CN105318080B - A kind of electric expansion valve, electrical-coil, circuit board assemblies and glue-pouring method - Google Patents
A kind of electric expansion valve, electrical-coil, circuit board assemblies and glue-pouring method Download PDFInfo
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- CN105318080B CN105318080B CN201410366614.1A CN201410366614A CN105318080B CN 105318080 B CN105318080 B CN 105318080B CN 201410366614 A CN201410366614 A CN 201410366614A CN 105318080 B CN105318080 B CN 105318080B
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Abstract
The invention discloses a kind of electric expansion valves, electrical-coil and circuit board assemblies, circuit board assemblies include shell, the circuit board that connector and setting are connect inside the shell and with the connector, shell includes the first shell and second housing, circuit board accommodating chamber is formed with after first shell and second housing cooperation are fixed, circuit board is arranged in circuit board accommodating chamber, encapsulating entrance is provided on shell, at least formed with the first encapsulating layer and the second encapsulating layer in circuit board accommodating chamber, electronic component on first encapsulating layer encapsulating circuit board, encapsulating entrance on second encapsulating layer encapsulating shell, and the first encapsulating layer is flexible glue, second encapsulating layer is corrosion resistance glue, second encapsulating layer obstructs the first encapsulating layer and contacts with the external world.Waterproof performance, corrosion resistance and cold-resistant thermal shock resistance properties can be effectively improved, and structure is simple, processing and installation is easy, at low cost.
Description
Technical field
The present invention relates to field of mechanical technique, and in particular to a kind of idle call components.
Background technique
It include a large amount of electric-controlled parts in automobile, the mobility of automobile determines automobile-used electric-controlled parts in use process
It is middle will the very harsh environmental condition of experience, for example the waterproof requirement of some electric-controlled parts reaches the requirement of IP9K, for another example resistance to-
40 DEG C are switched to 125 DEG C of (or opposite) impacts, thousands of circulations of bump in 30 seconds.Since automobile may undergo complexity
Environment, so have a very high requirement to auto parts and components, and as in automobile-used component automation control pith it is automatically controlled
Component is also required to requirement with higher, and which includes preferable waterproofs and cold-resistant thermal shock.
Electric control part is in automobile-used component in order to reach the requirement of preferable waterproof and cold-resistant thermal shock, common scheme have with
Under it is several:
Scheme 1, electric-controlled plate outside are surrounded with closed shell；
Scheme 2, glue is filled around electric-controlled plate, and outside is protected with closed shell again.
For scheme 1 in the prior art, in order to reach the waterproof requirement of electric control part, completely by shelling machine come real
It is existing, all have high requirements to shelling machine, outer casing mold, sheathing material selection aspect in this way, can correspondingly improve component cost.
For scheme 2 in the prior art, internal encapsulating can reduce to a certain extent designs and produces aspect to shell
Requirement, but it is general there is still a need for being designed using closed shell because in order to enable electronic component obtained it is cold-resistant
The problem of thermal shock effect, inevitable requirement institute encapsulating water is flexible glue, but flexible glue is brought is poor corrosion resistance, cannot be directly exposed
Outside, therefore there is still a need for cooperated using closed shell design.Moreover, encapsulating is more tired in closed shell
Difficulty is easy after encapsulating to form bubble in inside.
Therefore how to provide a kind of electric-controlled parts with preferable waterproof and cold-resistant thermal shock is those skilled in the art
Technical problem urgently to be solved.
Summary of the invention
In order to solve the above technical problems existing in the prior art, the present invention provides a kind of electric expansion valves, motor
Coil and circuit board assemblies, by there is electronic component part that software is perfused in circuit board assemblies, with extraneous contact portion
Corrosion resistant glue is perfused, can be effectively solved above-mentioned technical problem.
The present invention provides a kind of electric expansion valve, including electrical-coil, valve body and core assembly, is arranged in the valve body
There is refrigerant circulation passage, the core assembly includes spool, and the valve port corresponding to the spool, institute are additionally provided in the valve body
State spool can valve port movement relatively, and then control the aperture of the valve port, the coil includes coil injection molding part and electricity
Road board group part, the coil injection molding part are connect with circuit board assemblies, and the circuit board assemblies include shell, connector and setting
The circuit board connecting in the shell and with the connector, the shell include the first shell and second housing, and described the
One shell and the second housing are fixedly installed, and circuit board accommodating chamber is formed in the shell, and the circuit board is arranged in institute
It states in circuit board accommodating chamber, encapsulating entrance is provided on the shell, first shell and the second housing cooperate
The encapsulating entrance is formed, the encapsulating entrance is located at the side of the connector, is at least formed in the circuit board accommodating chamber
There are the first encapsulating layer and the second encapsulating layer, the electronic component on the circuit board is located at the first encapsulating layer, the shell
On encapsulating entrance sealed by the second encapsulating layer, and the first encapsulating layer be flexible glue, the second encapsulating layer be it is resistance to
Corrosivity glue, the second encapsulating layer obstruct the first encapsulating layer and contact with the external world, and the second encapsulating layer is directly contacted with the external world,
The connector includes inserted sheet, and the connector is connect by the inserted sheet with the circuit board, the inserted sheet and the circuit
Junction between plate is located in the first encapsulating layer.
The corrosion resistance glue is epoxy resin, and the solidification temperature of the epoxy resin is greater than the solidification temperature of the flexible glue
Degree, and the solidification temperature of the epoxy resin is less than or equal to 130 DEG C.
