CN102548313A - Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply - Google Patents
Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply Download PDFInfo
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- CN102548313A CN102548313A CN2012100316645A CN201210031664A CN102548313A CN 102548313 A CN102548313 A CN 102548313A CN 2012100316645 A CN2012100316645 A CN 2012100316645A CN 201210031664 A CN201210031664 A CN 201210031664A CN 102548313 A CN102548313 A CN 102548313A
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Abstract
The invention discloses an electronic equipment sealing structure which comprises a shell, wherein a circuit board with an electronic element is arranged in the shell; wire rods are introduced into the shell respectively from two ends of the shell and electrically connected with the circuit board; the shell comprises an upper shell and a cover board; an opening is formed on the bottom surface of the upper shell, and the cover board is covered at the opening of the upper shell; a soft encapsulation glue layer is encapsulated on the upper part of the inner cavity of the upper shell, and at least wraps a board body of the circuit board; and a hard encapsulation glue layer is encapsulated below the soft encapsulation glue layer. According to the electronic equipment sealing structure, a phenomenon of stress damage, caused by encapsulation glue, to the electronic element can be avoided. The invention also discloses an electronic power supply with the electronic equipment sealing structure, and an encapsulation method for the electronic power supply.
Description
Technical field
The present invention relates to electronic technology field, refer in particular to a kind of electronic equipment hermetically-sealed construction, have the electronic power supply of this hermetically-sealed construction and have the encapsulating method of the electronic power supply of this hermetically-sealed construction.
Background technology
For the electronic equipment (for example electronic power supply) of outdoor application; It is in expose to the sun and rain, among the adverse circumstances such as wind and rain thunder and lightning, acid rain, humidity, thermal shock; So electronic equipment need have the hermetically-sealed construction than high-protection level; To play effects such as waterproof and dustproof, high-low temperature resistant, avoid of the infringement of outside adverse circumstances for electronic equipment.The electronic equipment of existing outdoor application; In order to guarantee its sealing; The circuit board that will be provided with electronic devices and components mostly is arranged within the shell, re-uses that the hard casting glue is disposable to carry out embedding, though the hard casting glue has the good advantage of caking property; But the influence of factor is easy to the electronic devices and components in it are caused damage owing to expanded with heat and contract with cold.
The electronic equipment of all kinds of outdoor applications more or less is designed with certain hermetically-sealed construction; As State Intellectual Property Office on October 19th, 2011 Granted publication the CN202014427 utility model patent a kind of waterproof power supply is disclosed; It includes the side cover that a shaped as frame hollow shell and two is fixed in these shell both sides; Power supply circuit board is arranged at this enclosure, and the inboard of each side cover respectively is provided with a water bar, between water bar and side cover, is provided with the embedding glue-line.By the setting of embedding glue-line, play waterproof, sealing purpose.Though the hermetically-sealed construction that electronic equipment adopted of existing outdoor application has certain safeguard function, its degree of protection is lower, is difficult to satisfy the user demand of dealing with outdoor adverse circumstances.
Summary of the invention
The invention reside in and solve the disposable existing technical problem that is prone to electronic devices and components are caused the stress infringement of embedding of carrying out of existing electronic equipment hermetically-sealed construction employing hard casting glue, a kind of electronic equipment hermetically-sealed construction of avoiding casting glue electronic devices and components to be caused the stress infringement is provided.
The present invention also is to solve the existing not enough technical problem of the existing sealing property of electronic equipment hermetically-sealed construction, a kind of reliable in structure is provided, has the electronic equipment hermetically-sealed construction of high-protection level, can satisfy the user demand of outdoor adverse circumstances.
In addition, the present invention also provides a kind of electronic power supply and encapsulating method thereof with above-mentioned electronic equipment hermetically-sealed construction.
For solving the problems of the technologies described above; The present invention adopts following technical scheme: a kind of electronic equipment hermetically-sealed construction; Include a shell, the circuit board that electronic devices and components are installed is arranged within the said shell, and wire rod is introduced from the two ends of said shell respectively within the said shell and is electrically connected into said circuit board; Said shell includes the cover plate that upper shell and that a bottom surface forms opening is covered on the opening part of said upper shell; In the place's embedding of the top of said upper shell inner chamber one soft embedding glue-line is arranged, said soft embedding glue-line is wrapped in the plate body of said circuit board in it at least, and locating then embedding in said soft embedding glue-line below has a hard embedding glue-line.
