CN217467925U - LED digital tube shell structure with back glue filling - Google Patents
LED digital tube shell structure with back glue filling Download PDFInfo
- Publication number
- CN217467925U CN217467925U CN202221250638.7U CN202221250638U CN217467925U CN 217467925 U CN217467925 U CN 217467925U CN 202221250638 U CN202221250638 U CN 202221250638U CN 217467925 U CN217467925 U CN 217467925U
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- China
- Prior art keywords
- pcb
- led
- light guide
- side wall
- height
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- 239000003292 glue Substances 0.000 title claims description 9
- 230000002093 peripheral effect Effects 0.000 claims abstract description 4
- 239000004033 plastic Substances 0.000 claims description 17
- 238000007789 sealing Methods 0.000 claims description 10
- 239000004593 Epoxy Substances 0.000 abstract description 11
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000003014 reinforcing effect Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005429 filling process Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
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- Led Device Packages (AREA)
Abstract
The utility model discloses a LED nixie tube structure of back encapsulating, mould shell, leaded light cover, PCB side wall, edge seal step including the LED nixie tube, the LED nixie tube is moulded and is provided with a plurality of integrated into one piece's leaded light cover in the shell, the peripheral encirclement of leaded light cover is provided with the PCB side wall, the root of PCB side wall is provided with integrated into one piece's edge seal step. In this way, the utility model provides a LED charactron structure of back encapsulating makes the PCB and the step of LED charactron closely laminate, and the epoxy can't leak to the bottom from PCB and the clearance of moulding the shell, guarantees the gas tightness of product, and protection PCB is isolated with the air, strengthens the reliability of product.
Description
Technical Field
The utility model relates to a LED digital display module field especially relates to a digital tube structure of LED of back encapsulating.
Background
At present, household electrical appliance nixie tubes on the market have higher requirements on moisture prevention and moisture prevention, but the product size is larger, and the glue filling process can cause larger deformation, so the back glue filling process is generally selected, the wiring hole on the PCB is plugged by using printing ink, and after the PCB and a plastic shell are subjected to hot riveting, a layer of silicon resin or epoxy resin is injected on the back to seal.
Due to the existence of tolerance during processing, such as the working procedures of drilling, V cutting, edge milling and the like, the PCB and the inner cavity of the plastic shell cannot be perfectly matched without clearance, a clearance with a single side of 0.15-0.2mm exists between the positioning hole of the PCB and the positioning column of the plastic shell, and a clearance with a single side of 0.2-0.3mm exists between the PCB and the side wall of the plastic shell. Epoxy resin has strong fluidity and can leak into the plastic shell along the gaps, so that the epoxy quantity on the back of the product is reduced, and the following problems are caused:
1. because PCB back printing has solder mask oil, and solder mask oil surface is smooth, and under the less condition of epoxy volume, the unable even adhesion of epoxy can expose partial PCB, has lost the protection to the circuit, and the circuit is gradually oxidized along with time, leads to the product to open circuit at last and scraps.
2. When the back epoxy seepage is too much, the epoxy volume is too little, can lead to PCB and the unable epoxy solidification of leaning on in clearance of moulding the shell to stop up, can lose the protection to the product gas tightness, can't reach dampproofing damp-proof effect, can't cross customer's high temperature and high humidity experiment.
3. When epoxy leaks to the joint of the PCB and the plastic shell, the PCB may be arched due to expansion and contraction and internal stress when being baked and cured, resulting in light leakage of the product.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the main technical problem who solves provides a LED charactron structure of back encapsulating, makes the PCB and the step of LED charactron closely laminate, and the epoxy can't leak to the bottom in PCB and the clearance of moulding the shell, guarantees the gas tightness of product, and protection PCB is isolated with the air, strengthens the reliability of product.
In order to solve the technical problem, the utility model discloses a technical scheme be: the utility model provides a LED nixie tube shell structure of back encapsulating, mould the shell including the LED nixie tube, leaded light cover, PCB side wall, edge seal step, be provided with a plurality of integrated into one piece's leaded light cover in the LED nixie tube moulds the shell, the peripheral encirclement of leaded light cover is provided with the PCB side wall, the root of PCB side wall is provided with integrated into one piece's edge seal step.
In the utility model discloses a preferred embodiment, a plurality of vertical PCB reference columns that set up in LED charactron moulds shell are arranged between the leaded light cover, the root of PCB reference column is provided with the sealed step of via hole.
In a preferred embodiment of the present invention, the height of the end surface of the light guide cover inside the plastic housing of the LED digital tube is equal to the height of the edge sealing step.
In a preferred embodiment of the present invention, the height of the end surface of the light guide cover inside the plastic housing of the LED nixie tube is equal to the height of the via hole sealing step.
In a preferred embodiment of the present invention, a plurality of reinforcing ribs are disposed between the light guide covers, and a plurality of reinforcing ribs are disposed between the PCB side wall and the LED nixie tube plastic housing.
In a preferred embodiment of the present invention, the light guide cover has one or more light passing holes, and the end surface height of all the light passing holes is flush with the height of the side wall of the PCB.
