CN108808618B

CN108808618B - Method for manufacturing electronic machine and electronic machine

Info

Publication number: CN108808618B
Application number: CN201710310123.9A
Authority: CN
Inventors: 三田贵章; 杉本诚; 井上大辅; 林裕介; 后勇树; 桂浩人; 上原尚美
Original assignee: Omron Corp
Current assignee: Omron Corp
Priority date: 2017-05-04
Filing date: 2017-05-04
Publication date: 2020-06-23
Anticipated expiration: 2037-05-04
Also published as: CN108808618A

Abstract

The invention provides an electronic apparatus which can reduce the manufacturing cost and expand the selection range of the material types of resin parts. The electronic machine includes: the cable connector includes a housing, a cable drawn out of the housing, a resin-made joint spacer member attached to the cable, a cylindrical jig for holding the cable, and a sealing resin section for filling an internal space defined by the housing and the jig. The cable has a core wire and a resin sheath covering the core wire, and the core wire is exposed at an end portion of the cable without being covered with the sheath. The joint spacer member has a cylindrical base portion covering the outer peripheral surface of the sheath, and an extension portion extending from the base portion and joined to the sealing resin portion. The base portion is welded to the sheath, whereby the joint spacer is fixed to the cable.

Description

Method for manufacturing electronic machine and electronic machine

Technical Field

The present invention relates to a method of manufacturing an electronic device and an electronic device, and more particularly, to a method of manufacturing an electronic device in which a space inside a housing is sealed with a resin and a cable is pulled out from the inside of the housing to the outside, and an electronic device.

Background

In a specific electronic device, in order to ensure environmental resistance, the space inside the housing in which electronic components are housed is sealed with resin. In this case, how to pull out a power supply cable for supplying power or a signal cable for connecting to an external terminal from the inside of the housing while ensuring environmental resistance becomes a problem.

Generally, the cable such as the power cable or the signal cable is configured as follows: the cable is held by an elastically deformable jig fitted in an opening provided in the housing, thereby relaxing stress applied to the cable. However, in the configuration in which the cable is held only by the jig, the joint force between the cable and the sealing resin portion sealing the space inside the housing cannot be sufficiently ensured, and peeling occurs at the connection portion, resulting in poor environmental resistance.

Therefore, various methods of increasing the bonding force between the cable and the sealing resin portion have been studied, and for example, a method of increasing the bonding force between the cable and the sealing resin portion provided in a proximity sensor for detecting the presence or position of a metal body by a magnetic field is disclosed in japanese patent laid-open publication No. 2015-177042 (patent document 1) or japanese patent laid-open publication No. 2009-43429 (patent document 2).

In the proximity sensor disclosed in patent document 1, a loop wire (ring cord) made of Polybutylene terephthalate (PBT) resin is formed by insert molding so as to cover an end portion of a cable made of polyvinyl chloride (PVC) resin, and a sealing resin portion is formed in a state where the loop wire is pressed into a jig, whereby a bonding force between the cable and the sealing resin portion is secured by the loop wire.

In the proximity sensor disclosed in patent document 2, a two-color molded member made of Polyurethane (PUR) resin and PBT resin is formed by insert molding so as to cover an end portion of a cable, an inverted truncated cone-shaped protrusion is provided at a tip of the two-color molded member, and a sealing resin portion is formed in a state where the two-color molded member is press-fitted into a jig, whereby a bonding force between the cable and the sealing resin portion is secured by the two-color molded member.

[ Prior art documents ]

[ patent document ]

[ patent document 1] Japanese patent laid-open No. 2015-177042

[ patent document 2] Japanese patent application laid-open No. 2009-43429

Disclosure of Invention

[ problems to be solved by the invention ]

However, even when the configurations disclosed in patent documents 1 and 2 are adopted, since the loop or the two-color molded member must be formed at the end portion of the cable by insert molding, it is necessary to prepare molds corresponding to various specifications or to variously change molding conditions. Therefore, in recent years, there is a demand for suppressing the manufacturing cost required for insert molding as much as possible.

Even when the configurations disclosed in patent documents 1 and 2 are adopted, there is a situation in which sufficient environmental resistance is not ensured even under a relatively severe environment. For example, even in an environment where a large amount of oil such as cutting oil is used in an environment where a temperature change with time is severe, there is a possibility that a connection portion between the housing and the cable is peeled off and damaged.

In order to solve this problem, it is considered to use a material having excellent oil resistance as the loop wire or the two-color molding member, but such a material is generally not suitable for insert molding in many cases.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a method of manufacturing an electronic device and an electronic device, which can reduce manufacturing costs and expand a selection range of material types of various resin components for improving environmental resistance.

[ means for solving problems ]

According to the method of manufacturing an electronic device of the present invention, an electronic device is manufactured, the electronic device including: a housing provided with an opening; an electronic component housed in the housing; a cable inserted through the opening, one end of the cable being electrically connected to the electronic component, and the other end of the cable being pulled out to the outside; a resin joint spacer member attached to the cable; a cylindrical jig fitted in the opening and fitted with the joint spacer member to hold the cable; and a sealing resin part filling a space defined by the housing and the jig. The method for manufacturing an electronic device according to the present invention includes: a step of manufacturing the joint spacer member so as to have a cylindrical base portion and an extension portion extending from the base portion; a step of attaching the joining medium member to a portion of the one end side of the cable so that the outer peripheral surface of the sheath is covered with the base portion and the extending portion extends from the base portion toward the one end side of the cable; a step of welding the base portion to the sheath, thereby fixing the joint spacer to the cable; and filling an internal space defined by the housing and the jig with the sealing resin portion so as to be joined to the extending portion of the joining medium member.

In this way, by welding the joint spacer member to the sheath, the joint spacer member can be easily fixed to the cable, so that the manufacturing cost can be reduced, and the range of material selection for various resin components for improving the environmental resistance can be expanded.