In the above-mentioned electronic equipment hermetically-sealed construction; Said upper shell includes the end plate that side plate that a top board, two extends to form respectively from the both sides of the edge of said top board and two extends to form respectively from the edges at two ends of said top board downwards downwards; The outside of each end plate is formed with a convex closure plate; Said convex closure plate combines with end plate and is formed with a groove; And its place, outer face is formed with an outer inlet wire recess, is provided with a protective ring in the said outer inlet wire recess, is formed with inlet wire recess in corresponding to said outer inlet wire indent on the said end plate; Wire rod passes said protective ring, interior inlet wire recess in order and is electrically connected with the circuit board that is arranged within the said shell, and said cover plate is fixed said protective ring outside said among the inlet wire recess.
A kind of electronic power supply; Include a shell and at least one and be arranged at the power supply circuit board that electronic devices and components are installed in the said shell its; Wire rod is introduced from the two ends of said shell respectively within the said shell and is electrically connected into said power supply circuit board; Said shell includes the cover plate that upper shell and that a bottom surface forms opening is covered on the opening part of said upper shell; In the place's embedding of the top of said upper shell inner chamber one soft embedding glue-line is arranged, said soft embedding glue-line is wrapped in said circuit board in it at least, and locating then embedding in said soft embedding glue-line below has a hard embedding glue-line.
A kind of encapsulating method of electronic power supply includes following steps: a, wire rod is welded on the corresponding position of power supply circuit board; B, power supply circuit board is put into upper shell with the one side that is provided with electronic devices and components towards the mode of opening; C, soft casting glue is injected the inner chamber of upper shell, make soft casting glue flood the plate body of power supply circuit board at least, be solidified to form to the plate body of major general's circuit board and be wrapped in the soft embedding glue-line in it; D, hard heat conduction casting glue is injected the remainder of upper shell inner chamber, be solidified to form hard embedding glue-line; E, cover plate is assembled in upper shell.
Useful technique effect of the present invention is: the structure that adopts soft casting glue and the two-layer embedding of hard casting glue; Because soft casting glue has the good characteristic of heat conductivity, the heat that can be by this soft embedding glue-line be produced during with electronic devices and components work set on the circuit board conducts to upper shell rapidly and is distributed in the external environment condition, improves the radiating effect of electronic equipment; And; Than the hard casting glue, soft embedding glue-line can reduce the stress that acts on electronic devices and components because of the influence of expanding with heat and contract with cold significantly, avoids electronic devices and components are caused stress damage; And the hard casting glue has the strong characteristic of caking property; Can guarantee the sealing effectiveness of hermetically-sealed construction by the setting of this hard embedding glue-line, avoid the harmful effect of external environment condition for circuit board; Further; The outside of the end plate of this upper shell respectively is formed with a convex closure plate, and this convex closure plate combines with end plate and is formed with a groove, and its place, outer face is formed with an outer inlet wire recess; The inlet wire indent is provided with a protective ring outside this; Wire rod passes protective ring and is electrically connected with the circuit board that is arranged within the shell, and by the cover plate that is assembled in upper shell this protective ring is fixed outside this among inlet wire recess, by the setting of this protective ring; Make between wire rod and the shell and closely filled, guaranteed the sealing effectiveness of shell.
Description of drawings
Fig. 1 is a contour structures sketch map of the present invention.
Fig. 2 is a decomposition texture sketch map of the present invention.
Fig. 3 is a sectional structure sketch map of the present invention.
Fig. 4 is the flow chart of the encapsulating method of electronic power supply of the present invention.
Embodiment
For making those of ordinary skill in the art be expressly understood the object of the invention, technical scheme and advantage more, the present invention is done further elaboration below in conjunction with accompanying drawing and embodiment.
The disclosed electronic equipment hermetically-sealed construction of the present invention can be applicable to the electronic equipment of various outdoor applications, is particularly useful for LED road lamp power supply, LED Tunnel Lamp power supply, wind energy and solar inverter power supply etc.In the narration below, with the electronic power supply be example the present invention will be described, it will be appreciated by those skilled in the art that ground, the present invention is not limited to the electronic power supply in the accompanying drawing illustrated embodiment, also can be applicable to other suitable electronic equipments.
