CN102143655B - Power supply module and network equipment - Google Patents
Power supply module and network equipment Download PDFInfo
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- CN102143655B CN102143655B CN201010614985.9A CN201010614985A CN102143655B CN 102143655 B CN102143655 B CN 102143655B CN 201010614985 A CN201010614985 A CN 201010614985A CN 102143655 B CN102143655 B CN 102143655B
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Abstract
The embodiment of the invention provides a power supply module and network equipment. The power supply module comprises a printed circuit board (PCB) and a plurality of pins, wherein the bottom parts of the plurality of pins are arranged in the PCB and do not penetrate through the PCB; the side surfaces of the plurality of pins are partially contacted with the surface of the PCB; and the contact positions are provided with welding discs. In the power supply module and the network equipment provided by the embodiment of the invention, the bottom parts of the plurality of pins are arranged in the PCB and do not penetrate through the PCB, the side surfaces of the plurality of pins are partially contacted with the surface of the PCB, and the contact positions are provided with the welding discs. As the bottom parts of the pins do not penetrate through the PCB, the space occupied by the pins on one surface of the PCB is saved, so that more space is left in cabling of the PCB and the layout of other devices; and in addition, the contact positions of the side surfaces of the pins and the surface of the PCB are provided with the welding discs, so that the current flowability of the contact positions with the surface of the PCB is not influenced.
Description
Technical field
The present invention relates to areas of information technology, particularly a kind of power module and the network equipment.
Background technology
At present, the trend of power module high density, miniaturization is day by day obvious, conventionally need to be at very little printed circuit board (PCB) (PrintedCircuitBoard; PCB) in, realize very large power.
Existing a kind of power module, the multiple contact pins on it weld through the through hole on pcb board, and this mode contact pin and through hole area occupied are larger, take cabling and device layout space; Existing another kind of power module arranges connector on pcb board, and the multiple pins (golden finger) on power module insert in connector, and this mode area occupied is larger, and through-flow electric current is less, and conducting effect is poor.
Summary of the invention
The embodiment of the present invention provides a kind of power module and the network equipment, and to solve existing power module, contact pin and through hole area occupied are larger, take cabling and device layout space, and through-flow electric current are less, the problem that conducting effect is poor.
The embodiment of the present invention provides a kind of power module, comprising: printing board PCB and multiple pin;
The bottom of described multiple pins is located in described PCB and is not penetrated described PCB; The side of described multiple pins, part and described pcb board Surface Contact.
The embodiment of the present invention provides a kind of network equipment, comprises power module and mainboard that the embodiment of the present invention provides, and described power module is arranged on described mainboard.
The power module that the embodiment of the present invention provides and the network equipment, by being located in PCB by the bottom of multiple pins and not penetrating PCB; The side of multiple pins, part and pcb board Surface Contact, contact position is provided with pad.Because pin bottom does not penetrate PCB, thereby make a surface of PCB save the space that pin takies, therefore, for cabling and other device layouts of PCB reserve more spaces; In addition, be provided with pad because pin has part side and PCB Surface Contact, therefore do not affect the through-flow property of electric current with PCB Surface Contact place.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The partial structurtes schematic diagram of the power module that Fig. 1 provides for one embodiment of the invention;
The partial structurtes schematic diagram of the power module that Fig. 2 provides for another embodiment of the present invention;
Fig. 3 is the overall vertical view of the power module shown in Fig. 2.
Embodiment
For making object, technical scheme and the advantage of the embodiment of the present invention clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The structural representation of the power module that Fig. 1 provides for one embodiment of the invention, as shown in Figure 1, this power module comprises: printing board PCB 1 and multiple pin 2;
Wherein, the bottom of multiple pins 2 is located in PCB1 and is not penetrated PCB1; The side of multiple pins 2, part and PCB1 plate Surface Contact, contact position welding forms pad A.
