CN203982955U - Reactor device - Google Patents
Reactor device Download PDFInfo
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- CN203982955U CN203982955U CN201420353700.4U CN201420353700U CN203982955U CN 203982955 U CN203982955 U CN 203982955U CN 201420353700 U CN201420353700 U CN 201420353700U CN 203982955 U CN203982955 U CN 203982955U
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- reactor
- heat
- insulation layer
- reactor device
- embedding colloid
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Abstract
The application discloses a kind of reactor device, comprising: encapsulating housing; Be positioned over the reactor of encapsulating housing inside; Utilize the first casting glue encapsulating housing to be poured into the first embedding colloid forming, the first embedding colloid parcel reactor; Cover the heat-insulation layer of the first embedding colloid.The disclosed reactor device of the application, in reactor running, the heat that reactor produces conducts to after the first embedding colloid, owing to being coated with heat-insulation layer on the first embedding colloid, heat-insulation layer can reduce the heat exchange between the first embedding colloid and space outerpace, therefore can reduce the heat conducting to the space that is positioned at reactor device top, thereby delay the aging speed of the components and parts that are positioned at reactor device upper space.
Description
Technical field
The application belongs to reactor technical field, relates in particular to reactor device.
Background technology
Reactor is widely used in all kinds of electric equipments.In order to improve shockproof, waterproof and the anti-dust performance of reactor, utilize casting glue that reactor is potted in housing at present more.Casting glue after solidifying is connected as a single entity reactor and housing, can improve reactor shockproof properties, and the coated reactor of casting glue after simultaneously solidifying, avoids reactor to be exposed to space outerpace, can improve water resistance and the anti-dust performance of reactor.
But in the time that the temperature of reactor is higher, the heat that reactor produces can conduct to upper space, make components and parts in reactor top in hot environment, accelerate the aging speed of components and parts.
Utility model content
In view of this, the object of the embodiment of the present application is to provide a kind of reactor device, can reduce the heat of reactor to its upper space conduction, thereby delays the aging speed of the components and parts that are positioned at reactor device upper space.
For achieving the above object, the application provides following technical scheme:
A kind of reactor device, comprising:
Encapsulating housing;
Be positioned over the reactor of described encapsulating housing inside;
Utilize the first casting glue described encapsulating housing to be poured into the first embedding colloid forming, described the first embedding colloid wraps up described reactor;
Cover the heat-insulation layer of described the first embedding colloid.
Preferably, in above-mentioned reactor device, also comprise the wire being connected with the terminals of described reactor, described wire extends to the outside of described heat-insulation layer.
Preferably, in above-mentioned reactor device, described heat-insulation layer is insulation heat preservation layer.
Preferably, in above-mentioned reactor device, described heat-insulation layer is ceramic fibre heat-insulation layer.
Preferably, in above-mentioned reactor device, described heat-insulation layer is to utilize conductive coefficient described the first embedding colloid to be poured into the second embedding colloid forming lower than the second casting glue of described the first casting glue.
Preferably, in above-mentioned reactor device, described encapsulating housing comprises:
The main body of accommodating described reactor;
The installation portion that is positioned at the top of described main body, extends to the space outerpace of described main body, described installation portion is provided with installing hole.
Preferably, in above-mentioned reactor device, described encapsulating housing is metallic packaging housing.
As can be seen here, in the disclosed reactor device of the application, reactor is arranged at the inside of encapsulating housing, and is wrapped up by the first embedding colloid, is also provided with in addition the heat-insulation layer that covers the first embedding colloid.In reactor running, the heat that reactor produces conducts to after the first embedding colloid, owing to being coated with heat-insulation layer on the first embedding colloid, heat-insulation layer can reduce the heat exchange between the first embedding colloid and space outerpace, therefore can reduce the heat conducting to the space that is positioned at reactor device top, thereby delay the aging speed of the components and parts that are positioned at reactor device upper space.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present application or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only the application's embodiment, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
Fig. 1 is the cutaway view of the disclosed a kind of reactor device of the application;
Fig. 2 is the cutaway view of reactor device shown in Fig. 1 in concrete application scenarios;
Fig. 3 is the cutaway view of the disclosed another kind of reactor device of the application.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is clearly and completely described, obviously, described embodiment is only some embodiments of the present application, instead of whole embodiment.Based on the embodiment in the application, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the application's protection.