Consult Fig. 1 to Fig. 3; This electronic equipment hermetically-sealed construction includes a shell 10; The circuit board 20 that electronic devices and components 201 are installed at least one its plate body 200 is arranged within this shell 10 (among the embodiment shown in the drawings; Circuit board 20 is a power supply circuit board), wire rod 30 is introduced from the two ends of this shell 10 respectively within this shell 10 and is electrically connected into this circuit board 20.
This shell 10 can adopt the aluminum alloy materials preparation, and its upper shell 101 and one that includes bottom surface formation opening 100 is covered on the cover plate 102 at opening 100 places of this upper shell 101.In conjunction with shown in Figure 3, in the place's embedding of the top of these upper shell 101 inner chambers one soft embedding glue-line 103 is arranged, the plate body 200 of this soft embedding glue-line 103 to major general's circuit board 20 is wrapped in it (can partly wrap up the electronic devices and components 201 on this circuit board 20).Preferably, be provided with SMD electronic devices and components, then make this soft embedding glue-line 103 flood SMD electronic devices and components set on it like this circuit board 20.Locating then embedding in these soft embedding glue-line 103 belows has a hard embedding glue-line 104, and preferably, this hard embedding glue-line 104 flushes with the bottom surface of this upper shell 101.Adopt the structure of soft casting glue and the two-layer embedding of hard casting glue; Because soft casting glue has the good characteristic of heat conductivity; The heat that can be by this soft embedding glue-line 103 be produced during with electronic devices and components set on the circuit board 20 201 work conducts to upper shell 101 rapidly and is distributed in the external environment condition; Improve the radiating effect of electronic equipment, and, than the hard casting glue; Soft embedding glue-line 103 can reduce the stress that acts on electronic devices and components 201 (particularly SMD electronic devices and components) because of the influence of expanding with heat and contract with cold significantly, avoids electronic devices and components 201 are caused stress damage; And the hard casting glue has the strong characteristic of caking property, can guarantee the sealing effectiveness of hermetically-sealed construction by the setting of this hard embedding glue-line 104, avoids the harmful effect of external environment condition for circuit board 20.
Preferably, Shore hardness ShoreA was 40～50 casting glue after soft casting glue adopted and solidifies, and Shore hardness ShoreA is 45 heat conductive silica gel after for example solidifying; Shore hardness ShoreD was 60～70 casting glue after the hard casting glue adopted and solidifies, and for example solidifying back Shore hardness ShoreD is 65 epoxy resin.Preferably, no matter soft casting glue still is the hard casting glue, all adopts conductive coefficient greater than 0.8 casting glue material.
This upper shell 101 includes the end plate 107 that side plate 106 that a top board 105, two extends to form respectively from the both sides of the edge of this top board 105 and two extends to form respectively from the edges at two ends of this top board 105 downwards downwards; The outside of each end plate 107 is formed with a convex closure plate 108; This convex closure plate 108 combines with end plate 107 and is formed with a groove 109; And its place, outer face is formed with an outer inlet wire recess 110; Should be provided with a protective ring 111 in the outer inlet wire recess 110; Be formed with inlet wire recess 112 in corresponding to these outer inlet wire recess 110 places on this end plate 107, wire rod 30 passes protective ring 111, interior inlet wire recess 112 in order and is electrically connected with the circuit board 20 that is arranged within the shell 10.This cover plate 102 be covered on this upper shell 101 opening 100 and with 101 assemblings of this upper shell, and this protective ring 111 is fixed outside this among inlet wire recess 110.By the setting of this protective ring 111, make between wire rod 30 and the outer inlet wire recess 110 and closely filled, guaranteed the sealing effectiveness of shell 10.
Preferably, this protective ring 111 adopts silastic materials preparation, and it has advantages such as high temperature resistant, fire prevention, oil resistant, weatherability be strong.
For the ease of the location of this protective ring 111 and further improve protective ring 111 and outer inlet wire recess 110 seal degree between the two; This protective ring 111 be formed with one be matched with this outer inlet wire recess 110 location notch 113; Should be inserted among this location notch 113 by outer inlet wire recess 110, and be fixed this protective ring 111 by this cover plate 102.