Described in the connector includes connector housings and one end is arranged in the connector housings, the other end stretches out
The inserted sheet of connector housings；Boundary layer between the first encapsulating layer and the second encapsulating layer be located at the inserted sheet with it is described
The top of junction between circuit board.
The shell includes the first shell and second housing, and all side walls of first shell surround to form accommodating chamber, institute
One week side wall for stating the first shell is arranged in being open, and is open in all side walls of opening setting including first on first shell
End, the second open end and the first auxiliary section, first open end and the second open end are located at first auxiliary section
Both sides；The second housing is equipped with first shell, and all side walls of the second housing, which also surround, forms accommodating chamber,
And one week side wall of the second housing is also in opening setting, in all side walls of opening setting includes the on the second housing
Three open ends, the 4th open end and the second auxiliary section, the third open end and the 4th open end are located at described second and match
The both sides in conjunction portion.
First shell further includes first support portion at four angles of the accommodating chamber on first shell, second
Support portion, third support portion and the 4th support portion, first support portion, the second support portion, third support portion and the 4th
The height of support part lower than first shell week side wall height, and first support portion and the 4th support portion are respectively with described the
The end face of the end face of two open ends and the first open end maintains a certain distance；The first limit is additionally provided on first shell
Portion, first limiting section are located on all side walls on first shell in opening setting, the height of first limiting section
Higher than the height of first support portion, the circuit board and the first limiting section proximity are arranged.
First auxiliary section includes at least one second limiting section and the depressed section adjacent with second limiting section；
Second auxiliary section also includes at least one third limiting section and the depressed section adjacent with the third limiting section；Described
One auxiliary section and the second auxiliary section are arranged in relative engagement, when first auxiliary section and the second auxiliary section cooperate, described second
Limiting section and third limiting section surround the depressed section on depressed section and second auxiliary section on first auxiliary section；
The groove of an annular is additionally provided in the connector housings, the connector is matched by first auxiliary section and described second
Conjunction portion, which cooperates, to be caught in the groove and fixes, and first auxiliary section and second auxiliary section surround described connect
Plug-in unit.
The first open end on first shell and the third open end on the second housing complement each other to form for
First opening portion, the second open end on first shell are complemented each other to form with the 4th open end on the second housing
For the second opening portion, the encapsulating entrance includes first opening portion and the second opening portion, first opening portion and second
It is sealed by the second encapsulating layer opening portion；Line of demarcation between the second encapsulating layer and the first encapsulating layer is located at described first
The lower section of limiting section.
First shell and second housing are fixed by being welded to connect, and first shell is set at the position for welding
It is equipped with the bump of at least one shape at an acute angle, the bump is arranged along the connecting portion of the first shell in continuous, described
It is also equipped with corresponding bump, the protrusion of first shell and the recesses fit of second housing on second housing, described
The recesses fit of the protrusion of two shells and the first shell.
The present invention also provides a kind of glue-pouring method of electric expansion valve, the electric expansion valve includes circuit board assemblies, institute
The method of stating includes the following steps:
At least part of glue input unit protrudes into circuit board accommodating chamber from encapsulating entrance to the circuit being completed
Flexible glue is poured into board group part, flexible glue can slowly rise from bottom；
After equal flexible glues at least seal the electronic component on circuit board, solidify flexible glue at a certain temperature, flexible glue is consolidated
Changing temperature can be less than or equal to 60 degrees Celsius；
After the completion of flexible glue solidification, then epoxy resin adhesive liquid is poured into from encapsulating entrance make it at least and can completely cut off flexible glue and external
Contact, and maintained a certain distance between the liquid level of epoxy resin adhesive liquid and the end face of encapsulating entrance；
Solidify epoxy resin adhesive liquid at a certain temperature later, the solidification temperature of epoxy resin can be higher than flexible glue
Solidification temperature, and be less than or equal to 130 degrees Celsius；
In Curing Process of Epoxy, flexible glue expanded by heating, flexible glue can be lifted epoxide-resin glue during expansion
Liquid.
The present invention also provides a kind of electrical-coil, including coil injection molding part and circuit board assemblies, the coil injection molding part with
Circuit board assemblies are fixedly connected, and nut cap is provided with above the coil injection molding part, is provided with installation below the coil injection molding part
Part, the circuit board assemblies include the first shell, second housing, connector and are arranged in the shell and patch with described
The circuit board of part connection, first shell and second housing cooperation are formed with the first opening portion, the second opening after fixing
Portion and circuit board accommodating chamber, the circuit board accommodating chamber are interior at least formed with the first encapsulating layer and the second encapsulating layer, the circuit
Electronic component on plate is located at the first encapsulating layer, and first opening portion and the second opening portion are by the second encapsulating layer
Sealing, and the first encapsulating layer is flexible glue, and the second encapsulating layer is epoxy resin, the second encapsulating layer barrier first
Encapsulating layer is contacted with the external world, and the second encapsulating layer is directly contacted with the external world, and the circuit board assemblies further include being positioned close to
At least one first limiting section of first opening portion and/or the second opening portion, between the second encapsulating layer and the first encapsulating layer
Line of demarcation be located at the lower section of first limiting section；It is respectively arranged on first shell and second housing substantially in character cut in bas-relief
The first auxiliary section and the second auxiliary section of shape, offer the groove of annular on the connector, and the connector passes through described the
One auxiliary section and second auxiliary section, which cooperate, to be caught in the groove and fixes, first auxiliary section and described
Second auxiliary section surrounds the connector；Corrosion-resistant glue in the second encapsulating layer is being more than or equal to circuit board assemblies
Solidify at a temperature of highest practical service environment.
