CN102163613B - 显示装置和显示装置的制造方法 - Google Patents

显示装置和显示装置的制造方法 Download PDF

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Publication number
CN102163613B
CN102163613B CN201010519849.1A CN201010519849A CN102163613B CN 102163613 B CN102163613 B CN 102163613B CN 201010519849 A CN201010519849 A CN 201010519849A CN 102163613 B CN102163613 B CN 102163613B
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CN
China
Prior art keywords
opening
electrode
insulating film
layer
planarization insulating
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CN201010519849.1A
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English (en)
Chinese (zh)
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CN102163613A (zh
Inventor
辻明子
松元寿树
藤冈弘文
浅野慎
佐川裕志
三浦究
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Magno Bolan Co ltd
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Sony Corp
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/124Insulating layers formed between TFT elements and OLED elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/824Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/126Shielding, e.g. light-blocking means over the TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80522Cathodes combined with auxiliary electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • H10K2102/3023Direction of light emission
    • H10K2102/3026Top emission
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • H10K50/82Cathodes
    • H10K50/828Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/805Electrodes
    • H10K59/8052Cathodes
    • H10K59/80524Transparent cathodes, e.g. comprising thin metal layers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/871Self-supporting sealing arrangements
    • H10K59/8722Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80Constructional details
    • H10K59/87Passivation; Containers; Encapsulations
    • H10K59/873Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201010519849.1A 2009-10-22 2010-10-22 显示装置和显示装置的制造方法 Active CN102163613B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009243589A JP5593676B2 (ja) 2009-10-22 2009-10-22 表示装置および表示装置の製造方法
JP2009-243589 2009-10-22

Publications (2)

Publication Number Publication Date
CN102163613A CN102163613A (zh) 2011-08-24
CN102163613B true CN102163613B (zh) 2014-11-12

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US (3) US8212258B2 (https=)
JP (1) JP5593676B2 (https=)
CN (1) CN102163613B (https=)

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KR101784994B1 (ko) * 2011-03-31 2017-10-13 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
WO2013008765A1 (en) * 2011-07-08 2013-01-17 Semiconductor Energy Laboratory Co., Ltd. Light-emitting module, light-emitting device, and method for manufacturing the light-emitting module
US8912547B2 (en) * 2012-01-20 2014-12-16 Semiconductor Energy Laboratory Co., Ltd. Light-emitting device, display device, and semiconductor device
TWI504972B (zh) 2013-11-20 2015-10-21 Au Optronics Corp 顯示面板
KR102118676B1 (ko) * 2014-02-05 2020-06-04 삼성디스플레이 주식회사 유기발광 디스플레이 장치
JP6175644B2 (ja) * 2014-08-19 2017-08-09 株式会社Joled 表示装置および電子機器
USD794050S1 (en) 2014-08-19 2017-08-08 Fujifilm Corporation Display screen for digital camera with transitional graphical user interface
CN104766930B (zh) * 2015-04-17 2017-07-25 京东方科技集团股份有限公司 Oled基板及其制备方法、显示装置
KR102555408B1 (ko) * 2016-06-30 2023-07-13 엘지디스플레이 주식회사 비표시 영역으로 연장하는 신호 배선들을 포함하는 디스플레이 장치
JP6912080B2 (ja) 2017-06-09 2021-07-28 株式会社Joled 有機el表示パネル
KR102394984B1 (ko) * 2017-09-04 2022-05-06 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
CN107768411B (zh) * 2017-10-25 2020-09-01 昆山龙腾光电股份有限公司 显示装置及其制作方法
CN108336109B (zh) 2018-01-02 2021-02-02 厦门天马微电子有限公司 有机发光显示面板、显示装置和有机发光显示母板
WO2019186882A1 (ja) * 2018-03-29 2019-10-03 シャープ株式会社 表示装置およびその製造方法
JP6817997B2 (ja) * 2018-04-26 2021-01-20 キヤノン株式会社 有機デバイス、表示装置、撮像装置、照明装置、移動体、および、有機デバイスの製造方法
WO2021214829A1 (ja) * 2020-04-20 2021-10-28 シャープ株式会社 表示装置および表示装置の製造方法
US20230255076A1 (en) * 2020-07-20 2023-08-10 Sharp Kabushiki Kaisha Display device
CN120751897A (zh) * 2024-03-29 2025-10-03 合肥维信诺科技有限公司 显示面板、显示面板的制造方法及电子设备

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101506862A (zh) * 2006-06-19 2009-08-12 索尼株式会社 发光显示装置及其制造方法

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JP2001160486A (ja) 1999-12-03 2001-06-12 Sony Corp 有機elディスプレイの製造方法及び有機elディスプレイ
JP4982928B2 (ja) 2000-06-28 2012-07-25 東レ株式会社 表示装置
JP4089544B2 (ja) 2002-12-11 2008-05-28 ソニー株式会社 表示装置及び表示装置の製造方法
JP4278499B2 (ja) * 2003-12-01 2009-06-17 三菱電機株式会社 表示装置
JP4608921B2 (ja) 2004-03-22 2011-01-12 ソニー株式会社 表示装置の製造方法および表示装置
JP2006054111A (ja) * 2004-08-12 2006-02-23 Sony Corp 表示装置
JP4725054B2 (ja) * 2004-08-24 2011-07-13 ソニー株式会社 表示装置
KR100700643B1 (ko) * 2004-11-29 2007-03-27 삼성에스디아이 주식회사 보조 전극 라인을 구비하는 유기전계발광소자 및 그의제조 방법
KR100712111B1 (ko) * 2004-12-14 2007-04-27 삼성에스디아이 주식회사 보조 전극 라인을 구비하는 유기전계발광소자 및 그의제조 방법
JP4648166B2 (ja) 2005-11-24 2011-03-09 新電元工業株式会社 システム電源及び電力供給システム
JP5207670B2 (ja) * 2006-07-19 2013-06-12 キヤノン株式会社 表示装置
JP4396864B2 (ja) * 2007-03-14 2010-01-13 ソニー株式会社 表示装置およびその製造方法
JP5212103B2 (ja) * 2007-03-30 2013-06-19 東レ株式会社 ポジ型感光性樹脂組成物
KR100875102B1 (ko) * 2007-09-03 2008-12-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치
JP4506810B2 (ja) * 2007-10-19 2010-07-21 ソニー株式会社 表示装置
JP4655102B2 (ja) * 2008-04-11 2011-03-23 ソニー株式会社 表示素子およびその製造方法、ならびに表示装置

Patent Citations (1)

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CN101506862A (zh) * 2006-06-19 2009-08-12 索尼株式会社 发光显示装置及其制造方法

Also Published As

Publication number Publication date
JP2011090153A (ja) 2011-05-06
US8212258B2 (en) 2012-07-03
US8389315B2 (en) 2013-03-05
US20120244775A1 (en) 2012-09-27
US8653532B2 (en) 2014-02-18
CN102163613A (zh) 2011-08-24
US20110095299A1 (en) 2011-04-28
US20130146855A1 (en) 2013-06-13
JP5593676B2 (ja) 2014-09-24

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