Preferably, embedding has hard casting glue 114 in this groove 109, with the sealing reliability of further assurance electronic equipment hermetically-sealed construction.
In the embodiment shown in the figures; Form a plurality of through holes 115 on this cover plate 102; And be formed with a plurality of screw holes 116 on this upper shell 101 corresponding to this through hole 115; Use screw 117 to pass this through hole 115 and be screwed together in corresponding screw hole 116, thereby realize the combination of cover plate 102 and upper shell 101.
The dosing technology of electronic power supply is described below.
At first, wire rod 30 is welded on the power supply circuit board 20 corresponding positions, and ties band with fixing wire rod 30, with electronic devices and components set on the power supply circuit board 20 200 wrap insulate (step S01) in the place of wire rod 30.
Then, power supply circuit board 20 is put into upper shell 101 with the one side that is provided with electronic devices and components 201 towards the mode of opening 100, wire rod 30 is inserted in protective ring 111, again with protective ring 111 pack into (step S02) in the outer inlet wire recess 110 of upper shell 101 outsides.
Soft casting glue is injected in right amount the inner chamber of upper shell 101; Make soft casting glue flood the plate body 200 of power supply circuit board 20 at least; As SMD electronic devices and components are set on it; Then preferably make soft casting glue flood all SMD electronic devices and components, treat that the plate body 200 that is formed up to major general's circuit board 20 after it solidifies is wrapped in the soft embedding glue-line 103 (step S03) in it.In this step, can insert baking box and toast and make soft casting glue be solidified to form soft embedding glue-line 103 injecting upper shell 101 behind the soft casting glue.Preferably, after injecting soft casting glue, can upper shell 101 be inserted in the vacuum machine and vacuumize processing, to extract the bubble in the soft casting glue out.
Subsequently, hard heat conduction casting glue is injected the remainder of upper shell 101 inner chambers in right amount, and insert in the red baking box and toast, make the hard casting glue be solidified to form hard embedding glue-line 104 (step S04).Usually, the hard casting glue is injected into till the opening 100 of upper shell 101 flushes, and simultaneously, soft casting glue can flow in the groove 109 through interior inlet wire recess 112.Preferably, after injecting the hard casting glue, can upper shell 101 be inserted in the vacuum machine once more and vacuumize processing, to extract the bubble in the hard casting glue out.
In above-mentioned step, that also can adopt other solidifies soft casting glue and hard casting glue such as suitable modes such as infrared heating, is not limited to use roasting mode.
At last, cover plate 102 is assembled in upper shell 101, and makes cover plate 102 compressing protective rings 111, it closely is filled between wire rod 30 and the outer inlet wire recess 110, thereby accomplishes the embedding work (step S05) of electronic power supply.
The above is merely the preferred embodiments of the present invention, but not the present invention is done any pro forma restriction.Those skilled in the art can impose various changes that are equal to and improvement on the basis of the foregoing description, all equivalent variations or modifications of in the claim scope, being done all should fall within protection scope of the present invention.
Claims (10)
1. electronic equipment hermetically-sealed construction; Include a shell (10); The circuit board (20) that electronic devices and components (201) are installed is arranged within the said shell (10); Wire rod (30) is introduced from the two ends of said shell (10) respectively within the said shell (10) and is electrically connected into said circuit board (20); It is characterized in that: said shell (10) includes the cover plate (102) that opening (100) that upper shell (101) and that a bottom surface forms opening (100) is covered on said upper shell (101) is located; In the place's embedding of the top of said upper shell (101) inner chamber one soft embedding glue-line (103) is arranged, the plate body (200) of said soft embedding glue-line (103) to the said circuit board of major general (20) is wrapped in it, and locating then embedding in said soft embedding glue-line (103) below has a hard embedding glue-line (104).
2. electronic equipment hermetically-sealed construction as claimed in claim 1; It is characterized in that: said soft embedding glue-line (103) is that curing back Shore hardness ShoreA is 40～50 soft embedding glue-line, and said hard embedding glue-line (104) is 60～70 hard embedding glue-line for Shore hardness ShoreD after solidifying.
3. electronic equipment hermetically-sealed construction as claimed in claim 1 is characterized in that: said hard embedding glue-line (104) flushes with the bottom surface of said upper shell (101).
