CN101873780A - Encapsulating method of EPS (Electric Power Storage) controller - Google Patents

Encapsulating method of EPS (Electric Power Storage) controller Download PDF

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Publication number
CN101873780A
CN101873780A CN 201010174277 CN201010174277A CN101873780A CN 101873780 A CN101873780 A CN 101873780A CN 201010174277 CN201010174277 CN 201010174277 CN 201010174277 A CN201010174277 A CN 201010174277A CN 101873780 A CN101873780 A CN 101873780A
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CN
China
Prior art keywords
mainboard
silica gel
power panel
epoxy resin
encapsulating
Prior art date
Application number
CN 201010174277
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Chinese (zh)
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CN101873780B (en
Inventor
吴义全
张大硕
Original Assignee
重庆三祥汽车电控系统有限公司
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Application filed by 重庆三祥汽车电控系统有限公司 filed Critical 重庆三祥汽车电控系统有限公司
Priority to CN2010101742778A priority Critical patent/CN101873780B/en
Publication of CN101873780A publication Critical patent/CN101873780A/en
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Publication of CN101873780B publication Critical patent/CN101873780B/en

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Abstract

The invention discloses an encapsulating method of an EPS (Electric Power Storage) controller. The method comprises the following steps of: (1) mounting a mainboard at the bottom of a heat dissipation box body, and suspending a power panel in the heat dissipation box body and above the mainboard, wherein the surfaces of the mainboard and the power panel are coated with silica gel; and (2) after the silica gel is solidified, encapsulating epoxy resin in the heat dissipation box body. In the method, the surfaces of the mainboard and the power panel are coated with the silica gel, and the contractility of the silica gel is small so that welding spots of chip components and connecting lines on the mainboard and the power panel are effectively protected, and the reliability of electric connection is enhanced; the epoxy resin is encapsulated in the heat dissipation box body and has higher rigidity and stronger breakage-proof capacity; and the power panel, the mainboard and the heat dissipation box body are bonded into a whole through the epoxy resin and the silica gel, thus the integral anti-vibration, dust proofing, water proofing and anti-corrosion capacities and the durability are enhanced, and the service life is prolonged.