In the method of manufacturing an electronic device according to the present invention, it is preferable that a thickness of a portion of the base portion to be welded to the sheath before welding is 0.3mm or more and 0.5mm or less.

In this manner, by setting the thickness of the portion of the base portion of the joining medium member to be welded to the sheath before welding to 0.3mm or more and 0.5mm or less, it is possible to reliably weld the portion and to ensure the sealing property at the portion.

In the method of manufacturing an electronic device according to the present invention, it is preferable that the sealing resin portion includes any one of an epoxy resin and a polyurethane resin, the joining medium member includes any one of a polybutylene terephthalate resin, a polyurethane resin, a nylon-based resin, and a fluorine-based resin, and the sheath includes any one of a polyvinyl chloride resin, a polyurethane resin, and a fluorine-based resin.

As described above, in the method of manufacturing an electronic apparatus according to the present invention, a sealing resin portion, a joint spacer member, and a sheath made of various resins can be used.

An electronic apparatus according to the present invention includes: a housing provided with an opening; an electronic component housed in the housing; a cable inserted through the opening, one end of the cable being electrically connected to the electronic component, and the other end of the cable being pulled out to the outside; a resin joint spacer member attached to the cable; a cylindrical jig fitted in the opening and fitted with the joint spacer member to hold the cable; and a sealing resin part filling a space defined by the housing and the jig. The cable has a core wire including a conductive wire and a resin sheath covering the core wire, and the core wire is exposed without being covered with the sheath in a portion of the one end side of the cable. The joint spacer member has a cylindrical base portion covering an outer peripheral surface of the sheath, and an extending portion extending from the base portion toward the one end side of the cable and joined to the sealing resin portion. In the electronic apparatus according to the present invention, the base portion is welded to the sheath, and the joint spacer is fixed to the cable.

In the electronic device according to the present invention, it is preferable that the sealing resin portion includes any one of an epoxy resin and a polyurethane resin, the joining medium member includes any one of a polybutylene terephthalate resin, a polyurethane resin, a nylon-based resin, and a fluorine-based resin, and the sheath includes any one of a polyvinyl chloride resin, a polyurethane resin, and a fluorine-based resin.

As described above, in the electronic apparatus according to the present invention, the sealing resin portion, the joint spacer member, and the sheath may be made of various resins.

[ Effect of the invention ]

According to the present invention, it is possible to provide a method of manufacturing an electronic device and an electronic device, which can reduce manufacturing costs and expand the range of selection of material types of various resin components for improving environmental resistance.

Drawings

Fig. 1 is a perspective view of a proximity sensor according to embodiment 1 of the present invention.

Fig. 2 is a sectional view taken along line II-II shown in fig. 1.

Fig. 3 is an enlarged sectional view of the region III shown in fig. 2.

Fig. 4 is a schematic perspective view of the cable shown in fig. 1 and a joint spacer member fixed thereto.

Fig. 5 is a flowchart for explaining a method of manufacturing a proximity sensor according to embodiment 1 of the present invention.

Fig. 6(a) to 6(E) are assembly views for explaining a method of manufacturing a proximity sensor according to embodiment 1 of the present invention.

Fig. 7(a) and 7(B) are schematic sectional views for explaining the reason why a high bonding force can be secured at the connection portion between the housing and the cable in the proximity sensor according to embodiment 1 of the present invention, and front views of the cable to which the bonding spacer member is fixed.

Fig. 8 is an enlarged sectional view of the region VIII shown in fig. 7(a) and 7 (B).

Fig. 9 is an enlarged cross-sectional view of a main portion of a proximity sensor according to modification 1.

Fig. 10 is an enlarged cross-sectional view of a main part of a proximity sensor according to modification 2.

Fig. 11 is an enlarged cross-sectional view of a main part of a proximity sensor according to modification 3.

Fig. 12 is an enlarged cross-sectional view of a main portion of a proximity sensor according to modification 4.

Fig. 13 is an enlarged cross-sectional view of a main portion of a proximity sensor according to modification 5.

Fig. 14 is a flowchart for explaining a method of manufacturing a proximity sensor according to embodiment 2 of the present invention.

Fig. 15(a) and 15(B) are assembly views for explaining a method of manufacturing a proximity sensor according to embodiment 2 of the present invention.

[ description of symbols ]

1A to 1F: proximity sensor

10: outer casing

20: probe assembly

21: core

21 a: support groove

22: detection coil

23: coil casing

24: circuit board

24 a: connecting disc

25a to 25 c: electronic component

26: 1 st sealing resin part

30: cable with a protective layer

31: core wire

31 a: conductive wire

32: shielding material

33: protective sleeve

40: joint spacer member

41: base part

41 a: weld part

42. 44, 45: extending part

42 a: front end part

43: trough part

50: clamp apparatus

51: fixing part

52: holding part

53: connecting part

53 a: pouring gate

53 b: light guide part

60: 2 nd sealing resin part

t1, t 2: thickness of

A. B, C, D, E, F, G: arrow head

L: length in axial direction

W: width of

ST 11-ST 17, ST 21-ST 28: step (ii) of

Detailed Description

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the embodiments described below, the case where the present invention is applied to a proximity sensor and a method for manufacturing the proximity sensor is described by way of example. In the embodiments described below, the same or common portions are denoted by the same reference numerals in the drawings, and the description thereof will not be repeated.

(embodiment mode 1)

Fig. 1 is a perspective view of a proximity sensor in embodiment 1 of the present invention, and fig. 2 is a sectional view taken along line II-II shown in fig. 1. Fig. 3 is an enlarged cross-sectional view of a region III shown in fig. 2, and fig. 4 is a schematic perspective view of the cable shown in fig. 1 and the joint spacer member fixed thereto. First, the configuration of the proximity sensor 1A according to the present embodiment will be described with reference to fig. 1 to 4.