The present invention also provides a kind of circuit board assemblies, including shell, connector and be arranged in the shell and with institute
The circuit board of connector connection is stated, the shell includes the first shell and second housing, outside first shell and described second
Circuit board accommodating chamber is formed with after shell cooperation is fixed, the circuit board is arranged in the circuit board accommodating chamber, on the shell
It is provided with encapsulating entrance, the circuit board accommodating chamber is interior at least formed with the first encapsulating layer and the second encapsulating layer, the circuit board
On electronic component be located at the first encapsulating layer, the encapsulating entrance is sealed by the second encapsulating layer, and described
One encapsulating layer is flexible glue, and the second encapsulating layer is epoxy resin, and the second encapsulating layer obstructs the first encapsulating layer and connects with the external world
Touching, the second encapsulating layer are directly contacted with the external world；The circuit board assemblies further include be positioned close to the first opening portion and/or
At least one first limiting section of second opening portion, the line of demarcation between the second encapsulating layer and the first encapsulating layer are located at described
The lower section of first limiting section；Be respectively arranged on first shell and second housing substantially in concave shape the first auxiliary section and
Second auxiliary section, offers the groove of annular on the connector, and the connector passes through first auxiliary section and described the
Two auxiliary sections, which cooperate, to be caught in the groove and fixes, and first auxiliary section and second auxiliary section surround institute
State connector；Corrosion-resistant glue in the second encapsulating layer is in the highest practical service environment for being more than or equal to circuit board assemblies
At a temperature of solidify.The present invention is by two kinds of colloids of encapsulating in circuit board assemblies, with flexible glue encapsulating vulnerable to the larger stress shadow of colloid
The electronic component for ringing and damaging, and contacted with corrosion resistance glue barrier flexible glue with the external world, it can effectively improve waterproofness
Energy, corrosion resistance and cold-resistant thermal shock resistance properties, and avoid encapsulating in closed shell more difficult, including being easy after encapsulating
Portion forms bubble, and structure is simple, and processing and installation is easy, at low cost.
Detailed description of the invention
Fig. 1 is an embodiment stereoscopic schematic diagram of circuit board assemblies of the invention.
Fig. 2 is the first shell stereoscopic schematic diagram in Fig. 1 embodiment.
Fig. 3 is the schematic front view of the first shell in Fig. 1 embodiment.
Fig. 4 is the schematic front view of second housing in Fig. 1 embodiment.
Fig. 5 is the structural schematic diagram of connector and circuit board composition part in Fig. 1 embodiment.
Fig. 6 is the schematic cross-section of the circuit board assemblies of non-encapsulating.
Fig. 7 is the schematic cross-section of the circuit board assemblies after encapsulating.
Fig. 8 is the partial enlarged view of Fig. 7.
Fig. 9 is the partial enlargement diagram of Fig. 1.
Figure 10 is an embodiment stereoscopic schematic diagram of electrical-coil of the invention.
Figure 11 is the mounting structure schematic diagram of coil injection molding part shown in Figure 10 and the first shell.
Figure 12 is the mounting structure schematic diagram of coil injection molding part shown in Figure 10, the first shell and circuit board.
Figure 13 is an embodiment stereoscopic schematic diagram of electric expansion valve of the invention.
Figure 14 is the partial schematic sectional view of Figure 13.
Specific embodiment
Invention provides a kind of electric expansion valve, electrical-coil and circuit board assemblies, by having in circuit board assemblies
Software is perfused in electronic component part, and corrosion resistant glue is perfused in the opening contacted with the external world, has preferable corrosion-resistant, cold-resistant
Thermal shock.Here, flexible glue refers to solidify after glue of the hardness within the scope of shore00, corrosion resistance glue refer to after solidification have it is anti-
The glue of the substances long period of soaking such as acid, alkali, oiliness, water.
With reference to the accompanying drawings and detailed description, the present invention is specifically described.
Fig. 1 is an embodiment stereoscopic schematic diagram of circuit board assemblies of the invention, as shown in Figure 1, circuit board assemblies 10 wrap
Include the first shell 1, second housing 2 and the connector 4 being arranged between the first shell 1 and second housing 2, the one of connector 4
The first shell 1 and second housing 2 are stretched out in part, and connector 4 passes through the first auxiliary section 11 and second for being fastened on the first shell 1
It is fixed between the first shell 1 and second housing 2 between the second auxiliary section 21 on shell 2.It is also set on circuit board assemblies 10
It is equipped with the first opening portion 101, the second opening portion 102 and third opening portion 14, wherein the first opening portion 101 and the second opening portion
102 are located at the two sides of connector 4, and third opening portion 14 is provided on the side wall at 1 place of the first shell.
Fig. 2 is the first shell stereoscopic schematic diagram in Fig. 1 embodiment, and Fig. 3 is the main view signal of the first shell in Fig. 1 embodiment
Figure.As shown in Figures 2 and 3, all side walls of the first shell 1 surround to form accommodating chamber, offer third on the bottom of accommodating chamber and open
Oral area 14, and one week side wall of the first shell 1 in opening setting, in opening setting all side walls include the first open end 12,
Second open end 13 and the first auxiliary section 11, wherein the first open end 12 and the second open end 13 are located at first cooperation
The both sides in portion 11.