Description

The encapsulating method of EPS controller
Technical field
The present invention relates to a kind of method of making electric boosting steering system EPS controller, relate in particular to a kind of encapsulating method of EPS controller.
Background technology
EPS (electric boosting steering system) controller is that a collection control that is applied to vehicle is the Electric Machine Control driver of one with power drive, and its input and output power is greater than 200W, and electronic control unit mainly is made up of mainboard and power panel.
The EPS controller comprises heat radiation box body, mainboard and power panel, and mainboard is fixedly installed on the bottom of heat radiation box body, and power panel is installed in the heat radiation box body by bracing frame and is unsettled above mainboard, is electrically connected by conductor wire between power panel and the mainboard.Because the restriction in automobile Arrangement of Engine-room space, the volume of requirement EPS controller can not be excessive, overweight, simultaneously because the environment for use of automobile electronics is quite abominable, so vibrationproof, dust and water protection are had higher requirement, be everlasting in the prior art heat radiation box body the top seal lid, the method that employing seals lid can only partly solve dustproof problem, but vibrationproof and waterproof problem still be not resolved, and the electronic control unit in the heat radiation box body often goes to pot because of vibration.In order to solve vibrationproof better, some researchers adopt the method for direct encapsulated epoxy resin in the heat radiation box body, but adopt the method for direct encapsulated epoxy resin mainly to have following deficiency: one, epoxy resin produces very big internal stress in solidification process, the connecting line solder joint that has born tensile force is originally very easily pulled take off; Do not taken off even two connecting lines pull, in the process of high and low temperature impact test, owing to expanding with heat and contract with cold of epoxy resin, fragile connecting line also is easy to be torn.Therefore, the production qualification rate of EPS controller is low, and reliability and durability are relatively poor, and useful life is short.
Summary of the invention
At weak point of the prior art, it is strong to the invention provides a kind of reliability and durability, production qualification rate height, the encapsulating method of the EPS controller of long service life.
The encapsulating method of a kind of EPS controller provided by the invention comprises the steps:
1) mainboard is installed in the bottom of heat radiation box body, power panel is unsettled to be installed in the heat radiation box body and to be positioned at the top of mainboard, at the surface-coated silica gel of described mainboard and power panel;
2) treat that silica gel solidifies after, encapsulated epoxy resin in described heat radiation box body.
Further, in described step 1), pour into silica gel in the EPS controller and slowly rotation, make silica gel cover the surface of mainboard and power panel, layer of silica gel thickness is 1~2mm.
Beneficial effect of the present invention: the present invention is in the surface-coated layer of silica gel of mainboard and power panel, and the shrinkage of silica gel is little, and the solder joint of surface mount elements on mainboard and the power panel and connecting line is effectively protected, and the reliability of electrical connection strengthens; Encapsulated epoxy resin in the heat radiation box body, epoxy resin has bigger hardness, and the breakage-proof ability is stronger, power panel, mainboard and heat radiation box body by silica gel and epoxy bond in one, strengthen whole vibrationproof, anti-gray, waterproof, antiseptic power and durability, increase useful life.
Description of drawings
Accompanying drawing is a structural representation of the present invention.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is done explanation in further detail.
Accompanying drawing is a structural representation of the present invention, as shown in the figure.The encapsulating method of EPS controller comprises the steps: 1) mainboard 2 is installed in the bottom of heat radiation box body 1, the unsettled tops that are installed in the heat radiation box body 1 and are positioned at mainboard 2 of power panel 3, power panel 3 is electrically connected with mainboard 2 by conductor wire 6; 2) at the surface-coated silica gel 4 of described mainboard 2 and power panel 3; 3) treat that silica gel 4 solidifies after, encapsulated epoxy resin 5 in described heat radiation box body 1.
In the present embodiment, be silica gel to be poured in the EPS controller and slowly to rotate in the method for the surface-coated silica gel 4 of described mainboard 2 and power panel 3, its consumption exceeds with the surface that just fully covers mainboard 2 and power panel 3.Because the viscosity of silica gel is bigger; silica gel is understood some and is trapped in mainboard 2 and circuit board 3 surfaces; the coating of formation 1~2mm (for example; coating be 1mm, 1.5mm, 1.8mm or 2mm all can); carry out hyperthermia drying again; coating can be solidificated in circuit board surface, thereby the leg of components and parts on the circuit board and connecting line is protected, and keeps apart with the epoxy resin of follow-up embedding.After finishing above-mentioned silica gel and applying operation, epoxy resin is poured in the EPS controller, use amount is exceeded to be full of the remaining space in the heat radiation box body 1 fully and to form concave meniscus in the open surfaces of heat radiation box body 1.Carry out hyperthermia drying at last again, epoxy resin cure makes whole EPS controller become the firm integral body of sealing fully, thereby reaches the purpose of vibrationproof, dust and water protection.
Adhesive strength between silica gel 4 and mainboard 2 and the power panel 3 is very low, and the shrinkage stress of silica gel is little, and main effect is the surface mount elements on protection mainboard 2 and the power panel 3 and the solder joint of connecting line.After silica gel is coated in the surface of mainboard 2 and power panel 3, again to the heat radiation box body 1 in encapsulated epoxy resin 5, epoxy resin expands little in the process of being heating and curing, surfacing, good looking appearance; And hardness is higher, and vibrationproof and anti-damage ability are strong, and the mainboard of ECU inside and unsettled power panel are protected better, prolongs the useful life of whole EPS controller.
Explanation is at last, above embodiment is only unrestricted in order to technical scheme of the present invention to be described, although the present invention is had been described in detail with reference to preferred embodiment, those of ordinary skill in the art is to be understood that, can make amendment or be equal to replacement technical scheme of the present invention, and not breaking away from the aim and the scope of technical solution of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.

