CN102171845B - 用于制造光电子半导体器件的方法以及光电子半导体器件 - Google Patents

用于制造光电子半导体器件的方法以及光电子半导体器件 Download PDF

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Publication number
CN102171845B
CN102171845B CN200980139340XA CN200980139340A CN102171845B CN 102171845 B CN102171845 B CN 102171845B CN 200980139340X A CN200980139340X A CN 200980139340XA CN 200980139340 A CN200980139340 A CN 200980139340A CN 102171845 B CN102171845 B CN 102171845B
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layer
semiconductor body
semiconductor
growth substrate
solder
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CN200980139340XA
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CN102171845A (zh
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安德烈亚斯·普洛斯尔
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Ams Osram International GmbH
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Osram Opto Semiconductors GmbH
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors

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  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
CN200980139340XA 2008-10-06 2009-09-08 用于制造光电子半导体器件的方法以及光电子半导体器件 Expired - Fee Related CN102171845B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008050573.0 2008-10-06
DE102008050573A DE102008050573A1 (de) 2008-10-06 2008-10-06 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements und optoelektronisches Halbleiterbauelement
PCT/DE2009/001269 WO2010040331A1 (de) 2008-10-06 2009-09-08 Verfahren zur herstellung eines optoelektronischen halbleiterbauelements und optoelektronisches halbleiterbauelement

Publications (2)

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CN102171845A CN102171845A (zh) 2011-08-31
CN102171845B true CN102171845B (zh) 2013-07-31

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Country Link
US (1) US8367438B2 (enExample)
EP (1) EP2332183A1 (enExample)
JP (1) JP2012504875A (enExample)
KR (1) KR20110082540A (enExample)
CN (1) CN102171845B (enExample)
DE (1) DE102008050573A1 (enExample)
WO (1) WO2010040331A1 (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6909111B2 (en) 2000-12-28 2005-06-21 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a light emitting device and thin film forming apparatus
JP5754173B2 (ja) * 2011-03-01 2015-07-29 ソニー株式会社 発光ユニットおよび表示装置
TW201318215A (zh) * 2011-10-18 2013-05-01 Chi Mei Lighting Tech Corp 發光二極體及其製造方法
TW201351699A (zh) * 2012-06-05 2013-12-16 Lextar Electronics Corp 發光二極體及其製造方法
DE102012107921A1 (de) * 2012-08-28 2014-03-06 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE102013103079A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE102013109316A1 (de) 2013-05-29 2014-12-04 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung einer Mehrzahl von optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
DE102013107531A1 (de) * 2013-07-16 2015-01-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
KR102327141B1 (ko) * 2014-11-19 2021-11-16 삼성전자주식회사 프리패키지 및 이를 사용한 반도체 패키지의 제조 방법
US10304810B2 (en) * 2014-12-19 2019-05-28 Glo Ab Method of making a light emitting diode array on a backplane
KR20170133347A (ko) * 2015-03-30 2017-12-05 소니 세미컨덕터 솔루션즈 가부시키가이샤 발광 소자, 발광 유닛, 발광 패널 장치, 및 발광 패널 장치의 구동 방법
US10193038B2 (en) 2016-04-04 2019-01-29 Glo Ab Through backplane laser irradiation for die transfer
DE102017106508A1 (de) * 2017-03-27 2018-09-27 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauteil und Herstellungsverfahren
CN107910405B (zh) * 2017-09-27 2019-08-23 华灿光电（浙江）有限公司 一种发光二极管芯片的制作方法
CN111769438B (zh) * 2019-04-02 2021-10-15 苏州长瑞光电有限公司 面射型激光装置
JP7553915B2 (ja) * 2020-04-15 2024-09-19 国立大学法人東海国立大学機構 窒化ガリウム半導体装置の製造方法
JP7477835B2 (ja) * 2020-04-15 2024-05-02 株式会社デンソー 半導体チップの製造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2927158B2 (ja) 1993-09-29 1999-07-28 サンケン電気株式会社 半導体発光素子
US5972157A (en) * 1995-11-20 1999-10-26 Alliedsignal Inc. Joining of rough carbon-carbon composites with high joint strength
US20020017652A1 (en) * 2000-08-08 2002-02-14 Stefan Illek Semiconductor chip for optoelectronics
DE10059532A1 (de) * 2000-08-08 2002-06-06 Osram Opto Semiconductors Gmbh Halbleiterchip für die Optoelektronik
TWI226139B (en) 2002-01-31 2005-01-01 Osram Opto Semiconductors Gmbh Method to manufacture a semiconductor-component
KR101030068B1 (ko) * 2002-07-08 2011-04-19 니치아 카가쿠 고교 가부시키가이샤 질화물 반도체 소자의 제조방법 및 질화물 반도체 소자
DE10307280B4 (de) * 2002-11-29 2005-09-01 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines lichtemittierenden Halbleiterbauelements
US6929966B2 (en) * 2002-11-29 2005-08-16 Osram Opto Semiconductors Gmbh Method for producing a light-emitting semiconductor component
US7372077B2 (en) * 2003-02-07 2008-05-13 Sanyo Electric Co., Ltd. Semiconductor device
JP4868709B2 (ja) * 2004-03-09 2012-02-01 三洋電機株式会社 発光素子
US7208334B2 (en) * 2004-03-31 2007-04-24 Kabushiki Kaisha Toshiba Method of manufacturing semiconductor device, acid etching resistance material and copolymer
TWI266435B (en) * 2004-07-08 2006-11-11 Sharp Kk Nitride-based compound semiconductor light emitting device and fabricating method thereof
JP4906256B2 (ja) * 2004-11-10 2012-03-28 株式会社沖データ 半導体複合装置の製造方法
DE102005029246B4 (de) 2005-03-31 2023-06-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Halbleiterchip mit einer Lötschichtenfolge und Verfahren zum Löten eines Halbleiterchips
US20060237735A1 (en) * 2005-04-22 2006-10-26 Jean-Yves Naulin High-efficiency light extraction structures and methods for solid-state lighting
JP2007103460A (ja) * 2005-09-30 2007-04-19 Sanyo Electric Co Ltd 半導体レーザ素子およびその製造方法
US7880177B2 (en) * 2006-10-13 2011-02-01 Sanyo Electric Co., Ltd. Semiconductor light-emitting device, illuminator and method of manufacturing semiconductor light-emitting device
KR100856230B1 (ko) * 2007-03-21 2008-09-03 삼성전기주식회사 발광장치, 발광장치의 제조방법 및 모놀리식 발광다이오드어레이

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Publication number Publication date
WO2010040331A1 (de) 2010-04-15
DE102008050573A1 (de) 2010-04-08
CN102171845A (zh) 2011-08-31
US8367438B2 (en) 2013-02-05
US20110186953A1 (en) 2011-08-04
JP2012504875A (ja) 2012-02-23
KR20110082540A (ko) 2011-07-19
EP2332183A1 (de) 2011-06-15

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