4. electronic equipment hermetically-sealed construction as claimed in claim 1; It is characterized in that: said upper shell (101) includes the end plate (107) that side plate (106) that a top board (105), two extends to form respectively from the both sides of the edge of said top board (105) and two extends to form respectively from the edges at two ends of said top board (105) downwards downwards; The outside of each end plate (107) is formed with a convex closure plate (108); Said convex closure plate (108) combines with end plate (107) and is formed with a groove (109); And its place, outer face is formed with an outer inlet wire recess (110); Be provided with a protective ring (111) in the said outer inlet wire recess (110); Said end plate (107) is gone up corresponding to said outer inlet wire recess (110) and is located to be formed with an interior inlet wire recess (112), and wire rod (30) passes said protective ring (111), interior inlet wire recess (112) in order and is electrically connected with the circuit board (20) that is arranged within the said shell (10), and said cover plate (102) is fixed said protective ring (111) outside said among the inlet wire recess (110).
5. electronic equipment hermetically-sealed construction as claimed in claim 4 is characterized in that: said protective ring (111) be formed with one be matched with said outer inlet wire recess (110) location notch (113), said outer inlet wire recess (110) is inserted in said location notch (113).
6. like claim 4 or 5 described electronic equipment hermetically-sealed constructions, it is characterized in that: embedding has hard casting glue (114) in the said groove (106).
7. electronic power supply; Include a shell and at least one and be arranged at the power supply circuit board that electronic devices and components are installed in the said shell its; Wire rod is introduced from the two ends of said shell respectively within the said shell and is electrically connected into said power supply circuit board; It is characterized in that: said shell includes the cover plate that upper shell and that a bottom surface forms opening is covered on the opening part of said upper shell; In the place's embedding of the top of said upper shell inner chamber one soft embedding glue-line is arranged, said soft embedding glue-line is wrapped in said circuit board in it at least, and locating then embedding in said soft embedding glue-line below has a hard embedding glue-line.
8. electronic power supply as claimed in claim 7; It is characterized in that: said upper shell includes the end plate that side plate that a top board, two extends to form respectively from the both sides of the edge of said top board and two extends to form respectively from the edges at two ends of said top board downwards downwards; The outside of each end plate is formed with a convex closure plate; Said convex closure plate combines with end plate and is formed with a groove; And its place, outer face is formed with an outer inlet wire recess, is provided with a protective ring in the said outer inlet wire recess, is formed with inlet wire recess in corresponding to said outer inlet wire indent on the said end plate; Wire rod passes said protective ring, interior inlet wire recess in order and is electrically connected with the circuit board that is arranged within the said shell, and said cover plate is fixed said protective ring outside said among the inlet wire recess.
9. the encapsulating method of an electronic power supply as claimed in claim 7 is characterized in that, includes following steps:
A, wire rod is welded on the corresponding position of power supply circuit board;
B, power supply circuit board is put into upper shell with the one side that is provided with electronic devices and components towards the mode of opening;
C, soft casting glue is injected the inner chamber of upper shell, make soft casting glue flood the plate body of power supply circuit board at least, be solidified to form to the plate body of major general's circuit board and be wrapped in the soft embedding glue-line in it;
D, hard heat conduction casting glue is injected the remainder of upper shell inner chamber, be solidified to form hard embedding glue-line;
E, cover plate is assembled in upper shell.
10. the encapsulating method of electronic power supply as claimed in claim 9 is characterized in that, in step c; After injecting soft casting glue, upper shell inserted in the vacuum machine vacuumize processing, to extract the step of the bubble in the soft casting glue out; And in steps d; After injecting the hard casting glue, upper shell inserted in the vacuum machine vacuumize processing, to extract the bubble in the hard casting glue out.
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| CN2012100316645A CN102548313A (en) | 2012-02-13 | 2012-02-13 | Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply |
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| CN2012100316645A CN102548313A (en) | 2012-02-13 | 2012-02-13 | Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply |
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| CN105283016A (en) * | 2015-11-30 | 2016-01-27 | 中国电子科技集团公司第四十三研究所 | Vacuum encapsulation device for high-power high-packaging-density electronic products, and encapsulation method thereof |
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| CN105318080A (en) * | 2014-07-29 | 2016-02-10 | 杭州三花研究院有限公司 | Electronic expansion valve, motor coil, circuit board assembly and glue filling method |
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Application publication date: 20120704 |