RU2518198C2 - Светоизлучающее устройство - Google Patents

Светоизлучающее устройство Download PDF

Info

Publication number
RU2518198C2
RU2518198C2 RU2011115099/07A RU2011115099A RU2518198C2 RU 2518198 C2 RU2518198 C2 RU 2518198C2 RU 2011115099/07 A RU2011115099/07 A RU 2011115099/07A RU 2011115099 A RU2011115099 A RU 2011115099A RU 2518198 C2 RU2518198 C2 RU 2518198C2
Authority
RU
Russia
Prior art keywords
heat
led
emitting device
electrically conductive
light emitting
Prior art date
Application number
RU2011115099/07A
Other languages
English (en)
Russian (ru)
Other versions
RU2011115099A (ru
Inventor
М. ВАН ЭЛМПТ Роб Ф.
КОНИНГ Нилс ДЕ
Ян П. ЯКОБС
Original Assignee
Конинклейке Филипс Электроникс Н.В.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Конинклейке Филипс Электроникс Н.В. filed Critical Конинклейке Филипс Электроникс Н.В.
Publication of RU2011115099A publication Critical patent/RU2011115099A/ru
Application granted granted Critical
Publication of RU2518198C2 publication Critical patent/RU2518198C2/ru

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/767—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having directions perpendicular to the light emitting axis
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
RU2011115099/07A 2008-09-16 2009-09-09 Светоизлучающее устройство RU2518198C2 (ru)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP08164417.1 2008-09-16
EP08164417 2008-09-16
PCT/IB2009/053947 WO2010032169A1 (en) 2008-09-16 2009-09-09 Light-emitting arrangement

Publications (2)

Publication Number Publication Date
RU2011115099A RU2011115099A (ru) 2012-10-27
RU2518198C2 true RU2518198C2 (ru) 2014-06-10

Family

ID=41334468

Family Applications (1)

Application Number Title Priority Date Filing Date
RU2011115099/07A RU2518198C2 (ru) 2008-09-16 2009-09-09 Светоизлучающее устройство

Country Status (8)

Country Link
US (1) US20110180819A1 (enExample)
EP (1) EP2337986A1 (enExample)
JP (1) JP2012503306A (enExample)
KR (1) KR20110063833A (enExample)
CN (1) CN102159873A (enExample)
RU (1) RU2518198C2 (enExample)
TW (1) TW201017049A (enExample)
WO (1) WO2010032169A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2695700C2 (ru) * 2015-02-05 2019-07-25 Филипс Лайтинг Холдинг Б.В. Светодиодный модуль и способ герметизации

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2479142A (en) 2010-03-30 2011-10-05 Optovate Ltd Illumination Apparatus
JP5627932B2 (ja) * 2010-06-05 2014-11-19 交和電気産業株式会社 集魚装置
JP5658496B2 (ja) * 2010-07-08 2015-01-28 交和電気産業株式会社 集魚装置
JP2012094611A (ja) 2010-10-26 2012-05-17 Panasonic Corp 照明装置
CN103261786B (zh) * 2010-12-15 2018-06-05 飞利浦照明控股有限公司 照明装置和组装该照明装置的方法
JP6305766B2 (ja) * 2010-12-15 2018-04-04 フィリップス ライティング ホールディング ビー ヴィ 照明装置及び照明装置を組み立てる方法
US9458869B2 (en) 2011-05-13 2016-10-04 Koninklijke Philips N.V. Fastening element for clamping sheets
US9006770B2 (en) 2011-05-18 2015-04-14 Tsmc Solid State Lighting Ltd. Light emitting diode carrier
CN104160213B (zh) * 2012-03-08 2019-01-22 飞利浦照明控股有限公司 发光装置及用于制造发光装置的方法
CN104303291A (zh) * 2012-05-23 2015-01-21 皇家飞利浦有限公司 可表面安装的半导体器件
US9136293B2 (en) * 2012-09-07 2015-09-15 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for sensor module
WO2014192920A1 (ja) * 2013-05-31 2014-12-04 株式会社アイ・ライティング・システム 照明器具
CN104251417A (zh) * 2013-06-28 2014-12-31 展晶科技(深圳)有限公司 光源模组
KR101584294B1 (ko) * 2013-12-24 2016-01-11 한국해양대학교 산학협력단 극지환경용 선박 led 등기구
DE102014213388A1 (de) * 2014-07-09 2016-01-14 Osram Gmbh Halbleiterlampe
DE102015104641B4 (de) * 2015-03-26 2025-03-13 At & S Austria Technologie & Systemtechnik Ag Träger mit passiver Kühlfunktion für ein Halbleiterbauelement
US20170292690A1 (en) * 2016-04-06 2017-10-12 General Electric Company Heat dissipating reflectors for led luminaires
AT518872B1 (de) * 2016-07-06 2018-02-15 Zkw Group Gmbh Bestückung von thermisch hochleistungsfähigen Bauteilen zu Wärmespreizung
DE102017116932B4 (de) 2017-07-26 2019-06-27 Ledvance Gmbh Leuchtvorrichtung mit Linse und Verfahren zu dessen Herstellung
US12203644B2 (en) 2020-08-13 2025-01-21 Lumileds Llc Electronic device, light emitting device and method for manufacturing an electronic device
TWI865348B (zh) * 2024-02-27 2024-12-01 矽品精密工業股份有限公司 電子封裝件及其製法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1260634A2 (ru) * 1984-11-05 1986-09-30 Научно-Исследовательский И Экспериментальный Институт Автотракторного Электрооборудования И Автоприборов Противотуманна фара
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6793374B2 (en) * 1998-09-17 2004-09-21 Simon H. A. Begemann LED lamp
US6318886B1 (en) * 2000-02-11 2001-11-20 Whelen Engineering Company High flux led assembly
JP2001338505A (ja) * 2000-05-26 2001-12-07 Matsushita Electric Works Ltd 照明装置
US20040188696A1 (en) * 2003-03-28 2004-09-30 Gelcore, Llc LED power package
EP2365539B1 (en) * 2003-05-26 2018-05-02 Panasonic Intellectual Property Management Co., Ltd. Light-emitting device
CN100391017C (zh) * 2003-05-26 2008-05-28 松下电工株式会社 发光器件
JP4360858B2 (ja) * 2003-07-29 2009-11-11 シチズン電子株式会社 表面実装型ｌｅｄ及びそれを用いた発光装置
JP4534463B2 (ja) * 2003-10-30 2010-09-01 日亜化学工業株式会社 Ｌｅｄユニット
JP2006049443A (ja) * 2004-08-02 2006-02-16 Citizen Electronics Co Ltd 発光装置及びその実装構造
US20060098440A1 (en) * 2004-11-05 2006-05-11 David Allen Solid state lighting device with improved thermal management, improved power management, adjustable intensity, and interchangable lenses
US7806574B2 (en) * 2006-04-16 2010-10-05 Albeo Technologies, Inc. Thermal management of LED-based lighting systems
JP2008147513A (ja) * 2006-12-12 2008-06-26 Sanyo Electric Co Ltd 発光装置
ITGE20070073A1 (it) * 2007-07-31 2009-02-01 Giorgio Gai Elemento radiante per pannelli luminosi e pannello luminoso realizzato con detto elemento radiante