The application discloses a kind of reactor device, can reduce the heat of reactor to its upper space conduction, thereby delays the aging speed of the components and parts that are positioned at reactor device upper space.
Referring to Fig. 1, Fig. 1 is the cutaway view of the disclosed a kind of reactor device of the application.This reactor device comprises: encapsulating housing 1, reactor 2, the first embedding colloid 3, heat-insulation layer 4 and wire 5.
Wherein:
Reactor 2 is positioned over the inside of encapsulating housing 1.
It is to utilize the first casting glue to pour into formed to encapsulating housing 1 that the first embedding colloid 3 wraps up reactor 2, the first embedding colloids 3.The first embedding colloid 3 is connected as a single entity reactor 2 and encapsulating housing 1.In addition, because casting glue has thermal conductivity, the heat that therefore the first embedding colloid 3 can produce reactor 2 conducts to the periphery, comprises heat to encapsulating housing 1 and upper space conduction.Wherein, the heat that conducts to encapsulating housing 1 can be discharged by the cooling mechanism 100 in electric equipment, as shown in Figure 2.
Heat-insulation layer 4 can cover the first embedding colloid 3.When the heat that reactor 2 produces conducts to after the first embedding colloid 3, heat-insulation layer 4 can reduce the heat exchange between the first embedding colloid 3 and space outerpace, thereby reduces the heat conducting to the space that is positioned at reactor device top.
In the disclosed reactor device of the application, reactor 2 is arranged at the inside of encapsulating housing 1, and is wrapped up by the first embedding colloid 3, is also provided with in addition the heat-insulation layer 4 that covers the first embedding colloid 3.In reactor 3 runnings, the heat that reactor 2 produces conducts to the first embedding colloid 3, owing to being coated with heat-insulation layer 4 on the first embedding colloid 3, heat-insulation layer 4 can reduce the heat exchange between the first embedding colloid 3 and space outerpace, therefore can reduce the heat conducting to the space that is positioned at reactor device top, thereby delay the aging speed of the components and parts that are positioned at reactor device upper space.
For the ease of the terminals in operating personnel's linked reactor 2 and external circuit, in reactor device shown in Fig. 1, the wire 5 being connected with the terminals of reactor 2 is further set, namely each terminals of reactor 2 connect respectively a wire 5, the quantity of wire 5 is consistent with the quantity of the terminals of reactor 2, and wire 5 extends to the outside of heat-insulation layer 4.
In enforcement, heat-insulation layer 4 is preferably insulation heat preservation layer.For example: heat-insulation layer 3 can be ceramic fibre heat-insulation layer or heat barrier foam plate.
Preferably, heat-insulation layer 4 can be: utilize conductive coefficient the first embedding colloid 3 to be poured into the second embedding colloid forming lower than the second casting glue of the first casting glue.Because the conductive coefficient of the second embedding colloid is lower than the conductive coefficient of the first embedding colloid 3, therefore the second casting glue body can play the effect that reduces the heat exchange between the first embedding colloid and space outerpace.In addition, the second casting glue body that utilizes perfusion operation to form can cover the first embedding colloid 3 completely.
In enforcement, encapsulating housing 1 can only comprise the main body for accommodating reactor 2, as shown in Figures 1 and 2.The application further improves the structure of encapsulating housing 1, so that operating personnel are installed on reactor device in electric equipment more easily.
Referring to Fig. 3, Fig. 3 is the structural representation of the disclosed another kind of reactor device of the application.This reactor device comprises encapsulating housing 1, reactor 2, the first embedding colloid 3, heat-insulation layer 4 and wire 5.
Wherein:
Encapsulating housing 1 comprises main body 11 and installation portion 12.Main body 11 is for accommodating reactor 2.Installation portion 12 is positioned at the top of main body 11, and extends to the space outerpace of main body 11, is provided with installing hole 121 on installation portion 12.