Power module is essential functional unit in various device normally, for other modules in equipment provide electric energy.In power module, PCB1 is as the connection carrier of each device, between each device, connects by the cabling on PCB1, is arranged on pin on PCB1 and is mainly used in realizing other module in power module and equipment and is electrically connected.
Pin 2 can be pin type conventionally, and while being vertical placement of pin 2 of pin type, its structure can be approximately cylinder, and this cylinder comprises upper surface and bottom surface, and the damaged surface between upper surface and bottom surface is called the side of pin 2; Pin 2 can also be rectangular sheet, and when the pin 2 that is rectangular sheet is vertically placed, its structure proximate is cuboid, this cuboid comprise upper surface and bottom surface, the cuboid surface between upper surface and bottom surface is called the side of pin 2.In embodiment provided by the invention, the bottom of multiple pins 2 is located in PCB1, but does not penetrate PCB1, and the bottom surface of pin 2 is arranged in the thickness of the depth visual PCB1 of PCB1 and determines.There are part and the Surface Contact of PCB1 in the side of pin 2, forms pad A in contact position by welding.The size of contact position need to be considered the circulation of electric current and taking up room of contact position simultaneously, conventionally only need be by a very little part for pin 2 sides and PCB1 Surface Contact, and form pad A by welding.
It should be noted that, because the bottom of pin 2 is arranged in PCB1, therefore, the part of the side of above-described pin 2 and PCB1 Surface Contact can be the side of the bottom in next-door neighbour PCB1.
In addition, pin 2 can be arranged on PCB1 surface distributed device few region relative to cabling, to avoid taking the arrangement space of cabling and device as far as possible, and the regions such as the such as edge on PCB1 surface.
Except being arranged in pin 2 parts of PCB1 with the part contacting with PCB1, other parts of pin 2 all can with the vertical setting in PCB1 surface so that the use of power module.
The power module that the present embodiment provides, by being located in PCB by the bottom of multiple pins and not penetrating PCB; The side of multiple pins, part and pcb board Surface Contact, contact position is provided with pad.Because pin bottom does not penetrate PCB, thereby make a surface of PCB save the space that pin takies, therefore, for cabling and other device layouts of PCB reserve more spaces; In addition, be provided with pad because pin has part side and PCB Surface Contact, therefore do not affect the through-flow property of electric current with PCB Surface Contact place.
On the basis of last embodiment, the partial structurtes schematic diagram of the power module that Fig. 2 provides for another embodiment of the present invention, Fig. 3 is the overall vertical view of the power module shown in Fig. 2.Referring to Fig. 2 and Fig. 3, pin 2 can be arranged on the edge of PCB1 simultaneously, and the part side of pin 2 bottoms is arranged in PCB1.As can be seen from Figure 2, only some is arranged in PCB1 in the bottom of pin 2, and the bottom surface of pin 2 and part side are close to PCB1, between only have very little distance, or can fit, and remaining side is to be positioned at the edge of whole PCB1.
In addition, as shown in Figure 3, part between two surfaces of PCB1, the internal layer that is PCB1 is provided with multiple Copper Foils 3, Copper Foil 3 can form current sheet, ground plane and the winding of PCB1, according to the layout situation of power module, Copper Foil 3 can be extended to the edge of PCB1, contact with pin 2 bottoms of being located in PCB1, to increase circulation and the radiating requirements of electric current.
Part surface that can be corresponding with pin 2 bottom sides in PCB1 is established electrodeposited coating 4, thereby can realize the welding of this part PCB1 and pin 2.
In order to save space, pin 2 bottom sides in PCB1 can be affixed with electrodeposited coating 4.Copper Foil 3 can penetrate electrodeposited coating 4 and contact with pin 2.
In addition, be located at pin 2 bottoms in PCB1 vertical with the surface of PCB1 plate, further to save the area of PCB1 corresponding to below, PCB1 bottom surface.
The present invention also provides a network equipment embodiment, comprises the power module that the embodiment of the present invention provides, and also comprises mainboard, and power module is arranged on mainboard.