In substantially concave-shaped structure, the first auxiliary section 11 includes two the second limiting sections positioned at two sides for first auxiliary section 11
111 and the depressed section between two the second limiting sections 111.
First shell 1 further includes the support portion in accommodating chamber, and support portion includes four corners in accommodating chamber
The first support portion 15, the second support portion 16, third support portion 17 and the 4th support portion 18, the first support portion 15, second
Support part 16, third support portion 17 and the 4th support portion 18 protrude from the bottom of accommodating chamber and their height is lower than the first shell
The height of 1 all side walls, also, the first support portion 15 and the 4th support portion 18 end face and first with the second open end 13 respectively
The end face of open end 12 maintains a certain distance.Limiting section is additionally provided on first shell 1, limiting section includes the first limiting section
151, the first limiting section 151 can be located on all side walls in opening setting, be also possible to one of all side walls in opening setting
Part.First limiting section 151 is disposed adjacent with the first support portion 15, also, the height of the first limiting section 151 is higher than the first support
The height in portion 15.
It is pointed out here that the height that the setting of support portion needs to meet support portion is lower than the height of all side walls and each support
Portion is generally horizontal, and the quantity and set-up mode of support portion are not limited to the first support portion 15, the second support portion of above-mentioned setting
16, third support portion 17 and the 4th support portion 18, can also be other forms.Also, the quantity of the first limiting section can also
To be multiple.The set-up mode of the present embodiment realizes function by better simply structure, and the processing is simple for mold.
Fig. 4 is the schematic front view of second housing in Fig. 1 embodiment.As shown in figure 4, all side walls of second housing 2 surround
Accommodating chamber is formed, and one week side wall of second housing 2, in opening setting, all side walls in opening setting include third open end
22, the 4th open end 23 and the second auxiliary section 21, wherein third open end 22 and the 4th open end 23 are located at described second
The both sides of auxiliary section 21.
Also in substantially concave-shaped structure, the second auxiliary section 21 also includes at least one third limiting section for second auxiliary section 21
211 and the depressed section adjacent with third limiting section 211, and setting position of second auxiliary section 21 on second housing 2 with
Setting position of first auxiliary section 11 on the first shell 1 matches, and when the first shell 1 and the lid conjunction of second housing 2, first matches
Conjunction portion 11 and the second auxiliary section 21 are arranged in relative engagement.
For second housing 2 also containing the support portion being located in accommodating chamber, support portion includes the 5th support portion 25 and the 6th of position
Support portion 24.
It is pointed out here that the height that the setting of support portion needs to meet support portion is lower than the height of all side walls and each support
Portion is generally horizontal, and the quantity and set-up mode of support portion are not limited to the quantity and mode of above-mentioned setting, can also be other
Form.Also, limiting section also can be set on second housing 2.The set-up mode of the present embodiment passes through better simply structure
Realize function, and mold handling ease, cost is relatively low.
Fig. 5 is the structural schematic diagram of connector and circuit board composition part in Fig. 1 embodiment, and Fig. 6 is the circuit board of non-encapsulating
The schematic cross-section of component.As shown in figure 5, connector 4 includes that connector housings and one end are arranged in connector housings, are another
The inserted sheet 42 of connector housings is stretched out in one end, and one end that inserted sheet 42 stretches out connector housings is fixed by modes such as welding, grafting
On circuit board 3.Connector housings are being provided with an annular groove 41 on circuit board side.
The first auxiliary section 11 on the first shell 1 is caught in groove 41 in connector housings, to keep connector 4 fixed
On the first shell 1, wherein be caught in groove 41 first auxiliary section 11 set-up mode can limit connector 4 on move down
It is dynamic, and the second limiting section 111 on the first auxiliary section 11 can limit moving left and right for connector 4.Circuit board 3 is located at the at this time
In the accommodating chamber of one shell 1 and pass through the first support portion 15, the second support portion 16, third support portion 17 and the 4th support portion 18
Support, and the output end on circuit board 3 can pass through third opening portion on the first shell 1 and external connection.When circuit board 3 is complete
After installation, the first shell 1 and the lid of second housing 2 are combined, and are caught on second housing 2 in the groove 41 in connector housings
The second auxiliary section 21, such connector 4 matched by second on the first auxiliary section 11 and second housing 2 on the first shell 1
Conjunction portion 21 cooperates in the groove 41 being caught in connector housings and fixes.
Here it should be noted that the structure of the first auxiliary section 11 and the second auxiliary section 21 is not limited in substantially concave knot
Structure can also be other similar structures such as L shape structure, and the first auxiliary section 11 and the second auxiliary section 21, which cooperate to be caught in, to be patched
In groove 41 on part shell, the first auxiliary section 11 and the second auxiliary section 21 is made to surround connector 4, to limit connector 4
It moves up and down.
It, can be by modes such as ultrasonic bonding by the first shell 1 after first shell 1 and the lid of second housing 2 are combined
Junction melting with second housing 2 is fixed together.
