CN102169847A - Dustproof film assembly receiving container - Google Patents

Dustproof film assembly receiving container Download PDF

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Publication number
CN102169847A
CN102169847A CN2011100356991A CN201110035699A CN102169847A CN 102169847 A CN102169847 A CN 102169847A CN 2011100356991 A CN2011100356991 A CN 2011100356991A CN 201110035699 A CN201110035699 A CN 201110035699A CN 102169847 A CN102169847 A CN 102169847A
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CN
China
Prior art keywords
dustproof film
film component
accommodating container
component accommodating
film assembly
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Granted
Application number
CN2011100356991A
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Chinese (zh)
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CN102169847B (en
Inventor
关原一敏
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN102169847A publication Critical patent/CN102169847A/en
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Publication of CN102169847B publication Critical patent/CN102169847B/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Packaging Frangible Articles (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packages (AREA)

Abstract

The invention aims to provide a dustproof film assembly receiving container, which can maintain the cleanness of the inner container even a functional part composed by any one of a handle, a dustproof film assembly fixing component and a reinforcing component is disposed on the receiving container. The dustproof film assembly receiving container comprises a dustproof film assembly receiving container body (20) used for loading a dustproof film assembly and a cover body which covers the dustproof film assembly and is clamped with the edge part of the dustproof film assembly receiving container body (20). The dustproof film assembly receiving container is characterized in that the functional part composed by the handle, the dustproof film assembly fixing component and the reinforcing component is disposed on the dustproof film assembly receiving container body (20) or on the cover body through a threaded coupling mechanism; the outer surface and the inner surface of the threaded coupling mechanism do not expose from the inner side of the container body (20) or the cover body.