The network equipment provided by the invention can be: various types of network equipments such as personal computer (PC), server or router, in these network equipments, include power module and mainboard, power module is arranged on mainboard, in power module by the bottom of multiple pins being located in PCB and not penetrating PCB; The side of multiple pins, part and pcb board Surface Contact.Because pin bottom does not penetrate PCB, thereby make a surface of PCB save the space that pin takies, therefore, for cabling and the device layout of PCB reserve more spaces; In addition, because pin has part side and PCB Surface Contact, therefore do not affect the through-flow property of electric current with PCB Surface Contact place.
Finally it should be noted that: above embodiment only, in order to technical scheme of the present invention to be described, is not intended to limit; Although the present invention is had been described in detail with reference to previous embodiment, those of ordinary skill in the art is to be understood that: its technical scheme that still can record aforementioned each embodiment is modified, or part technical characterictic is wherein equal to replacement; And these amendments or replacement do not make the essence of appropriate technical solution depart from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (2)
1. a power module, is characterized in that, comprising: printing board PCB and multiple pin;
The bottom of described multiple pins is located in described PCB and is not penetrated described PCB; The side of described multiple pins, part and described pcb board Surface Contact, described contact position arranges pad; Between two surfaces of described PCB, be provided with multiple Copper Foils, described Copper Foil contacts with the described pin bottom of being located in described PCB; Part surface corresponding with described pin bottom sides in described PCB is provided with electrodeposited coating; Described Copper Foil penetrates described electrodeposited coating and contacts with described pin; Be located at described pin bottom in described PCB vertical with the surface of described pcb board, described pin is arranged on the edge of described PCB, the part side of described pin bottom is arranged in described PCB, and described pin bottom sides and the described electrodeposited coating be located in described PCB are affixed.
2. a network equipment, is characterized in that, comprises power module as claimed in claim 1, also comprises mainboard, and described power module is arranged on described mainboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010614985.9A CN102143655B (en) | 2010-12-24 | 2010-12-24 | Power supply module and network equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010614985.9A CN102143655B (en) | 2010-12-24 | 2010-12-24 | Power supply module and network equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102143655A CN102143655A (en) | 2011-08-03 |
| CN102143655B true CN102143655B (en) | 2014-09-17 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010614985.9A Active CN102143655B (en) | 2010-12-24 | 2010-12-24 | Power supply module and network equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102143655B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386313A (en) * | 2000-07-31 | 2002-12-18 | 皇家菲利浦电子有限公司 | System comprising at least two printed circuit boards |
| CN200962689Y (en) * | 2006-10-18 | 2007-10-17 | 中控科技集团有限公司 | Printed board connection structure |
| CN201319429Y (en) * | 2008-11-29 | 2009-09-30 | 贵州航天电器股份有限公司 | Vertical surface mounting connector |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10229953A1 (en) * | 2002-07-03 | 2004-01-29 | Hartmann Codier Gmbh & Co.Kg | Component for PCB assembly |
-
2010
- 2010-12-24 CN CN201010614985.9A patent/CN102143655B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1386313A (en) * | 2000-07-31 | 2002-12-18 | 皇家菲利浦电子有限公司 | System comprising at least two printed circuit boards |
| CN200962689Y (en) * | 2006-10-18 | 2007-10-17 | 中控科技集团有限公司 | Printed board connection structure |
| CN201319429Y (en) * | 2008-11-29 | 2009-09-30 | 贵州航天电器股份有限公司 | Vertical surface mounting connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102143655A (en) | 2011-08-03 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20211104 Address after: 518043 No. 01, 39th floor, building a, antuoshan headquarters building, No. 33, antuoshan Sixth Road, Xiang'an community, Xiangmihu street, Futian District, Shenzhen, Guangdong Province Patentee after: Huawei Digital Energy Technology Co.,Ltd. Address before: 518129 Bantian HUAWEI headquarters office building, Longgang District, Guangdong, Shenzhen Patentee before: HUAWEI TECHNOLOGIES Co.,Ltd. |