As shown in fig. 1 and 2, a proximity sensor 1A as an electronic device in the present embodiment has a substantially cylindrical outer shape and includes: the probe unit assembly 20 includes a housing 10, a probe unit assembly 20 including a 1 st sealing resin unit 26, a cable 30, a joint spacer member 40, a jig 50, and a 2 nd sealing resin unit 60.

The housing 10 includes a metal elongated cylindrical member having both ends open, and has a front end portion and a rear end portion in the axial direction. The probe assembly 20 is assembled to the front end of the housing 10, and the jig 50 is assembled to the rear end of the housing 10.

As shown in fig. 2, the probe assembly 20 mainly includes: a core 21, a search coil 22, a coil case 23, a circuit board 24, and a 1 st sealing resin portion 26.

The core 21 includes a short strip-like cylindrical member containing a magnetic material. The search coil 22 is formed in a substantially cylindrical shape by winding a lead wire, for example, and is housed in an annular recess provided in the distal end surface of the core 21. Further, a support groove 21a for supporting the front end portion of the circuit board 24 is provided on the rear end surface of the core 21.

The coil case 23 includes a bottomed cylindrical insulating member, and houses the core 21 and the probe coil 22 therein. The front end surface of the core 21 abuts on the bottom of the coil housing 23. The coil case 23 is press-fitted and fixed into the case 10 so that the bottom thereof is positioned at the front end of the case 10.

The circuit board 24 is disposed behind the core 21 so as to extend in the axial direction of the housing 10. The circuit board 24 has conductive patterns formed on the front and rear surfaces thereof, and various electronic components 25a to 25c and the like are mounted at predetermined positions on the front and rear surfaces. The detection coil 22 is electrically connected to the circuit board 24 via a needle attached to an end of the detection coil 22.

Among the various electronic components 25a to 25c mounted on the circuit board 24, the electronic component 25c mounted on the rear end portion of the circuit board 24 is a light-emitting element that emits light by being energized. The Light Emitting element emits Light in accordance with the operation state of the proximity sensor 1A, and includes, for example, a Light Emitting Diode (LED).

Various processing circuits are formed on the circuit board 24. As a processing circuit, comprising: an oscillation circuit having the detection coil 22 as a resonance circuit element, or a discrimination circuit (discrimination circuit) for comparing an oscillation amplitude of the oscillation circuit with a threshold value and performing binarization. The circuit board 24 is also provided with an output circuit for converting the output of the discrimination circuit into a voltage output or a current output of a predetermined specification, or a power supply circuit for converting externally-supplied power into a predetermined power supply specification and outputting the power. A light-emitting element driving circuit for controlling the driving of the electronic component 25c as the light-emitting element is also provided on the circuit board 24.

The various circuits include the conductive patterns provided on the circuit board 24, the various electronic components 25a to 25c, the search coil 22, and the like.

The 1 st sealing resin portion 26 seals the core 21 and the probe coil 22 housed in the coil case 23, and the front end portion of the circuit board 24. The 1 st sealing resin portion 26 protects the core 21, the probe coil 22, and the front end portion of the circuit board 24, and seals them from the outside in an airtight and liquid-tight manner.

The 1 st sealing resin portion 26 is formed by injecting a liquid resin into the coil case 23 and curing the liquid resin. As a material of the 1 st encapsulating resin section 26, for example, an epoxy resin, a PUR resin, or the like can be suitably used.

A land (land)24a to which a conductive wire 31a included in a core wire 31 of the cable 30 described later is connected is provided at a predetermined position of the rear end portion of the circuit board 24. For example, solder not shown may be used for connection of the land 24a and the conductive line 31 a.

Cable 30 comprises a composite cable comprising: a core 31 including a conductive wire 31a, and a shield material 32 and a sheath 33 covering the core 31. The cable 30 is inserted into an opening provided in the housing 10 on the rear end side, and is electrically connected to the various circuits by being connected to the circuit board 24 at one end and pulled out to the outside at the other end. The sheath 33 is made of resin, and preferably includes any one of PVC resin, PUR resin and fluorine resin.

Here, at the one end of the cable 30, the shield material 32 and the sheath 33 are peeled off so that the core wire 31 is exposed, and the covering material of the core wire 31 is also peeled off so that the conductive wire 31a is exposed at the portion of the core wire 31 connected to the land 24 a.

As shown in fig. 2 to 4, the joint spacer member 40 is a member for securing the joint property between the cable 30 and the 2 nd sealing resin portion 60, and is assembled to the end portion of the sheath 33 positioned on the one end side of the cable 30.

The joint spacer member 40 has a cylindrical base portion 41 and a cylindrical extended portion 42, the cylindrical base portion 41 covering the outer peripheral surface of the end portion of the sheath 33 positioned on the one end side of the cable 30 in the internal space defined by the housing 10 and the jig 50, and the cylindrical extended portion 42 extending toward the one end side of the cable 30 beyond the end portion of the sheath 33 positioned on the one end side of the cable 30. The joint spacer 40 is attached to the cable 30 so that at least a part of the joint spacer 40 enters the space defined by the housing 10 and the jig 50. More specifically, the extending portion 42 is located on the one end side of the cable 30 than the end portion of the sheath 33 located on the one end side of the cable 30, and protrudes so as to extend in the extending direction of the cable 30. The cylindrical extending portion 42 includes a relatively thick portion located on the proximal end side thereof and a sufficiently thin portion located on the distal end side thereof. The bonding spacer member 40 is made of a resin, and preferably includes any one of a PBT resin, a PUR resin, a nylon resin, and a fluorine resin.