Reactor 2 is positioned over the inside of encapsulating housing 1.
It is to utilize the first casting glue to pour into formed to encapsulating housing 1 that the first embedding colloid 3 wraps up reactor 2, the first embedding colloids 3.The first embedding colloid 3 is connected as a single entity reactor 2 and encapsulating housing 1.
Heat-insulation layer 4 can cover the first embedding colloid 3.
Each terminals of reactor 2 connect respectively a wire 5, and wire 5 extends to the outside of heat-insulation layer 4.That is to say, one end of wire 5 is connected with terminals of reactor 2, and the other end extends to the outside of heat-insulation layer 4.
In the reactor device shown in the application Fig. 3, encapsulating housing 1 is provided with installation portion 12, and be provided with installing hole on installation portion 12, in the process of assembling electric equipment, use the securing members such as screw or bolt just reactor device can be installed in electric equipment, the personnel's that can simplify the operation assembly manipulation.
In addition, in the disclosed reactor device of the application, encapsulating housing 1 preferably adopts the material that conductive coefficient is higher to make.For example: encapsulating housing 1 preferably adopts metallic packaging housing.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment identical similar part mutually referring to.For the disclosed device of embodiment, because it corresponds to the method disclosed in Example, so description is fairly simple, relevant part illustrates referring to method part.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the application.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the case of not departing from the application's spirit or scope, realize in other embodiments.Therefore, the application will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a reactor device, is characterized in that, comprising:
Encapsulating housing;
Be positioned over the reactor of described encapsulating housing inside;
Utilize the first casting glue described encapsulating housing to be poured into the first embedding colloid forming, described the first embedding colloid wraps up described reactor;
Cover the heat-insulation layer of described the first embedding colloid.
2. reactor device according to claim 1, is characterized in that, also comprises the wire being connected with the terminals of described reactor, and described wire extends to the outside of described heat-insulation layer.
3. reactor device according to claim 1, is characterized in that, described heat-insulation layer is insulation heat preservation layer.
4. reactor device according to claim 3, is characterized in that, described heat-insulation layer is ceramic fibre heat-insulation layer.
5. according to reactor device claimed in claim 3, it is characterized in that, described heat-insulation layer is to utilize conductive coefficient described the first embedding colloid to be poured into the second embedding colloid forming lower than the second casting glue of described the first casting glue.
6. according to the reactor device described in claim 1 to 5 any one, it is characterized in that, described encapsulating housing comprises:
The main body of accommodating described reactor;
The installation portion that is positioned at the top of described main body, extends to the space outerpace of described main body, described installation portion is provided with installing hole.
7. reactor device according to claim 6, is characterized in that, described encapsulating housing is metallic packaging housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420353700.4U CN203982955U (en) | 2014-06-27 | 2014-06-27 | Reactor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420353700.4U CN203982955U (en) | 2014-06-27 | 2014-06-27 | Reactor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203982955U true CN203982955U (en) | 2014-12-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420353700.4U Active CN203982955U (en) | 2014-06-27 | 2014-06-27 | Reactor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203982955U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021196961A1 (en) * | 2020-03-30 | 2021-10-07 | 华为技术有限公司 | Inductor and electronic device |
-
2014
- 2014-06-27 CN CN201420353700.4U patent/CN203982955U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021196961A1 (en) * | 2020-03-30 | 2021-10-07 | 华为技术有限公司 | Inductor and electronic device |
| EP4120296A4 (en) * | 2020-03-30 | 2023-09-06 | Huawei Digital Power Technologies Co., Ltd. | Inductor and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190422 Address after: 230088 Mingchuan Road 788, Baiyan Science Park, Hefei High-tech Zone, Anhui Province Patentee after: Sunshine Samsung (Hefei) Energy Storage Power Supply Co., Ltd. Address before: 230088 No. 1699 Xiyou Road, Hefei High-tech Zone, Anhui Province Patentee before: Sun Grow Power Co., Ltd. |
|
| TR01 | Transfer of patent right |