Fig. 9 is the partial enlargement diagram of Fig. 1, after guaranteeing the first shell 1 and the welding of 2 junction of second housing
Insulation performance, as shown in figure 9, the first shell 1 is provided with the bump of at least one shape at an acute angle at the position for welding,
Bump along the first shell 1 connecting portion in continuous setting, and be also equipped with corresponding bump in second housing 2, make the
The protrusion of one shell 1 and the recesses fit of second housing 2, the recesses fit of the protrusion of second housing 2 and the first shell 1；Make two
Person can mutually merge in welding, and in addition this structure setting can also play position-limiting action, dislocation when preventing from welding.
As shown in Figure 1, the accommodating chamber and second after the first shell 1 and second housing 2 are fixed together, in the first shell 1
Accommodating chamber in shell 2 complements each other to form as circuit board accommodating chamber, circuit board 3 and the setting of 151 proximity of the first limiting section；First
The first open end 12 on shell 1 complements each other to form the first opening portion 101 with the third open end 22 on second housing 2, the
The second open end 13 on one shell 1 complements each other to form the second opening portion 102 with the 4th open end 23 on second housing 2,
First opening portion 101 and the second opening portion 102 can be connected to circuit board accommodating chamber.In this way, when needing to carry out encapsulating, first
Opening portion 101 and the second opening portion 102 can be used as encapsulating entrance.It is to be appreciated that circuit board accommodating chamber is not only for accommodating
Circuit board can also accommodate a part of connector 4.
It is pointed out here that the set-up mode of encapsulating entrance is not limited to aforesaid way, other forms, In can also be
Set-up mode in the present embodiment using setting the first opening portion 101 and the second opening portion 102 as encapsulating entrance, design letter
Single, convenient for opening up mold, and encapsulating entrance is big, can make in the inflow circuit board accommodating chamber of glue smoothness, and make glue
It is uniformly mixed, it is not easy to generate bubble.
Fig. 7 is the schematic cross-section of the circuit board assemblies after encapsulating, and Fig. 8 is the partial enlarged view of Fig. 7.As shown in fig. 7, filling
After glue, the first encapsulating layer 5 and the second encapsulating layer 6 are formed in the circuit board accommodating chamber of circuit board assemblies 10, wherein the first encapsulating
Layer 5 uses flexible glue, such as silica gel, and for electronic component part on encapsulating circuit board, the second encapsulating layer 6 uses corrosion-resistant glue,
Such as epoxy resin, for blocking encapsulating entrance, the first encapsulating layer 5 of barrier is contacted with the external world.
Since the stress that flexible glue is generated in cooling thermal impact is smaller, electronic component not will lead to thus in cooling thermal impact
It is extruded damage when larger greatly by stress, but flexible glue presence is easily damaged by foreign matter intrusion, the poor problem of corrosion resistance；
Although and corrosion resistance glue is not easy to be damaged by foreign matter firmly and corrosion resistance and good, can generate in cooling thermal impact very big
Stress.In the present embodiment, the first encapsulating layer 5 of the electronic component damaged containing easy affected by force is filled by flexible glue
Envelope, and the second encapsulating layer 6 contacted with the external world then has the encapsulating of corrosion resistance glue institute, in this way, can be obstructed by the second encapsulating layer 6
External environment is contacted with the first encapsulating layer 5, and the second encapsulating layer is directly contacted with the external world, and the corrosion resistant of circuit board assemblies both can be improved
Corrosion, and make circuit board assemblies cold-resistant thermal shock resistance properties with higher.
In order to improve the binding force of glue, degumming, 56, the line of demarcation between the second encapsulating layer 6 and the first encapsulating layer 5 are prevented
In the lower section of the first limiting section 151, in this way, the second encapsulating layer 6 is made to be formed with stage portion, Ke Yiyou at the first limiting section 151
Effect prevents degumming.Further, the first auxiliary section 11 and the second auxiliary section 21 are located in the second encapsulating layer 6, the first auxiliary section
11 and second auxiliary section 21 also have the function of preventing degumming.And each support portion being arranged in the first shell 1 and second housing 2
The structure of corner positions is changed, the binding force of glue can be effectively improved, be also possible to prevent degumming.Also, circuit board holds
Inner wall corresponding with the second encapsulating layer 6 on chamber of receiving is non-smooth structure, can be improved the second encapsulating layer and circuit board housing it
Between sealing performance.
Since flexible glue can constantly be expanded with the height of temperature, internal flexible glue expands pair in use in order to prevent
Shell extruding causes casing deformation, corrosion resistance glue (such as epoxy resin) in the second encapsulating layer 6 can be made being greater than or
Solidify when the highest practical service environment temperature of circuit board assemblies.In this way, the solidification of corrosion-resistant glue is in the first encapsulating layer 5
Flexible glue (such as silica gel) carry out when being expanded into utmostly, in the specific use process, make flexible glue expanded by heating degree will not
Degrees of expansion when more than corrosion-resistant adhesive curing can effectively prevent internal flexible glue and be expanded in use to shell extruding
Cause casing deformation.