Here, in the present embodiment, the outer shape of the portion on the tip end side of the extending portion 42 is configured to be smaller than the outer shape of the portion on the base end side of the extending portion 42 and the outer shape of the base portion 41 when viewed in the extending direction of the cable 30. With this configuration, the configuration of the jig 50 described later can be simplified, and accordingly, the outer shape of the connection portion between the housing 10 and the cable 30 can be reduced.

A welded portion 41a is formed on the base portion 41. The welding portion 41a is a portion formed by fixing the joint spacer member 40 to the cable 30 by welding. By welding the base portion 41 to the sheath 33 in this manner, the joint spacer member 40 is immovably fixed to the cable 30.

A groove portion 43 extending in the circumferential direction is provided at a predetermined position on the outer peripheral surface of the distal end side portion of the extending portion 42. The groove portion 43 is an uneven portion provided to improve the joining force between the after-mentioned 2 nd sealing resin portion 60 and the joining spacer member 40, and by providing the groove portion 43 on the extending portion 42, a so-called anchor effect (anchoreffect) can be obtained and the joining force can be improved. The anchor effect is an effect of increasing the joining force by providing unevenness on the joining surface, and the unevenness becomes a wedge.

As shown in fig. 2 and 3, the jig 50 has a substantially cylindrical shape, and the cable 30 is inserted therein. The clamp 50 is fitted in an opening portion on the rear end side provided in the housing 10, and the joint spacer member 40 is fitted in the rear end portion of the clamp 50, thereby holding the cable 30. The jig 50 is made of a resin material so as to be elastically deformable, and is used to relax the stress applied to the cable 30 and the stress applied to the joint spacer member 40.

In more detail, the jig 50 includes: a cylindrical fixing portion 51 located at the front end portion, a substantially cylindrical holding portion 52 located at the rear end portion, and a coupling portion 53 located between the fixing portion 51 and the holding portion 52 and coupling the fixing portion 51 and the holding portion 52.

The fixing portion 51 is a portion for fixing the jig 50 to the housing 10 by being press-fitted into an opening portion on the rear end side provided in the housing 10. The holding portion 52 is a portion for holding the joint spacer member 40 by pressing the joint spacer member 40 into the inside thereof. The connecting portion 53 is a portion for improving the function of relaxing the stress applied to the cable 30 and the stress applied to the joint spacer member 40 by securing only a predetermined distance between the fixing portion 51 and the holding portion 52.

In order to fill the 2 nd encapsulating resin portion 60 into the space defined by the housing 10 and the jig 50, a gate (gate)53a used when injecting the liquid resin to be the 2 nd encapsulating resin portion 60 is provided at a predetermined position of the connecting portion 53.

In the present embodiment, the jig 50 is made of a non-light-shielding resin material. This is because the light guide portion 53b having a predetermined shape is provided in a portion of the fixing portion 51 facing the light emitting element, in order to project the light emitted from the electronic component 25c as the light emitting element to the outside through the jig 50.

The 2 nd sealing resin portion 60 fills a space other than the space sealed by the 1 st sealing resin portion 26 among the internal spaces defined by the housing 10 and the jig 50. Thus, the portion of the circuit board 24 other than the distal end portion, the various electronic components 25a to 25c mounted on the portion, and the core wire 31 of the portion not covered with the sheath 33 of the cable 30 are sealed by the 2 nd sealing resin portion 60.

The 2 nd sealing resin portion 60 protects the portion of the circuit board 24 other than the distal end portion, the various electronic components 25a to 25c mounted thereon, and the core wire 31 of the portion not covered with the sheath 33 of the cable 30, and seals them from the outside in an airtight and liquid-tight manner.

The 2 nd sealing resin portion 60 is formed by injecting a liquid resin through the gate 53a of the jig 50 and curing the liquid resin as described above. As a material of the 2 nd encapsulating resin section 60, for example, an epoxy resin, a PUR resin, or the like can be suitably used.

Here, as shown in fig. 3, the extending portion 42 of the joining spacer member 40 is joined to the 2 nd sealing resin portion 60, and the inner peripheral surface of the portion on the tip end side of the extending portion 42, the outer peripheral surface thereof, and the end surface on the tip end side in the axial direction thereof are covered with the 2 nd sealing resin portion 60. Thus, in the proximity sensor 1A of the present embodiment, the joining force between the cable 30 and the 2 nd sealing resin portion 60 is ensured to be higher than that of the previous proximity sensor, but the detailed mechanism thereof will be described later.

Fig. 5 and 6(a) to 6(E) are a flowchart and an assembly diagram for explaining a method of manufacturing the proximity sensor according to the present embodiment, respectively. Next, a method for manufacturing the proximity sensor according to the present embodiment will be described with reference to fig. 5 and fig. 6(a) to 6 (E).

First, as shown in fig. 5, the joint spacer member 40 is produced (step ST 11). More specifically, the joint spacer member 40 is formed to have a cylindrical base portion 41 and a cylindrical extending portion 42 extending from the base portion 41. Various methods such as injection molding can be applied to manufacture the joint spacer member 40.

Then, as shown in fig. 5 and 6 a, the joint spacer 40 is attached to the cable 30 (step ST 12). More specifically, the base portion 41 of the joint spacer member 40 is press-fitted into the end portion of the sheath 33 of the cable 30, whereby the joint spacer member 40 is attached to the cable 30. Thereby, the outer peripheral surface of the end portion of the sheath 33 is covered by the base portion 41, and the extending portion 42 is positioned in a manner of being extended from the base portion 41.

Then, as shown in fig. 5 and 6B, the joint spacer 40 is welded to the cable 30 (step ST 13). In more detail, the base 41 of the portion pressed into the sheath 33 is heated from the outside, whereby thermal welding is performed on the portion (i.e., the portion indicated by the arrow a in fig. 6 (B)). The welding may be performed by, for example, laser irradiation, in addition to thermal welding using heat conduction.