Description

The dustproof film component accommodating container
Technical field
The present invention relates to a kind of when making semiconductor equipment, printed circuit board (PCB) or LCD etc., in order to remove the dustproof film component accommodating container that the employed photoetching of impurity is taken in, takes care of, transported with dustproof film component.
Background technology
When making semiconductor such as large scale integration, ultra-large type integrated circuit or LCD; make pattern with rayed semiconductor crystal wafer or liquid crystal with raw sheet; but photomask that this moment is used or intermediate light mask (being designated hereinafter simply as photomask) are if adhere to impurity; then, or make light deflection, so can be out of shape except the pattern that is shifted because this impurity can absorb light; outside the edge meeting is irregular; the bottom meeting is dirty etc., and size, quality, outward appearance etc. all can be damaged to some extent, and these all are problem points.
So this operation is normally carried out in dust free room, but the nonetheless also difficult cleaning of guaranteeing photomask at any time.Therefore, behind the dustproof film component that anti-impurity is used in the attaching of photomask surface, expose again.At this moment, because foreign matter can not be attached directly to the photomask surface, and can be attached on the dustproof film component, as long as incite somebody to action the pattern of photomask in focus when photoetching, the foreign matter on the dustproof film component just can not have influence on transfer printing.
Usually, dustproof film component system is with the transparent dustproof film that nitrocellulose, cellulose acetate or the fluororesin etc. with good light permeability are constituted, and attaches or sticks together upper surface at the dustproof film framework that is made of aluminium, stainless steel, polyethylene etc.In addition, in dustproof film framework lower end, in order to adorn on photomask, and be provided with the adhesion layer that is constituted by polybutene resin, polyvinyl acetate resins, acrylate etc., and purpose is at the abscission layer (separated part) of protection adhesion layer.
But, dustproof film component is after being attached at photomask, though have the effect that prevents that foreign matter from invading toward inside from the outside of the formed confined space of these parts, but at foreign matter attached to dustproof film component itself, and when tying up to the inside of confined space, just be difficult to prevent that foreign matter is attached on the photomask.Therefore, dustproof film component itself to keep certainly the height cleanliness, and the keeping, when transporting employed dustproof film component accommodating container also requirement the performance that can keep its cleanliness must be arranged.Particularly, following requirement is arranged: the time also do not produce the material of dust even prevent the good friction of chargeding performance, prevent the structure that contacts between dustproof film component and component part, high rigid construction, the material of being out of shape when preventing to apply external force as far as possible.
The dustproof film component accommodating container is normally made with the resin ejection formed or vacuum forming of ABS (acrylonitrile-butadiene-styrene resin), acrylic resin etc.Adopt this type of forming method to be because it has following advantage: seldom to have because of surface smoothing and adhere to foreign matter and the possibility that produces dust; One-body moldedly do not have seam and the possibility that produces dust or foreign body intrusion is seldom arranged because be; Even complex-shaped also manufacturing easily; Production is good to reduce cost again.This dustproof film component accommodating container outward appearance one for example shown in Figure 7, it comprises: dustproof film component accommodating container body 71 is used to load dustproof film component; The lid 72 of dustproof film component accommodating container, it is covered in dustproof film component, and with dustproof film component accommodating container body in the fastening of edge part tabling; Dustproof film component accommodating container body and dustproof film component accommodating container lid are by sticking together adhesive tape (diagram is omitted) or 73 snappings of clip.
The dustproof film component accommodating container of semiconductor with use in printed circuit board, the external form length of side is about about 200 to 300mm, and this accommodating container normally utilizes the ejection formation manufacturing to form.On the other hand, being mainly used in liquid crystal uses the length of side of dustproof film component to surpass the large-scale dustproof film component accommodating container of 500mm, generally be to use synthetic resin sheets such as ABS (acrylonitrile-butadiene-styrene resin), acrylic resin, the thing that vacuum forming is made.This be since from 1 or the progressive die mouth of many places resin is injected ejection formation in the mould at a high speed, the resin flows distance is long, so have any problem on method for making.On the other hand, the resin sheet that the vacuum forming genealogy of law will heat covers on the mould, only can make the moulding simply of large scale article with vacuumizing.
The dustproof film component accommodating container can fit a handle on, functional features such as dustproof film component fixed part, reinforcement parts as required.This installing gimmick based on the simplification and the reliability of gimmick, in general is to carry out with screw.With the situation of screw installing the time, because can cause foreign matter to invade from the gap, and water can immerse when cleaning, and also has dry problem.The known method that addresses these problems for example has: the root at screw clips the mode (with reference to TOHKEMY 2008-216846 patent disclosure communique) of packing ring to carry out snapping.
Yet, the fitting portion of bolt and instrument and the small concavo-convex very difficult cleaning in surface, and when loading onto the resin packing ring, can produce dust etc. from packing ring, these are its problem points, thus its aspect the cleanliness of keeping dustproof film component accommodating container inside, defectiveness still.Though people can use bonding or hot melting to engage the method that replaces the screw snapping, this method is difficult to use and concern the functional features that install the position for regulating, and reliability problems in addition, and is not suitable as alternative.
Summary of the invention
In view of these the problems referred to above, the object of the invention just is to provide a kind of dustproof film component accommodating container, even when functional features such as handle, dustproof film component fixed part, reinforcement parts are installed in the dustproof film component accommodating container, also can keep the internal tank cleaning.
