CN102177428B - 图像处理方法、图像处理装置及使用该图像处理装置的表面检查装置 - Google Patents
图像处理方法、图像处理装置及使用该图像处理装置的表面检查装置 Download PDFInfo
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- CN102177428B CN102177428B CN2009801404438A CN200980140443A CN102177428B CN 102177428 B CN102177428 B CN 102177428B CN 2009801404438 A CN2009801404438 A CN 2009801404438A CN 200980140443 A CN200980140443 A CN 200980140443A CN 102177428 B CN102177428 B CN 102177428B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T1/00—General purpose image data processing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30121—CRT, LCD or plasma display
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
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- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Biochemistry (AREA)
- Pathology (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008265808 | 2008-10-14 | ||
| JP2008-265808 | 2008-10-14 | ||
| PCT/JP2009/067808 WO2010044433A1 (ja) | 2008-10-14 | 2009-10-14 | 画像処理方法、画像処理装置及び該画像処理装置を用いた表面検査装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102177428A CN102177428A (zh) | 2011-09-07 |
| CN102177428B true CN102177428B (zh) | 2013-01-02 |
Family
ID=42106597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009801404438A Expired - Fee Related CN102177428B (zh) | 2008-10-14 | 2009-10-14 | 图像处理方法、图像处理装置及使用该图像处理装置的表面检查装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2010118046A (https=) |
| KR (1) | KR101227706B1 (https=) |
| CN (1) | CN102177428B (https=) |
| WO (1) | WO2010044433A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011110783A1 (de) * | 2011-08-22 | 2013-02-28 | Focke & Co. (Gmbh & Co. Kg) | Verfahren und Vorrichtung zum Prüfen stabförmiger Tabakprodukte |
| CN103149215B (zh) * | 2013-02-27 | 2016-04-13 | 中国计量学院 | 一种钢化玻璃绝缘子缺陷检测方法与装置 |
| CN103530885B (zh) * | 2013-10-23 | 2015-10-07 | 北京倍肯恒业科技发展有限责任公司 | 一种一维图像自适应分层边缘检测提取方法 |
| CN106767425B (zh) * | 2016-11-07 | 2019-07-26 | 无锡市莱科自动化科技有限公司 | 一种轴承卡簧豁口的视觉测量方法 |
| CN107680048B (zh) * | 2017-09-05 | 2020-11-10 | 信利(惠州)智能显示有限公司 | 一种边缘显示效果处理方法 |
| CN108844471B (zh) * | 2018-08-02 | 2019-05-07 | 成都天衡智造科技有限公司 | 一种对圆形工件边缘凹陷区域向圆心延伸长度的测量方法及装置 |
| KR102606069B1 (ko) * | 2020-12-28 | 2023-11-24 | 세메스 주식회사 | 웨이퍼 검사 방법 |
| CN112884769B (zh) * | 2021-04-12 | 2021-09-28 | 深圳中科飞测科技股份有限公司 | 图像处理方法、装置、光学系统和计算机可读存储介质 |
| CN115775241B (zh) * | 2022-12-04 | 2023-07-07 | 武汉惠强新能源材料科技有限公司 | 用于锂电池隔膜生产的流延厚度均匀性检测方法 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0718811B2 (ja) * | 1989-03-15 | 1995-03-06 | 松下電工株式会社 | 欠陥検査方法 |
| JP2803930B2 (ja) * | 1991-11-22 | 1998-09-24 | 株式会社三協精機製作所 | 円形パターン識別方法および装置 |
| JPH0772097A (ja) * | 1993-09-03 | 1995-03-17 | Dainippon Printing Co Ltd | 欠陥検査方法 |
| JPH0968502A (ja) * | 1995-08-30 | 1997-03-11 | Dainippon Screen Mfg Co Ltd | 透孔板の検査方法および検査装置 |
| JPH10311776A (ja) * | 1997-03-13 | 1998-11-24 | Asahi Optical Co Ltd | 光学部材検査装置 |
| JP3580088B2 (ja) * | 1997-06-25 | 2004-10-20 | 松下電工株式会社 | 外観検査方法 |
| DE69800756T2 (de) * | 1998-10-15 | 2001-08-09 | Wacker Siltronic Gesellschaft Fuer Halbleitermaterialien Ag | Verfahren und Vorrichtung zum Detektieren, Überwachung und Charakterisierung von Kantendefekten in Halbleiterscheiben |
| JP2001221749A (ja) * | 2000-02-10 | 2001-08-17 | Hitachi Ltd | 観察装置及び観察方法 |
| JP2002325246A (ja) * | 2001-04-25 | 2002-11-08 | Univ Waseda | 競技場用中継システム |
| JP2002328094A (ja) * | 2001-05-02 | 2002-11-15 | Nidec Tosok Corp | Ledリング照明及びそれを備えた画像検査装置 |
| JP3385276B2 (ja) * | 2001-08-27 | 2003-03-10 | 東芝アイティー・ソリューション株式会社 | 円形体の形状検査装置 |
| JP2007147441A (ja) * | 2005-11-28 | 2007-06-14 | Nikon Corp | 検査装置 |
| JP2007234932A (ja) * | 2006-03-02 | 2007-09-13 | Olympus Corp | 外観検査装置 |
| DE102007010225B4 (de) * | 2007-02-28 | 2018-08-23 | Vistec Semiconductor Systems Gmbh | Verfahren zur Aufnahme von hochauflösenden Bildern von Defekten auf der Oberseite des Waferrandes |
| US7636156B2 (en) * | 2007-06-15 | 2009-12-22 | Qimonda Ag | Wafer inspection system and method |
| JP5128920B2 (ja) * | 2007-12-03 | 2013-01-23 | 芝浦メカトロニクス株式会社 | 基板表面検査装置及び基板表面検査方法 |
-
2009
- 2009-10-14 WO PCT/JP2009/067808 patent/WO2010044433A1/ja not_active Ceased
- 2009-10-14 JP JP2009237631A patent/JP2010118046A/ja active Pending
- 2009-10-14 CN CN2009801404438A patent/CN102177428B/zh not_active Expired - Fee Related
- 2009-10-14 KR KR1020117006596A patent/KR101227706B1/ko not_active Expired - Fee Related
Non-Patent Citations (5)
| Title |
|---|
| JP特开2001-221749A 2001.08.17 |
| JP特开2008-216248A 2008.09.18 |
| JP特开平10-311776A 1998.11.24 |
| JP特开平7-72097A 1995.03.17 |
| JP特开平9-68502A 1997.03.11 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010118046A (ja) | 2010-05-27 |
| WO2010044433A1 (ja) | 2010-04-22 |
| CN102177428A (zh) | 2011-09-07 |
| KR101227706B1 (ko) | 2013-01-29 |
| KR20110057170A (ko) | 2011-05-31 |
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