Then, as shown in fig. 5 and 6C, the cable 30 is connected to the probe assembly 20 (step ST 14). More specifically, the exposed conductive wire 31a of the cable 30 is arranged so as to face the land 24a of the circuit board 24, and the soldering is performed in this state.

Then, as shown in fig. 5 and 6D, the probe assembly 20 is assembled to the housing 10 (step ST 15). More specifically, the probe assembly 20 is assembled to the housing 10 by pressing the probe assembly 20 into the front end of the housing 10.

Then, as shown in fig. 5 and 6E, the jig 50 is assembled to the housing 10 and the joint spacer member 40 (step ST 16). More specifically, the fixing portion 51 of the jig 50 is press-fitted into the opening portion on the rear end side of the housing 10, and the joint spacer member 40 is press-fitted into the rear end portion of the jig 50, whereby the jig 50 is assembled to the housing 10 and the joint spacer member 40.

Then, as shown in fig. 5, a liquid resin is injected into the interior of the housing 10 and the jig 50 and cured (step ST 17). More specifically, the proximity sensor 1A having the above-described configuration can be obtained by injecting a liquid resin from a portion indicated by an arrow B in fig. 6(E) through the gate 53a of the jig 50 and curing the liquid resin.

In the above description, the case where the joint spacer 40 is welded to the cable 30 after the joint spacer 40 is attached to the cable 30 and before the cable 30 is connected to the probe assembly 20 has been described, but the joint spacer 40 may be welded to the cable 30 after the cable 30 is connected to the probe assembly 20 or after the probe assembly 20 is assembled to the housing 10. That is, step ST13 may be performed between step ST14 and step ST15, or may be performed between step ST15 and step ST 16.

Further, although the case where the probe assembly 20 is assembled to the case 10 after the cable 30 is connected to the probe assembly 20 and before the jig 50 is assembled to the case 10 and the joint spacer 40 has been described above, the probe assembly 20 may be assembled to the case 10 before the cable 30 is connected to the probe assembly 20. That is, step ST15 may be performed before step ST 14.

As described above, in the method of manufacturing the proximity sensor according to the present embodiment, since the resin-made joint spacer member 40 for improving the joint force between the 2 nd sealing resin portion 60 and the cable 30 is fixed to the cable 30 by welding, the manufacturing is facilitated, and thus the manufacturing cost can be reduced, and the range of selection of the material type of various resin parts for improving the environmental resistance can be widened.

Fig. 7(a) and 7(B) are a schematic cross-sectional view for explaining the reason why a high bonding force can be secured at the connection portion between the housing and the cable in the proximity sensor according to the present embodiment, and a front view of the cable to which the bonding spacer member is fixed, respectively. In addition, fig. 8 is an enlarged sectional view of the region VIII shown in fig. 7 (a). Next, the reason why the proximity sensor 1A of the present embodiment can secure a high bonding force will be described with reference to fig. 7(a), 7(B), and 8. In fig. 7(a), the structure of the jig 50 is simplified and depicted for ease of understanding.

As described above with reference to fig. 7(a) and 7(B), in the proximity sensor 1A of the present embodiment, the substantially cylindrical extension portion 42 that is configured to be sufficiently thin and protrudes from the end portion of the sheath 33 to be seated is provided in the joint spacer member 40 provided so as to cover the end portion of the sheath 33 of the cable 30, and the inner circumferential surface and the outer circumferential surface of the portion on the distal end side of the extension portion 42 and the end surface on the distal end side of the extension portion 42 in the axial direction are each covered with the 2 nd sealing resin portion 60.

With this configuration, first, the residual stress generated when the 2 nd sealing resin portion 60 is cured can be reduced. The reason for this is that: there is the extending portion 42, and accordingly, the amount of resin of the 2 nd sealing resin portion 60 at the end portion of the 2 nd sealing resin portion 60 on the joining medium member 40 side is reduced.

Therefore, the residual stress is low, and accordingly, the joining force can be maintained high, with the result that a high joining force can be secured at the connecting portion of the housing 10 and the cable 30.

Second, the following property of the extending portion 42 can be ensured during expansion and contraction of the 2 nd encapsulating resin portion 60 accompanying a change in the ambient temperature. The reason for this is that: the thickness of the distal end side portion of the extending portion 42 is small, and accordingly, the distal end side portion of the extending portion 42 is allowed to follow and elastically deform during expansion and contraction of the 2 nd encapsulating resin portion 60.

More specifically, when the 2 nd encapsulating resin section 60 contracts, a large stress is locally applied to the end portion of the interface between the joining medium member 40 and the 2 nd encapsulating resin section 60 as indicated by an arrow C in fig. 7(a), but at this time, the portion on the tip end side of the extending section 42 is elastically deformed following the arrow D in the direction shown in the figure, and therefore the stress applied to the end portion is greatly relaxed, and the occurrence of peeling at the interface can be suppressed.

Therefore, stress applied to the interface between the bonding spacer member 40 and the 2 nd sealing resin portion 60 is reduced at the time of expansion and contraction of the 2 nd sealing resin portion 60, and accordingly, the bonding force can be maintained high, and as a result, a high bonding force can be secured at the connection portion between the housing 10 and the cable 30.

This also contributes to an increase in the choice of materials for the bonding spacer member 40 and the 2 nd sealing resin portion 60 by adopting this configuration, and therefore, by providing the proximity sensor 1A in the present embodiment, an effect of reducing various restrictions in manufacturing can be obtained.

As shown in fig. 7(a) and 8, in the proximity sensor 1A of the present embodiment, the groove portion 43 extending in the circumferential direction is provided on the outer peripheral surface of the portion on the distal end side of the extending portion 42 as described above. By so constituting, a so-called anchor effect can be obtained as described above.

