CN102159873A - 发光装置 - Google Patents

发光装置 Download PDF

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Publication number
CN102159873A
CN102159873A CN2009801362204A CN200980136220A CN102159873A CN 102159873 A CN102159873 A CN 102159873A CN 2009801362204 A CN2009801362204 A CN 2009801362204A CN 200980136220 A CN200980136220 A CN 200980136220A CN 102159873 A CN102159873 A CN 102159873A
Authority
CN
China
Prior art keywords
led
heat
light
release member
heat release
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801362204A
Other languages
English (en)
Chinese (zh)
Inventor
R·F·M·范埃姆普特
N·德科宁
J·P·雅各布斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN102159873A publication Critical patent/CN102159873A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
CN2009801362204A 2008-09-16 2009-09-09 发光装置 Pending CN102159873A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08164417 2008-09-16
EP08164417.1 2008-09-16
PCT/IB2009/053947 WO2010032169A1 (en) 2008-09-16 2009-09-09 Light-emitting arrangement

Publications (1)

Publication Number Publication Date
CN102159873A true CN102159873A (zh) 2011-08-17

Family

ID=41334468

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801362204A Pending CN102159873A (zh) 2008-09-16 2009-09-09 发光装置

Country Status (8)

Country Link
US (1) US20110180819A1 (enExample)
EP (1) EP2337986A1 (enExample)
JP (1) JP2012503306A (enExample)
KR (1) KR20110063833A (enExample)
CN (1) CN102159873A (enExample)
RU (1) RU2518198C2 (enExample)
TW (1) TW201017049A (enExample)
WO (1) WO2010032169A1 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104303291A (zh) * 2012-05-23 2015-01-21 皇家飞利浦有限公司 可表面安装的半导体器件
CN106537024A (zh) * 2014-07-09 2017-03-22 欧司朗有限公司 半导体灯
CN107327772A (zh) * 2016-04-06 2017-11-07 通用电气公司 用于led灯具的散热反射器

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2479142A (en) 2010-03-30 2011-10-05 Optovate Ltd Illumination Apparatus
JP5627932B2 (ja) * 2010-06-05 2014-11-19 交和電気産業株式会社 集魚装置
JP5658496B2 (ja) * 2010-07-08 2015-01-28 交和電気産業株式会社 集魚装置
JP2012094611A (ja) 2010-10-26 2012-05-17 Panasonic Corp 照明装置
JP6305766B2 (ja) 2010-12-15 2018-04-04 フィリップス ライティング ホールディング ビー ヴィ 照明装置及び照明装置を組み立てる方法
CN103261786B (zh) * 2010-12-15 2018-06-05 飞利浦照明控股有限公司 照明装置和组装该照明装置的方法
CN103547815B (zh) 2011-05-13 2016-01-06 皇家飞利浦有限公司 用于夹持薄片的紧固元件
US9006770B2 (en) 2011-05-18 2015-04-14 Tsmc Solid State Lighting Ltd. Light emitting diode carrier
US10222048B2 (en) * 2012-03-08 2019-03-05 Philips Lighting Holding B.V. Light emitting device and method for manufacturing a light emitting device
US9136293B2 (en) 2012-09-07 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for sensor module
CN105209819B (zh) * 2013-05-31 2018-10-02 岩崎电气株式会社 照明器具
CN104251417A (zh) * 2013-06-28 2014-12-31 展晶科技(深圳)有限公司 光源模组
KR101584294B1 (ko) * 2013-12-24 2016-01-11 한국해양대학교 산학협력단 극지환경용 선박 led 등기구
CN107208874B (zh) * 2015-02-05 2020-02-18 飞利浦灯具控股公司 Led模块及密封方法
DE102015104641B4 (de) * 2015-03-26 2025-03-13 At & S Austria Technologie & Systemtechnik Ag Träger mit passiver Kühlfunktion für ein Halbleiterbauelement
AT518872B1 (de) * 2016-07-06 2018-02-15 Zkw Group Gmbh Bestückung von thermisch hochleistungsfähigen Bauteilen zu Wärmespreizung
DE102017116932B4 (de) 2017-07-26 2019-06-27 Ledvance Gmbh Leuchtvorrichtung mit Linse und Verfahren zu dessen Herstellung
DE212021000438U1 (de) * 2020-08-13 2023-05-16 Lumileds Llc Elektronische Vorrichtung und Licht emittierende Vorrichtung
TWI865348B (zh) * 2024-02-27 2024-12-01 矽品精密工業股份有限公司 電子封裝件及其製法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030021113A1 (en) * 1998-09-17 2003-01-30 U. S. Philips Corporation LED lamp
CN1591924A (zh) * 2003-07-29 2005-03-09 西铁城电子股份有限公司 表面安装型led及使用它的发光装置
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses
CN1795567A (zh) * 2003-05-26 2006-06-28 松下电工株式会社 发光器件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
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SU1260634A2 (ru) * 1984-11-05 1986-09-30 Научно-Исследовательский И Экспериментальный Институт Автотракторного Электрооборудования И Автоприборов Противотуманна фара
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
JP2001338505A (ja) * 2000-05-26 2001-12-07 Matsushita Electric Works Ltd 照明装置
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode
US20040188696A1 (en) * 2003-03-28 2004-09-30 Gelcore, Llc LED power package
TWI253765B (en) * 2003-05-26 2006-04-21 Matsushita Electric Works Ltd Light-emitting device
JP4534463B2 (ja) * 2003-10-30 2010-09-01 日亜化学工業株式会社 Ｌｅｄユニット
JP2006049443A (ja) * 2004-08-02 2006-02-16 Citizen Electronics Co Ltd 発光装置及びその実装構造
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
JP2008147513A (ja) * 2006-12-12 2008-06-26 Sanyo Electric Co Ltd 発光装置
ITGE20070073A1 (it) * 2007-07-31 2009-02-01 Giorgio Gai Elemento radiante per pannelli luminosi e pannello luminoso realizzato con detto elemento radiante

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030021113A1 (en) * 1998-09-17 2003-01-30 U. S. Philips Corporation LED lamp
CN1795567A (zh) * 2003-05-26 2006-06-28 松下电工株式会社 发光器件
CN1591924A (zh) * 2003-07-29 2005-03-09 西铁城电子股份有限公司 表面安装型led及使用它的发光装置
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104303291A (zh) * 2012-05-23 2015-01-21 皇家飞利浦有限公司 可表面安装的半导体器件
CN106537024A (zh) * 2014-07-09 2017-03-22 欧司朗有限公司 半导体灯
CN106537024B (zh) * 2014-07-09 2019-09-13 朗德万斯公司 半导体灯
CN107327772A (zh) * 2016-04-06 2017-11-07 通用电气公司 用于led灯具的散热反射器

Also Published As

Publication number Publication date
KR20110063833A (ko) 2011-06-14
WO2010032169A1 (en) 2010-03-25
TW201017049A (en) 2010-05-01
JP2012503306A (ja) 2012-02-02
RU2011115099A (ru) 2012-10-27
RU2518198C2 (ru) 2014-06-10
EP2337986A1 (en) 2011-06-29
US20110180819A1 (en) 2011-07-28

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
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Application publication date: 20110817