the filling process in the early stage, so it still can continue to discharge cavity of resorption, i.e. gas in the air chamber, and to when finishing encapsulation, groove is capped and seals with extraneous after packing material reaches certain thickness.
As shown in Figure 5, as an embodiment, the combination shape exhaust passage of described hole and groove is to be positioned at the hole shape part of described brace table below 7 channel-shaped portion above with being positioned at described brace table to divide combination to form.This combination also has above-mentioned technical characterictic essence and can solve existing technical problem.Gas in the air chamber partly enters by hole shape and discharges from the part of flute profile.This kind structure makes that box body processing is more simple, and structure is compact more.
As another kind of embodiment, comprise the situation at least one described L shaped hole on the described protection box.Fig. 6 reality be situation with 3 L shaped holes.Certainly, as improvement, the exhaust passage also can be a L shaped passage with bigger aperture area, for example rectangular inlet port and exhaust outlet.
Claims (10)
1. a circuit board is protected box, and it comprises:
Be used to place the also brace table of support circuit plate, described brace table is separated described protection box and form the filling chamber and the air chamber of gas connection;
Hold in the described filling chamber and state circuit board to some extent and described circuit board is encapsulated in packing material in the filling chamber of described protection box;
The exhaust passage, described exhaust passage has the air inlet area that is positioned at air chamber; It is characterized in that:
Described exhaust passage also has the exhaust area that is positioned at described filling chamber, and when not dosing packing material, described exhaust passage gas is communicated with described air chamber and fills the chamber, and when finishing when dosing packing material, described exhaust area is by sealing that described packing material covers.
2. circuit board protection box as claimed in claim 1, it is characterized in that: described exhaust passage is the combination of hole shape, flute profile or hole and groove.
3. circuit board protection box as claimed in claim 2, it is characterized in that: described hole shape exhaust passage is L shaped, and an end in described L shaped hole is arranged in described air chamber as inlet end, and its other end is arranged in described filling chamber as exhaust end.
4. circuit board protection box as claimed in claim 3, it is characterized in that: the exhaust end in described L shaped hole is near the upper surface of described packing material and by sealing that described packing material is filled.
5. circuit board protection box as claimed in claim 1, it is characterized in that: the electric component on the described circuit board is arranged in described air chamber.
6. circuit board as claimed in claim 2 protection box is characterized in that: described flute profile exhaust passage is to be located at the connection described filling chamber on the described box body and the straight-line groove of described air chamber.
7. circuit board protection box as claimed in claim 2 is characterized in that: the combination shape exhaust passage of described hole and groove is to be positioned at the following hole shape part of described brace table and to be positioned at the above channel-shaped portion of described brace table to divide combination.
8. circuit board protection box as claimed in claim 3 is characterized in that: comprise at least one described L shaped hole on the described protection box.
9. the installation method of circuit board protection box: step 1 mounting circuit boards step is installed in circuit board on the brace table of protection box as claimed in claim 1; Step 2 is injected the packing material step, injects packing material to reaching the required thickness of dimensional packaged circuit board in described protection box; Step 3 curing filler material step.
10. the installation method of circuit board protection box as claimed in claim 9, it is characterized in that: in step 2, the position of injecting described packing material is positioned at the opposite side of described exhaust passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010140658.4A CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010140658.4A CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102209448A true CN102209448A (en) | 2011-10-05 |
| CN102209448B CN102209448B (en) | 2015-03-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010140658.4A Active CN102209448B (en) | 2010-03-29 | 2010-03-29 | Protection box for circuit board and installation method of protection box |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259652A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Manufacturing system for thin-film multilayer substrate |
| CN1171310A (en) * | 1996-04-19 | 1998-01-28 | 新东工业株式会社 | Method of filling cores with molding sand |
| CN1525910A (en) * | 2001-07-09 | 2004-09-01 | 诺德森公司 | Method and apparatus for underfilling electronic components using vacuum assist |
| US20050285307A1 (en) * | 2004-06-24 | 2005-12-29 | Siemens Vdo Automotive Corporation | Alternate vent hole sealing method |
| CN101023521A (en) * | 2004-07-29 | 2007-08-22 | 菲科公司 | Mould part and method for encapsulating electronic components |
| WO2009013139A1 (en) * | 2007-07-26 | 2009-01-29 | Takata-Petri Ag | Venting device |
| CN101611483A (en) * | 2007-02-15 | 2009-12-23 | 飞科公司 | Utilize the method and apparatus of Vacuum Package electronic devices and components |
-
2010
- 2010-03-29 CN CN201010140658.4A patent/CN102209448B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05259652A (en) * | 1992-03-13 | 1993-10-08 | Hitachi Ltd | Manufacturing system for thin-film multilayer substrate |
| CN1171310A (en) * | 1996-04-19 | 1998-01-28 | 新东工业株式会社 | Method of filling cores with molding sand |
| CN1525910A (en) * | 2001-07-09 | 2004-09-01 | 诺德森公司 | Method and apparatus for underfilling electronic components using vacuum assist |
| US20050285307A1 (en) * | 2004-06-24 | 2005-12-29 | Siemens Vdo Automotive Corporation | Alternate vent hole sealing method |
| CN101023521A (en) * | 2004-07-29 | 2007-08-22 | 菲科公司 | Mould part and method for encapsulating electronic components |
| CN101611483A (en) * | 2007-02-15 | 2009-12-23 | 飞科公司 | Utilize the method and apparatus of Vacuum Package electronic devices and components |
| WO2009013139A1 (en) * | 2007-07-26 | 2009-01-29 | Takata-Petri Ag | Venting device |
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| Publication number | Publication date |
|---|---|
| CN102209448B (en) | 2015-03-25 |
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| C06 | Publication | ||
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| C14 | Grant of patent or utility model | ||
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180706 Address after: Sweden Wogaerda Patentee after: Vennell Sweden Address before: Wal Valley, Sweden Patentee before: AUTOLIV DEVELOPMENT AB |
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| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230506 Address after: Stockholm, SWE Patentee after: Vinier Passive Systems Co.,Ltd. Address before: Sweden Wogaerda Patentee before: Vennell Sweden |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Stockholm, SWE Patentee after: Vinninger Swedish Security Systems Address before: Stockholm, SWE Patentee before: Vinier Passive Systems Co.,Ltd. |