More specifically, as shown in fig. 8, when the 2 nd sealing resin portion 60 contracts with a change in the ambient temperature, the vicinity of the outer peripheral surface of the 2 nd sealing resin portion 60, which is a contact surface with the jig 50, contracts in the direction indicated by the arrow E in the drawing, and accordingly, shear stress occurs in the direction indicated by the arrow F in the drawing at the interface between the joining spacer member 40 and the 2 nd sealing resin portion 60, but the groove portion 43 is located on the outer peripheral surface of the extending portion 42, and the shear stress is suppressed from reaching the tip end portion 42a of the extending portion 42, and as a result, peeling at the interface can be suppressed.

As described above, by using the proximity sensor 1A in the present embodiment, a high bonding force can be secured at the connection portion between the housing 10 and the cable 30, and occurrence of damage such as peeling at that portion can be greatly suppressed, and as a result, a proximity sensor having excellent environmental resistance can be obtained.

Referring to fig. 8, the thickness t1 at the thinnest portion of the cylindrical extending portion 42 is preferably 0.3mm to 0.5 mm. More specifically, the cylindrical extending portion 42 preferably includes a portion having a thickness t1 of 0.3mm to 0.5mm in the circumferential direction. With such a configuration, the flexibility and rigidity of the extending portion 42 can be appropriately adjusted, and the following performance can be more reliably obtained. However, the thickness of the extending portion 42 is not particularly limited thereto.

The axial length L of the thin portion of the extending portion 42 on the distal end side is preferably 0.5mm or more. By setting the axial length L to 0.5mm or more, the flexibility and rigidity of the extending portion 42 can be appropriately adjusted, and the following ability can be more reliably obtained. However, the axial length of the thin portion of the extending portion 42 on the tip side is not particularly limited thereto.

Further, the width W of the groove portion 43 is preferably 0.5mm or more. By setting the width W to 0.5mm or more, the flexibility and rigidity of the extending portion 42 can be appropriately adjusted, and the following ability can be more reliably obtained. However, the width of the groove 43 is not particularly limited thereto.

As described above, in the proximity sensor 1A of the present embodiment, the case where the groove portion 43 extending in the circumferential direction is provided on the outer peripheral surface of the portion on the distal end side of the extending portion 42 is exemplified, but an uneven portion different from the above shape may be provided on either or both of the outer peripheral surface and the inner peripheral surface of the extending portion 42, or a hole penetrating in the radial direction of the extending portion 42, various notches, or the like may be provided on the extending portion 42. Even in the case of such a constitution, the so-called anchor effect can be obtained.

As described above, in the proximity sensor 1A of the present embodiment, the case where the extending portion 42 is substantially cylindrical is exemplified, but the extending portion 42 does not necessarily need to be cylindrical, and even when the extending portion 42 is cylindrical, the outer shape thereof does not need to be cylindrical, and for example, the outer shape thereof may be polygonal cylindrical or elliptical cylindrical.

As described above, in the proximity sensor 1A of the present embodiment, it is preferable that the material of the 2 nd sealing resin portion 60 is selected from any one of epoxy resin and PUR resin, the material of the bonding spacer member 40 is selected from any one of PBT resin, PUR resin, nylon resin and fluorine resin, and the material of the sheath 33 is selected from any one of PVC resin, PUR resin and fluorine resin.

Further, when a fluorine-based resin is selected as the material of the joining medium member 40 and a fluorine-based resin is similarly selected as the material of the sheath 33, a very high oil resistance can be secured. Therefore, in a proximity sensor used in an environment where oil such as cutting oil is used in a large amount, it is preferable to use a combination of these materials.

Here, the fluorine-based resin is not suitable for insert molding, and when the material of the joint spacer member 40 is the fluorine-based resin, the joint spacer member 40 cannot be easily manufactured by insert molding. Therefore, in the method of manufacturing the proximity sensor according to the present embodiment, the joint spacer member 40 is manufactured as another component, and then is attached to the cable 30 and fixed by welding, so that the joint spacer member 40 can be changed to a joint spacer member made of a fluorine-based resin relatively easily.

Here, in general, welding can be easily performed when the difference between the melting points of the members to be joined is in the range of approximately 50 ℃ or less. Therefore, in selecting the material, the material must be selected in consideration of this point.

Referring to fig. 7(a) and 7(B), the thickness t2 of the welded portion 41a of the joint spacer member 40 formed by welding the joint spacer member 40 to the sheath 33 must be set in consideration of the sealing property at this portion. Therefore, the thickness of the portion of the base portion 41 to be the welded portion 41a before welding is preferably set to approximately 0.3mm or more and 0.5mm or less.

As described above, in the present embodiment, the case where the base portion 41 of the joining medium member 40 is fixed to the end portion of the sheath 33 positioned on the one end side of the cable 30 has been described as an example, but the base portion is not necessarily configured as such, and may be fixed to the sheath 33 at a position distant from the end portion of the sheath 33. That is, the joint spacer member may have a cylindrical base portion covering the outer peripheral surface of the sheath and an extending portion extending from the base portion toward the one end side of the cable and joined to the sealing resin portion, and the positional relationship between the end portion of the sheath and the base portion and the positional relationship between the end portion of the sheath and the extending portion may be variously changed.

(modification 1)

Fig. 9 is an enlarged cross-sectional view of a main portion of a proximity sensor according to modification 1 of the present embodiment. Next, a proximity sensor 1B according to modification 1 will be described with reference to fig. 9.

As shown in fig. 9, the proximity sensor 1B of the modification 1 is obtained by providing a lid-like extending portion 44 so as to cover the end surfaces of the sheath 33 and the shield material 32, instead of the cylindrical extending portion 42 of the bonding spacer member 40, as compared with the proximity sensor 1A of the embodiment 1. Here, as in the case of embodiment 1, the joint spacer member 40 including the lid-like extended portion 44 is fixed to the cable 30 by welding.