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1260634A2 (ru) * 1984-11-05 1986-09-30 Научно-Исследовательский И Экспериментальный Институт Автотракторного Электрооборудования И Автоприборов Противотуманна фара
US6599768B1 (en) * 2002-08-20 2003-07-29 United Epitaxy Co., Ltd. Surface mounting method for high power light emitting diode

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2695700C2 (ru) * 2015-02-05 2019-07-25 Филипс Лайтинг Холдинг Б.В. Светодиодный модуль и способ герметизации

Also Published As

Publication number Publication date
KR20110063833A (ko) 2011-06-14
JP2012503306A (ja) 2012-02-02
TW201017049A (en) 2010-05-01
CN102159873A (zh) 2011-08-17
RU2011115099A (ru) 2012-10-27
WO2010032169A1 (en) 2010-03-25
US20110180819A1 (en) 2011-07-28
EP2337986A1 (en) 2011-06-29

Similar Documents

Publication Publication Date Title
RU2518198C2 (ru) Светоизлучающее устройство
US7965029B2 (en) Light-emitting diode illumination apparatus
JP5283750B2 (ja) プリント回路基板をヒートシンクに取り付けるための熱伝導取り付け素子
JP5388598B2 (ja) 素子の放熱構造
CN101592323B (zh) 基板及照明器具
US20090141508A1 (en) Lamp with heat conducting structure and lamp cover thereof
JP4969332B2 (ja) 基板及び照明装置
EP2421062A1 (en) Led unit
JP2008294428A (ja) 発光ダイオードパッケージ
WO2008074245A1 (en) Blacklight apparatus and manufacturing method of the same
EP3602626A1 (en) Mounting an led element on a flat carrier
US9453617B2 (en) LED light device with improved thermal and optical characteristics
US20070081342A1 (en) System and method for mounting a light emitting diode to a printed circuit board
US20090095971A1 (en) Wire bond led lighting unit
US20070109788A1 (en) Backlight module
US8585247B2 (en) Lighting device
CN105993081A (zh) 安装组件和照明设备
JP2006066725A (ja) 放熱構造を備える半導体装置及びその組立方法
KR101963738B1 (ko) 고방열 형상 제어기술이 적용된 구리 유닛을 구비하는 엘이디 조명 장치
KR20100001116A (ko) 방열 ｌｅｄ 마운트 및 램프
KR102878841B1 (ko) 등기구용 엘이디 일체형 방열판
KR101766462B1 (ko) 인쇄회로기판
WO2025183191A1 (ja) 照明装置
WO2025126930A1 (ja) 照明装置
KR20120017642A (ko) 발광장치

Legal Events

Date Code Title Description
MM4A The patent is invalid due to non-payment of fees

Effective date: 20150910