According to the present invention, a kind of dustproof film component accommodating container is provided, it comprises: dustproof film component accommodating container body is used to load dustproof film component;
And dustproof film component accommodating container lid, be covered in dustproof film component, and with dustproof film component accommodating container body in the fastening of edge part tabling;
This dustproof film component accommodating container is characterized as: install by functional features that any constituted such as handle, dustproof film component fixed part, reinforcement parts in resinous dustproof film component accommodating container body or dustproof film component accommodating container lid by thread connection mechanism, and the surface of the external screw thread of this thread connection mechanism and internal thread is not exposed to the inboard of this dustproof film component accommodating container body or dustproof film component accommodating container lid.
At this, aforesaid thread connection mechanism for cover with the all-in-one-piece resin screw thread outside or internal thread around for good.
Make the screw surface not expose the Li of portion in holding device, and can improve the cleanliness of part in the mode that the all-in-one-piece resin covers, and because of surface smoothing, so detergency is also good.
At this, cover the resin of this thread connection mechanism, be good adhesive resin to be arranged with the dustproof film component accommodating container body that is contacted or the material of dustproof film component accommodating container lid.In addition, better situation is: after functional features is fixing, make it bonding with sticker in the gap around the contact portion.Though adopt the screw snapping as fixed form to guarantee reliability, also dual-purpose sticker and can prevent that detergent remover from infiltrating from the junction surface.But around the snapping portion stick together covering surfaces coarse, produce the part of dust, thereby prevent to produce dust.
In addition, also can with an organic solvent replace aforementioned sticker, the seal clearance with dissolving, in this occasion, except that can prevent detergent remover infiltrate, take place dust, also can prevent the pollution that gas caused that produces from sticker, and more suitable.
According to the present invention, can obtain a kind of dustproof film component accommodating container, it is characterized in that: when functional features such as handle, dustproof film component fixed part, reinforcement parts are installed in the dustproof film component accommodating container, can reach with thread connection and to have the fixing of reliability, and,, cleanliness improves so showing because its surface is coated by resin with being integral.In addition, when utilizing sticker or organic solvent fixed contact, can prevent that detergent remover from infiltrating and the generation dust, keeps the cleaning of dustproof film component accommodating container inside.
Description of drawings
Figure 1A has represented a kind of example of dustproof film component accommodating container of the present invention, and the plane graph of back state is installed for handle.
Figure 1B is the A-A line profile of Figure 1A.
Fig. 2 A has represented the another kind of example of dustproof film component accommodating container of the present invention, and the plane graph of back state is installed for reinforcing body.
Fig. 2 B is the B-B line profile of Fig. 2 A.
Fig. 3 A has represented a kind of example of fixedly tool of the present invention, is the plane graph of single fixedly tool.
Fig. 3 B is the C-C line profile of Fig. 3 A.
Fig. 4 A has shown the another kind of example of fixedly tool of the present invention, is the plane graph of example of the nut portion that is provided with plural number
Fig. 4 B is the D-D line profile of Fig. 4 A.
Fig. 5 is near the fixedly sectional skeleton diagram of tool of the present invention.
Fig. 6 is the cross sectional illustration figure of demonstration according to an example of the handle installation method of prior art.
Fig. 7 is the perspective illustration that shows the outward appearance of dustproof film component accommodating container.
Among the figure, 10,72 is dustproof film component accommodating container lid, and 11,61 is handle, 12 is hexagon socket head cap screw, and 13,23 are fixing tool, and 14,24 is wire connecting portion, 20,71 is dustproof film component accommodating container body, and 21 is reinforcing body, and 22,63 is hexagon socket head cap screw, 30 is nut portion, 31 is resin-coated body, and 32 is planar portions, and 50 are dissolving portion, 62 is seal washer, and 73 is clip.
Embodiment
Followingly the execution mode of dustproof film component accommodating container of the present invention is described, but the present invention is not limited only to this with reference to accompanying drawing.
Figure 1A and Figure 1B system are according to dustproof film component accommodating container of the present invention, and this is the execution mode that is applicable to the dustproof film component accommodating container lid that is provided with handle.
Handle 11 lies in dustproof film component accommodating container lid 10 and inserts hexagon socket head cap screw 12 from the outside, and fixedly tool 13 is installed in its inboard.Hexagon socket head cap screw 12 also can be other nose shape such as hex bolts.Fixedly tool 13 is provided with metal nut portion in the inboard.Fixedly tool 13, except can be pressed into and union nut portion and make, also can be metal nut portion, and the threaded portion is set directly in the resin, or can adopts reinforcement measure such as spiral shell mosquito lining processing again.
But best execution mode is nut to be inserted be integral manufacturing with injection molding method, and it is the structure shown in Fig. 3 A and Fig. 3 B in detail.Nut portion 30 processes Metal Cutting such as stainless steel, brass, and in order to improve and the adhesion and the connecting airtight property of resin-coated body 31 around it, the periphery of nut portion 30 should impose embossing processing etc. and make shaggy measure.
Resin-coated body 31 should be provided with planar portions 32, so that lock screw time ratio is easier to fix.This planar portions 32, though in the execution mode of Fig. 3 A and Fig. 3 B, be two-sided, obviously, adopt 4,6 or other solid shapes also can.But, because there is the form of complicated shape and groove that detergency is worsened, so undesirable.
In addition, the material of dustproof film component accommodating container lid 10 should be used PMMA (polymethyl methacrylate), ABS (acrylonitrile-butadiene-styrene resin), PC (Merlon), PVC (polyvinyl chloride) etc.About color, be advisable with the transparent or semitransparent of identification content with the naked eye.Secondly, the fixing resin-coated material of tool 13, with adopt and dustproof film component accommodating container lid 10 to have adhesive material be good.For example, when the material system of dustproof film component accommodating container lid 10 uses ABS (acrylonitrile-butadiene-styrene resin), fixedly the resin-coated material of tool 13 can be used with a kind of ABS (acrylonitrile-butadiene-styrene resin), or PVC (polyvinyl chloride), PS (polystyrene) etc. are advisable.