The proximity sensor 1B configured as described above is inferior in terms of reduction of residual stress generated at the time of curing of the 2 nd encapsulating resin portion 60 and followability of the extending portion 44 at the time of expansion and contraction of the 2 nd encapsulating resin portion 60 accompanying a change in the environmental temperature when compared with the proximity sensor 1A in embodiment 1, but is advantageous in terms of reduction of manufacturing cost by facilitating the manufacturing and increase of the degree of freedom in material selection as in the case of embodiment 1.

(modification 2)

Fig. 10 is an enlarged cross-sectional view of a main part of a proximity sensor according to modification 2 of the present embodiment. Next, a proximity sensor 1C according to a modification example 2 will be described with reference to fig. 10.

As shown in fig. 10, the proximity sensor 1C of this modification 2 differs from the proximity sensor 1A of embodiment 1 only in the following points: the joint spacer member 40 includes a base portion 41 and a cylindrical extension portion 42, and further includes a cover-shaped extension portion 44 that covers the end surfaces of the sheath 33 and the shield material 32. Here, as in the case of embodiment 1, the joint spacer member 40 including the cylindrical extending portion 42 and the lid-shaped extending portion 44 is fixed to the cable 30 by welding.

The proximity sensor 1C thus configured is advantageous in that it is superior in the reduction of residual stress generated when the 2 nd sealing resin portion 60 is cured and in the followability of the extending portion 42 at the time of expansion and contraction of the 2 nd sealing resin portion 60 accompanying a change in the environmental temperature, and in that it is possible to reduce the manufacturing cost by facilitating the manufacturing and to increase the degree of freedom in material selection, as in the case of the embodiment 1.

(modification 3)

Fig. 11 is an enlarged cross-sectional view of a main part of a proximity sensor according to modification 3 of the present embodiment. Next, a proximity sensor 1D according to a modification 3 will be described with reference to fig. 11.

As shown in fig. 11, the proximity sensor 1D of this modification 3 differs from the proximity sensor 1A of embodiment 1 only in the following points: the groove portion 43 is not provided in the cylindrical extending portion 42 of the joining medium member 40. Here, as in the case of embodiment 1, the joint spacer member 40 including the cylindrical extending portion 42 is fixed to the cable 30 by welding.

The proximity sensor 1D thus configured is advantageous in that it is superior in the reduction of residual stress generated when the 2 nd sealing resin portion 60 is cured and in the followability of the extending portion 42 at the time of expansion and contraction of the 2 nd sealing resin portion 60 accompanying a change in the environmental temperature, and in that it is possible to reduce the manufacturing cost by facilitating the manufacturing and to increase the degree of freedom in material selection, as in the case of the above-described embodiment 1.

(modification 4)

Fig. 12 is an enlarged cross-sectional view of a main part of a proximity sensor according to a 4 th modification of the present embodiment. Next, a proximity sensor 1E according to a 4 th modification will be described with reference to fig. 12.

As shown in fig. 12, the proximity sensor 1E of the 4 th modification differs from the proximity sensor 1D of the 3 rd modification only in the following points: the welded portion 41a is provided only at the rear end of the base portion 41 of the joining spacer member 40, and the base portion 41 does not become the welded portion 41a in its entirety. Here, as in the case of embodiment 1, the joint spacer member 40 including the cylindrical extending portion 42 is fixed to the cable 30 by welding.

The proximity sensor 1E thus configured is advantageous in that it is superior in the reduction of residual stress generated when the 2 nd sealing resin portion 60 is cured and in the followability of the extending portion 42 at the time of expansion and contraction of the 2 nd sealing resin portion 60 accompanying a change in the environmental temperature, and in that it is possible to reduce the manufacturing cost by facilitating the manufacturing and to increase the degree of freedom in material selection, as in the case of the above-described embodiment 1.

(modification 5)

Fig. 13 is an enlarged cross-sectional view of a main part of a proximity sensor according to a 5 th modification of the present embodiment. Next, a proximity sensor 1F according to a modification example 5 will be described with reference to fig. 13.

As shown in fig. 13, the proximity sensor 1F of the 5 th modification differs from the proximity sensor 1E of the 4 th modification in that the base portion 41 of the joining medium member 40 and the cylindrical extending portion 42 have substantially the same outer shape, and in that the inner diameter of the jig 50 corresponding to the portion of the cylindrical extending portion 42 is configured to be larger than the inner diameter of the jig 50 corresponding to the portion of the base portion 41.

The proximity sensor 1F thus configured is advantageous in that it is superior in the reduction of residual stress generated when the 2 nd sealing resin portion 60 is cured and in the followability of the extending portion 42 at the time of expansion and contraction of the 2 nd sealing resin portion 60 accompanying a change in the environmental temperature, and in that it is possible to reduce the manufacturing cost by facilitating the manufacturing and to increase the degree of freedom in material selection, as in the case of the above-described embodiment 1.

(embodiment mode 2)

Fig. 14, 15(a) and 15(B) are a flowchart and an assembly diagram, respectively, for explaining a method of manufacturing a proximity sensor according to embodiment 2 of the present invention. A method for manufacturing a proximity sensor according to the present embodiment will be described below with reference to fig. 14, 15(a), and 15 (B).

As will be described later, the method of manufacturing the proximity sensor in the present embodiment is slightly different from the method of manufacturing the proximity sensor 1A in embodiment 1, and accordingly, the shape thereof is slightly different, and the specific form thereof is substantially clear in the assembly views of fig. 15(a) and 15(B), and therefore, the illustration thereof is omitted here.

First, as shown in fig. 14, the joint spacer member 40 is produced (step ST21), the joint spacer member 40 is attached to the cable 30 (step ST22), the joint spacer member 40 is soldered to the cable 30 (step ST23), the cable 30 is connected to the probe unit assembly 20 (step ST24), and the probe unit assembly 20 is assembled to the housing 10 (step ST 25). Further, the details of the steps ST21 to ST25 are the same as those of the steps ST11 to ST15 shown in fig. 5, respectively, and therefore, the description thereof will not be repeated here.