Specific encapsulating process can be such that
At least part of glue input unit protrudes into circuit board accommodating chamber from encapsulating entrance to the circuit being completed
Flexible glue is poured into board group part, flexible glue can slowly rise from bottom, can prevent flexible glue contamination to non-flexible glue encapsulating layer in this way
On the inner wall of corresponding circuit board accommodating chamber, make flexible glue certain after waiting flexible glues at least to seal the electronic component on circuit board
At a temperature of solidify, the solidification temperature of flexible glue, which can be, is less than equal 70 degrees Celsius, after the completion of flexible glue solidification, then pours into from encapsulating entrance
Corrosion resistance glue makes it that can at least completely cut off flexible glue and external contact, and the end face of the liquid level of corrosion resistance glue and encapsulating entrance
Between maintain a certain distance, solidify corrosion resistance glue at a certain temperature, the solidification temperature of corrosion resistance glue can
To be above the solidification temperature of flexible glue, and it is less than or equal to 130 degrees Celsius, in corrosion resistance adhesive curing, since temperature is higher than soft
The solidification temperature of glue, flexible glue meeting expanded by heating, flexible glue can be lifted the corrosion resistance glue of liquid during expansion, due to filling
It when glue, is maintained a certain distance between liquid level and the end face of encapsulating entrance, can prevent corrosion resistance glue from being lifted by flexible glue in this way
It is overflowed when rising.After the completion of corrosion resistance adhesive curing, the environment temperature of circuit board assemblies is restored to normal temperature, at this point, soft
Glue is shunk, and at least part region of flexible glue and corrosion resistance glue intersection, has gap between flexible glue and corrosion resistance glue.
Here for corrosion resistance glue in encapsulating liquid, there is corrosion resistance glue in the distance between the end face of liquid level and encapsulating entrance
The coefficient of expansion and solidification temperature determine.
Further, as shown in figure 8, the line of demarcation 56 between the second encapsulating layer 6 and the first encapsulating layer 5 be located at inserted sheet 42 with
The top of fixed connection place between circuit board 3 makes the fixed connection place between inserted sheet 42 and circuit board 3 be located at the first encapsulating layer
In 5, it can effectively prevent between the corrosion-resistant glue stress damage inserted sheet 42 generated when cooling thermal impact is larger and circuit board 3
It is fixedly connected.
Figure 10 is an embodiment stereoscopic schematic diagram of electrical-coil of the invention, Figure 11 be coil injection molding part shown in Figure 10 with
The mounting structure schematic diagram of first shell, Figure 12 are the mounting structures of coil injection molding part shown in Figure 10, the first shell and circuit board
Schematic diagram.As shown in Figure 10 to Figure 12, electrical-coil 100 includes circuit board assemblies 10 and coil injection molding part 1001, circuit board group
Part 10 and coil injection molding part 1001 are fixed together by connector 1004, and the contact pin 1011 of coil injection molding part 1001 passes through connection
Part 1004 and third opening portion 14 are protruded into the accommodating chamber of the first shell 1, stretch out circuit board 3 and coil injection molding part 1001 slotting
Needle 1011 carries out cooperation assembly, and circuit board 3 and contact pin 1011 can be by being welded to connect fixed conducting.Circuit board assemblies 10 are joined
It examines described above, no longer repeats one by one here.
In addition, in order to protect motor, electrical-coil 100 can also include the nut cap positioned at 1001 top of coil injection molding part
1002；Electrical-coil 100 further includes the installation part 1003 positioned at 1001 lower section of coil injection molding part, and electrical-coil 100 can pass through
Installation part 1003 is fixed in motor (not shown).
Figure 13 is an embodiment stereoscopic schematic diagram of electric expansion valve of the invention, and Figure 14 is the broken section signal of Figure 13
Figure.As shown, electric expansion valve includes electrical-coil 100, valve body 200 and core assembly 300, it is provided in valve body 200
Refrigerant circulation passage 201, core assembly 300 include spool 301, are provided in refrigerant circulation passage 201 corresponding to spool 301
Valve port 400, spool 301 can be moved with respect to valve port 400, and then control the aperture of valve port 400, and wherein electrical-coil 100 includes
Circuit board assemblies 10.
Electrical-coil 100 and circuit board assemblies 10 no longer repeat one by one here with reference to being described above.
In this way, circuit board assemblies circuit board, electrical-coil and electric expansion valve of the invention can effectively improve it is anti-
Aqueous energy, corrosion resistance and cold-resistant thermal shock resistance properties, and structure is simple, and processing and installation is easy.
The above is only specific embodiments of the present invention, is not intended to limit the present invention in any form.Though
So the present invention has been disclosed as a preferred embodiment, and however, it is not intended to limit the invention.It is any to be familiar with those skilled in the art
Member, without departing from the scope of the technical proposal of the invention, all using the disclosure above technology contents to technical solution of the present invention
Make many possible changes and modifications or equivalent example modified to equivalent change.Therefore, all without departing from skill of the present invention
The content of art scheme, according to the technical essence of the invention any simple modification made to the above embodiment, equivalent variations and repair
Decorations, all of which are still within the scope of protection of the technical scheme of the invention.
Claims (11)
1. a kind of electric expansion valve, including electrical-coil, valve body and core assembly, it is logical that refrigerant circulation is provided in the valve body
Road, the core assembly include spool, and the valve port corresponding to the spool is additionally provided in the valve body, and the spool being capable of phase
The valve port is moved, and then controls the aperture of the valve port, which is characterized in that the coil includes coil injection molding part and circuit
Board group part, the coil injection molding part are connect with circuit board assemblies, and the circuit board assemblies include that shell, connector and setting exist
Circuit board connect in the shell and with the connector, the shell include the first shell and second housing, and described first
Shell and the second housing are fixedly installed, and circuit board accommodating chamber is formed in the shell, and the circuit board is arranged described
In circuit board accommodating chamber, encapsulating entrance, first shell and the second housing mutual cooperation shape are provided on the shell
At the encapsulating entrance, the encapsulating entrance is located at the side of the connector, in the circuit board accommodating chamber at least formed with
First encapsulating layer and the second encapsulating layer, the electronic component on the circuit board are located at the first encapsulating layer, on the shell
Encapsulating entrance sealed by the second encapsulating layer, and the first encapsulating layer be flexible glue, the second encapsulating layer be corrosion resistant
Corrosion glue, the second encapsulating layer obstruct the first encapsulating layer and contact with the external world, and the second encapsulating layer is directly contacted with the external world, institute
Stating connector includes inserted sheet, and the connector is connect by the inserted sheet with the circuit board, the inserted sheet and the circuit board
Between junction be located in the first encapsulating layer.