When selecting this material, except with dustproof film component accommodating container lid 10 adhesive, special ideal situation is: less by the gas that resin produces for the easness of ejection formation, water absorption is low to wait other characteristics, also does comprehensive considering.
After handle 11 is connected with thread fully, should coat sticker (diagram is omitted) and be fixed for the wire connecting portion 14 of joining with dustproof film component accommodating container lid 10 of fixing tool 13.Because in the minim gap that the composition surface was produced, and the scar that produces fixedly the time etc. also covers with sticker with the sticker filling, so can reduce the possibility of generation dust.For example, when the material of dustproof film component accommodating container lid was used ABS (acrylonitrile-butadiene-styrene resin), aforementioned sticker can use A Kulidanni (aerylicdyneA) (trade name, three Prey Tyke (sanplatec) companies make) etc.
Better situation is: replace sticker, and only coating can be with dustproof film component accommodating container lid 10 and the fixing organic solvent that dissolves together of the resin-coated body of tool 13.The profile of fixedly tool 13 peripheries after the coating as shown in Figure 5.Be coated on the organic solvent infiltration of wire connecting portion 14 and dissolve the fixedly resin-coated body 31 and the dustproof film component accommodating container lid 10 of tool 13, the portion that welds 50 that mutual dissolving engages can be around fixedly whole generations on every side of tool 13.
By aforementioned manner, except can preventing thoroughly that rinse water from immersing from the fixing gap between tool 31 and the dustproof film component accommodating container lid 10, can also prevent to produce dust and realize improving detergency from the gap.In addition, by with an organic solvent mode only, after resin dissolves engages, because the organic solvent that is coated with can gasify, from the vessel surface complete obiteration, so can thoroughly prevent from engaging the defective that gas caused of composition generation.
About the example of this solvent, for example, dustproof film component accommodating container lid 10 and fixedly the material of the resin-coated body of tool 13 use the occasion of ABS (acrylonitrile-butadiene-styrene resin), this solvent is good to use MEK (butanone) etc.This selects according to the material of using, and considers that dissolubility, vapour pressure, boiling point etc. are harmonious with material and get final product.
Fig. 2 A and Fig. 2 B have shown the execution mode that reinforcing body is installed in dustproof film component accommodating container body.The hexagon socket head cap screw 22 that reinforcing body 21 is inserted from the vessel outside is fixed up with fixing tool 23.Fixedly the detailed construction of tool 23 is shown in Fig. 4 A and Fig. 4 B for this, and nut portion 30 is located at 4 places.
In the present embodiment, also should select material with the same resin-coated body 31 of the execution mode of relevant aforementioned dustproof film component accommodating container lid.And the fixedly tool 23 of screw after fixing engages with the wire connecting portion 24 employing stickers of dustproof film component accommodating container body 20, or more suitablely engages with organic solvent.
Embodiment
Embodiments of the present invention below are described, but the present invention is not limited only to this.
Embodiment 1
Transparent PMMA (polymethyl methacrylate) sheet material of used thickness 3mm, form the dustproof film component accommodating container lid 10 of shape shown in Figure 1A and Figure 1B of external form 1900 * 1750mm, height 180mm by vacuum forming, outer part is refined to both sizings with the execution of NC router, and forms the installing hole of handle 11 with machining.
In addition, with the fixedly tool 13 of the structure of injection molding method manufacturing shown in Fig. 3 A and Fig. 3 B.The inboard is provided with brazen nut portion 30, this nut portion is inserted, and use black ABS (acrylonitrile-butadiene-styrene resin) to form resin-coated body with injection molding method.At this, resin-coated body 31 is decided to be black, be to ask the foreign matter that is easy to observe surface attachment, and based on avoiding seeing from the outside that inserting inner the apparent of nut portion 30 considers.
In addition, handle 11 is ABS (acrylonitrile-butadiene-styrene resin) ejection formation to add glass reinforced fiber.And with this fixedly tool 13 and handle 11 with stainless steel hexagon socket head cap screw 12 (M8 * 30mm) locking, in addition on the contact site of fixing tool 13 and dustproof film component accommodating container lid 10, utilize micro-syringe (diagram is omitted), organic solvent (MEK) do not stayed be coated on gap around wire connecting portion 14 whole, make its bone dry.
, use the sponge of interface activating agent, pure water, PVA (polyvinyl alcohol) system this dustproof film component accommodating container lid attentively scrubbed cleaning thereafter, and to make its bone dry after the pure water washing.To the handle 10 of this dustproof film component accommodating container lid and fixedly near tool 13 in the darkroom while using spotlight (light quantity 300,000 Lx) irradiation to observe, but can't see around it gap, dirty, adhere to foreign matter etc., it is in very clean state.
Comparative example
The inventor has made an external form, size is identical with previous embodiment, handled dustproof film component accommodating container lid.Near this handle portion section as shown in Figure 6.Handle 61 is equipped with internal thread part, clips seal washer 62 from the inboard and with the hexagon socket head cap screw 63 (M8 * 15mm) be locked of stainless steel.The material of sealing packing ring 62 has good sealing property for asking, and adopts PTFE (polytetrafluoroethylene), and thickness is 2mm.
Dustproof film component accommodating container lid 10 is cleaned, after the drying, uses spotlight (light quantity 300,000 Lx) to shine on one side in the darkroom and observe near the handle portion with previous embodiment the same manner.The result, in the periphery of seeing hexagon socket head cap screw and hexagon ring, have many foreign matters, the contrary flexure (curling) of a little takes place in the end of seal washer 62 owing to the locking of hexagon socket head cap screw 63, and from the gap of seal washer 62 and dustproof film component accommodating container lid 10, there is clean water to ooze out and dry vestige (dirty), presents and be difficult to be referred to as clean state.