Then, as shown in fig. 14 and 15 a, the jig 50 is assembled to the housing 10 (step ST 26). More specifically, the fixing portion 51 of the jig 50 is press-fitted into the opening portion on the rear end side of the housing 10.

Then, as shown in fig. 14 and 15B, the joint spacer member 40 is assembled to the jig 50 (step ST 27). More specifically, the jig 50 is assembled to the joint spacer member 40 by pressing the base portion 41 of the joint spacer member 40 into the rear end portion of the jig 50.

Then, as shown in fig. 14, a liquid resin is injected into the interior of the housing 10 and the jig 50 and cured (step ST 28). Further, the details of this step ST28 are the same as those of step ST17 shown in fig. 5, and therefore, the description thereof will not be repeated here. In the above manner, the proximity sensor in the present embodiment according to the configuration of the proximity sensor 1A in embodiment 1 described above can be obtained.

In the above description, the case where the joint spacer 40 is welded to the cable 30 after the joint spacer 40 is attached to the cable 30 and before the cable 30 is connected to the probe assembly 20 has been described, but the joint spacer 40 may be welded to the cable 30 at any time point from the time when the cable 30 is connected to the probe assembly 20 to the time when the proximity sensor is completed. That is, the step ST23 may be performed after any one of the steps ST24 to ST28 as long as it is after the step ST 24.

Further, although the case where the probe unit assembly 20 is assembled to the case 10 after the cable 30 is connected to the probe unit assembly 20 and before the jig 50 is assembled to the case 10 has been described above, the probe unit assembly 20 may be assembled to the case 10 before the cable 30 is connected to the probe unit assembly 20. That is, step ST25 may be performed before step ST 24.

Even in the case of the proximity sensor in the present embodiment described above, similarly to the case of embodiment 1 described above, it is advantageous in that the reduction of the residual stress generated at the time of curing the 2 nd sealing resin portion 60 and the following ability of the extending portion 42 at the time of expansion and contraction of the 2 nd sealing resin portion 60 accompanying a change in the environmental temperature are excellent, and that the manufacturing cost can be reduced by facilitating the manufacturing, and the degree of freedom in selecting a material is increased.

In the above-described embodiments 1 and 2 of the present invention and the modifications thereof, the case where the composite cable provided with the shielding material is used as the cable pulled out from the housing is exemplified and described, but various cables can be used as the cable, and for example, the present invention can be applied to a composite cable not including the shielding material or a cable including only a conductive wire and a sheath covering the conductive wire (so-called a conductive wire or the like).

In embodiments 1 and 2 and the modified examples thereof of the present invention, the case where the internal space defined by the housing and the jig is filled with the 1 st and 2 nd encapsulating resin portions has been described as an example, but the configuration is not necessarily required, and only a single encapsulating resin portion may be used.

In embodiments 1 and 2 and the modified examples thereof of the present invention, the case where the bonding spacer member includes a single component has been described as an example, but the bonding spacer member may include a plurality of components or may be a two-color molded product.

In addition, although the embodiments 1 and 2 and the modified examples thereof of the present invention have been described by exemplifying the case where the present invention is applied to a proximity sensor, the present invention may be applied to a sensor other than a proximity sensor or various electronic devices other than a sensor.

As described above, the embodiment and the modification thereof disclosed herein are illustrative in all respects and are not limited thereto. The technical scope of the present invention is defined by the claims, and includes all modifications equivalent in meaning and scope to the description of the claims.

Claims

1. A method of manufacturing an electronic device, the method comprising:

a housing provided with an opening;

an electronic component housed in the housing;

a cable inserted through the opening, one end of the cable being electrically connected to the electronic component, and the other end of the cable being pulled out to the outside;

a resin joint spacer member attached to the cable;

a cylindrical jig fitted in the opening and fitted with the joint spacer member to hold the cable; and

a sealing resin part for filling the space defined by the housing and the clamp;

the method for manufacturing the electronic machine comprises the following steps:

a step of manufacturing the joint spacer member so as to have a cylindrical base portion and an extension portion extending from the base portion;

a step of attaching the joining medium member to a portion of the one end side of the cable so that an outer peripheral surface of a sheath is covered with the base portion and the extending portion extends from the base portion toward the one end side of the cable;

a step of welding the base portion to the sheath, thereby fixing the joint spacer to the cable; and

and filling an internal space defined by the housing and the jig with the sealing resin portion so as to be joined to the extending portion of the joining medium member.

2. The method of manufacturing an electronic device according to claim 1, wherein a thickness of a portion of the base portion welded to the sheath before welding is 0.3mm or more and 0.5mm or less.

3. The method of manufacturing an electronic machine according to claim 1 or 2, wherein the sealing resin portion includes any one of an epoxy resin and a polyurethane resin,

the bonding spacer member comprises any one of polybutylene terephthalate resin, polyurethane resin, nylon resin and fluorine resin,

the sheath includes any one of a polyvinyl chloride resin, a polyurethane resin, and a fluorine-based resin.

4. An electronic machine, comprising:

a housing provided with an opening;

an electronic component housed in the housing;

a resin joint spacer member attached to the cable;

the cable comprises a core wire including a conductive wire and a resin sheath covering the core wire,

in a portion of the one end side of the cable, the core wire is exposed without being covered with the sheath,

the joint spacer member has a cylindrical base portion covering an outer peripheral surface of the sheath, and an extending portion extending from the base portion toward the one end side of the cable and joined to the sealing resin portion,

the joint spacer member is fixed to the cable by welding the base portion to the sheath.

5. The electronic machine according to claim 4, wherein the sealing resin portion includes any one of an epoxy resin and a polyurethane resin,