2. electric expansion valve according to claim 1, which is characterized in that the corrosion resistance glue is epoxy resin, described
The solidification temperature of epoxy resin is greater than the solidification temperature of the flexible glue, and the solidification temperature of the epoxy resin is less than or equal to
130℃。
3. electric expansion valve according to claim 2, which is characterized in that the connector includes connector housings and one
End is arranged in the connector housings, the other end stretches out the inserted sheets of the connector housings；The first encapsulating layer and described
The top of junction of the boundary layer between the inserted sheet and the circuit board between second encapsulating layer.
4. electric expansion valve according to any one of claims 1 to 3, which is characterized in that all side walls of first shell
Encirclement forms accommodating chamber, and one week side wall of first shell is arranged in opening, in the week of opening setting on first shell
Side wall includes the first open end, the second open end and the first auxiliary section, and first open end and the second open end are located at
The both sides of first auxiliary section；The second housing is equipped with first shell, all side walls of the second housing
Also it surrounds and forms accommodating chamber, and one week side wall of the second housing is also in opening setting, be in opening on the second housing
All side walls of setting include third open end, the 4th open end and the second auxiliary section, the third open end and the 4th open end
It is located at the both sides of second auxiliary section.
5. electric expansion valve according to claim 4, which is characterized in that first shell further includes being located at described first
First support portion, the second support portion, third support portion and the 4th support portion at four angles of the accommodating chamber on shell, described
One support portion, the second support portion, third support portion and the 4th support portion height lower than first shell week side wall height, and
First support portion and the 4th support portion keep one with the end face of the end face of second open end and the first open end respectively
Fixed distance；The first limiting section is additionally provided on first shell, first limiting section, which is located on first shell, is in
Be open on all side walls of setting, the height of first limiting section is higher than the height of first support portion, the circuit board with
The first limiting section proximity setting.
6. electric expansion valve according to claim 5, which is characterized in that first auxiliary section include at least one second
Limiting section and the depressed section adjacent with second limiting section；Second auxiliary section also includes at least one third limiting section
The depressed section adjacent with the third limiting section；First auxiliary section and the second auxiliary section are arranged in relative engagement, institute
When stating the first auxiliary section and the cooperation of the second auxiliary section, second limiting section and third limiting section are surrounded on first auxiliary section
Depressed section and second auxiliary section on depressed section；The groove of an annular is additionally provided in the connector housings,
The connector cooperates to be caught in the groove and fix by first auxiliary section and second auxiliary section,
First auxiliary section and second auxiliary section surround the connector.
7. electric expansion valve according to claim 5, which is characterized in that the first open end and institute on first shell
The third open end on second housing is stated to complement each other to form as the first opening portion, the second open end on first shell with
The 4th open end on the second housing complements each other to form as the second opening portion, and the encapsulating entrance includes described first opening
Oral area and the second opening portion, first opening portion and the second opening portion are sealed by the second encapsulating layer；Second encapsulating
Line of demarcation between layer and the first encapsulating layer is located at the lower section of first limiting section.
8. electric expansion valve according to claim 7, which is characterized in that first shell and second housing pass through welding
It is connected and fixed, first shell is provided with the bump of at least one shape at an acute angle at the position for welding, described recessed
Protrusion along the first shell connecting portion in continuous setting, be also equipped with corresponding bump on the second housing, described the
The protrusion of one shell and the recesses fit of second housing, the recesses fit of the protrusion of the second housing and the first shell.
9. a kind of glue-pouring method of electric expansion valve, the electric expansion valve include circuit board assemblies, which is characterized in that the side
Method includes the following steps:
At least part of glue input unit protrudes into circuit board accommodating chamber from encapsulating entrance to the circuit board group being completed
Flexible glue is poured into part, flexible glue slowly rises from bottom；
After equal flexible glues at least seal the electronic component on circuit board, solidify flexible glue at a certain temperature, the solidification temperature of flexible glue
Degree is less than or equal to 70 degrees Celsius；
After the completion of flexible glue solidification, then epoxy resin adhesive liquid is poured into from encapsulating entrance make it at least and can completely cut off flexible glue to connect with outside
Touching, and maintained a certain distance between the liquid level of epoxy resin adhesive liquid and the end face of encapsulating entrance；
Solidify epoxy resin adhesive liquid at a certain temperature later, the solidification temperature of epoxy resin is higher than the solidification temperature of flexible glue
Degree, and it is less than or equal to 130 degrees Celsius.
