CN102159657A - 一种化学机械抛光液 - Google Patents

一种化学机械抛光液 Download PDF

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Publication number
CN102159657A
CN102159657A CN2009801370569A CN200980137056A CN102159657A CN 102159657 A CN102159657 A CN 102159657A CN 2009801370569 A CN2009801370569 A CN 2009801370569A CN 200980137056 A CN200980137056 A CN 200980137056A CN 102159657 A CN102159657 A CN 102159657A
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Prior art keywords
mechanical polishing
polishing liquid
chemical mechanical
content
mass percent
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CN2009801370569A
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CN102159657B (zh
Inventor
王晨
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Anji Microelectronics Shanghai Co Ltd
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Anji Microelectronics Shanghai Co Ltd
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Priority to CN200980137056.9A priority Critical patent/CN102159657B/zh
Publication of CN102159657A publication Critical patent/CN102159657A/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

本发明公开了一种化学机械抛光液，其含有研磨颗粒、过氧化氢、过硫酸盐和水，所述的化学机械抛光液的pH为9～12。本发明的化学机械抛光液具有较高的钨的去除速率。

Description

一种化学机械抛光液
PCT国内申请，说明书已公开。

Claims (1)

  1. PCT国内申请，权利要求书已公开。
CN200980137056.9A 2008-10-10 2009-10-09 一种化学机械抛光液 Active CN102159657B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN200980137056.9A CN102159657B (zh) 2008-10-10 2009-10-09 一种化学机械抛光液

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN200810201029.0 2008-10-10
CN2008102010290 2008-10-10
CN200810201029A CN101724346A (zh) 2008-10-10 2008-10-10 一种化学机械抛光液
CN200980137056.9A CN102159657B (zh) 2008-10-10 2009-10-09 一种化学机械抛光液
PCT/CN2009/001121 WO2010040280A1 (zh) 2008-10-10 2009-10-09 一种化学机械抛光液

Publications (2)

Publication Number Publication Date
CN102159657A true CN102159657A (zh) 2011-08-17
CN102159657B CN102159657B (zh) 2015-05-20

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CN200810201029A Pending CN101724346A (zh) 2008-10-10 2008-10-10 一种化学机械抛光液
CN200980137056.9A Active CN102159657B (zh) 2008-10-10 2009-10-09 一种化学机械抛光液

Family Applications Before (1)

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CN200810201029A Pending CN101724346A (zh) 2008-10-10 2008-10-10 一种化学机械抛光液

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CN (2) CN101724346A (zh)
WO (1) WO2010040280A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102399494B (zh) * 2010-09-10 2014-12-31 安集微电子（上海）有限公司 一种化学机械抛光液
KR101257336B1 (ko) * 2012-04-13 2013-04-23 유비머트리얼즈주식회사 연마용 슬러리 및 이를 이용한 기판 연마 방법
CN108250973A (zh) * 2016-12-28 2018-07-06 安集微电子科技（上海）股份有限公司 一种用于阻挡层平坦化的化学机械抛光液
CN109251674B (zh) * 2017-07-13 2021-12-17 安集微电子科技（上海）股份有限公司 一种化学机械抛光液
CN109850910B (zh) * 2019-01-25 2020-09-25 西北工业大学 一种分级多孔氧化硅的制备方法
CN113463178B (zh) * 2021-07-23 2023-01-13 南昌大学 一种钨基丝材或片材的电解抛光液及电解抛光方法
CN113528028A (zh) * 2021-08-23 2021-10-22 长鑫存储技术有限公司 化学机械抛光液、半导体结构及其制备方法
CN115124927A (zh) * 2022-07-18 2022-09-30 大连理工大学 一种碳化硅晶体的绿色化学机械抛光液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6039891A (en) * 1996-09-24 2000-03-21 Cabot Corporation Multi-oxidizer precursor for chemical mechanical polishing
US20040232379A1 (en) * 2003-05-20 2004-11-25 Ameen Joseph G. Multi-oxidizer-based slurry for nickel hard disk planarization
CN1300271C (zh) * 2004-09-24 2007-02-14 中国科学院上海微系统与信息技术研究所 硫系化合物相变材料化学机械抛光的纳米抛光液及其应用
CN100335581C (zh) * 2004-11-24 2007-09-05 中国科学院上海微系统与信息技术研究所 硫系相变材料化学机械抛光的无磨料抛光液及其应用
CN1290962C (zh) * 2004-12-22 2006-12-20 中国科学院上海微系统与信息技术研究所 高介电材料钛酸锶钡化学机械抛光用的纳米抛光液
US20090047787A1 (en) * 2007-07-31 2009-02-19 Yuzhuo Li Slurry containing multi-oxidizer and nano-abrasives for tungsten CMP

Also Published As

Publication number Publication date
CN102159657B (zh) 2015-05-20
WO2010040280A1 (zh) 2010-04-15
CN101724346A (zh) 2010-06-09

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