Claims (5)

1. dustproof film component accommodating container, it comprises:
Dustproof film component accommodating container body, it is used to load dustproof film component;
And dustproof film component accommodating container lid, it is used to cover dustproof film component, and with dustproof film component accommodating container body in the fastening of edge part tabling;
It is characterized in that, to be installed on resinous dustproof film component accommodating container body or dustproof film component accommodating container lid by the functional features that any one constituted of handle, dustproof film component fixed part, reinforcement parts by thread connection mechanism, and the surface of the external screw thread of this thread connection mechanism and internal thread is not exposed to the inboard of this dustproof film component accommodating container body or dustproof film component accommodating container lid.
2. dustproof film component accommodating container according to claim 1, wherein, around its external screw thread of above-mentioned thread connection mechanism, the internal thread by and the threaded portion resin that forms one cover.
3. dustproof film component accommodating container according to claim 2, wherein, the resin that covers above-mentioned thread connection mechanism is with the resinous dustproof film component accommodating container body that is contacted or the material of dustproof film component accommodating container lid adhesive resin to be arranged.
4. dustproof film component accommodating container according to claim 3, wherein, above-mentioned thread connection mechanism is after fixing with functional features, and is again that the gap around the contact site is in addition bonding with sticker.
5. dustproof film component accommodating container according to claim 3, wherein, above-mentioned thread connection mechanism seals the gap around the contact site after functional features is fixing again with organic solvent dissolution.
CN2011100356991A 2010-02-10 2011-02-10 Dustproof film assembly receiving container Active CN102169847B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010027825A JP2011164404A (en) 2010-02-10 2010-02-10 Pellicle storage container
JP2010-027825 2010-02-10

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Publication Number Publication Date
CN102169847A true CN102169847A (en) 2011-08-31
CN102169847B CN102169847B (en) 2013-08-14

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JP (1) JP2011164404A (en)
KR (1) KR20110093592A (en)
CN (1) CN102169847B (en)
HK (1) HK1158819A1 (en)
TW (1) TWI424947B (en)

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KR20110093592A (en) 2011-08-18
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CN102169847B (en) 2013-08-14
JP2011164404A (en) 2011-08-25

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