10. a kind of electrical-coil, including coil injection molding part and circuit board assemblies, the coil injection molding part is fixed with circuit board assemblies
Connection, the coil injection molding part top are provided with nut cap, are provided with installation part, the circuit board group below the coil injection molding part
Part includes the first shell, second housing, connector and the circuit board for being arranged in the shell and connecting with the connector,
The first opening portion, the second opening portion and circuit board is formed with after first shell and second housing cooperation are fixed to accommodate
Chamber, the electronics member device at least formed with the first encapsulating layer and the second encapsulating layer in the circuit board accommodating chamber, on the circuit board
Part is located at the first encapsulating layer, and first opening portion and the second opening portion are sealed by the second encapsulating layer, and described
First encapsulating layer is flexible glue, and the second encapsulating layer is epoxy resin, and the second encapsulating layer obstructs the first encapsulating layer and the external world
Contact, the second encapsulating layer are directly contacted with extraneous, the circuit board assemblies further include be positioned close to the first opening portion with/
Or second opening portion at least one first limiting section, the line of demarcation between the second encapsulating layer and the first encapsulating layer is located at institute
State the lower section of the first limiting section；The first auxiliary section substantially in concave shape is respectively arranged on first shell and second housing
With the second auxiliary section, the groove of annular is offered on the connector, the connector passes through first auxiliary section and described
Second auxiliary section, which cooperates, to be caught in the groove and fixes, and first auxiliary section and second auxiliary section surround
The connector；The solidification temperature of the epoxy resin is greater than the solidification temperature of the flexible glue, and the epoxy resin is consolidated
Change temperature and is less than or equal to 130 DEG C.
11. a kind of circuit board assemblies, including shell, connector and it is arranged in the shell and is connect with the connector
Circuit board, the shell include the first shell and second housing, shape after first shell and second housing cooperation are fixed
At there is circuit board accommodating chamber, the circuit board is arranged in the circuit board accommodating chamber, and encapsulating entrance is provided on the shell,
Electronic component position at least formed with the first encapsulating layer and the second encapsulating layer in the circuit board accommodating chamber, on the circuit board
In the first encapsulating layer, the encapsulating entrance is sealed by the second encapsulating layer, and the first encapsulating layer is flexible glue, institute
Stating the second encapsulating layer is epoxy resin, and the second encapsulating layer obstructs the first encapsulating layer and contacts with the external world, the second encapsulating layer
It is directly contacted with the external world；The circuit board assemblies further include being positioned close to the first opening portion and/or the second opening portion at least
One the first limiting section, the line of demarcation between the second encapsulating layer and the first encapsulating layer are located under first limiting section
Side；The first auxiliary section and the second auxiliary section substantially in concave shape, institute are respectively arranged on first shell and second housing
The groove that annular is offered on connector is stated, the connector passes through first auxiliary section and the second auxiliary section phase interworking
Conjunction is caught in the groove and fixes, and first auxiliary section and second auxiliary section surround the connector；It is described
The solidification temperature of epoxy resin is greater than the solidification temperature of the flexible glue, and the solidification temperature of the epoxy resin is less than or equal to
130℃。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366614.1A CN105318080B (en) | 2014-07-29 | 2014-07-29 | A kind of electric expansion valve, electrical-coil, circuit board assemblies and glue-pouring method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410366614.1A CN105318080B (en) | 2014-07-29 | 2014-07-29 | A kind of electric expansion valve, electrical-coil, circuit board assemblies and glue-pouring method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105318080A CN105318080A (en) | 2016-02-10 |
| CN105318080B true CN105318080B (en) | 2019-11-01 |
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| CN201410366614.1A Active CN105318080B (en) | 2014-07-29 | 2014-07-29 | A kind of electric expansion valve, electrical-coil, circuit board assemblies and glue-pouring method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017209657A1 (en) * | 2017-06-08 | 2018-12-13 | Robert Bosch Gmbh | Housing for an electrical appliance with a tightly molded housing part |
| CN110735957B (en) * | 2018-07-20 | 2021-10-19 | 浙江三花智能控制股份有限公司 | Manufacturing method of electronic expansion valve |
| CN113241871A (en) * | 2021-05-18 | 2021-08-10 | 江苏华阳智能装备股份有限公司 | Air conditioner draining pump stator assembly and encapsulating method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| NL1037176C2 (en) * | 2009-08-05 | 2011-02-08 | J M Geluk Beheer B V | Explosion proof electronic device and method of manufacturing such a device. |
| CN102654209B (en) * | 2011-03-03 | 2016-01-06 | 浙江三花股份有限公司 | A kind of coil of electric expansion valve and the electric expansion valve of this coil of use |
| CN202404468U (en) * | 2012-01-09 | 2012-08-29 | 朱午辰 | Drying and dehydrating humiture self-control instrument |
| CN102548313A (en) * | 2012-02-13 | 2012-07-04 | 惠州茂硕能源科技有限公司 | Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply |
| CN203120341U (en) * | 2013-02-07 | 2013-08-07 | 刘友辉 | Waterproof structure for circuit board of electronic governor |
| CN203722952U (en) * | 2014-02-08 | 2014-07-16 | 昆山力久新能源汽车技术有限公司 | Low-speed electric vehicle motor controller shell |
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Effective date of registration: 20170515 Address after: 310018 No. 301, No. 12, Hangzhou economic and Technological Development Zone, Zhejiang Province Applicant after: Zhejiang Sanhua Automobile Components Co., Ltd. Address before: 310018 289-2, Hangzhou economic and Technological Development Zone, Zhejiang, No. 12 Applicant before: Hangzhou Sanhua Institute Co., Ltd. |
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