Claims (2)

1. the encapsulating method of an EPS controller is characterized in that, comprises the steps:
1) mainboard (2) is installed in the bottom of heat radiation box body (1), power panel (3) is unsettled to be installed in the heat radiation box body (1) and to be positioned at the top of mainboard (2), at the surface-coated silica gel (4) of described mainboard (2) and power panel (3);
2) treat that silica gel (4) solidifies after, encapsulated epoxy resin (5) in described heat radiation box body (1).
2. the encapsulating method of EPS controller according to claim 1 is characterized in that: in described step 1), pour into silica gel in the EPS controller and slowly rotation, the layer of silica gel thickness that makes silica gel cover the surface of mainboard (2) and power panel (3) is 1~2mm.
CN2010101742778A 2010-05-17 2010-05-17 Encapsulating method of EPS (Electric Power Storage) controller CN101873780B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010101742778A CN101873780B (en) 2010-05-17 2010-05-17 Encapsulating method of EPS (Electric Power Storage) controller

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010101742778A CN101873780B (en) 2010-05-17 2010-05-17 Encapsulating method of EPS (Electric Power Storage) controller

Publications (2)

Publication Number Publication Date
CN101873780A true CN101873780A (en) 2010-10-27
CN101873780B CN101873780B (en) 2012-06-20

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548313A (en) * 2012-02-13 2012-07-04 惠州茂硕能源科技有限公司 Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply
CN104319266A (en) * 2014-10-14 2015-01-28 联合汽车电子有限公司 Sealant encapsulation structure of automotive electronic elements and sealant sealing method thereof
CN104316094A (en) * 2014-10-14 2015-01-28 联合汽车电子有限公司 Rubber sealing type sensor and manufacturing process thereof
CN106852055A (en) * 2017-02-07 2017-06-13 西安奇维科技有限公司 A kind of encapsulating method of medium-sized high overload tape deck
CN109983854A (en) * 2016-11-23 2019-07-05 罗伯特·博世有限公司 The carrier module of carrier module, especially automotive controls

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003063325A (en) * 2001-08-22 2003-03-05 Omron Corp Case for electric power steering controller
CN101022145A (en) * 2006-02-15 2007-08-22 深圳市量子光电子有限公司 Light-emitted diode
CN101079411A (en) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 Electronic encapsulation part resisting electromagnetic interference
CN101272669A (en) * 2007-03-20 2008-09-24 林士云 Electric power-assisted steering controller frame structure
CN201334045Y (en) * 2008-08-29 2009-10-28 上海航天卫星应用有限公司 Automobile electric power-assisted steering controller

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003063325A (en) * 2001-08-22 2003-03-05 Omron Corp Case for electric power steering controller
CN101022145A (en) * 2006-02-15 2007-08-22 深圳市量子光电子有限公司 Light-emitted diode
CN101079411A (en) * 2006-05-23 2007-11-28 台达电子工业股份有限公司 Electronic encapsulation part resisting electromagnetic interference
CN101272669A (en) * 2007-03-20 2008-09-24 林士云 Electric power-assisted steering controller frame structure
CN201334045Y (en) * 2008-08-29 2009-10-28 上海航天卫星应用有限公司 Automobile electric power-assisted steering controller

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102548313A (en) * 2012-02-13 2012-07-04 惠州茂硕能源科技有限公司 Electronic equipment sealing structure, electronic power supply and encapsulation method for electronic power supply
CN104319266A (en) * 2014-10-14 2015-01-28 联合汽车电子有限公司 Sealant encapsulation structure of automotive electronic elements and sealant sealing method thereof
CN104316094A (en) * 2014-10-14 2015-01-28 联合汽车电子有限公司 Rubber sealing type sensor and manufacturing process thereof
CN104319266B (en) * 2014-10-14 2017-12-12 联合汽车电子有限公司 The sealant sealing assembling structure and glue encapsulation method of auto electronic element
CN109983854A (en) * 2016-11-23 2019-07-05 罗伯特·博世有限公司 The carrier module of carrier module, especially automotive controls
CN109983854B (en) * 2016-11-23 2021-01-08 罗伯特·博世有限公司 Carrier assembly, in particular for a motor vehicle control device
CN106852055A (en) * 2017-02-07 2017-06-13 西安奇维科技有限公司 A kind of encapsulating method of medium-sized high overload tape deck

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