The utility model has the advantages that: the utility model provides a pair of LED charactron structure of back encapsulating makes the PCB and the step of LED charactron closely laminate, and the epoxy can't leak to the bottom in PCB and the clearance of moulding the shell, guarantees the gas tightness of product, and protection PCB is isolated with the air, strengthens the reliability of product.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained without inventive work, wherein:
fig. 1 is a structural diagram of a preferred embodiment of the LED digital tube structure with glue filled on the back of the utility model.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it should be apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
As shown in fig. 1, the embodiment of the present invention includes:
the utility model provides a back encapsulating's LED charactron shell structure, moulds 1, leaded light cover 2, PCB side wall 3, edge seal step 401 including the LED charactron, the LED charactron is moulded and is provided with a plurality of integrated into one piece's leaded light cover 2 in the mould 1, 2 peripheral encircles of leaded light cover are provided with PCB side wall 3, the root of PCB side wall 3 is provided with integrated into one piece's edge seal step 401.
A plurality of PCB positioning columns 5 vertically arranged in the LED nixie tube plastic shell 1 are arranged between the light guide covers 2, and the root parts of the PCB positioning columns 5 are provided with via hole sealing steps 402.
Further, the height of the end face of the light guide cover 2 located on the inner side of the LED nixie tube plastic case 1 is equal to the height of the edge sealing step 401.
Further, the height of the end face of the light guide cover 2 located on the inner side of the LED nixie tube plastic case 1 is equal to the height of the via hole sealing step 402.
Further, a plurality of reinforcing ribs 6 are arranged between the light guide cover 2, and a plurality of reinforcing ribs 6 are arranged between the PCB side wall 3 and the LED nixie tube plastic shell 1.
Further, the light guide cover 2 is provided with one or more light through holes, and the end surface height of all the light through holes is flush with the height of the PCB side wall 3.
This product respectively increases sealed step at 3 inboard roots of side wall and 5 roots of reference column, and the step height flushes with light guide cover 2, and when the installation, the PCB at LED module place is installed on light guide cover 2 by corresponding, and the terminal surface of light guide cover 2 is in the same place with the close laminating of PCB, and the LED chip correspondence is arranged at light guide cover 2 center, makes the terminal surface of light guide cover 2 form luminous cavity face, and the light that should give out light the cavity face and send shines out from logical unthreaded hole.
In addition, a yielding notch can be arranged on the sealing step as required, and the interference with a PIN needle or a socket of the LED module is avoided. Like this, sealed step just can protect the PIN needle as required, avoids being blocked on sealed step and leads to the light leak problem.
The utility model discloses a key point includes:
1. a sealing step is added on the side wall 3 and the positioning column 5;
2. the step height is flush with the light-emitting cavity surface;
3. the step is provided with an avoiding notch.
To sum up, the utility model provides a LED charactron structure of back encapsulating makes the PCB and the step of LED charactron closely laminate, and the epoxy can't leak to the bottom in PCB and the clearance of moulding the shell, guarantees the gas tightness of product, and protection PCB is isolated with the air, strengthens the reliability of product.
The above only is the embodiment of the present invention, not limiting the patent scope of the present invention, all of which utilize the equivalent structure or equivalent flow transformation made by the content of the specification of the present invention, or directly or indirectly applied to other related technical fields, all included in the same way in the patent protection scope of the present invention.
Claims (6)
1. The utility model provides a back encapsulating's LED charactron shell structure, its characterized in that, moulds shell, light guide cover, PCB side wall, edge seal step including the LED charactron, be provided with a plurality of integrated into one piece's light guide cover in the LED charactron moulds shell, the peripheral encirclement of light guide cover is provided with the PCB side wall, the root of PCB side wall is provided with integrated into one piece's edge seal step.
2. The back-glue LED nixie tube package structure as claimed in claim 1, wherein a plurality of PCB positioning posts vertically disposed in the LED nixie tube plastic housing are disposed between the light guide covers, and a via hole sealing step is disposed at a root of the PCB positioning posts.
3. The back-glue-filled LED digital tube shell structure as claimed in claim 1, wherein the height of the end surface of the light guide cover located at the inner side of the plastic shell of the LED digital tube is equal to the height of the edge sealing step.
4. The back-glue LED nixie tube package structure according to claim 2, wherein the height of the end surface of the light guide cover inside the plastic housing of the LED nixie tube is equal to the height of the via hole sealing step.
5. The back-glue LED nixie tube package structure as claimed in claim 1, wherein a plurality of ribs are disposed between the light guide covers, and a plurality of ribs are disposed between the PCB side wall and the LED nixie tube plastic housing.
6. The back-filled LED digital package structure according to claim 1, wherein the light guide cover has one or more light-passing holes, and the height of the end surface of all the light-passing holes is flush with the height of the side wall of the PCB.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221250638.7U CN217467925U (en) | 2022-05-23 | 2022-05-23 | LED digital tube shell structure with back glue filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221250638.7U CN217467925U (en) | 2022-05-23 | 2022-05-23 | LED digital tube shell structure with back glue filling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217467925U true CN217467925U (en) | 2022-09-20 |
Family
ID=83278364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221250638.7U Active CN217467925U (en) | 2022-05-23 | 2022-05-23 | LED digital tube shell structure with back glue filling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217467925U (en) |
-
2022
- 2022-05-23 CN CN202221250638.7U patent/CN217467925U/en active Active
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